ALM1108

Document overview

  • Manufacturer or author: Diodes Incorporated
  • PDF pages: 87

Technical content

Features

  • 1.71 V to 5.50 V Supply
  • Operating Temperature Range: -40°C to 85°C
  • Six Digital Inputs/Outputs
  • One Digital Input
  • Five Digital Inputs/Outputs
  • Two Combinatorial 2-bit Look Up Tables (LUTs)
  • Nine Multifunctional Macrocell
  • Two Selectable D Flip-Flop (DFF)/Latches or 2-bit LUTs
  • Four Selectable D Flip-Flop/Latches or 3-bit LUTs
  • One Selectable Shift Register or 3-bit LUT
  • Shift Register (SR) – 16 stage/3 outputs
  • One Selectable 16-bit Timer with bidirectional counting (TMR) or 4-bit LUT
  • One Programmable Delay or Edge Detector
  • Three 8-bit Timers with external clock/reset
  • Oscillator (OSC)
  • Power On Reset (POR)
  • Data Protection Feature
  • Continuous Registers Verification (CRV)
  • Package Options
  • 8-pin X1-QFN1012-8 (Type AX) package (1.0×1.2×0.42 mm, 0.4 mm pitch) Architecture Block Diagram IO2 VDD IO3 IO4 IO7 IO8 IO6 GND REGISTERS OSC 25kHz 2MHz MULTIFUNCTIONAL MACROCELLS 2-bit LUT0 . DFF0/LATCH0 2-bit LUT1 . DFF1/LATCH1 3-bit LUT0 . DFF2/LATCH2 3-bit LUT1 . DFF3/LATCH3 3-bit LUT2 . DFF4/LATCH4 3-bit LUT3 . DFF5/LATCH5 3-bit LUT4 . Shift Register 4-bit LUT0 . 16-bit Timer (TMR2) PDLY . Edge Detector COMBINATORIAL LOGIC 2-bit LUT2 2-bit LUT3 8-bit TIMERS TMR0 TMR1 TMR3 Non-Volatile Memory CRV CONNECTION MATRIX 32× 40 POR READY (MF0) (MF1) (MF2) (MF3) (MF4) (MF5) (MF6) (MF7) (MF8)

© 2026 Copyright Diodes Incorporated. All Rights Reserved. serving as a Digital Input PIN. Figure 1. Top View (X1-QFN1012-8 (Type AX))

1 VDD Power Supply -- --

2 IO2 Digital Input Digital Input w/o Schmitt Trigger

3 IO3 Digital IO Digital Input w/o Schmitt Trigger

4 IO4 Digital IO Digital Input w/o Schmitt Trigger

5 GND Ground -- --

6 IO6 Digital IO Digital Input w/o Schmitt Trigger

7 IO7 Digital IO Digital Input w/o Schmitt Trigger

8 IO8 Digital IO Digital Input w/o Schmitt Trigger

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 3 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Macrocell Manifest Macrocell Name Description Number of Units Total Units Referenced Section IOs 6 5 Digital Input • Digital Input (low or normal voltage; with or without a Schmitt Trigger)

  • 10 k/100 k/1 M Pull-Down resistors
  • One Digital Input 1 5.1, 5.3, 5.6.1, 5.4 Digital Input/Output
  • Digital Input (low or normal voltage; with or without a Schmitt Trigger)
  • Open Drain Outputs: NMOS ×1(2), PMOS ×1(2)
  • Push Pull Outputs: PP ×1(2)
  • 10 k/100 k/1 M Pull-Up/Pull-Down resistors
  • Thirteen Digital IOs 5 5.1, 5.2, 5.3, 5.6.2, 5.6.3, 5.6.4, 5.6.5, 5.6.6, 5.5 Connection Matrix 1 6 Connection Matrix
  • Digital matrix connections are based on user design
  • Size 32×40 1 6.1, 6.2, 6.3 Combinatorial Logic Look Up Tables 2 7 2-bit LUT • 2-bit Look-Up Table • Two 2-bit LUTs 2 7.1 Multifunctional Macrocells 9 8 2-bit LUT • 2-bit Look-Up Table • Two 2-bit LUTs shared with DFF/LATCH w/o RST 2 8.1 3-bit LUT • 3-bit Look-Up Table • Four 3-bit LUTs shared with DFF/LATCH w/ RST
  • One 3-bit LUT shared with Shift Register 5 8.2, 8.3 4-bit LUT • 4-bit Look-Up Table • One 4-bit LUT shared with 16-bit Timer 1 8.4 DFF w/o RST • D Flip-Flop w/o RST • Two DFFs shared with 2-bit LUTs or LATCHs w/o RST 2 8.1 DFF w/ RST • D Flip-Flop w/ RST • Four DFFs shared with 3-bit LUTs or LATCHs w/ RST 4 8.2 LATCH w/o RST
  • LATCH w/o RST • Two LATCHs shared with 2-bit LUTs or DFFs w/o RST 2 8.1 LATCH w/ RST
  • LATCH w/ RST • Four LATCHs shared with 3-bit LUTs or DFFs w/ RST 4 8.2 Shift Register • 16 stages/3 outputs
  • Two outputs with 1 to 16 selectable stages
  • One output with 1 stage
  • One Shift Register shared with 3-bitLUT 1 8.3 16-bit TMR • 16-bit Timer with bidirectional counting • One 16-bit TMR shared with 4-bit LUT 1 8.5 PDLY • Programmable Delay
  • 140 ns/280 ns/420 ns/560 ns @ VDD = 3.3 V
  • One PDLY shared with Edge Detector 1 8.4 Edge Detector • Rising Edge Detector
  • Falling Edge Detector
  • Both Edge Detector
  • One Edge Detector shared PDLY 1 8.4 8-bit Timers 3 9

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 4 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Macrocell Name Description Number of Units Total Units Referenced Section 8-bit TMR • One input from the Connection Matrix for DLY IN/RST IN

  • One input from the Connection Matrix for an external couter/clock source
  • Four Modes:
  • Delay
  • One Shot
  • Frequency Detector
  • Counter
  • Two 8-bit TMR with two inputs from Connection Matrix 2 9.1, 9.3 8-bit TMR • One input from the Connection Matrix which has a shared function of DLY IN or EXT CLK input
  • Four Modes:
  • Delay
  • One Shot
  • Frequency Detector
  • Counter
  • One 8-bit TMR with one input from Connection Matrix 1 9.4 Data Protection 2 11 CRV • Continuous Registers Verification • 1 11 Oscillators 1 12 25kHz • 25 kHz or 2 MHz selectable frequency or External clock source
  • CLKPrescaler: /1, /2, /4, and /8
  • Out clock frequency controlled with two outputs scaled by OUT0Prescaler and OUT1Prescaler: /1, /2, /4, /8, /16, /32, /64 or /128
  • One OSC (25kHz/2MHz) 1 12 2MHz POR 2 13 IO2 Reset • Reset by events of IO2 • 1 13.4

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 5 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved.

Contents

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 6 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved.

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 8 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 2. How to Get Samples and Go to Production Customer creates design in Atlas EDA Software Product Definition Debug design with simulation/development board Diodes Application Engineer creates a design based on Customer Definition Customer debugs the design with simulation/development board Fill sample form in the Atlas EDA Software and submit Diodes assigns custom part number Diodes sends programmed engineering samples Verify the sample in the system design Approve design Custom Customer part enter production Figure 2.1. Steps to create a custom μASIC device

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 9 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 3. Ordering information The custom program part number will be created when design is submitted. Please contact your local Sales representative.

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 10 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 4. Electrical Specifications 4.1. Absolute Maximum Conditions Table 4.1. Absolute Maximum Conditions Parameter Min. Max. Unit Supply voltage on VDD relative to GND -0.5 7 V DC Input voltage GND - 0.5 VDD + 0.5 V Maximum Average or DC Current Through VDD PIN (Per chip side, see Note 4.1) 100 mA Maximum Average or DC Current Through GND PIN (Per chip side, see Note 4.1) 100 mA Maximum Average or DC Current (Through pin) PP×1 -- 18 mA PP×2 -- 28 mA OD(NMOS)×1 -- 18 mA OD(NMOS)×2 -- 28 mA OD(PMOS)×1 18 mA OD(PMOS)×2 28 mA Current at Input PIN (Note 4.2) -10.0 10.0 mA Input leakage (Absolute Value) -- 2.0 nA Storage Temperature Range -65 150 °C Junction Temperature -- 150 °C ESD Protection (Human Body Model) 2000 -- V ESD Protection (Charged Device Model) 1000 -- V Moisture Sensitivity Level 1 Note 4.1 The power rails are divided in two sides. PINs 2, 3 and 4 are connected to one side, pins 6, 7 and 8 to another Note 4.2 Limiting input pin current is only necessary for input voltages that exceed absolute maximum input voltage ratings 4.2. Recommended Operating Conditions Table 4.2. Recommended Operating Conditions Symbol Parameter Condition/Note Min. Typ. Max. Unit VDD Supply Voltage 1.71 3.30 5.50 V TA Operating Temperature -40 25 85 °C VO Operating Voltage Applied to any PIN in HIGH-Impedance State GND – 0.3 -- VDD+0.3 V CVDD Capacitor Value at VDD -- 0.1 -- F

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 11 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 4.3. General Specifications Table 4.3. General characteristics Symbol Parameter Condition/Note Min. Typ. Max. Unit TSU Startup Time From VDD rising past PONTHR -- 0.28 0.456 ms PONTHR Power On Threshold VDD Level Required to Start Up the Chip 1.486 1.6 1.652 V POFFTHR Power Off Threshold VDD Level Required to Switch Off the Chip 1.348 1.5 1.541 V 4.4. IO Specifications Table 4.4. IO Electrical Characteristics @ VDD = 1.71V to 5.50V, T = - 40 °C to +85 °C Unless Otherwise Noted Symbol Parameter Condition/Note Min. Typ. Max. Unit VIH HIGH-Level Input Voltage Digital input w/o Schmitt trigger (Note 4.3) 0.7xVDD -- VDD+0.3 V Digital input w/ Schmitt trigger 0.8xVDD -- VDD+0.3 V Digital input low voltage (Note 4.3) 1.05 -- VDD+0.3 V VIL LOW-Level Input Voltage Digita input w/o Schmitt trigger (Note 4.3) GND-0.3 -- 0.3xVDD V Digital input w/ Schmitt trigger GND-0.3 -- 0.2xVDD V Digital input low voltage (Note 4.3) GND-0.3 -- 0.5 V VHYS Schmitt Trigger Hysteresis Voltage Digital input w/ Schmitt trigger -- 0.5 -- V VOH HIGH-Level Output Voltage Push-Pull ×1, Open Drain PMOS ×1, IOH = -100 A, VDD = 1.8 V 1.793 1.795 -- V Push-Pull ×2, Open Drain PMOS ×2, IOH = -100 A, VDD = 1.8 V 1.796 1.797 -- V Push-Pull ×1, Open Drain PMOS ×1, IOH = -3 mA, VDD = 3.3 V 3.200 3.219 - V Push-Pull ×2, Open Drain PMOS ×2, IOH = -3 mA, VDD = 3.3 V 3.250 3.259 -- V Push-Pull ×1, Open Drain PMOS ×1, IOH = -5 mA, VDD = 5.0 V 4.880 4.902 -- V Push-Pull ×2, Open Drain PMOS ×2, IOH = -5 mA, VDD = 5.0 V 4.939 4.950 -- V VOL LOW-Level Output Voltage Push-Pull ×1, Open Drain NMOS ×1, IOL = 100 A, VDD = 1.8 V -- 0.0026 0.0034 V Push-Pull ×2, Open Drain NMOS ×2, IOL = 100 A, VDD = 1.8 V -- 0.0012 0.0017 V Push-Pull ×1, Open Drain NMOS ×1, IOL = 3 mA, VDD = 3.3 V -- 0.0442 0.0554 V Push-Pull ×2, Open Drain NMOS ×2, IOL = 3 mA, VDD = 3.3 V -- 0.0223 0.0281 V Push-Pull ×1, Open Drain NMOS ×1, IOL = 5 mA, VDD = 5.0 V -- 0.0542 0.0693 V Push-Pull ×2, Open Drain NMOS ×2, IOL = 5 mA, VDD = 5.0 V -- 0.0275 0.0354 V IOH HIGH-Level Output Current (see Note 4.4) Push-Pull ×1, Open Drain PMOS ×1, VOH = VDD - 0.2, VDD = 1.8 V -2.622 -3.252 -- mA Push-Pull ×2, Open Drain PMOS ×2, VOH = VDD - 0.2, VDD = 1.8 V -5.123 -6.463 -- mA Push-Pull ×1, Open Drain PMOS ×1, VOH = 2.4 V, VDD = 3.3 V -20.341 -24.741 -- mA Push-Pull ×2, Open Drain PMOS ×2, VOH = 2.4 V, VDD = 3.3 V -36.466 -46.501 -- mA

