AMIS-30663_14 ONSEMI | Alldatasheet

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© Semiconductor Components Industries, LLC, 2009 January, 2009 − Rev. 6

1 Publication Order Number:

AMIS−30663/D AMIS-30663 High Speed CAN Transceiver Introduction The AMIS −30663 CAN transceiver is the interface between a controller area network (CAN) protocol controller and the physical bus and may be used in both 12 V and 24 V systems. The digital interface level is powered from a 3.3 V supply providing true I/O voltage levels for 3.3 V CAN controllers. The transceiver provides differential transmit capability to the bus and differential receive capability to the CAN controller. Due to the wide common −mode voltage range of the receiver inputs, the AMIS−30663 is able to reach outstanding levels of electromagnetic susceptibility (EMS). Similarly, extremely low electromagnetic emission (EME) is achieved by the excellent matching of the output signals. Key Features

  • Fully Compatible with the “ISO 11898−2” Standard
  • Certified “Authentication on CAN Transceiver Conformance (d1.1)”
  • High Speed (up to 1 Mbit/s)
  • Ideally Suited for 12 V and 24 V Industrial and Automotive

Applications

  • Low EME Common−mode−choke is No Longer Required
  • Differential Receiver with Wide Common−mode Range (±35 V) for High EMS
  • No Disturbance of the Bus Lines with an Un−powered Node
  • Transmit Data (TxD) Dominant Time−out Function
  • Thermal Protection
  • Bus Pins Protected Against Transients in an Automotive Environment
  • Short Circuit Proof to Supply V oltage and Ground
  • Logic Level Inputs Compatible with 3.3 V Devices
  • ESD Protection Level for CAN Bus up to ±8 kV
  • This is a Pb−Free Device

Table 1. Ordering Information Specifications Brochure, BRD8011/D.

Figure 1. Block Diagram

1 Driver

Table 2. Technical Characteristics

  1. The parameters VCM −peak and VCM−step guarantee low EME.

Figure 2. Application Diagram Figure 3. Pin Configuration Table 3. Pin Out

1 TxD Transmit data input; low input → dominant driver; internal pull−up current

2 GND Ground

3 VCC Supply voltage

4 RxD Receive data output; dominant transmitter → low output

5 VREF Reference voltage output

6 CANL LOW−level CAN bus line (low in dominant mode)

7 CANH HIGH−level CAN bus line (high in dominant mode)

AMIS−30663 http://onsemi.com Functional Description General The AMIS −30663 is the interface between the CAN protocol controller and the physical bus. It is intended for use in automotive and industrial applications requiring baud rates up to 1 Mbaud. It provides differential transmit capability to the bus and differential receiver capability to the CAN protocol controller. It is fully compatible to the “ISO 11898−2” standard. Operating Modes AMIS−30663 only operates in high −speed mode as illustrated in Table 4. The transceiver is able to communicate via the bus lines. The signals are transmitted and received to the CAN controller via the pins TxD and RxD. The slopes on the bus lines outputs are optimised to give extremely low EME. Table 4. Function Table (X = don’t care) circuit is particularly needed when a bus line short circuits. reset by a positive edge on pin TxD. dissipation increases during this fault condition. supplied by the CAN controller through the I/O pins.

3.3 V Interface

a pull resistor from TxD to V33 is necessary.

Electrical Characteristics

All voltages are referenced to GND (pin 2). Positive currents flow into the IC. Sinking current means that the current is flowing into the pin. Sourcing current means that the current is flowing out of the pin. Absolute Maximum Ratings Stresses above those listed in Table 5 may cause permanent device failure. Exposure to absolute maximum ratings for extended periods may effect device reliability.

Table 5. Absolute Maximum Ratings

  1. Applied transient waveforms in accordance with “ISO 7637 part 3”, test pulses 1, 2, 3a and 3b (see Figure 4).
  2. Standardized human body model system ESD pulses in accordance to IEC 1000.4.2.
  3. Standardized human body model ESD pulses in accordance to MIL883 method 3015. Supply pin 8 is ±4 kV.
  4. Static latch −up immunity: static latch−up protection level when tested according to EIA/JESD78.
  5. Standardized charged device model ESD pulses when tested according to EOS/ESD DS5.3 −1993.

Table 6. Thermal Characteristics Table 7. DC Characteristics

Table 8. Digital Output Characteristics @ V33 = 2.5 V

re−flow soldering is often used. heating in a conveyor type oven. should preferably be kept below 230°C. double−wave soldering method was specifically developed.

  • Use a double−wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.
  • For packages with leads on two sides and a pitch (e): 1. Larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the PCB; 2. Smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the PCB. The footprint must incorporate solder thieves at the downstream end.
  • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the PCB. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is four seconds at 250 °C. A mildly−activated flux will eliminate the need for removal of corrosive residues in most applications. Manual Soldering Fix the component by first soldering two diagonally − opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300°C. When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270 and 320°C.

Table 9. Soldering Process

  1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect
  2. These packages are not suitable for wave soldering as a solder joint between the PCB and heatsink (at bottom version) can not be achieved,

and as solder may stick to the heatsink (on top version). incorporate solder thieves downstream and at the side corners.

  1. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable

for packages with a pitch (e) equal to or smaller than 0.65 mm. for packages with a pitch (e) equal to or smaller than 0.5 mm. For more information about ON Semiconductor’s products or services visit our Web site at http://onsemi.com.

AMIS−30663 http://onsemi.com PACKAGE DIMENSIONS SOIC 8 CASE 751AZ−01 ISSUE O ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 AMIS−30663/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative