AMIS-30421 ONSEMI | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 41
Technical content
© Semiconductor Components Industries, LLC, 2011 October, 2011 − Rev. 0
1 Publication Order Number:
AMIS−30421/D AMIS-30421 Micro-Stepping Stepper Motor Bridge Controller Introduction The AMIS −30421 is a micro -stepping stepper motor bridge controller for large current range bipolar applications. The chip interfaces via a SPI interface with an external controller in order to control 2 external power NMOS H−bridges. It has an on-chip voltage regulator, current sensing, self adapting PWM controller and pre-driver with smart slope control switching allowing the part to be EMC compliant with industrial and automotive applications. It uses a proprietary PWM algorithm for reliable current control. The AMIS−30421 contains a current translation table and takes the next micro-step depending on the clock signal on the “NXT” input pin and the status of the “DIR” (direction) register or input pin. The chip provides a so-called “Speed and Load Angle” output. This allows the creation of stall detection algorithms and control loops based on load angle to adjust torque and speed. The AMIS−30421 is implemented in a mature technology, enabling fast high voltage analog circuitry and multiple digital functionalities on the same chip. The chip is fully compatible with automotive voltage requirements. The AMIS−30421 is easy to use and ideally suited for large current stepper motor applications in the automotive, industrial, medical and marine environment. With the on −chip voltage regulator it further reduces the BOM for mechatronic stepper applications. Key Features
- Dual H−Bridge Pre−Drivers for 2−Phase Stepper Motors
- Programmable Current via SPI
- On−chip Current Translator
- SPI Interface
- Speed and Load Angle Output
- 8 Step Modes from Full Step up to 64 Micro−Steps
- Current−Sense via Two External Sense Resistors
- PWM Current Control with Automatic Selection of Fast and Slow Decay
- Low EMC PWM with Selectable V oltage Slopes
- Full Output Protection and Diagnosis
- Thermal Warning and Shutdown
- Compatible with 3.3 V Microcontrollers
- Integrated 3.3 V Regulator to Supply External Microcontroller
- Integrated Reset Function to Reset External Microcontroller
- These Devices are Pb−Free and are RoHS Compliant* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. See detailed ordering and shipping information in the package dimensions section on page 40 of this data sheet.
ORDERING INFORMATION
http://onsemi.com QFN44 CASE 485BY MARKING DIAGRAM 14 4 AMIS30421 0C421−001 AWLYYWWG A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb −Free Package
Table 1. PIN LIST AND DESCRIPTION
representations of the circuits used. Figure 3. In− and Output Equivalent Diagrams
Table 2. ABSOLUTE MAXIMUM RATINGS (Notes 1 and 2)
- If more than one value is mentioned, the most stringent applies.
- Convention: currents flowing in the circuit are defined as positive.
- Circuit functionality not guaranteed.
- According to JEDEC JESD22 −A114C
- High Voltage Pins MOTxx, VBB, GND; According to JEDEC JESD22 −A114C
- According to JEDEC EIA −JESD22−A115−A
- According to STM5.3.1 −1999
for extended periods of time may affect device reliability. Table 3. OPERATING RANGES
- High junction temperature can result in reduced lifetime.
Table 4. DC PARAMETERS The DC parameters are given for VBB and temperature in their operating ranges unless otherwise specified. Convention: currents flowing in the circuit are defined as positive.
6 V /C0118 VBB < VBBLV
The DC parameters are given for VBB and temperature in their operating ranges unless otherwise specified. Convention: currents flowing in the circuit are defined as positive.
The DC parameters are given for VBB and temperature in their operating ranges unless otherwise specified. Convention: currents flowing in the circuit are defined as positive. Table 5. AC PARAMETER The AC parameters are given for VBB and temperature in their operating ranges unless otherwise toff Bridge MOSFET switch off time Selectable through SPI.
Figure 9. Typical Application Schematic AMIS−30421 Table 6. EXTERNAL COMPONENTS LIST AND DESCRIPTION
Table 7. CIRCULAR TRANSLATOR TABLE
♦ Positive coil current conducts from MOTXP to MOTXN or MOTYP to MOTYN.
Figure 21. BEMF sampling without (left) and with (right) zero crossing stretching current−consumption when the motor is not in operation.
- The drivers are put in HiZ
- All analog circuits are disabled and in low−power mode
- All SPI registers maintain their logic content
- SPI communication is still possible (slightly current increase during SPI communication).