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 12 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Symbol Parameter Condition/Note Min. Typ. Max. Unit Push-Pull ×1, Open Drain PMOS ×1, VOH = 2.4 V, VDD = 5.0 V -58.441 -67.107 -- mA Push-Pull ×2, Open Drain PMOS ×2, VOH = 2.4 V, VDD = 5.0 V -105.513 -124.048 -- mA IOL LOW-Level Output Current (see Note 4.3) Push-Pull ×1, Open Drain NMOS ×1, VOL = 0.15 V, VDD = 1.8 V 3.794 4.631 -- mA Push-Pull ×2, Open Drain NMOS ×2, VOL = 0.15 V, VDD = 1.8 V 7.463 9.100 -- mA Push-Pull ×1, Open Drain NMOS ×1, VOL = 0.4 V, VDD = 3.3 V 19.191 24.155 -- mA Push-Pull ×2, Open Drain NMOS ×2, VOL = 0.4 V, VDD = 3.3 V 37.496 47.278 -- mA Push-Pull ×1, Open Drain NMOS ×1, VOL = 0.4 V, VDD = 5.0 V 26.735 34.613 -- mA Push-Pull ×2, Open Drain NMOS ×2, VOL = 0.4 V, VDD = 5.0 V 51.917 67.477 -- mA RPULL Pull-Up or Pull-Down Resistance 1000 k For Pull-Up VIN = GND; For Pull-Down VIN = VDD 910.732 1000 1161.136 k 100 k For Pull-Up VIN = GND; For Pull-Down VIN = VDD 94.058 100 116.915 k 10 k; For Pull-Up VIN = GND; For Pull-Down VIN = VDD 9.154 10 12.294 k CIN Input Capacitance -- 4 -- pF Note 4.3 No hysteresis Note 4.4 DC or average current through any pin should not exceed value given in Absolute Maximum Conditions 4.5. Typical Current Consumption Table 4.5. Typical Current Estimated for Each Macrocell Symbol Parameter Note VDD = 1.8 V VDD = 3.3 V VDD = 5.0 V Unit IDD Current Chip Quiescent 0.349 0.377 0.414 A OSC 2 MHz, OFF State -- -- <1 nA OSC 2 MHz, IDLE State 174.2 174.2 174.2 nA OSC 2 MHz, PreScaler = 1 9.542 20.719 38.265 A OSC 2 MHz, PreScaler = 2 8.823 19.321 35.932 A OSC 2 MHz, PreScaler = 4 8.493 18.684 34.874 A OSC 2 MHz, PreScaler = 8 8.296 18.304 34.239 A OSC 25 kHz, OFF State -- -- <1 nA OSC 25 kHz, IDLE State 43 42 41 nA OSC 25 kHz, PreScaler = 1 0.175 0.271 0.303 A OSC 25 kHz, PreScaler = 2 0.167 0.253 0.372 A OSC 25 kHz, PreScaler = 4 0.162 0.245 0.358 A OSC 25 kHz, PreScaler = 8 0.160 0.240 0.350 A 4.6. Timing Estimator Table 4.6 Typical Propagation Time (tPROP) for Each Macrocell Start Point End point Note VDD = 1.8 V VDD = 3.3 V VDD = 5.0 V Unit Low to High High to Low Low to High High to Low Low to High High to Low

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 13 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Start Point End point Note VDD = 1.8 V VDD = 3.3 V VDD = 5.0 V Unit Low to High High to Low Low to High High to Low Low to High High to Low DI w/o ST DO NMOS×1 IO -- 28.5 -- 10.0 -- 6.8 ns DI w/o ST DO NMOS×2 IO -- 28 -- 9.9 -- 6.7 ns DI w/o ST DO PMOS×1 IO 43.1 -- 13.4 -- 8.3 -- ns DI w/o ST DO PMOS×2 IO 42.8 -- 13.2 -- 8.1 -- ns nRST Q DFF w/ nRST -- 22.5 -- 7.6 -- 5.0 ns nSET Q DFF w/ nSET 29.9 -- 9.9 -- 5.9 -- ns nRST nQ DFF w/ nRST 26.4 -- 8.6 -- 5.2 -- ns nSET nQ DFF w/ nSET -- 24.0 -- 8.0 -- 5.3 ns nRST OUT0 Shift register -- 27.3 -- 9.1 -- 6.2 ns nRST OUT1 Shift register -- 28.1 -- 9.6 -- 6.5 ns nRST Q[1] Shift register -- 22.7 -- 7.9 -- 5.3 ns nRST nOUT1 Shift register 33.3 -- 11.1 -- 7.1 -- ns IN OUT 8-bit TMR (One-Shot) 39.3 -- 13.0 -- 8.2 -- ns RST OUT 8-bit TMR (Counter) 51.8 -- 16.8 -- 10.8 -- ns IN OUT 8-bit TMR (Frequency Detector) IN OUT 8-bit TMR (Edge Detector) 28.8 -- 9.7 -- 5.8 -- ns CLK OUT 8-bit TMR (One-Shot) -- 60.5 -- 20.5 -- 13.0 ns CLK OUT 8-bit TMR (Frequency Detector) IN OUT 8-bit TMR (Delayed Edge Detector)

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 14 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Start Point End point Note VDD = 1.8 V VDD = 3.3 V VDD = 5.0 V Unit Low to High High to Low Low to High High to Low Low to High High to Low IN OUT 16-bit TMR (One-Shot) 40.0 -- 13.5 -- 8.5 -- ns RST OUT 16-bit TMR (Counter) 55.5 -- 18.5 -- 12.5 -- ns IN OUT 16-bit TMR (Frequency Detector) CLK OUT 16-bit TMR (One-Shot) -- 101.0 -- 33.0 -- 21.0 ns CLK OUT 16-bit TMR (Frequency Detector) Table 4.7 Expected Delays and Widths for Programmable Delay/Edge Detector Symbol Parameter Note VDD = 1.8V VDD = 3.3V VDD = 5.0V Unit TWidth Width, 140ns Mode:(any)Edge Detect, Edge Detect Output 123.7 118.8 117.2 ns TWidth Width, 280ns Mode:(any)Edge Detect, Edge Detect Output 256.7 254.4 254.8 ns TWidth Width, 420ns Mode:(any)Edge Detect, Edge Detect Output 388.6 387.7 390.3 ns TWidth Width, 560ns Mode:(any)Edge Detect, Edge Detect Output 521.2 522.0 526.8 ns TPROP Delay, 140ns Mode:(any)Edge Detect, Edge Detect Output 34.6 11.1 7.3 ns TPROP Delay, 280ns Mode:(any)Edge Detect, Edge Detect Output 34.6 11.2 7.3 ns TPROP Delay, 420ns Mode:(any)Edge Detect, Edge Detect Output 34.5 11.2 7.3 ns TPROP Delay, 560ns Mode:(any)Edge Detect, Edge Detect Output 34.6 11.2 7.3 ns TDLY Delay, 140ns Mode: Both Edge Delay, Edge Detect Output 158.2 130.0 124.5 ns TDLY Delay, 280ns Mode: Both Edge Delay, Edge Detect Output 291.3 265.6 262.2 ns TDLY Delay, 420ns Mode: Both Edge Delay, Edge Detect Output 423.1 398.8 397.6 ns TDLY Delay, 560ns Mode: Both Edge Delay, Edge Detect Output 555.9 533.2 534.1 ns 4.7. OSC Specifications 4.7.1. 25 kHz Oscillator Table 4.8 25 kHz OSC Frequency Limits Power Supply Range VDD, V Temperature Range Min, kHz Max, kHz Min, kHz Max, kHz Min, kHz Max, kHz Table 4.9 25 kHz OSC Frequency Error (Error Calculated Relative to Nominal Value) Power Supply Range VDD, V Temperature Range Min Max Min Max Min Max

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 15 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Table 4.10 25 kHz OSC Power on time at Room Temperature Power Supply Range VDD, V Normal Fast Typ, us Max, us Typ, us Max, us Table 4.11 25 kHz OSC Frequency Settling Time Parameter Description Normal Fast Unit Frequency Settling Time To reach the 2.5% error 1 1 Cycles Note 4.5 The OSC frequency error during settling time is less than 10% 4.7.2. 2 MHz Oscillator Table 4.12 2 MHz OSC Frequency Limits Power Supply Range VDD, V Temperature Range Min, MHz Max, MHz Min, MHz Max, MHz Min, MHz Max, MHz Table 4.13 2 MHz OSC Frequency Error (Error Calculated in Relation to Nominal Value) Power Supply Range VDD, V Temperature Range Min Max Min Max Min Max Table 4.14 2 MHz OSC Power on time at Room Temperature Power Supply Range VDD, V Normal Fast Typ, us Max, us Typ, us Max, us

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 16 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Table 4.15 2 MHz OSC Frequency Settling Time Parameter Description Normal Fast Unit Frequency Settling Time To reach the 2.5% error 7 10 Cycles Note 4.6 The OSC frequency error during settling time is less than 10%

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 17 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 5. IO PINs 5.1. Input Modes Each of the IOs can be configured as a Digital Input with or without a buffered Schmitt trigger or they can also be configured as a Digital Input Low Voltage. 5.2. Output Modes All IOs except IO2 can be configurable as digital outputs. 5.3. Pull Up/Down Resistors All IOs have an option for user selectable resistors connected to the input structure , with the selectable values being 10 kΩ, 100 kΩ and 1 MΩ. In the case of IO2, the resistors are fixed to a pull -down configuration. In the case of all other IO pins, the internal resistors can be configured as pull-up or pull-downs. 5.4. IO Structure (for IO2) Figure 5.1. IO2 Structure Diagram w/o ST PAD RESD DOUT 4×1 AMUX S1 S0 1190k 900k Floating 10k EN ST LV EN EN 0 0 0 1 1 0 1 1 VSS VDD VSS PULL_R_VAL Definition DI w/o ST DI w/ ST DILV Reserved To Connection Matrix Input #·· IMC

