AM9789
Document overview
- Manufacturer or author: Diodes Incorporated
- PDF pages: 19
Technical content
Features
BTL Output Single-phase Full-wave Linear Driver Silent Driver Low Supply Current (Normal Operation, Less than 4mA) Low Standby Current (PWM=0 Duty) @ Supply Current Less than 200μA Speed Controllable by PWM Input Signal Built-in Quick Start Function Built-in Lock Protection and Auto Restart Function Built-in Hall Bias Circuit Built-in FG Output Built-in Thermal Shutdown Circuit Built-in Over Current Protection Circuit Totally Lead-free & Fully RoHS Compliant (Note 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Pin Assignments (Top View) OUT2 VCC HIN+ HIN- FG PWM GND OUT1 OUT2 HB GND OUT1 VCC FG 5 6 PWM NC HIN+ HIN- MSOP-8 (M8 Package) MSOP-10 (MM Package) Pin 1 Mark 4 5 OUT2 VCC HIN+ HIN- FG PWM GND OUT1 OUT2 HB GND OUT1 VCC FG PWM NC HIN+ HIN- Pin 1 Mark 5 6 U-DFN3030-8 (DN8 Package) U-DFN3030-10 (DN Package)
Applications
Silent Fan Motors Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/ EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen - and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
Document number: DS36820 Rev. 2 - 4 2 of 19 www.diodes.com February 2019 © Diodes Incorporated AM9789 OBSOLETE – PART DISCON TINUED PART OBSOLETE – NO ALTERNATE PART Typical Applications Circuit (Note 4) AM9789 OUT2 HIN+ NC - FG VCC OUT1 GND 1mF/10V Hall RFG Pull High Voltage10K 4 HB HIN PWM VCC Option PWM Control Signal R 1 R 2 coil For MSOP-10 Package AM9789 OUT2 HIN+ - FG VCC OUT1 GND 1mF/10V Hall RFG Pull High Voltage10K HIN PWM VCC Option PWM Control SignalR1 coil For MSOP-8 Package Note 4: D1 is an ordinary diode used to filter the noise from VCC and protect IC if VCC and GND are plugged reversed. C1=1μF/10V typical. R1 and R2 should be fine tuned based on system design. They can be removed according to the system requirements. Zener diode (D2) is an optional choice. RFG=10kΩ typical.
Document number: DS36820 Rev. 2 - 4 3 of 19 www.diodes.com February 2019 © Diodes Incorporated AM9789 OBSOLETE – PART DISCON TINUED PART OBSOLETE – NO ALTERNATE PART Pin Descriptions Pin Number Pin Name Function MSOP-10/ U-DFN3030-10 MSOP-8/ U-DFN3030-8 1 1 OUT2 Output Connection 2 2 – NC No connected 3 3 HIN+ Hall input(+). Connect to Hall element positive output 4 – HB Hall bias 5 4 HIN- Hall input(-). Connect to Hall element negative output 6 5 FG Rotation speed output 7 6 PWM PWM signal input terminal 8 2 VCC Power supply 9 7 OUT1 Output Connection 1 10 8 GND Ground Functional Block Diagram HIN- HB HIN+ OUT2 VCC GND PWM FG OUT1 Hall Bias Control Logic Lock protection OSC TSD Shaping 1(1) 3(3) 5(4) 6(5) 7(6) 8(2) 9(7) 10(8) A(B) A: MSOP-10/U-DFN3030-10 B: MSOP-8/U-DFN3030-8
Document number: DS36820 Rev. 2 - 4 4 of 19 www.diodes.com February 2019 © Diodes Incorporated AM9789 OBSOLETE – PART DISCON TINUED PART OBSOLETE – NO ALTERNATE PART Absolute Maximum Ratings (TA=+25C, Note 5) Symbol Parameter Value Unit VCC Supply Voltage 10 V IOUT Output Current 1 A VOUT Output Voltage 10 V IHB HB Output Current 10 mA VFG FG Output Voltage 10 V IFG FG Output Sink Current 10 mA TOP Operation Temperature -40 to +125 C TSTG Storage Temperature Range -55 to +150 C TLEAD Lead Temperature (Soldering 10s) +260 C θJA Thermal Resistance (Junction to Ambient) MSOP-8 205 C/W MSOP-10 195 U-DFN3030-8 71 U-DFN3030-10 71 θJC Thermal Resistance (Junction to Case) MSOP-8 48 C/W MSOP-10 46 U-DFN3030-8 48 U-DFN3030-10 48 PD Power Dissipation MSOP-8 585 mW MSOP-10 585 U-DFN3030-8 1760 U-DFN3030-10 1760 – ESD (Human Body Model) 4000 V – ESD (Machine Model) 400 V Note 5: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These a re stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Condi tions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device re liability. Recommended Operating Conditions (TA=+25C) Symbol Parameter Min Max Unit VCC Supply Voltage 2 6 V VHB Hall Input Voltage Range 0.4 VCC -1.1 V TA Operating Ambient Temperature -40 +105 C
