AMC

AMC OHMITE | Alldatasheet

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1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com12 AMC Series Thick Film Automotive Grade Chips The Ohmite AMC series is compliant with AEC- Q200 specifications. These AEC-Q200 qualified chips are ideal for automotive electronics and other applications requiring great reliability. The AMC chips are halogen free and RoHS compli- ant reducing the effects on the environment. The wide range of chip sizes offered makes choosing the AMC series even easier. Series Power Max. Working Voltage Max. Overload Voltage Dielec. Withst. Voltage Resistance Range (by tolerance) 5.00% 1.00% 0.5% AMC0201 1/20 W 25V 50V 50V 1-10MΩ 10-1MΩAMC0402 1/16 W 50V 100V 100V 1-22MΩ 1-10MΩ AMC0603 1/10 W 75V 150V 150V 1-10MΩ AMC0805 1/8 W 150V 300V 300V 1-10MΩ 10-1MΩ AMC1206 1/4 W 200V 400V 500V AMC1210 1/2 W 200V 500V 500V AMC2010 3/4 W 200V 500V 500V AMC2512 1 W 200V 500V 500V SerieS SpeCifiCA tionS ChArACteriStiCS Operating Temp. Range -55℃ to +155℃ Rated Voltage The DC or AC (rms) continuous working voltage cor- responding to the rated power is determined by the following formula: V = √(PxR) or max. working voltage whichever is less, where: V = Cont. rated DC or AC (rms) working voltage (V) P = Rated power (W) R = Resistance value (Ω) Temperature Coeff. of Resistance Resistance range 1Ω-10Ω ±200ppm 10Ω-10MΩ ±100ppm 10MΩ-22MΩ ±200ppm 24MΩ-100MΩ ±300ppm Marking layer Protective glass Overcoat Ceramic substrate Inner electrode Termination (Ni/matte tin) Resistive layer 100Percent Rated Power Ambient Temperature, °C -40 0 120 140 160-20-60 20 80 10040 60 70°-55° 155° 270° 190° Temperature °C Time (sec.) 200 500 100 150 250200 250 300 100 150 Preheating ramp up rate <3K/s ramp up rate <3K/s ramp down rate <6K/s Construction Derating Soldering Conditions

1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com 13 AMC Series Thick Film Automotive Grade Chips Wave soldering footprintReflow soldering footprint diMenSionS (mm) B A D C Preferred direction during wave soldering Size L W H l1 l2 Size A B C D 0201 1.0 0.3 0.35 0.4 0402 1.5 0.5 0.5 0.6 0603 2.6 0.8 0.9 0.8 0805 3.0 1.2 0.9 1.2 1206 4.2 2 .2 1.0 1.5 1210 4.2 2.2 1.0 2.4 2010 6.1 3.3 1.4 2.4 2512 8.0 4.4 1.8 3.0 Size A B C D 0603 2.70 0.90 0.90 0.80 0805 3.30 1.30 1.00 1.30 1206 4.70 2.50 1.10 1.70 1210 4.70 2.50 1.10 2.50 2010 6.40 4.20 1.10 2.50 2512 8.20 5.50 1.35 3.20 Note: Wave soldering not rec- ommended for parts smaller than 0603. perforMAnCe dA tA Test Method Procedure Requirements Temp. Coeff. of Res. MIL-STD-202 Method 304 At +25/–55°C and +25/+125°C High Temperature Exposure AEC-Q200 Test 3 MIL-STD-202 Method 108 1,000 hours at TA = 155°C, unpowered ±(1.0%+0.05Ω) for D/F tol ±(2.0%+0.05Ω) for J tol Moisture Resistance AEC-Q200 Test 6 MIL-STD-202 Method 106 Each temperature / humidity cycle is defined at 8 hours (method 106F), 3 cycles / 24 hours for 10d. with 25°C / 65°C 95% R.H, without steps 7a & 7b, unpowered. Parts mounted on test-boards, without condensation on parts ±(0.5%+0.05Ω) for D/F tol ±(2.0%+0.05Ω) for J tol Biased Humidity AEC-Q200 Test 7 MIL-STD-202 Method 103 1,000 hours; 85°C / 85% RH 10% of operating power Measurement at 24±4 hours after test conclusion. ±(1.0%+0.05Ω) for D/F tol ±(3.0%+0.05Ω) for J tol Operational Life AEC-Q200 Test 8 MIL-STD-202 Method 108 1,000 hours at 125°C, derated voltage applied for 1.5 hours on, 0.5 hour off, still-air required ±(1.0%+0.05Ω) for D/F tol ±(3.0%+0.05Ω) for J tol Resistance to Soldering Heat AEC-Q200 Test 15 MIL-STD-202 Method 210 Condition B, no pre-heat of samples Lead-free solder, 260±5°C, 10±1 seconds immersion time Procedure 2 for SMD: devices fluxed and cleaned with isopropanol ±(0.5%+0.05Ω) for D/F tol ±(1.0%+0.05Ω) for J tol No visible damage Thermal Shock AEC-Q200 Test 16 MIL-STD-202 Method 107 -55/+125°C Number of cycles is 300. Devices mounted Maximum transfer time is 20 seconds. Dwell time is 15 minutes. Air – Air ±(0.5%+0.05Ω) for D/F tol ±(1.0%+0.05Ω) for J tol ESD AEC-Q200 Test 17 AEC-Q200-002 Human Body Model, 1 pos. + 1 neg. discharges. 0201: 500V; 0402/0603: 1KV; 0805 and above: 2KV ±(3.0%+0.05 Ω) Solderability Wetting AEC-Q200 Test 18 J-STD-002 Electrical Test not required Magnification 50X. SMD conditions: (a) Method B, aging 4 hours at 155°C dry heat, dipping at 235±3°C for 5±0.5 seconds. (b) Method B, steam aging 8 hours, dipping at 215±3°C for 5±0.5 seconds. (c) Method D, steam aging 8 hours, dipping at 260±3°C for 7±0.5 seconds. Well tinned (≥95% covered) No visible damage Board Flex AEC-Q200 Test 21 AEC-Q200-005 Chips mounted on a 90mm glass epoxy resin PCB (FR4) Bending for 0201/0402: 5 mm 0603/0805: 3 mm 1206 and above: 2 mm Holding time: minimum 60 seconds ±(1.0%+0.05Ω) Short Time Overload IEC60115-1 4.13 2.5 times of rated voltage or maximum overload voltage whichever is less for 5 sec at room temperature ±(1.0%+0.05Ω) for D/F tol ±(2.0%+0.05Ω) for J tol FOS ASTM-B-809-95 Sulfur (saturated vapor) 500 hours, 60±2℃, unpowered ±(1.0%+0.05Ω)

1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com14 AMC Series Thick Film Automotive Grade Chips tApe And reel (mm) orderinG inforMA tion D ANC E F W T Paper/PE tape Embossed/blister tape E F W T cover tape Direction of feed Paper/PE tape Qty. per reel Size A0 B0 W E F P0 P1 P2 ØD0 T (178mm) *For size 0201, the typical value of thickness (excluding cover tape) is 0.42 mm for paper tape and 0.33 mm for PE tape. Embossed/blister tape Size A0 B0 W E F P0 P1 P2 ØD0 ØD1 T Qty/reel Reel dimensions Size Qty./reel 8mm tape 12mm tape A N C D W1 W2 max. AMC0603J1K00ET Part series Automotive chip Size RoHS Compliant Tolerance K = 10% J = 5% F = 1% D = 0.5% Tape & reel Ohms 5% in E24 values, 1% and lower tolerances available in E24 and E96 values rev 9/17-1