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 18 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 5.5. IO Structure (for IO3, IO4, IO6, IO7, IO8) Figure 5.2. IO Structure Diagram w/o ST DOUT IN1 OUT IN0 1190k 900k Floating 10k EN ST LV EN EN 0 0 0 1 1 0 1 1 2×1 AMUX S PULL_R_DOWN_UP_SEL Q2 Q4 FORCE_IN_EN DIR 0 0 0 1 1 0 1 1 4×1 AMUX VSS VDD VSS VDD VDD VSS VSS VDD Q1 Q3 PULL_R_VAL Definition DI w/o ST DI w/ ST DILV Reserved Definition Push Pull OD NMOS OD PMOS Reserved OMC S1 S0 DRIVE_STRENGTH Driver Strength ×1 Driver Strength ×2 Note: <DIR> direction signal is set by register for IO3, IO6 and IO7 and by Connection Matrix for IO4 and IO8 To Connection Matrix Input #·· DIN PAD RESD From Connection Matrix Output #·· IMC

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 19 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 5.6. IO Register Settings 5.6.1. IO2 Register Settings Table 5.1 IO2 Register Settings Register Bit Address Register Name Register Definition IO2 <408:407> IO2_IMC Input mode control: 00: Digital Input without Schmitt trigger 01: Digital Input with Schmitt trigger 10: Digital Input Low Voltage 11: Reserved Pulled resistor value: 00: Floating 01: 10 k Resistor 10: 100 k Resistor 11: 1 M Resistor 5.6.2. IO3 Register Settings Table 5.2 IO3 Register Settings Register Bit Address Register Name Register Definition IO3 <404> IO3_DIR Direction: 0: Input 1: Output Force input: 0: Disable 1: Enable (Input is always ON) <413:412> IO3_IMC Input mode control: 00: Digital Input without Schmitt trigger 01: Digital Input with Schmitt trigger 10: Digital Input Low Voltage 11: Reserved <415:414> IO3_OMC Output mode control: 00: Push Pull 01: Open Drain NMOS 10: Open Drain PMOS 11: Reserved <337> IO3_DRIVE_STRENGTH Drive strength: 0: ×1 1: ×2 Pull resistor: 0: Down 1: Up Pulled resistor value: 00: Floating 01: 10 k Resistor 10: 100 k Resistor 11: 1 M Resistor

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 20 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 5.6.3. IO4 Register Settings Table 5.3 IO4 Register Settings Register Bit Address Register Name Register Definition IO4 Force input: 0: Disable 1: Enable (Input is always ON) <420:419> IO4_IMC Input mode control: 00: Digital Input without Schmitt trigger 01: Digital Input with Schmitt trigger 10: Digital Input Low Voltage 11: Reserved <422:421> IO4_OMC Output mode control: 00: Push Pull 01: Open Drain NMOS 10: Open Drain PMOS 11: Reserved <338> IO4_DRIVE_STRENGTH Drive strength: 0: ×1 1: ×2 Pull resistor: 0: Down 1: Up Pulled resistor value: 00: Floating 01: 10 k Resistor 10: 100 k Resistor 11: 1 M Resistor 5.6.4. IO6 Register Settings Table 5.4 IO6 Register Settings Register Bit Address Register Name Register Definition IO6 <405> IO6_DIR Direction: 0: Input 1: Output Force input: 0: Disable 1: Enable (Input is always ON) <427:426> IO6_IMC Input mode control: 00: Digital Input without Schmitt trigger 01: Digital Input with Schmitt trigger 10: Digital Input Low Voltage 11: Reserved <429:428> IO6_OMC Output mode control: 00: Push Pull 01: Open Drain NMOS 10: Open Drain PMOS 11: Reserved <339> IO6_DRIVE_STRENGTH Drive strength: 0: ×1 1: ×2 Pull resistor: 0: Down 1: Up

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 21 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Register Bit Address Register Name Register Definition IO6 Pulled resistor value: 00: Floating 01: 10 k Resistor 10: 100 k Resistor 11: 1 M Resistor

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 22 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 5.6.5. IO7 Register Settings Table 5.5 IO7 Register Settings Register Bit Address Register Name Register Definition IO7 <406> IO7_DIR Direction: 0: Input 1: Output Force input: 0: Disable 1: Enable (Input is always ON) <434:433> IO7_IMC Input mode control: 00: Digital Input without Schmitt trigger 01: Digital Input with Schmitt trigger 10: Digital Input Low Voltage 11: Reserved <436:435> IO7_OMC Output mode control: 00: Push Pull 01: Open Drain NMOS 10: Open Drain PMOS 11: Reserved <340> IO7_DRIVE_STRENGTH Drive strength: 0: ×1 1: ×2 Pull resistor: 0: Down 1: Up Pulled resistor value: 00: Floating 01: 10 k Resistor 10: 100 k Resistor 11: 1 M Resistor 5.6.6. IO8 Register Settings Table 5.6 IO8 Register Settings Register Bit Address Register Name Register Definition IO8 Force input: 0: Disable 1: Enable (Input is always ON) <441:440> IO8_IMC Input mode control: 00: Digital Input without Schmitt trigger 01: Digital Input with Schmitt trigger 10: Digital Input Low Voltage 11: Reserved <443:442> IO8_OMC Output mode control: 00: Push Pull 01: Open Drain NMOS 10: Open Drain PMOS 11: Reserved <341> IO8_DRIVE_STRENGTH Drive strength: 0: ×1 1: ×2 Pull resistor: 0: Down 1: Up

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 23 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Register Bit Address Register Name Register Definition IO8 Pulled resistor value: 00: Floating 01: 10 k Resistor 10: 100 k Resistor 11: 1 M Resistor

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 25 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Figure 6.3. Block Diagram of Connection Matrix 32×1 MUX #38 <201:197> 32×1 MUX #39 <206:202> 32×1 MUX #37 <196:192> 32×1 MUX <25:21> 32×1 MUX <20:16> <4:0> <9:5> 32×1 MUX #·· 32×1 MUX #·· <14:10> IO2 IN#1 IO3 IN#2 LOGIC_1 IN#31 IO8 IO7 DIR IN#4 IN#27 D DFF0 CLK nQ Q Connection Matrix OUT#3 OUT#4 OUT#38 OUT#39 OUT#37 32×1 MUX <30:26> #·· 32×1 MUX #·· 32×1 MUX #·· #36 <190:186> #·· #·· #··

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 26 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 6.2. Matrix Input Table Table 6.1. Matrix Input Table Matrix Input Number Matrix Input Signal Function Matrix Decode 4 3 2 1 0

00 Logic 0 0 0 0 0 0

01 IO2 DOUT 0 0 0 0 1

02 IO3 DOUT 0 0 0 1 0

03 IO4 DOUT 0 0 0 1 1

04 MF0(2-bit LUT0 / DFF0/LATCH0) OUT / Q 0 0 1 0 0

05 MF1(2-bit LUT1 / DFF1/LATCH1) OUT / Q 0 0 1 0 1

06 2-bit LUT2 OUT 0 0 1 1 0 07 2-bit LUT3 OUT 0 0 1 1 1

08 MF2(3-bit LUT0 / DFF2/LATCH2) OUT0 / Q 0 1 0 0 0

09 MF3(3-bit LUT1 / DFF3/LATCH3) OUT0 / Q 0 1 0 0 1

10 MF4(3-bit LUT2 / DFF4/LATCH4) OUT / Q 0 1 0 1 0

11 MF5(3-bit LUT3 / DFF5/LATCH5) OUT / Q 0 1 0 1 1

12 MF6(3-bit LUT4 / Shift Register) OUT0 0 1 1 0 0

13 MF6(3-bit LUT4 / Shift Register) OUT1/nOUT1 0 1 1 0 1

14 MF8(4-bit LUT0 / 16-bit TMR2) OUT 0 1 1 1 0

15 8-bit TMR0 OUT 0 1 1 1 1 16 8-bit TMR1 OUT 1 0 0 0 0 17 8-bit TMR3 OUT 1 0 0 0 1 18 8-bit TMR3 ED 1 0 0 1 0