Document number: DS36820 Rev. 2 - 4 5 of 19 www.diodes.com February 2019 © Diodes Incorporated AM9789 OBSOLETE – PART DISCON TINUED PART OBSOLETE – NO ALTERNATE PART Electrical Characteristics (VCC =5V, TA=+25° C, unless otherwise specified.) Symbol Parameter Conditions Min Typ Max Unit ICC1 Operation Current Rotation Mode – 2 4 mA ICC2 Standby Current VPWM=0 – 130 200 μA VHB HB Pin Output Voltage IHB=5mA 1.1 1.3 1.5 V tON Lock Detection ON Time – 0.3 0.4 0.5 s tOFF Lock Detection OFF Time – 3 4 5 s tQS Quick Start Enable Time – – 55 75 ms VSAT(H+L) Output Drivers Saturation Voltage IOUT=250mA, upper and lower total – 0.5 0.7 V GIO Input-Output Gain VOUT/(VHIN+-VHIN-) 44 47 50 dB VFG FG Pin Low Voltage IFG=5mA – 0.2 0.3 V IFGL FG Pin Leakage Current VFG=5V – 0.1 1 μA VPWMH PWM Input High Level Voltage – 0.5× VCC – VCC V VPWML PWM Input Low Level Voltage – 0 – 0.2×VCC V fPWM PWM Input Frequency – 0.02 – 50 kHz VHOFS Hall Input Offset Voltage – – – ± 10 mV VHYS Hall Input Hysteresis Voltage – ±5 ± 10 ± 15 mV TSD Thermal Protection Temperature – – +165 – C △TSD Thermal Hysteresis Width – – +30 – C Performance Characteristics Supply Current vs. Supply Voltage (VPWM=VCC) Supply Current vs. Supply Voltage (VPWM=0V) 0 1 2 3 4 5 6 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Supply Current (mA) Supply Voltage (V) Operation Mode VPWM=VCC 0 1 2 3 4 5 6 100 150 200 Supply Current (mA) Supply Voltage (V) Standby Mode VPWM=0V
Document number: DS36820 Rev. 2 - 4 6 of 19 www.diodes.com February 2019 © Diodes Incorporated AM9789 OBSOLETE – PART DISCON TINUED PART OBSOLETE – NO ALTERNATE PART Performance Characteristics (Cont.) Saturation Voltage vs. Output Current Power Dissipation vs. Temperature (MSOP) Power Dissipation vs. Temperature (DFN) Truth Table INPUT OUTPUT Mode HIN- HIN+ PWM OUT1 OUT2 FG L H H H L L Operation Mode H L L H OFF H L L L L OFF L H L L L L H L L OFF Lock Mode H L L L OFF - - L OFF OFF OFF Standby Mode 0 100 200 300 400 500 200 400 600 800 Saturation Voltage (mV) Output Current (mA) VSAT-H VSAT-L -40 -20 0 20 40 60 80 100 120 140 100 200 300 400 500 600 700 800 Power Dissipation (mW) Ambient Temperature ( o Package: MSOP-10/MSOP-8 -40 -20 0 20 40 60 80 100 120 140 500 1000 1500 2000 Power Dissipation (mW) Ambient Temperature ( o
Document number: DS36820 Rev. 2 - 4 7 of 19 www.diodes.com February 2019 © Diodes Incorporated AM9789 OBSOLETE – PART DISCON TINUED PART OBSOLETE – NO ALTERNATE PART
Application Information
- Reverse Connection of Power Supply Connector Reverse connection of power supply connector may break IC. Some methods such as inserting a diode between power supply and VCC terminal can be taken to avoid the reverse connection destruction. 2. Power Supply Line Back electromotive force (EMF) causes regenerated current to the power supply line, so insert a capacitor (recommended value: 1μF or larger) as close as possible to the space between the power supply pin (VCC pin) and ground pin (GND pin) for routing regenerated current. 3. GND Potential and External Components Ensure that the potential of GND terminal is the minimum potential in any operating condition. External components connected to the ground must be connected with lines that are as short as possible and external compone nts connected between IC pins must be placed as close to the pins as possible. 4. Mounting Failures In the process of attaching IC to the printed board, more attention must be paid to the direction and location of the IC, sin ce mounting failures may also break IC. In addition, destruction is also possible when the circuit is shorted by foreign substance between outputs or betwe en output and power supply or between output and GND. 5. Thermal Consideration Refer to “Power Dissipation vs. Ambient Temperature (MSOP-10/MSOP-8)” in page 6, the IC is safe to operate below the curve and the thermal protection will be caused if the operating area is above the line. For example, when TA=+75C, the maximum power dissipation is about 0.35W. The power dissipation can be calculated by the following equation: PD=VSAT(H+L)×IOUT+VCC×ICC For example, VCC=5V, ICC=2mA, IOUT=250mA, VSAT(H+L)=0.5V, then PD=0.135W. The GND pin provides an electrical connection to the ground and channeling heat away. The printed circuit board (PCB) forms a heat sink and dissipates most of the heat to the ambient air. 6. Thermal Shutdown Circuit Considering the power dissipation under actual operating condition, the thermal design must be applied with sufficient margin. AM9789 features thermal shutdown (TSD) circuit (operation temperature is +165C typical and hysteresis width is +30C typical). When the chip temperature reaches the TSD circuit temperature, the output terminal becomes an open state. TSD circuit is designed simply fo r the purpose of intercepting IC from overheating. Make sure that the IC should not be used again after this circuit operating. Figure 1 shows a fan rotates normally first and then enters into OTP mode since the chip temperature reaches +165C. Finally the chip temperature decreases below +135C, then OTP mode is canceled and the fan rotates normally again.
Figure 1. OTP Function that if the output current decreases, AM9789 will enable the fan to rotate again. Figure 2 shows the detailed process.
Document number: DS36820 Rev. 2 - 4 10 of 19 www.diodes.com February 2019 © Diodes Incorporated AM9789 OBSOLETE – PART DISCON TINUED PART OBSOLETE – NO ALTERNATE PART
Ordering Information
TR : Tape & ReelM8 : MSOP-8 G1 : Green Product Name RoHS/Green MM : MSOP-10 DN8 : U-DFN3030-8 DN : U-DFN3030-10 Package Temperature Range Part Number Marking ID Packing MSOP-10 -40 to +105C AM9789MMTR-G1 9789MM-G1 3000/Tape & Reel MSOP-8 AM9789M8TR-G1 9789M8-G1 3000/Tape & Reel U-DFN3030-8 AM9789DN8TR-G1 B6E 5000/Tape & Reel U-DFN3030-10 AM9789DNTR-G1 BFD 5000/Tape & Reel Marking Information MSOP-8 (Top View) MSOP-10 (Top View) U-DFN3030-8 (Top View) U-DFN3030-10 (Top View) First and Second Lines: Logo and Marking ID Third Line: Date Code Y: Year WW: Work Week of Molding A: Assembly House Code XX: 7th and 8th Digits of Batch No. First Line: Marking ID : Pin 1 Mark
Document number: DS36820 Rev. 2 - 4 11 of 19 www.diodes.com February 2019 © Diodes Incorporated AM9789 OBSOLETE – PART DISCON TINUED PART OBSOLETE – NO ALTERNATE PART Package Outline Dimensions (All dimensions in mm(inch).) (1) Package Type: MSOP-10 0.400(0.016) 0.800(0.031) 3.100(0.122) 2.900(0.114) 0.820(0.032) 1.100(0.043) 0.090(0.004) 0.230(0.009) 0.750(0.030) 0.950(0.037) 4.750(0.187) 5.050(0.199) 0.280(0.011) 0.180(0.007) 0.500(0.020) TYP 3.100(0.122) 2.900(0.114) 0.020(0.001) 0.150(0.006) Note: Eject hole, oriented hole and mold mark is optional.
Document number: DS36820 Rev. 2 - 4 12 of 19 www.diodes.com February 2019 © Diodes Incorporated AM9789 OBSOLETE – PART DISCON TINUED PART OBSOLETE – NO ALTERNATE PART Package Outline Dimensions (All dimensions in mm(inch). Cont.) (2) Package Type: MSOP-8 4.700(0.185) 0.650(0.026)TYP 5.100(0.201) 0.400(0.016) 0.800(0.031) 0.000(0.000) 0.200(0.008) 0.300(0.012)TYP 3.100(0.122) 2.900(0.114) 0.800(0.031) 1.200(0.047) 3.100(0.122) 2.900(0.114) 0.150(0.006)TYP 0.750(0.030) 0.970(0.038) Note: Eject hole, oriented hole and mold mark is optional.