- Status Registers can not be cleared by reading out
- NXT and DIR inputs are forbidden
- Oscillator and digital clocks are silent
- Motor driver can not be cleared by means of the CLR−pin The voltage regulator remains active but with reduced current−output capability (I LOAD_PD). When Sleep Mode is left a start−up time is needed for the charge pump to stabilize. After this time (t SLP_SET) NXT commands can be issued (see also Figure 6). Enabling the motor when the charge pump is not stable can result in overcurrent errors (see section Over−Curr ent Detection). Because of this it’s advised to keep the motor disabled during the stabilization time (t SLP_SET). The IO−pins of AMIS−30421 have internal pull−down or pull−up resistors (see Figure 3). Keep this in mind when entering Sleep Mode. In Sleep Mode V DD can drop to 2.1 V minimum (see VDD_SLEEP in Table 4). Keep in mind that in this case it’s not allowed to pull the input pins above 2.1 V!
level is reached which is the thermal warning range. Figure 22. Thermal Ranges circuit condition may damage the drivers. open−coil errors. Increase the timing if this is the case. Note: A short circuit could trigger an open coil. Register 1 to clear the charge pump failure. time the ERRb−pin will be active but not latched for 250us.
due to slow voltage slope Error is latched. Figure 23. Charge Pump Failure microcontroller at power up. functionality can be used to reset a “stuck” microcontroller. fast after power up (see tDSPI, Figure 4). noise on the VDD supply (trf).
- Thermal Warning
- Thermal Shutdown
- Overcurrent
- Open Coil
- Charge Pump Failure
- All errors except a Thermal Warning will disable the H−bridge drivers to protect the motor driver (<MOTEN> = ‘0’). To reset the error one needs to read out the error. Only when all errors are reset it will be possible to re−enable the motor driver (<MOTEN> = ‘1’). Keep in mind that during power up a charge pump failure will be reported during the first 250us but will not be latched (see also Charge Pump Failure). During and after power up the ERRb−pin is an open drain output. One can change this to a push−pull output with SPI bit <IO_OT>.
AMIS−30421 http://onsemi.com POWER SUPPLY AND THERMAL CALCULATION Logic Supply Regulator AMIS−30421 has an on−chip 3.3V low−drop regulator to supply the digital part of the chip itself, some low−voltage analog blocks and external circuitry. See Table 4 for the limitations. Over− and Undervoltage AMIS−30421 has undervoltage detection. If V BB drops below VBBUL, the drivers are disabled. To be able to enable the drivers again the V BB voltage needs to rise above VBBUH. Overvoltage detection is also present. If the voltage rises above VBBOH the drivers are disabled. The voltage needs to drop below VBBOL to be able to enable the driver again. See also Figure 5. Start−Up Behavior Figure 4 gives the start−up of AMIS−30421. After VBB is applied and after a certain power up time (tPU), the internal voltage regulator VDD will start−up. When VDD gets above VDDH, the internal POR will be released and the digital will start−up. The WDb−pin will be kept low for an additional 100ms (tPOR). After the WDb−pin is deactivated and after a time tDSPI, SPI communication can be initiated. Junction Temperature Calculation To calculate the junction temperature of AMIS−30421 the thermal resistance junction −to−ambient must be known. When only a PCB heat sink is used, a typical value is 30°C/W (see Table 4). There are three modes the junction temperature can be calculated for.
- In Sleep Mode (<SLP> = ‘1’) the VBAT consumption is maximum 150 /C0109A making Tj = Tamb.
- In Normal Mode when the driver is disabled (<MOTEN> = ‘0’), the VBAT consumption is maximum 20 mA (no external load on VDD−pin). The junction temperature can be calculated as next: TJ /C0043TA /C0041/C0466VBAT /C0032IBAT /C0032RthJA/C0467 For an 18 V application operating at an ambient temperature of 125°C this would give: TJ /C0043125° C /C0041/C046618 V /C003220 mA /C003230° C/C0324W/C0467 TJ /C0043135.8° C
- In Normal Mode with the driver enabled (<MOTEN> = ‘1’) the gate charge current needs to be included in the calculations. IBAT /C004320 mA /C0041/C04666 /C0032VREGH /C0032CISS /C0032fPWM/C0467 For an 18 V application driving external MOSFET’s with an input capacitance of 1 nF this would result in: IBAT /C004320 mA /C0041/C04666 /C003212.8 V /C00321n F /C003230 kHz/C0467 IBAT /C004322.3 mA Operating at 125°C ambient temperature this result in a junction temperature of: TJ /C0043125° C /C0041/C046618 V /C003222.3 mA /C003230° C/C0324W/C0467 TJ /C0043137° C
Table 8. SPI REGISTER OVERVIEW The Watchdog Register is located at address 0x00 and can be used to enable the watchdog and set the watchdog time−out. It can also be used to set the short circuit and open coil detection time−out. Table 9. WATCHDOG REGISTER Table 10. WATCHDOG REGISTER PARAMETERS
0 Disable
1 Enable
coil (OPEN_X and/or OPEN_Y) will be reported. Note: Short circuit could trigger open coil detection.
to set the “coil current zero crossing” duration. Table 11. CONTROL REGISTER 0 Table 12. CONTROL REGISTER 0 PARAMETERS
101 Half step compensated
110 Half step uncompensated
111 Full Step
Defines the minimum “coil current zero crossing” duration. (fPWM), MIN_SLA_TIME could be 40us longer. resistor which defines the maximum coil current. on MOSFET’s of one half H−bridge (to prevent a short circuit). Table 13. CONTROL REGISTER 1
Table 14. CONTROL REGISTER 1 PARAMETERS 0 CW Defines the direction of rotation.