19 MF7(PDLY / Edge Detector) OUT/nOUT 1 0 0 1 1

20 MF6(3-bit LUT8/ Shift Register) OUT2(LUT)/Q[1] 1 0 1 0 0

21 OSC OUT1 1 0 1 0 1

22 OSC OUT0 1 0 1 1 0

23 Ready 1 0 1 1 1

24 IO6 DOUT 1 1 0 0 0

25 IO7 DOUT 1 1 0 0 1

26 IO8 DOUT 1 1 0 1 0

27 MF0(2-bit LUT0 / DFF0/LATCH0) nQ 1 1 0 1 1

28 MF1(2-bit LUT1 / DFF1/LATCH1) nQ 1 1 1 0 0

29 MF2(3-bit LUT0 / DFF2/LATCH2) OUT1 / nQ 1 1 1 0 1

30 MF3(3-bit LUT1 / DFF3/LATCH3) OUT1 / nQ 1 1 1 1 0

31 Logic 1 1 1 1 1 1

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 27 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 6.3. Matrix Output Table Table 6.2. Matrix Output Table Register Bit Address Register Name Register Definition Connection matrix outputs <4:0> CMO0_IO3_DIN IO3 DIN <9:5> CMO1_IO4_DIN IO4 DIN <14:10> CMO2_IO4_DIR IO4 DIR <20:16> CMO3_MF0_2BLUT0_DFF0_IN0_CLK MF0(2-bit LUT0/DFF0/LATCH0) IN0/CLK/nL <25:21> CMO4_MF0_2BLUT0_DFF0_IN1_D MF0(2-bit LUT0/DFF0/LATCH0) IN1/D <30:26> CMO5_MF1_2BLUT1_DFF1_IN0_CLK MF1(2-bit LUT1/DFF1/LATCH1) IN0/CLK/nL <35:31> CMO6_MF1_2BLUT1_DFF1_IN1_D MF1(2-bit LUT1/DFF1LATCH1) IN1/D <40:36> CMO7_2BLUT2_IN0 2-bit LUT2 IN0 <48:44> CMO8_2BLUT2_IN1 2-bit LUT2 IN1 <53:49> CMO9_2BLUT3_IN0 2-bit LUT3 IN0 <58:54> CMO10_2BLUT3_IN1 2-bit LUT3 IN1 <63:59> CMO11_MF2_3BLUT0_DFF2_IN0_CLK MF2(3-bit LUT0/DFF2/LATCH2) IN0/CLK/nL <68:64> CMO12_MF2_3BLUT0_DFF2_IN1_D MF2(3-bit LUT0/DFF2/LATCH2) IN1/D <73:69> CMO13_MF2_3BLUT0_DFF2_IN2_NRST MF2(3-bit LUT0/DFF2/LATCH2) IN2/nRST <78:74> CMO14_MF3_3BLUT1_DFF3_IN0_CLK MF3(3-bit LUT1/DFF3/LATCH3) IN0/CLK/nL <83:79> CMO15_MF3_3BLUT1_DFF3_IN1_D MF3(3-bit LUT1/DFF3/LATCH3) IN1/D <89:85> CMO16_MF3_3BLUT1_DFF3_IN2_NRST MF3(3-bit LUT1/DFF3/LATCH3) IN2/nRST <94:90> CMO17_MF4_3BLUT2_DFF4_IN0_CLK MF4(3-bit LUT2/DFF4/LATCH4) IN0/CLK/nL <99:95> CMO18_MF4_3BLUT2_DFF4_IN1_D MF4(3-bit LUT2/DFF4/LATCH4) IN1/D <104:100> CMO19_MF4_3BLUT2_DFF4_IN2_NRST MF4(3-bit LUT2/DFF4/LATCH4) IN2/nRST <109:105> CMO20_MF5_3BLUT3_DFF5_IN0_CLK MF5(3-bit LUT3/DFF5/LATCH5) IN0/CLK/nL <114:110> CMO21_MF5_3BLUT3_DFF5_IN1_D MF5(3-bit LUT3/DFF5/LATCH5) IN1/D <119:115> CMO22_MF5_3BLUT3_DFF5_IN2_NRST MF5(3-bit LUT3/DFF5/LATCH5) IN2/nRST <124:120> CMO23_MF6_3BLUT4_SH_REG_IN0_D MF6(3-bit LUT4/Shift Register) IN0/D <129:125> CMO24_MF6_3BLUT4_SH_REG_IN1_NRST MF6(3-bit LUT4/Shift Register) IN1/nRST <134:130> CMO25_MF6_3BLUT4_SH_REG_IN2_CLK MF6(3-bit LUT4/Shift Register) IN2/CLK <139:135> CMO26_MF8_4BLUT0_16BTMR2_IN0_CLK MF8(4-bit LUT0/16-bit TMR2) IN0/CLK <145:141> CMO27_MF8_4BLUT0_16BTMR2_IN1_RST MF8(4-bit LUT0/16-bit TMR2) IN1/RST <150:146> CMO28_MF8_4BLUT0_16BTMR2_IN2_KEEP MF8(4-bit LUT0/16-bit TMR2) IN2/KEEP <155:151> CMO29_MF8_4BLUT0_16BTMR2_IN3_UP MF8(4-bit LUT0/16-bit TMR2) IN3/UP <160:156> CMO30_8BTMR0_IN_RST 8-bit TMR0 IN/RST <165:161> CMO31_8BTMR1_IN_RST 8-bit TMR1 IN/RST <170:166> CMO32_8BTMR0_8BTMR1_CLK 8-bit TMR0/8-bit TMR1 CLK <175:171> CMO33_8BTMR3_IN_CLK 8-bit TMR3 IN/CLK <180:176> CMO34_MF7_PDLY_ED_IN MF7(PDLY/Edge Detector) IN <185:181> CMO35_OSC_PWR_DWN OSC PWR DWN <190:186> CMO36_IO6_DIN IO6 DIN <196:192> CMO37_IO7_DIN IO7 DIN <201:197> CMO38_IO8_DIN IO8 DIN <206:202> CMO39_IO8_DIR IO8 DIR

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 28 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 7. Combinatorial Logic Two Look Up Tables (LUTs) within the ALM1108 provide the support for c ombinatorial logic. There are two 2 -bit LUTs, and there are eight Multifunctional Macrocells that can be used as LUTs. For more details, please see Section 8 Multifunctional Macrocells. 7.1. 2-bit LUT The 2-bit LUT (Figure 7.1) takes in two input signals from the connection matrix and produces a single output, that goes back into the connection matrix. The LUT allows to implement user-defined combinatorial logic function, including standard digital logic gates (AND, NAND, OR, NOR, XOR, XNOR). Standard logic gates configuration of the LUT is shown in the Table 7.1. Table 7.1. Truth Table of Standard Logic Gates Function MSB LSB AND-2 1 0 0 0 NAND-2 0 1 1 1 OR-2 1 1 1 0 NOR-2 0 0 0 1 XOR-2 0 1 1 0 XNOR-2 1 0 0 1 Figure 7.1. 2-bit LUTs 7.1.1. 2-bit LUT2 Macrocell Registers of 2-bit LUT2 defined its output function set out in Table 7.2. Table 7.2. 2-bit LUT2 Truth Table Register Bit Address Register Name Register Definition 2-bit LUT2 <230:227> 2BLUT2_CTRL_DATA OUT LUT control data 7.1.2. 2-bit LUT3 Macrocell Registers of 2-bit LUT3 defined its output function set out in Table 7.3). Table 7.3. 2-bit LUT3 Truth Table Register Bit Address Register Name Register Definition 2-bit LUT0 <234:231> 2BLUT2_CTRL_DATA OUT LUT control data To Connection Matrix Input #·· IN0From Connection Matrix Output #·· IN1From Connection Matrix Output #·· 2-bit LUT 4×1 MUX CTRL_DATA

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 29 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 8. Multifunctional Macrocells Nine multifunction macrocells (MF) in the ALM1108 can serve more than one logic or timing function. They can serve as a Look Up Table (LUT) or as another logic or timing function in four of the cases. Functions that can be implemented in these macrocells:

  • Two selectable 2-bit LUTs or DFF/LATCHs;
  • Four selectable 3-bit LUTs or DFF/LATCHs;
  • One 3-bit LUT or 16-bit Shift Register;
  • One 4-bit LUT or 8-Bit TMR;
  • One Programmable Delay or Edge Detector. 8.1. MF (2-bit LUT / DFF/LATCH) Macrocells The ALM1108 has MF macrocells capable of serving as either 2-bit LUTs, DFFs or LATCHs (see Figure 8.1). When the MF macrocells are used as LUT, the 2-bit LUT takes in two input signals from the connection matrix and produces a single output, that goes back into the connection matrix. The LUT allows to implement user-defined combinatorial logic function, including standard digital logic gates (AND, NAND, OR, NOR, XOR, XNOR). Standard logic gates configuration of the LUT is shown in the Table 8.1. When the macrocells are used as DFF or LATCH, the two input signals from the connection matrix go to the data (D) and clock/ nlatch (CLK/nL) inputs for the DFF/LATCH, and the output s Q and nQ go back to the connection matrix. Operation of the DFF and LATCH are shown in the Table 8.2, Table 8.3. Table 8.1. 2-bit LUT Truth Table of Standard Logic Gates Function MSB LSB AND-2 1 0 0 0 NAND-2 0 1 1 1 OR-2 1 1 1 0 NOR-2 0 0 0 1 XOR-2 0 1 1 0 Table 8.2. Operation of the DFF D CLK Q(t)/nQ(t) 0 0/1 0 t–1 1 1/0 1 t–1 Note 8.1: X – Don’t Care Note 8.2: t–1 – Previous State Table 8.3. Operation of the LATCH nL D Q(t)/nQ(t) 0 0 t–1 0 1 t–1 1 0 0/1 1 1 1/0 Note 8.3: X – Don’t Care Note 8.4: t–1 – Previous State

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 30 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Figure 8.1. Schematic diagram of mf (2-bit LUT/DFF/LATCH) 8.1.1. MF0 (2-bit LUT0/DFF0/LATCH0) Macrocell Register settings of MF0 (2-bit LUT0/DFF0/LATCH0) macrocell set out in Table 8.4. Table 8.4. MF0 (2-bit LUT0/DFF0/LATCH0) Register Settings Register Bit Address Register Name Register Definition MF0 (2-bit LUT0/DFF0/LATCH0) <235> MF0_MODE MF mode: 0: LUT 1: DFF/LATCH 0th bit of LUT control data: 0: LOW 1: HIGH or DFF/LATCH selection: 0: DFF 1: LATCH 1st bit of LUT control data: 0: LOW 1: HIGH 2nd bit of LUT control data: 0: LOW 1: HIGH or Initial state of DFF/LATCH: 0: LOW 1: HIGH 3rd bit of LUT control data: 0: LOW 1: HIGH 1×2 DEMUX 2×1 MUX 0 0 0 1 1 0 1 1 4×1 MUX 1×2 DEMUX IN0 IN1 MODE OUT Q To Connection Matrix Input #·· IN0 CLK/nL IN1 D From Connection Matrix Output #·· From Connection Matrix Output #·· 2-bit LUT/DFF/LATCH LUT_CTRL_DATA_2_DFF_LATCH_INIT_STATE LUT_CTRL_DATA_3 LUT_CTRL_DATA_1 nQ To Connection Matrix Input #·· D DFF/LATCH CLK/nL Q nQ

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 31 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. The MF0 ( 2-bit LUT0 /DFF0/LATCH0) macrocell, if programmed for a LUT function, uses 4-bit register to define its output function by reg<218:215> (see Table 8.5). Table 8.5. 2-bit LUT0 Truth Table IN1 IN0 OUT 0 0 MF0_LUT_CTRL_DATA_0_DFF_LATCH_SEL LSB 0 1 MF0_LUT_CTRL_DATA_1 1 0 MF0_LUT_CTRL_DATA_2_DFF_LATCH_INIT_STATE 1 1 MF0_LUT_CTRL_DATA_3 MSB 8.1.2. MF1 (2-bit LUT1/DFF1/LATCH1) Macrocell Register settings of MF1 (2-bit LUT1/DFF1/LATCH1) macrocell set out in Table 8.6. Table 8.6. MF1 (2-bit LUT1/DFF1/LATCH1) Register Settings Register Bit Address Register Name Register Definition MF1 (2-bit LUT1/DFF1/LATCH1) <236> MF1_MODE MF mode: 0: LUT 1: DFF/LATCH 0th bit of LUT control data: 0: LOW 1: HIGH or DFF/LATCH selection: 0: DFF 1: LATCH 1st bit of LUT control data: 0: LOW 1: HIGH 2nd bit of LUT control data: 0: LOW 1: HIGH or Initial state of DFF/LATCH: 0: LOW 1: HIGH 3rd bit of LUT control data: 0: LOW 1: HIGH The MF1 ( 2-bit LUT1 /DFF1/LATCH1) macrocell, if programmed for a LUT function, uses 4-bit register to define its output function by reg<223:220> (see Table 8.7). Table 8.7. 2-bit LUT1 Truth Table IN1 IN0 OUT 0 0 MF1_LUT_CTRL_DATA_0_DFF_LATCH_SEL LSB 0 1 MF1_LUT_CTRL_DATA_1 1 0 MF1_LUT_CTRL_DATA_2_DFF_LATCH_INIT_STATE 1 1 MF1_LUT_CTRL_DATA_3 MSB

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 32 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 8.2. MF (3-bit LUT / DFF/LATCH) Macrocells The ALM1108 has a MF macrocell that can serve as either 3-bit LUTs or as DFF/LATCHs (Figure 8.2, Figure 8.3). When the MF macrocells are used as LUT, the 3-bit LUT takes in three input signals from the connection matrix and produces a single output for 3-bit LUT2 and 3-bit LUT3, and two outputs for 3 -bit LUT0 and 3 -bit LUT1, that go back into the connection matrix. The LUT allows to implement user-defined combinatorial logic function, including standard digital logic gates (AND, NAND, OR, NOR, XOR, XNOR). Standard logic gates configuration of the LUT is shown in the Table 8.8. When the macrocells are used as DFF or LATCH, the three input signals from the connection matrix go to the data (D), clock/nlatch (CLK/nL) and (n)RST/(n)SET inputs of the DFF/LATCH, and the output(DFF4/LATCH4, DFF5/LATCH5) or outputs(DFF2/LATCH2, DFF3/LATCH3) go back to the connection matrix. Operation of the DFF and LATCH are shown in the Table 8.9, Table 8.10. Table 8.8. 3-bit LUT Truth Table of Standard Logic Gates Function MSB LSB AND-3 1 0 0 0 0 0 0 0 NAND-3 0 1 1 1 1 1 1 1 OR-3 1 1 1 1 1 1 1 0 NOR-3 0 0 0 0 0 0 0 1 XOR-3 1 0 0 1 0 1 1 0 XNOR-3 0 1 1 0 1 0 0 1 Table 8.9. Operation of the DFF nRST/nSET D CLK Q(t) nRST = 0 X X 0/1 nSET = 0 X X 1/0 1 0 0/1 1 0 t–1 1 1 1/0 1 1 t–1 Note 8.5: X – Don’t Care Note 8.6: t–1 – Previous State Table 8.10. Operation of the LATCH nRST/nSET nL D Q(t)/nQ(t) nRST = 0 X X 0/1 nSET = 0 X X 1/0 1 0 0 t–1 1 0 1 t–1 1 1 0 0/1 1 1 1 1/0 Note 8.7: X – Don’t Care Note 8.8: t–1 – Previous State

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 33 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Figure 8.2. Schematic diagram of MF (3-bit LUT/DFF/LATCH) (with 2 OUTs and nRST/nSET) 1×2 DEMUX D DFF/LATCH CLK/nL nRST/nSET Q/nQ 2×1 MUX 0 0 0 0 0 1 0 1 0 0 1 1 1 0 0 1 0 1 1 1 0 1 1 1 8×1 MUX 1×2 DEMUX IN0 IN1 MODE OUT0 Q To Connection Matrix Input #·· IN0 CLK/nL IN1 D From Connection Matrix Output #·· From Connection Matrix Output #·· 1×2 DEMUX IN2 nRST/nSET From Connection Matrix Output #·· IN2 OUT 3-bit LUT/DFF/LATCH LUT_CTRL_DATA0_0_DFF_LATCH_SEL LUT_CTRL_DATA0_4 LUT_CTRL_DATA0_1 LUT_CTRL_DATA0_2_DFF_LATCH_NRST_NSET_SEL LUT_CTRL_DATA0_3_DFF_LATCH_INIT_STATE LUT_CTRL_DATA0_5 LUT_CTRL_DATA0_6 LUT_CTRL_DATA0_7 2×1 MUX OUT1 nQ To Connection Matrix Input #·· nQ 8×1 MUX CTRL_DATA1 IN0IN1IN2

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 34 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Figure 8.3. Schematic diagram of MF (3-bit LUT/DFF/LATCH) (with single OUT and nRST/nSET) 1×2 DEMUX D DFF/LATCH CLK/nL nRST/nSET Q/nQ 2×1 MUX 0 0 0 0 0 1 0 1 0 0 1 1 1 0 0 1 0 1 1 1 0 1 1 1 8×1 MUX 1×2 DEMUX IN0 IN1 MODE OUT Q/nQ To Connection Matrix Input #·· IN0 CLK/nL IN1 D From Connection Matrix Output #·· From Connection Matrix Output #·· 1×2 DEMUX IN2 nRST/nSET From Connection Matrix Output #·· IN2 OUT 3-bit LUT/DFF/LATCH LUT_CTRL_DATA_4 LUT_CTRL_DATA_3_DFF_LATCH_INIT_STATE LUT_CTRL_DATA_5 LUT_CTRL_DATA_6 LUT_CTRL_DATA_7

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 35 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 8.2.1. MF2 (3-bit LUT0/DFF2/LATCH2) Schematic diagram of MF2 (3-bit LUT0/DFF2/LATCH2) macrocell is shown in Figure 8.2. Its register settings set out in Table 8.11. Table 8.11. MF2 (3-bit LUT0/DFF2/LATCH2) Register Settings Register Bit Address Register Name Register Definition MF2 (3-bit LUT0/DFF2/LATCH2) <293> MF2_MODE MF mode: 0: LUT 1: DFF/LATCH 0th bit of OUT0 LUT control data: 0: LOW 1: HIGH or DFF/LATCH selection: 0: DFF 1: LATCH 1st bit of OUT0 LUT control data: 0: LOW 1: HIGH 2nd bit of OUT0 LUT control data: 0: LOW 1: HIGH or nRESET/nSET selection: 0: nRST 1: nSET 3rd bit of OUT0 LUT control data: 0: LOW 1: HIGH or Initial state of DFF/LATCH: 0: LOW 1: HIGH 4th bit of OUT0 LUT control data: 0: LOW 1: HIGH 5th bit of OUT0 LUT control data: 0: LOW 1: HIGH 6th bit of OUT0 LUT control data: 0: LOW 1: HIGH 7th bit of OUT0 LUT control data: 0: LOW 1: HIGH <252:245> MF2_LUT_CTRL_DATA1 OUT1 LUT control data The MF2 ( 3-bit LUT0 /DFF2/LATCH2) macrocell, if programmed for a LUT function, uses 8-bit register to define its output function (see Table 8.12): OUT0 by reg<244:237>; OUT1 by reg<252:245>. Table 8.12. 3-bit LUT0 Truth Table IN2 IN1 IN0 OUT0 OUT0 0 0 0 MF2_LUT_CTRL_DATA0_0_DFF_LATCH_SEL MF2_CTRL_DATA1<0> LSB 0 0 1 MF2_LUT_CTRL_DATA0_1 MF2_CTRL_DATA1<1> 0 1 0 MF2_LUT_CTRL_DATA0_2_DFF_LATCH_NRST_NSET_SE L MF2_CTRL_DATA1<2> 0 1 1 MF2_LUT_CTRL_DATA0_3_DFF_LATCH_INIT_STATE MF2_CTRL_DATA1<3> 1 0 0 MF2_LUT_CTRL_DATA0_4 MF2_CTRL_DATA1<4>

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 36 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. IN2 IN1 IN0 OUT0 OUT0 1 0 1 MF2_LUT_CTRL_DATA0_5 MF2_CTRL_DATA1<5> 1 1 0 MF2_LUT_CTRL_DATA0_6 MF2_CTRL_DATA1<6> 1 1 1 MF2_LUT_CTRL_DATA0_7 MF2_CTRL_DATA1<7> MSB 8.2.2. MF3 (3-bit LUT1/DFF3/LATCH3) Schematic diagram of MF3 (3-bit LUT1/DFF3/LATCH3) macrocell is shown in Figure 8.2. Its register settings set out in Table 8.13. Table 8.13. MF3 (3-bit LUT1/DFF3/LATCH3) Register Settings Register Bit Address Register Name Register Definition MF3 (3-bit LUT1/DFF3/LATCH3) <294> MF3_MODE MF mode: 0: LUT 1: DFF/LATCH 0th bit of OUT0 LUT control data: 0: LOW 1: HIGH or DFF/LATCH selection: 0: DFF 1: LATCH 1st bit of OUT0 LUT control data: 0: LOW 1: HIGH 2nd bit of OUT0 LUT control data: 0: LOW 1: HIGH or nRESET/nSET selection: 0: nRST 1: nSET 3rd bit of OUT0 LUT control data: 0: LOW 1: HIGH or Initial state of DFF/LATCH: 0: LOW 1: HIGH 4th bit of OUT0 LUT control data: 0: LOW 1: HIGH 5th bit of OUT0 LUT control data: 0: LOW 1: HIGH 6th bit of OUT0 LUT control data: 0: LOW 1: HIGH 7th bit of OUT0 LUT control data: 0: LOW 1: HIGH <268:261> MF3_LUT_CTRL_DATA1 OUT1 LUT control data The MF3 (3-bit LUT1 /DFF3/LATCH3) macrocell, if programmed for a LUT function, uses 8-bit register to define its output function (see Table 8.14): OUT0 by reg<260:253>; OUT1 by reg<268:261>.

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 37 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Table 8.14. 3-bit LUT1 Truth Table IN2 IN1 IN0 OUT0 OUT0 0 0 0 MF3_LUT_CTRL_DATA0_0_DFF_LATCH_SEL MF3_CTRL_DATA1<0> LSB 0 0 1 MF3_LUT_CTRL_DATA0_1 MF3_CTRL_DATA1<1> 0 1 0 MF3_LUT_CTRL_DATA0_2_DFF_LATCH_NRST_NSET_SEL MF3_CTRL_DATA1<2> 0 1 1 MF3_LUT_CTRL_DATA0_3_DFF_LATCH_INIT_STATE MF3_CTRL_DATA1<3> 1 0 0 MF3_LUT_CTRL_DATA0_4 MF3_CTRL_DATA1<4> 1 0 1 MF3_LUT_CTRL_DATA0_5 MF3_CTRL_DATA1<5> 1 1 0 MF3_LUT_CTRL_DATA0_6 MF3_CTRL_DATA1<6> 1 1 1 MF3_LUT_CTRL_DATA0_7 MF3_CTRL_DATA1<7> MSB 8.2.3. MF4 (3-bit LUT2/DFF4/LATCH4) Schematic diagram of MF4 (3-bit LUT2/DFF4/LATCH4) macrocell is shown in Figure 8.3. Its register settings set out in Table 8.15. Table 8.15. MF4 (3-bit LUT2/DFF4/LATCH4) Register Settings Register Bit Address Register Name Register Definition MF4 (3-bit LUT2/DFF4/LATCH4) <295> MF4_MODE MF mode: 0: LUT 1: DFF/LATCH 0th bit of OUT0 LUT control data: 0: LOW 1: HIGH or DFF/LATCH selection: 0: DFF 1: LATCH 1st bit of OUT0 LUT control data: 0: LOW 1: HIGH or Q polarity of DFF/LATCH: 0: Q 1: nQ 2nd bit of OUT0 LUT control data: 0: LOW 1: HIGH or nRESET/nSET selection: 0: nRST 1: nSET 3rd bit of OUT0 LUT control data: 0: LOW 1: HIGH or Initial state of DFF/LATCH: 0: LOW 1: HIGH 4th bit of OUT0 LUT control data: 0: LOW 1: HIGH 5th bit of OUT0 LUT control data: 0: LOW 1: HIGH 6th bit of OUT0 LUT control data: 0: LOW 1: HIGH

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 38 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Register Bit Address Register Name Register Definition MF4 (3-bit LUT2/DFF4/LATCH4) 7th bit of OUT0 LUT control data: 0: LOW 1: HIGH The MF4 ( 3-bit LUT2 /DFF4/LATCH4) macrocell, if programmed for a LUT function, uses 8-bit register to define its output function by reg<276:269> (see Table 8.16). Table 8.16. 3-bit LUT2 Truth Table IN2 IN1 IN0 OUT 0 0 0 MF4_LUT_CTRL_DATA0_DFF_LATCH_SEL LSB 0 0 1 MF4_LUT_CTRL_DATA1_DFF_LATCH_Q_POL 0 1 0 MF4_LUT_CTRL_DATA2_DFF_LATCH_NRST_NSET_SEL 0 1 1 MF4_LUT_CTRL_DATA3_DFF_LATCH_INIT_STATE 1 0 0 MF4_LUT_CTRL_DATA4_DFF_LATCH 1 0 1 MF4_LUT_CTRL_DATA_5 1 1 0 MF4_LUT_CTRL_DATA_6 1 1 1 MF4_LUT_CTRL_DATA_7 MSB 8.2.4. MF5 (3-bit LUT3/DFF5/LATCH5) Schematic diagram of 3-bit MF5 (LUT3/DFF5/LATCH5) macrocell is shown in Figure 8.3. Its register settings set out in Table 8.21. Table 8.17. MF5 (3-bit LUT3/DFF5/LATCH5) Register Settings Register Bit Address Register Name Register Definition MF5 (3-bit LUT3/DFF5/LATCH5) <296> MF5_MODE MF mode: 0: LUT 1: DFF/LATCH 0th bit of OUT0 LUT control data: 0: LOW 1: HIGH or DFF/LATCH selection: 0: DFF 1: LATCH 1st bit of OUT0 LUT control data: 0: LOW 1: HIGH or Q polarity of DFF/LATCH: 0: Q 1: nQ 2nd bit of OUT0 LUT control data: 0: LOW 1: HIGH or nRESET/nSET selection: 0: nRST 1: nSET 3rd bit of OUT0 LUT control data: 0: LOW 1: HIGH or Initial state of DFF/LATCH: 0: LOW 1: HIGH

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 39 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Register Bit Address Register Name Register Definition MF5 (3-bit LUT3/DFF5/LATCH5) 4th bit of OUT0 LUT control data: 0: LOW 1: HIGH 5th bit of OUT0 LUT control data: 0: LOW 1: HIGH 6th bit of OUT0 LUT control data: 0: LOW 1: HIGH 7th bit of OUT0 LUT control data: 0: LOW 1: HIGH The MF5 ( 3-bit LUT3 /DFF5/LATCH5) macrocell, if programmed for a LUT function, uses 8-bit register to define its output function by reg<284:277> (see Table 8.18). Table 8.18. 3-bit LUT3 Truth Table IN2 IN1 IN0 OUT 0 0 0 MF5_LUT_CTRL_DATA0_DFF_LATCH_SEL LSB 0 0 1 MF5_LUT_CTRL_DATA1_DFF_LATCH_Q_POL 0 1 0 MF5_LUT_CTRL_DATA2_DFF_LATCH_NRST_NSET_SEL 0 1 1 MF5_LUT_CTRL_DATA3_DFF_LATCH_INIT_STATE 1 0 0 MF5_LUT_CTRL_DATA4_DFF_LATCH 1 0 1 MF5_LUT_CTRL_DATA_5 1 1 0 MF5_LUT_CTRL_DATA_6 1 1 1 MF5_LUT_CTRL_DATA_7 MSB 8.3. MF (3-bit LUT/Shift Register) Macrocell The MF macrocell has a capability to serve as either a 3-bit LUT or as a Shift Register (SHR). When the MF macrocell is used as LUT, the 3 -bit LUT takes in three input signals from the connection matrix and produces a single output, that go back into the connection matrix. The LUT allows to implement user-defined combinatorial logic function, including standard digital logic gates (AND, NAND, OR, NOR, XOR, XNOR). Standard logic gates configuration of the LUT is shown in the Table 8.19. The Shift Register contains sixteen stages cascade of positive edge triggered DFFs. The signal from any stage can be routed t o OUT0 and OUT1 independently. The Q[1] output is always connected to the output of the first stage. The Shift Register has Data (D ), Clock (CLK) and Reset (nRST) inputs from connection matrix. Applying low-level signal to the nRST sets all stage values to zero. Schematic diagram of 3-bit LUT4/Shift Register macrocell is shown on Figure 8.4.

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 40 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Figure 8.4. 3-bit LUT4/Shift Register Table 8.19. 3-bit LUT Truth Table of Standard Logic Gates Function MSB LSB AND-3 1 0 0 0 0 0 0 0 NAND-3 0 1 1 1 1 1 1 1 OR-3 1 1 1 1 1 1 1 0 NOR-3 0 0 0 0 0 0 0 1 XOR-3 1 0 0 1 0 1 1 0 XNOR-3 0 1 1 0 1 0 0 1 IN0 D IN1 nRST From Connection Matrix Output #·· From Connection Matrix Output #·· IN2 CLK From Connection Matrix Output #·· D DFF0 CLK nRST Q[1] 2×1 MUX 8×1 MUX IN0IN1 MODE OUT(LUT) Q[1] To Connection Matrix Input #·· IN2 OUT STAGE_OUT0 STAGE_OUT1 CTRL_DATA 16×1 MUX D DFF1 CLK nRST Q[2] D DFF·· CLK nRST Q[##] D DFF15 CLK nRST Q[16] 16×1 MUX Q[1] OUT0 To Connection Matrix Input #·· 2×1 MUX OUT1 nOUT1 To Connection Matrix Input #·· SHIFT_REG_OUT1_POL Q[1] 1×2 DEMUX 1×2 DEMUX 1×2 DEMUX 3-bit LUT/Shift Register

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 41 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 8.3.1. MF6 (3-bit LUT4/Shift Register) The MF registers set out in Table 8.20. Table 8.20. MF6 (3-bit LUT4/Shift Register) Registers Settings Register Bit Address Register Name Register Definition MF6 (3-bit LUT4/Shift Register) <297> MF6_MODE MF mode: 0: LUT 1: Shift register Shift register OUT1 polarity: 0: OUT1 1: nOUT1 <288:285> MF6_LUT_CTRL_DATA3_0_SHIFT_REG_STAGE_OUT0 Low tetrad of OUT LUT control data or stage of OUT0 shift register <292:289> MF6_LUT_CTRL_DATA7_4_SHIFT_REG_STAGE_OUT1 High tetrad of OUT LUT control data or stage of OUT1 shift register The MF6 ( 3-bit LUT4 /Shift Register ) macrocell, if programmed for a LUT function, uses 8-bit register to define its output function by reg<292:285> (see Table 8.21). Table 8.21. 3-bit LUT4 Truth Table IN2 IN1 IN0 OUT 0 0 0 MF6_LUT_CTRL_DATA3_0_SHIFT_REG_STAGE_OUT0<0> LSB 0 0 1 MF6_LUT_CTRL_DATA3_0_SHIFT_REG_STAGE_OUT0<1> 0 1 0 MF6_LUT_CTRL_DATA3_0_SHIFT_REG_STAGE_OUT0<2> 0 1 1 MF6_LUT_CTRL_DATA3_0_SHIFT_REG_STAGE_OUT0<3> 1 0 0 MF6_LUT_CTRL_DATA7_4_SHIFT_REG_STAGE_OUT1<0> 1 0 1 MF6_LUT_CTRL_DATA7_4_SHIFT_REG_STAGE_OUT1<1> 1 1 0 MF6_LUT_CTRL_DATA7_4_SHIFT_REG_STAGE_OUT1<2> 1 1 1 MF6_LUT_CTRL_DATA7_4_SHIFT_REG_STAGE_OUT1<3> MSB 8.4. MF (PDLY/Edge Detector) - Programmable Delay/Edge Detector Macrocell The ALM1108 has a macrocell that can serve as programmable delay (PDLY) or as edge detector (Figure 8.5). In the PDLY mode the macrocell serves as both edge delay with four selectable delay value TADJ: 140 ns, 280 ns, 420 ns, 560 ns. If input signal is shorter than the delay value, the signal does not propagate to the output and is filtered out. In the Edge Detector mode, the macrocell generates a high level pulse (for non -inverted polarity) when detecting the respective selected edge event (rising edge, falling edge, both edges). The pulse width value (TWIDTH) is configurable (140 ns, 280 ns, 420 ns, 560 ns). See the timing diagrams below for further information (Figure 8.6). The output polarity of the macrocell is configurable and can be selected as non-inverted or inverted.

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 43 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Register Bit Address Register Name Register Definition MF7 (PDLY/Edge Detector) <462:461> MF7_DELAY_VAL Delay value: 00: 140ns 01: 280ns 10: 420ns 11: 560ns 8.5. MF (4-bit LUT0/16-Bit Timer) Macrocells One macrocell has the capability to serve as 4-bit LUTs or as 16-bit timer (TMR) (Figure 8.7). When the MF macrocell is configured as LUT, the 4 -bit LUT receives four input signals from the connection matrix and generates a single output, which is routed back into the connection matrix. The LUT allows the implementation of user-defined combinatorial logic function, including standard digital logic gates (AND, NAND, OR, NOR, XOR, XNOR). Standard logic gates configuration of the LUT are shown in the Table 8.23. When the macrocell is configured as 16-bit TMR, four input signals from the connection matrix go to the external clock (EXTCLK), IN (RST for Counter mode), KEEP and UP. The output signal is routed back to the connection matrix. The timer has the following mode of operation:

  • Delay
  • Counter
  • One Shot
  • Frequency Detector The output polarity of the TMR is configurable and can be selected as non-inverted or inverted. The KEEP input allows to pause counting by applying HIGH level to KEEP, the counting is resume after KEEP goes LOW. In the Delay mode the TMR delays the input signal by the selected edge event (rising edge, falling edge, both edges) for a ti me determined by the Control Data, input clock signal and selected divider value. If input signal is shorter than the delay value, the signal does not propagate to the output. The timing diagrams of this mode is shown in the Figure 9.1…Figure 9.6. In the Counter mode the TMR divides input clock signal by the value determined by the Control Data, input clock signal and selected divider value. The output of the TMR goes HIGH every time when the Counted Value (current value of the counter) is equal 0. The RST in of the TMR reset Counted value to 0 by one of the following events: rising edge, falling edge, both edge, high level. The timing dia grams of this mode is shown in the Figure 9.7…Figure 9.12. The TMR2 also support Up/Down counting mode. By default, the counter decrements. The counting direction reverses when a HIGH level is applied to the UP input. Counting can be paused by applying a HIGH level to the KEEP input. The count resumes when the level goes LOW. Timing diagrams of the Up/Down mode are shown in Figure 9.32…Figure 9.35. In One-Shot mode this macrocell generates a high-level pulse with a set width, when detecting the edge event, which is selectable by the registers, on its IN input. The pulse width is determined by the Control Data, input clock signal and selected divider value. Any incoming edges are ignored during pulse width generation. The timing diagrams of this mode is shown in the Figure 9.13…Figure 9.18. In Frequency Detector mode the TMR function following scenarios:
  • Rising Edge: The output will go HIGH if the time between two rising edges is less than the delay. The output will go LOW if the next rising edge has not come after the last rising edge in specified time.
  • Falling Edge: The output will go HIGH if the time between two falling edges is less than the set time. The output will go LOW if the next falling edge has not come after the last falling edge in specified time.
  • Both Edges: The output will go HIGH if the time between the rising and falling edges is less than the set time, which is equivalent to the length of the pulse. The output will go LOW if the next rising/falling edge has not come after the last falling/rising edge in specified time. The timing diagrams of the Frequency Detector Mode is shown in the Figure 9.19…Figure 9.24.

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 44 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Time of Timers for each mode can be calculated using the following formulas (Note 8.9, Note 8.10):

  • Delay (Figure 9.1…Figure 9.6) Delay Time = (Control Data + 1 + VAR)/FCLK;
  • Counter Figure 9.7…Figure 9.12, Figure 9.32…Figure 9.35) Output Period = (Control Data + 1)/FCLK; Output Frequency = FCLK/(Control Data + 1);
  • One Shot (Figure 9.13…Figure 9.18) Pulse width = (Control Data + 1 + VAR)/FCLK;
  • Frequency Detector (Figure 9.19…Figure 9.24) Detected Frequency = FCLK/(Control Data + 1 + VAR). Note 8.9 FCLK – CLK input frequency. Note 8.10 VAR = 0…1 – defined by the asynchronous time between the input signal and the first clock pulse. Note 8.11 Counters initialize with Control Data after POR. Table 8.23. 4-bit LUT Truth Table of Standard Logic Gates Function MSB LSB AND-4 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 NAND-4 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 OR-4 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 NOR-4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 XOR-4 0 1 1 0 1 0 0 1 1 0 0 1 0 1 1 0 XNOR-4 1 0 0 1 0 1 1 0 0 1 1 0 1 0 0 1

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 45 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Figure 8.7. 4-bit LUT0/TMR2 0 0 0 0 0 1 0 1 0 0 1 1 1 0 0 1 0 1 1 1 0 1 1 1 8×1 MUX 1×2 DEMUX IN3 UP From Connection Matrix Output #·· 2×1 MUX 16×1 MUX 1×2 DEMUX IN2 KEEP From Connection Matrix Output #·· 1×2 DEMUX IN1 IN/RST From Connection Matrix Output #·· 1×2 DEMUX IN0 CLK From Connection Matrix Output #·· CTRL_DATA IN0IN1IN2IN3 OUT To Connection Matrix Input #·· TMR_MODE 0 0 0 1 1 0 1 1 Definition Delay One Shot Frequency Detector Counter TMR_TRIG_EVENT 0 0 0 1 1 0 1 1 Definition Both Edge Falling Edge Rising Edge High Level RST TMR_OUT_POL TMR_RST_FUNC TMR_CLK MODE EXT CLK IN/RST 16-bit Timer CLK UP KEEP 4-bit LUT/16-bit TMR TMR_INIT_STATE 0 0 0 1 1 0 1 1 Definition Initial 0 Initial 1 Bypass initial Bypass initial

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 46 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 8.5.1. MF8 (4-bit LUT0/TMR2) Settings of MF8 (4-bit LUT0/TMR2) is set out in Table 8.24. Table 8.24. MF8 (4-bit LUT0/TMR2) Register Settings Register Bit Address Register Name Register Definition MF8 (3-bit LUT9/8-bit TMR1) <314:299> MF8_CTRL_DATA MF control data <316:315> MF8_TMR_MODE Timer mode: 00: Delay 01: One shot 10: Frequency detector 11: Counter <319:317> MF8_TMR_CLK CLK source: 000: OSC 001: OSC/4 010: OSC/8 011: OSC/16 100: OSC/64 101: OSC/128 110: External CLK 111: TMR1_OUT <321:320> MF8_TMR_TRIG_EVENT Timer trigger event: 00: On both falling and rising edges 01: On falling edge only 10: On rising edge only 11: High level reset (counter) Reset functionality: 0: Reset to 0 1: Set to Control data Polarity of timer output: 0: OUT 1: nOUT <324> MF8_MODE MF mode: 0: LUT 1: Timer <488:487> MF8_TMR_INIT_STATE Timer initial state: 00: Initial 0 01: Initial 1 10: Bypass initial 11: Bypass initial The MF8 (4-bit LUT0/TMR2) macrocell, if programmed for a LUT function, uses 16-bit register to define its output function by reg<314:299> (see Table 8.12). Table 8.25. MF8 (4-bit LUT0) Truth Table IN3 IN2 IN1 IN0 OUT 0 0 0 0 MF8_CTRL_DATAL<0> LSB 0 0 0 1 MF8_CTRL_DATAL<1> 0 0 1 0 MF8_CTRL_DATAL<2> 0 0 1 1 MF8_CTRL_DATAL<3> 0 1 0 0 MF8_CTRL_DATAL<4> 0 1 0 1 MF8_CTRL_DATAL<5> 0 1 1 0 MF8_CTRL_DATAL<6> 0 1 1 1 MF8_CTRL_DATAL<7> 1 0 0 0 MF8_CTRL_DATAL<8> 1 0 0 1 MF8_CTRL_DATAL<9> 1 0 1 0 MF8_CTRL_DATAL<10> 1 0 1 1 MF8_CTRL_DATAL<11> 1 1 0 0 MF8_CTRL_DATAL<12> 1 1 0 1 MF8_CTRL_DATAL<13> 1 1 1 0 MF8_CTRL_DATAL<14> 1 1 1 1 MF8_CTRL_DATAL<15> MSB

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 47 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 9. Timers (TMR) The ALM1108 has three configurable 8-bit timers (TMR0, TMR1 – see Figure 9.36, TMR3 – see Figure 9.37). TMR0 and TMR1 have one input from the connection matrix for IN/RST, and one for an external counter/clock source (for a total of two inputs from the connection matrix). One of the Timer macrocells (TMR3) has one input from the connection matrix which has a shared f unction of IN or external CLK input. The outputs of TMR0 and TMR1 go back to the conncection matrix. TMR3 has an additional output of Edge Detector. Each timer has the following mode of operation:

  • Delay
  • Counter
  • One Shot
  • Frequency Detector
  • Delayed Edge Detector
  • Edge Detector The output polarity of the TMR is configurable and can be selected as non-inverted or inverted. In the Delay mode the TMR delays the input signal by the selected edge event (rising edge, falling edge, both edges) for a ti me determined by the Control Data, input clock signal and selected divider value. If input signal is shorter than the delay value, the signal does not propagate to the output. The timing diagrams of this mode is shown in the Figure 9.1…Figure 9.6. In the Counter mode the TMR divides input clock signal by the value determined by the Control Data, input clock signal and selected divider value. The output of the TMR goes HIGH every time when the Counted Value (current value of the counter) is equal 0. The RST in of the TMR reset Counted value to 0 by one of the following events: rising edge, falling edge, both edge s, high level. The timing diagrams of this mode is shown in the Figure 9.7…Figure 9.12. In One-Shot mode this macrocell generates a high-level pulse with a set width, when detecting the edge event, which is selectable by the registers, on its IN input. The pulse width is determined by the Control Data, input clock signal and selected divider value. Any incoming edges are ignored during pulse width generation. The timing diagrams of this mode is shown in the Figure 9.13…Figure 9.18. In Frequency Detector mode the TMR function following scenarios:
  • Rising Edge: The output will go HIGH if the time between two rising edges is less than the delay. The output will go LOW if the next rising edge has not come after the last rising edge in specified time.
  • Falling Edge: The output will go HIGH if the time between two falling edges is less than the set time. The output will go LOW if the next falling edge has not come after the last falling edge in specified time.
  • Both Edges: The output will go HIGH if the time between the rising and falling edges is less than the set time, which is equivalent to the length of the pulse. The output will go LOW if the next rising/falling edge has not come after the last falling/rising edge in specified time. The timing diagrams of the Frequency Detector Mode is shown in the Figure 9.19…Figure 9.24. In the Delayed Edge Detector mode the TMR generates delayed short high level pulse (for non -inverted polarity) when detecting the respective selected edge event (rising edge, falling edge, both edges). The delay time is determined by the Control Data, input clock signal and selected divider value. The timing diagrams of this mode is shown in the Figure 9.25…Figure 9.30. In Edge Detector mode the TMR generates short high level pulse (for non -inverted polarity) when detecting the respective selected edge event (rising edge, falling edge, both edges). The timing diagrams of this mode is shown in the Figure 9.31. Time of Timers for each mode can be calculated using the following formulas (Note 8.9, Note 8.10):
  • Delay (Figure 9.1…Figure 9.6) Delay Time = (Control Data + 1 + VAR)/FCLK;
  • Counter Figure 9.7…Figure 9.12) Output Period = (Control Data + 1)/FCLK; Output Frequency = FCLK/(Control Data + 1);
  • One Shot (Figure 9.13…Figure 9.18) Pulse width = (Control Data + 1 + VAR)/FCLK;
  • Frequency Detector (Figure 9.19…Figure 9.24) Detected Frequency = FCLK/(Control Data + 1 + VAR).
  • Delayed Edge Detector (Figure 9.25…Figure 9.30) Delay Time = (Control Data + 1 + VAR)/FCLK. Note 9.1 FCLK – CLK input frequency. Note 9.2 VAR = 0…1 – defined by the asynchronous time between the input signal and the first clock pulse. Note 9.3 Counters initialize with Control Data after POR. There is also one Multifunctional Macrocells that can implement either 4-bit LUT or 16-bit TMR (See Section 8.5 MF (4-bit LUT0/16-Bit Timer) Macrocells).

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 56 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Table 9.1. TMR0 Register Settings Register Bit Address Register Name Register Definition 8-bit TMR0 <350:343> TMR0_CTRL_DATA Timer control data <352:351> TMR0_TRIG_EVENT Timer trigger event: 00: On both falling and rising edges 01: On falling edge only 10: On rising edge only 11: High level reset (counter) <355:353> TMR0_CLK CLK source: 000: OSC 001: OSC/4 010: OSC/8 011: OSC/16 100: OSC/64 101: OSC/128 110: External CLK 111: TMR3_OUT <358:356> TMR0_MODE Timer mode: 000: Delay 001: One shot 010: Frequency detector 011: Counter 100: Edge detector 101: Delayed edge detector 110: Reserved 111: Reserved <359> TMR0_OUT_POL Polarity of timer output: 0: OUT 1: nOUT <472:471> TMR0_INIT_STATE Timer initial state: 00: Initial 0 01: Initial 1 10: Bypass initial 11: Bypass initial

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 57 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 9.3. 8-bit TMR1 Schematic diagram of TMR1 macrocell is shown in Figure 9.36. Its register settings set out in Table 9.2. Table 9.2. TMR1 Register Settings Register Bit Address Register Name Register Definition 8-bit TMR1 <367:360> TMR1_CTRL_DATA Timer control data <379:378> TMR1_TRIG_EVENT Timer trigger event: 00: On both falling and rising edges 01: On falling edge only 10: On rising edge only 11: High level reset (counter) <382:380> TMR1_CLK CLK source: 000: OSC 001: OSC/4 010: OSC/8 011: OSC/16 100: OSC/64 101: OSC/128 110: External CLK 111: TMR0_OUT <385:383> TMR1_MODE Timer mode: 000: Delay 001: One shot 010: Frequency detector 011: Counter 100: Edge detector 101: Delayed edge detector 110: Reserved 111: Reserved <386> TMR1_OUT_POL Polarity of timer output: 0: OUT 1: nOUT <474:473> TMR1_INIT_STATE Timer initial state: 00: Initial 0 01: Initial 1 10: Bypass initial 11: Bypass initial

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 58 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 9.4. 8-bit TMR3 Schematic diagram of TMR3 macrocell is shown on Figure 9.37. Its register settings set out in Table 9.3. Figure 9.37. TMR3 Table 9.3. TMR3 Register Settings Register Bit Address Register Name Register Definition 8-bit TMR3 <395:388> TMR3_CTRL_DATA Timer control data <397:396> TMR3_MODE Timer mode: 00: Delay 01: One shot 10: Frequency detector 11: Counter <400:398> TMR3_CLK CLK source: 000: OSC 001: OSC/4 010: OSC/8 011: OSC/16 100: OSC/64 101: OSC/128 110: External CLK 111: TMR0_OUT <402:401> TMR3_TRIG_EVENT Timer trigger event: 00: On both falling and rising edges 01: On falling edge only 10: On rising edge only 11: Reserved <403> TMR3_OUT_POL Polarity of timer output: 0: OUT 1: nOUT OSC_CLK/128 OSC_CLK/64 OSC_CLK/16 OSC_CLK/8 TMR2_OUT OSC_CLK/4 OSC_CLK IN CLK From Connection Matrix Output #·· CTRL_DATA OUT To Connection Matrix Input #·· 0 0 0 1 1 0 1 1 Definition Delay One Shot Frequency Detector Counter 0 0 0 1 1 0 1 1 Definition Both Edge Falling Edge Rising Edge Reserved OUT_POL 1×2 DEMUX MODE TRIG_EVENT0 0 0 0 0 1 0 1 0 0 1 1 1 0 0 1 0 1 1 1 0 1 1 1 8×1 MUX CLK ED To Connection Matrix Input #·· EXT CLK TMR3_OUT IN 8-bit Timer CLK 8-bit TMR3 INIT_STATE 0 0 0 1 1 0 1 1 Definition Initial 0 Initial 1 Bypass initial Bypass initial OUT Edge Detector

