AMIS-39100 ONSEMI | Alldatasheet
Document overview
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Technical content
Features
- Eight HS drivers
- Up to 830 mA Continuous Current Per Driver Pair (Resistive Load)
- Charge Pump with One External Capacitor
- Serial peripheral interface (SPI)
- Short−Circuit Protection
- Diagnostic Features
- Powerdown Mode
- Internal Thermal Shutdown
- 3.3 V and 5 V Microcontroller Compliant
- Excellent System ESD
- Automotive Compliant
- SOIC 28 Package with Low Rthja
- This is a Pb−Free Device* Typical Applications
- Automotive Dashboard
- Automotive Load Management
- Actuator Control
- LED Driver Applications
- Relays and Solenoids
- Industrial Process Control http://onsemi.com PIN ASSIGNMENT (Top View) See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet.
ORDERING INFORMATION
AMIS−39100 PC20070110.1 GND1 GND5 VB4 OUT7 GND4 VB1 OUT2 GND2 OUT3 VB2 OUT6 VB3 OUT4 DIN DOUT TEST2 OUT5 CAPA1 TEST GND3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
Figure 1. Block Diagram
Table 1. PIN DESCRIPTION
1 TEST1 Connect to GND
2 CLK Schmitt Trigger SPI CLK Input
3 WR Schmitt Trigger SPI Write Enable Input
4 OUT1 HS Driver Output
5 VB1 Battery Supply
6 OUT2 HS Driver Output
7 GND1 Power Ground and Thermal Dissipation Path Junction−to−PCB
8 GND2 Power Ground and Thermal Dissipation Path Junction−to−PCB
9 OUT3 HS Driver Output
10 VB2 Battery Supply
11 OUT4 HS Driver Output
12 DIN SPI Input Pin (Schmitt trigger or CMOS inverter)
13 DOUT Digital Three State Output for SPI
14 TEST2 Connect to GND
15 GND3 Power Ground and Thermal Dissipation Path Junction−to−PCB
16 TEST Connect to GND
17 CAPA1 Charge Pump Capacitor Pin
18 OUT5 HS Driver Output
19 VB3 Battery Supply
20 OUT6 HS Driver Output
21 GND4 Power Ground and Thermal Dissipation Path Junction−to−PCB
22 GND5 Power Ground and Thermal Dissipation Path Junction−to−PCB
23 OUT7 HS Driver Output
24 VB4 Battery Supply
25 OUT8 HS Driver Output
26 PDB Schmitt Trigger Powerdown Input
27 VDDN Digital Supply
28 GND6 Power Ground and Thermal Dissipation Path Junction−to−PCB
Table 2. ABSOLUTE MAXIMUM RATINGS
- The power dissipation of the chip must be limited not to exceed the maximum junction temperature Tj.
- According to Human Body Model (HBM) standard MIL −STD−883 method 3015.7
- According to norm EOS/ESD −STM5.3.1−1999 robotic mode
Table 3. THERMAL CHARACTERISTICS OF THE PACKAGE Table 4. THERMAL CHARACTERISTICS OF THE AMIS−39100 ON A PCB
- These values are informative only.
Table 5. OPERATING RANGES
- The power dissipation of the chip must be limited not to exceed maximum junction temperature T J of 130°C.
17 CAPA
Figure 2. Typical Application Diagram TEST1, and TEST2 are shorted on the PCB level. Table 6. EXTERNAL COMPONENTS
- The capacitor must be placed close to the AMIS −39100 pins on the PCB.
- Both capacitors are optional and depend on the final application and board layout.
Figure 3. Layout Recommendation for Thermal Characteristics the maximum operating rating for the power supply or temperature must be less than 100 hours. The parameters below are independent from load type (see Section “Load Specific Parameters”). Table 7. ELECTRICAL CHARACTERISTICS
- The power dissipation of the chip must be limited not to exceed maximum junction temperature T J.
- The cumulative operation time mentioned above may cause permanent device failure.
Table 8. LOAD SPECIFIC CHARACTERISTICS PCB (see Section “Thermal Characteristics”). With TSD_H = 130°C and Rthja according to Table 4. the application according to . drivers will be switched off (see ). the device has cooled down under the TSD trip point. Table 9. OUT DIAGNOSTICS
- The correct diagnostic information is available after T_diagnostic_OFF time.
12.All 8 diagnostic bits DIAG_x must be in the fault condition to conclude a TSD diagnostic.
Table 10. POWER LOSS shown in and Figures 5 and 6. DIN signal is the input from the MCU to the AMIS−39100. high between the transferred bytes. diagram for 8−bit communication. bits are shifted with x = 1 first and ending with x = 8. are simultaneously switching to the newly requested status. pulses with dummy DIN data and ignoring the DOUT data. Table 11. DIGITAL CHARACTERISTICS
Figure 6. Timing Diagram
26 Units / Rail
Specifications Brochure, BRD8011/D.
AMIS−39100 http://onsemi.com PACKAGE DIMENSIONS SOIC 28 W CASE 751AR−01 ISSUE O
AMIS−39100 http://onsemi.com ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems in tended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resa le in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 AMIS−39100/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your loca l Sales Representative