Document number: DS36820 Rev. 2 - 4 13 of 19 www.diodes.com February 2019 © Diodes Incorporated AM9789 OBSOLETE – PART DISCON TINUED PART OBSOLETE – NO ALTERNATE PART Package Outline Dimensions (All dimensions in mm(inch). Cont.) (3) Package Type: U-DFN3030-8 2.900(0.114) 3.100(0.122) 2.900(0.114) 3.100(0.122) 2.200(0.087) 2.400(0.094) 1.400(0.055) 1.600(0.063) N8N5 N4 N1 0.375(0.015) 0.575(0.023) 0.180(0.007) 0.300(0.012) 0.153(0.006) 0.253(0.010) 0.000(0.000) 0.800(0.031) PIN #1 IDENTIFICATION See DETAIL A BSC 0.650(0.026) Pin 1 Mark DETAIL A 12 12 Pin 1 options
Document number: DS36820 Rev. 2 - 4 14 of 19 www.diodes.com February 2019 © Diodes Incorporated AM9789 OBSOLETE – PART DISCON TINUED PART OBSOLETE – NO ALTERNATE PART Package Outline Dimensions (All dimensions in mm(inch). Cont.) (4) Package Type: U-DFN3030-10 2.900(0.114) 3.100(0.122) 2.900(0.114) 3.100(0.122) 1.500(0.059) 1.800(0.071) 0.200(0.008) 0.300(0.012) 0.500(0.020) TYP 0.250(0.010) 0.550(0.022) 0.000(0.000) 0.050(0.002) 2.300(0.090) 2.500(0.098) N1N5 N6 N10 Pin 1 Mark PIN #1 IDENTIFICATION See DETAIL A DETAIL A 12 12 Pin 1 options Symbol A min(mm) max(mm) min(inch) max(inch) Option 1 Option 2 0.700 0.570 0.800 0.630 0.028 0.022 0.031 0.025 min(mm) max(mm) min(inch) max(inch) 0.153 0.150 (Typ) 0.253 0.006 0.006 (Typ) 0.010 A
Document number: DS36820 Rev. 2 - 4 15 of 19 www.diodes.com February 2019 © Diodes Incorporated AM9789 OBSOLETE – PART DISCON TINUED PART OBSOLETE – NO ALTERNATE PART Suggested Pad Layout (1) Package Type: MSOP-10 G Z Y E X Dimensions Z (mm)/(inch) G (mm)/(inch) X (mm)/(inch) Y (mm)/(inch) E (mm)/(inch)
Document number: DS36820 Rev. 2 - 4 16 of 19 www.diodes.com February 2019 © Diodes Incorporated AM9789 OBSOLETE – PART DISCON TINUED PART OBSOLETE – NO ALTERNATE PART Suggested Pad Layout (Cont.) (2) Package Type: MSOP-8 XE Y G Z Dimensions Z (mm)/(inch) G (mm)/(inch) X (mm)/(inch) Y (mm)/(inch) E (mm)/(inch)
Document number: DS36820 Rev. 2 - 4 17 of 19 www.diodes.com February 2019 © Diodes Incorporated AM9789 OBSOLETE – PART DISCON TINUED PART OBSOLETE – NO ALTERNATE PART Suggested Pad Layout (Cont.) (3) Package Type: U-DFN3030-8 X2 Y E Dimensions Y (mm)/(inch) (mm)/(inch) (mm)/(inch) (mm)/(inch) (mm)/(inch) E (mm)/(inch)
Document number: DS36820 Rev. 2 - 4 18 of 19 www.diodes.com February 2019 © Diodes Incorporated AM9789 OBSOLETE – PART DISCON TINUED PART OBSOLETE – NO ALTERNATE PART Suggested Pad Layout (Cont.) (4) Package Type:U- DFN3030-10 Y2 Y E Dimensions Y (mm)/(inch) (mm)/(inch) (mm)/(inch) (mm)/(inch) (mm)/(inch) E (mm)/(inch)
Document number: DS36820 Rev. 2 - 4 19 of 19 www.diodes.com February 2019 © Diodes Incorporated AM9789 OBSOLETE – PART DISCON TINUED PART OBSOLETE – NO ALTERNATE PART IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNE SS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license unde r its patent o r trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are rep resented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising ou t of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, internation al or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into mul tiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or system s without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided i n the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in th e safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporate d products in such safety -critical, life support devices or systems, notwithstanding any devices - or systems -related information or support that may be pr ovided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2019, Diodes Incorporated www.diodes.com