1 CCW
0 Positive Edge
1 Negative Edge
0 Push Pull
1 Open Drain
0 Disabled
1 Enabled
mode. It also has some parameters that can be used to set the SLA. Table 15. CONTROL REGISTER 2 Table 16. CONTROL REGISTER 2 PARAMETERS 0 Disabled Enables the PWM regulator. bits in Status Register 1 or 2 is set.
0 Normal Mode
1 Sleep Mode
0 Not Transparent
1 Transparent
0 No additional offset
temperature range or to verify a watchdog event. Notice that bit 7 is the parity bit (see READ operation p26). Table 17. STATUS REGISTER 0 Table 18. STATUS REGISTER 0 PARAMETERS 00 −40°C to 15°C Motor driver thermal range.
11 TSD = 0: 150°C to 170°C
0 No watchdog event
1 Watchdog event occurred
the X−coil, or to report a charge pump failure. Notice that bit 7 is the parity bit (see READ operation p26). Table 19. STATUS REGISTER 1
- In Sleep mode the register can be read out but will not be cleared!
Table 20. STATUS REGISTER 1 PARAMETERS
0 No overcurrent
1 Overcurrent
0 No charge pump failure
1 Charge pump failure
0 No open coil detected Open coil detection for X−coil
1 Open coil detected
the Y−coil, or to report a thermal shutdown. Notice that bit 7 is the parity bit (see READ operation p26). Table 21. STATUS REGISTER 2 Table 22. STATUS REGISTER 2 PARAMETERS
0 No thermal shutdown
1 Thermal shutdown
- In Sleep mode the register can be read out but will not be cleared!
microstepping position can be updated by the motor driver at any moment. Status Register 3 does not contain a parity bit. Table 23. STATUS REGISTER 3 Table 24. STATUS REGISTER 3 PARAMETERS top MOSFET’s during t1 (see Figure 11). Table 25. PREDRIVER REGISTER 0 Table 26. PREDRIVER REGISTER 0 PARAMETERS Defines the current source for the external top MOSFET’s during t1. top MOSFET’s during t2 (see Figure 11). Table 27. PREDRIVER REGISTER 1
Table 28. PREDRIVER REGISTER 1 PARAMETERS Defines the current source for the external top MOSFET’s during t2. bottom MOSFET’s during t1 (see Figure 11). Table 29. PREDRIVER REGISTER 2 Table 30. PREDRIVER REGISTER 2 PARAMETERS
- Current source can be calculated as next:
bottom MOSFET’s during t2 (see Figure 11). Table 31. PREDRIVER REGISTER 3 Table 32. PREDRIVER REGISTER 3 PARAMETERS
- Current source can be calculated as next:
Table 33. PREDRIVER REGISTER 4 Table 34. PREDRIVER REGISTER 4 PARAMETERS Predriver Register 5 is located at address 0x0E and can be used to set t2 (see Figure 11). Table 35. PREDRIVER REGISTER 5 Table 36. PREDRIVER REGISTER 5 PARAMETERS
Predriver Register 6 is located at address 0x0F and can be used to set toff (see Figure 11). Table 37. PREDRIVER REGISTER 6 Table 38. PREDRIVER REGISTER 6 PARAMETERS
Predriver Register 7 is located at address 0x10 and can be used to set t1 (see Figure 11). Table 39. PREDRIVER REGISTER 7 Table 40. PREDRIVER REGISTER 7 PARAMETERS
AMIS−30421 http://onsemi.com PACKAGE DIMENSIONS QFN44 7x7, 0.5P CASE 485BY ISSUE O ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ NOTE 3 SEATING PLANE K 0.15 C (A3) A b 44 34 44X L44X BOTTOM VIEW TOP VIEW SIDE VIEW 0.15 C D A B E PIN 1 REFERENCE 0.08 C 0.05 C e C NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO THE PLATED TERMINAL AND IS MEASURED ABETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP . 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM MIN MAX MILLIMETERS A 0.80 0.90 A1 −−− 0.05 A3 0.20 REF b 0.20 0.30 D 7.00 BSC D2 4.60 4.80 E 7.00 BSC E2 4.60 4.80 e 0.50 BSC K 0.20 −−− L 0.45 0.65 NOTE 4 DIMENSIONS: MILLIMETERS 0.50 4.90 0.30 44X 7.30 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 1DETAIL A 0.82 44X DETAIL A L ALTERNATE CONSTRUCTIONS L ÉÉÉ ÉÉÉ DETAIL B MOLD CMPDEXPOSED Cu ALTERNATE CONSTRUCTION L1 −−− 0.15 A0.10 B C 0.05 C M M AM0.10 B C AM0.10 B C PITCH DETAIL B ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 AMIS−30421/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative