AMDIP1606L16T WALSIN | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 6
Technical content
Page 1 of 6 ASC_AMDIP1606L16T_V01 Dec. 2017 AMDIP Series – 1608(0603)- RoHS Compliance MULTILAYER CERAMIC DIPLEXER Halogens Free Product
2.4 GHz & 5 GHz ISM Band RF Application
P/N: AMDIP1606L16T *Contents in this sheet are subject to change without prior notice.
Page 2 of 6 ASC_AMDIP1606L16T_V01 Dec. 2017
FEATURES
- Miniature footprint: 1.6 X 0.8X 0.7 mm3 2. Low Insertion Loss 3. High attenuation on 2nd harmonic suppressed 4. LTCC process
APPLICATIONS
- ISM 2.4/ 5GHz band RF application 2. Wi-Fi 802.11a/b/g/n application CONSTRUCTION Top view DIMENSIONS Figure Symbol Dimension (mm) L 1.60 ± 0.15 W 0.80 ± 0.15 T 0.70 max. A 0.175 ± 0.15 B 0.25 ± 0.15 C 0.25 ± 0.15 D 0.50 ± 0.15 L 1.60 ± 0.15 PIN Connection PIN Connection
1 GND 4 High Band
2 Common 5 GND
3 GND 6 Low Band
Top view Bottom view Side view
Page 3 of 6 ASC_AMDIP1606L16T_V01 Dec. 2017
ELECTRICAL CHARACTERISTICS
AMDIP16060L16T Specification Frequency range 2400~2500 MHz 4900~5950 MHz Insertion Loss 0.55 dB max. at 25℃ 0.85 dB max. at -55℃~ +125℃ 0.80 dB max. at 25℃ 1.10 dB max. at -55℃~ +125℃ Attenuation 26 dB min. @ 4800~5000MHz 24 dB min. @ 7200~7500 MHz 32 dB min. @ 30~2700MHz 15 dB min. @ 9800~11900 MHz 11 dB min. @ 14700~17850 MHz Isolation 32 dB min. @ 30~2700 MHz 26 dB min. @ 4900~5950 MHz VSWR 1.8 max. Impedance 50Ω Moisture sensitivity levels MSL is LEVEL 1 (Refer to : IPC/JEDEC J-STD-020) Operating & Storage Condition (Component) Operation Temperature Range: -55C ~ +125C Storage Temperature Range: -55C ~ +125C Storage Condition before Soldering (Included packaging material) Storage Temperature Range: +5 ~ +40 ℃ Humidity: 30 to 70% relative humidity Typical Electrical Chart SOLDER LAND PATTERN Figure Unit: mm Line width to be designed to match 50 Ω characteristic impedance, depending on PCB material and thickness.
Page 4 of 6 ASC_AMDIP1606L16T_V01 Dec. 2017 RELIABILITY TEST TEST PROCEDURE / TEST METHOD REQUIREMENT Resistance to soldering heat (R.S.H) MIL-STD-202 method 210 Un-mounted chips completely immersed for 10±1second in a SAC solder bath at 270℃±5ºC No mechanical damage. Electrical specification shall satisfy the descriptions in electrical characteristics under the operational temperature range within -55 ~ 125°C. Loss of metallization on the edges of each electrode shall not exceed 25 Solderability J-STD-002 a)4hrs / 155℃*dry then solder dipping 235 ℃/5sec b)Steam 8 hrs then 215℃ / 5sec solder dipping c)Steam 8 hrs then 260℃ / 7sec solder dipping 95% coverage min., good tinning and no visible damage Temperature cycling JESD22 method JA-104 1000 cycles, -55℃ ~ +125℃, dwell time 30min No mechanical damage. Electrical specification shall satisfy the descriptions in electrical characteristics under the operational temperature range within -55 ~ 125°C. Humidity MIL-STD-202 method 103 1000+48/-0 hours; 85C, 85% RH No mechanical damage. Electrical specification shall satisfy the descriptions in electrical characteristics under the operational temperature range within -55 ~ 125°C. High Temperature Exposure MIL-STD-202 method 108 1000+48/-0 hours; without load in a temperature chamber controlled 125±3°C No mechanical damage. Electrical specification shall satisfy the descriptions in electrical characteristics under the operational temperature range within -55 ~ 125°C. Mechanical Shock MIL-STD-202 method 213 1/2 Sine Pulse / 100g Peak / Velocity 12.3ft/sec No mechanical damage. Electrical specification shall satisfy the descriptions in electrical characteristics under the operational temperature range within -55 ~ 125°C. Board Flex AEC-Q200-005 RF component mounted on a 90mm glass epoxy resin PCB(FR4), bending once 2mm for 60sec No mechanical damage. Electrical specification shall satisfy the descriptions in electrical characteristics under the operational temperature range within -55 ~ 125°C. Terminal strength AEC-Q200-006 Pressurizing force: 1.8Kg, Test time: 60±1sec. Only 0402 for 1.0kg/60sec No remarkable damage or removal of the terminations Vibration MIL-STD-202 method 204 Test 5g’s for 20min., 12 cycles each of 3 orientations No mechanical damage. Electrical specification shall satisfy the descriptions in electrical characteristics under the operational temperature range within -55 ~ 125°C. ESD AEC-Q200-002 Test contact 1.0KV ( 0.5KV for 1005 only) No mechanical damage. Electrical specification shall satisfy the descriptions in electrical characteristics under the operational temperature range within -55 ~ 125°C.
Page 5 of 6 ASC_AMDIP1606L16T_V01 Dec. 2017 SOLDERING CONDITION Typical examples of soldering processes that provide reliable joints without any da mage are given in Fig 2, Fig 2. Infrared soldering profile ORDERING CODE AM DIP 1606 L 16 T Walsin Automotive device Product Code DIP : Diplexer Dimension code Per 2 digits of Length, Width, Thickness : e.g. : 1606 = Length 16, Width 08, Thickness 06 Application L :2.4GHz/5GHz Specification Design code Packing T : Reeled Minimum Ordering Quantity: 4000 pcs per reel. PACKAGING Paper Tape specifications (unit :mm) Index Ao Bo D T W Index E F Po P1 P2
Page 6 of 6 ASC_AMDIP1606L16T_V01 Dec. 2017 Reel dimensions A B C Taping Quantity:4000 pieces per 7” reel CAUTION OF HANDLING Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects, which might directly cause damage to the third party’s life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Medical equipment (5) Disaster prevention / crime prevention equipment (6) Traffic signal equipment (7) Transportation equipment (vehicles, trains, ships, etc.) (8) Applications of similar complexity and /or reliability requirements to the applications listed in the above. Storage condition (1) Products should be used in 6 months from the day of WALSIN outgoing inspection . (2) Storage environment condition. Products should be storage in the warehouse on the following conditions. Temperature : +5 to +40℃ Humidity : 30 to 70% relative humidity Don’t keep products in corrosive gases such as sulfur. Ch lorine gas or acid or it may cause oxidization of electrode, resulting in poor solderability. Products should be storage on the palette for the prevention of the influence from humidity, dust and son on. Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on. Products should be storage under the airtight packaged condition. Index A B C Dimension (mm) Φ178.0 Φ60.0 Φ13.0