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 59 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Register Bit Address Register Name Register Definition 8-bit TMR3 <496:495> TMR3_INIT_STATE Timer initial state: 00: Initial 0 01: Initial 1 10: Bypass initial 11: Bypass initial

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 60 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 10. Memory Architecture The Memory of μASIC consists of two main parts: non-volatile memory (NVM) and registers. The configuration of the μASIC is stored in the NVM and is loaded to the volatile registers, during device power on. The registers values define macrocells configuration, matrix connections setting (signal routing), IO configuration etc., that allows to get the desired functionality for user’s application (see Figure 10.1). Figure 10.1. Memory Architecture NON-VOLATILE MEMORY CONNECTION MATRIX 32×40 TIMERS COMBINATORIAL LOGIC REGISTERS IOs MULTIFUNCTIONAL MACROCELLS OSCILLATOR

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 61 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 11. Data Protection The ALM1108 has data protection that is provided by CRV. Table 11.1. Security Control Registers Register Bit Address Register Name Register Definition Security Control <456> SYS_SECURITY_CRV_EN Continuous register verification: 0: Disable 1: Enable Continuous Registers Verification (CRV) is provided by a continuous comparison the register bits <501, 411, 377, 376, 368, 342, 327, 219, 191, 140, 84, 43, 42, 41, 15> with hardcoded value 15’b011001100001101. If the comparison shows a mismatch the ALM1108 automatically restarts.

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 62 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 12. Oscillator (OSC) The ALM1108 has an internal Oscillators with two selectable frequencies: 25 kHz and 2 MHz. OSC macrocell can be sourced from internal oscillator or by external frequency from IO8. The OSC has two prescaler stages that gives user flexibility for introducing clock signals on the Connection Matrix Input lines. The first stage (CLKPrescale) allows to divide the fundamental frequency by /1, /2, /4 or /8. The two independent second stage prescaler allow to divide the frequency from the first stage divider by /1, /4, /8, /16, /32, /64 or /128, and outputs this frequency on the Connection Matrix Input # 21 and #22 (See Figure 12.1 for more details). When internal OSC is used, there is a choice between “Force Power On”, meaning that the OSC will always run, or “Auto Power On”, meaning that the OSC will run only on demand of internal logics (TMRs) and consequently have an associated startup and settling time. The oscillator is turned on when the PWRDWN signal is LOW and turned off when the PWRDWN signal is HIGH. The PWRDWN signal has the highest priority. Schematic diagram of the OSC macrocell is shown in Figure 12.1. Its register settings set out in Table 12.3. The ALM1108 has an internal oscillator that allows to cover a variety of application:

  • OSC with two selectable output frequencies 25 kHz or 2 MHz. OSC macrocell can be sourced either from internal oscillator or by external frequency from IO8. The OSC has two divider stages that gives user flexibility for introducing clock signals on the Connection Matrix Input lines. The first stage (prescaler) allows to divide the fundamental frequency by /1, /2, /4 or /8. The two independent second stage dividers allow to divide the frequency from the first stage divider by /1, /2, /4, /8, /16, /32, /64, /128 and outputs this frequency on the Connection Matrix Input # 21 and #22 (See Figure 12.1 and Table 12.3 for more details). Each oscillator has three power states of operation (see Table 12.1). The flow of turning on the oscillator is started from OFF state, then it goes to IDLE state and last is ON state in which frequency appear on the oscillator output. Table 12.1. Oscillator power states State Description OFF state The oscillator is fully shut down and consumes the minimum amount of current (less than 1nA). The power on time of the oscillator is longer compare to the power on from the IDLE state (see Table 4.10, Table 4.14). The oscillator stays in this state when it is not turned on by timers or control input, and Power On Time is selected as normal. IDLE state The power consumption is higher compared to the OFF state and depends on the type of oscillator (see Table 4.5). The oscillator is ready to operate and power on time is within 1 clock cycle of the oscillator. ON state The oscillator consumes its active current and frequency is generated on the oscillator output (see Table 4.5) Each oscillators have three settings that allow to choose appropriate mode of operation (see Table 12.2). Table 12.2. Oscillator setting Setting Option Description Power On Time Normal The oscillator power on time is normal (see Table 4.10, Table 4.14). When the oscillator is turned off it stays in the OFF state. Fast The oscillator power on time fast, within 1 clock cycle (see Table 4.10, Table 4.14). When the oscillator is turned off it stays in the IDLE state. Power Mode Auto power on The oscillator is turned on when any of timers require it (Note 12.1). Forced power on The oscillator is turned on when part is powered on and PWR_DWN signal doesn’t shut down it. Note 12.1 PWR_DWN signal has the highest priority and sut down the oscillator.

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 63 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Figure 12.1. OSC Block Diagram PWR_DWNFrom Connection Matrix Output #·· 2×1 MUX CLK_SOURCE_SEL FREQ_SEL PWR_DWN Oscillator OUT EXTCLK 4×1 MUX PRESCALER_MAIN PWR_MODE OSCCLK/4 OSCCLK/16 OSCCLK/8 OSCCLK/64 OSCCLK/128 OSCCLK CLK OSC OUT0 To Connection Matrix Input #·· 8×1 MUX 000 001 010 011 100 101 110 111 PRESCALER_OUT0 8×1 MUX 000 001 010 011 100 101 110 111 PRESCALER_OUT1 OUT1 To Connection Matrix Input #·· Prescaler Prescaler 1/16PWR_ON_TIME OSC_OUT0_EN OSC_OUT1_EN IO8

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 64 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Table 12.3. OSC Register Settings Register Bit Address Register Name Register Definition OSC (25kHz/2MHz) <225:224> OSC_FREQ_SEL Frequency: 00: Both disable 01: 25kHz 10: 2MHz 11: Both enable <325> OSC_PWR_MODE Power mode: 0: Auto power on 1: Forced power on Power on time: 0: Normal 1: Fast Clock source: 0: Inner oscillator 1: External CLK <329:328> OSC_PRESCALER_MAIN Main prescaler: 00: 1 01: 1/2 10: 1/4 11: 1/8 <332:330> OSC_PRESCALER_OUT0 OUT0 prescaler: 000: OUT0_DISABLE 001: OSC_CLK 010: OSC_CLK/4 011: OSC_CLK/8 100: OSC_CLK/16 101: OSC_CLK/32 110: OSC_CLK/64 111: OSC_CLK/128 <335:333> OSC_PRESCALER_OUT1 OUT1 prescaler: 000: OUT1_DISABLE 001: OSC_CLK/2 010: OSC_CLK/4 011: OSC_CLK/8 100: OSC_CLK/16 101: OSC_CLK/32 110: OSC_CLK/64 111: OSC_CLK/128 <374> OSC_OUT0_EN OUT0 enable: 0: OUT0 disable 1: OUT0 enable <375> OSC_OUT1_EN OUT1 enable: 0: OUT1 disable 1: OUT1 enable

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 65 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 13. Power On Reset (POR) To ensure correct device initialization and operation of all macrocells in the device, the μASIC has a Power-On Reset (POR) circuit. The POR circuit achieves consistent behavior and predictable results during VDD power ramp up and power down. T o accomplish this goal, the POR circuit releases a defined Power-Up sequence of internal events that initialize different macrocells inside the device. 13.1. POR General Operation To start the Power-Up sequence, the voltage applied on the VDD should be higher than the POWER ON threshold (which can vary by PVT, soon as the V DD rises to the POWER ON threshold, but the VDD voltage itself must continue to ramp up to the operational voltage value. After the POR sequence has started, ALM1108 will have a period of time to go through all the steps in the sequence and will be ready and completely operational after the Power-Up sequence is completed. ALM1108 is powered down and non-operational when the VDD voltage is between 0.6 V and -0.6 V. Another essential condition for the chip to be powered down is that no voltage higher than the VDD voltage is applied to any other pin (although there is a 0.5 V margin due to forward drop voltage of the ESD protection diodes). All pins are in HIGH IMPEDANCE state while the Power -Up sequence is taking place, and when the chip is powered down. The last step in the Power-Up sequence releases the IO structures from the HIGH IMPEDANCE state making the device operational. The design programmed into the chip defines the pin configuration of the device when operational. (The voltage on pins can’t be higher than the VDD and this rule does apply to when the chip is powered on). 13.2. Power-Up Sequence The Power-Up sequence of signals shown in Figure 13.1. Figure 13.1. POR sequence As demonstrated by Figure 13.1 after the VDD starts ramping up and crosses the POWER ON threshold, the on-chip NVM memory is enable. After that Input pins and Connection Matrix are e nabled and all traces between all macrocells are routed. The macrocells like LUT, DFF, LATCH, Shift Register, Timers and others are initialized and stabilized for the next 3 cycles of 2MHz oscillator. After another one cycle READY signal and OSC outputs are enabled and outputs start run. The output pins, transition from HIGH IMPEDANCE to active at this point. The completion time for the POR sequence varies by device type in the μASIC family. The completion time also depend s on many environmental factors, such as: slew rate, V DD value, temperature to a degree that the times will even vary from chip to chip due to process influence. PWR_UPNVM (NVM enable) VDD PWR_UPINPUT (IO input/IO pull up/IO pull down/ Connection matrix enable) PWR_UPCORE (LUT/DFF/LATCH/Shift register/Timers/ other macrocells enable) PWR_UPOUT (IO output/Oscillator/Ready enable) TSU 3 cycles of 2MHz 1 cycle of 2MHz

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 66 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 13.3. Macrocells Output States During Power-Up Sequence First, all macrocells have their output set to logic LOW , except the output pins which are in HIGH IMPEDANCE state, before the NVM is enabled. Then until the NVM is ready, all macrocell outputs are unpredictable except the IOs. On the next step Input pins determined by external signals, LOGIC 1 is high, LOGIC 0 is low, LUTs and PDLY macrocell configured as edge detector work according to their inputs. All other macrocells are initialized in the next step. Lastly, READY signal, oscillator and the output pins become active as determined by the input signals. (Figure 13.2 describes the macrocell output signal states during the Power-Up sequence). Figure 13.2. Internal Macrocell States during POR sequence 13.4. Reset Events There are number of reset events for ALM1108:

  • POR;
  • CRV;
  • IO2 Reset. CRV (see section 111) and IO2 Reset can be enabled or disabled by register bits (Table 13.1). Keep in mind that IO2 should be configured as Digital IN (any of the input modes) as long as IO2 Reset is enabled. Table 13.1. IO2 Reset Register Settings Register Bit Address Register Name Register Definition IO2 Reset <499> IO2_RESET_EN IO2 Reset: 0: Disable 1: Enable <498:497> IO2_RESET_TRIG IO2 Reset Trigger Event: 00: Rising Edge 01: Falling Edge 10: High Level 11: Reserved VDD IO input to matrix Logic 1 to matrix PDLYOUT to matrix P_EDGE_DETOUT to matrix DFF/LATCHOUT to matrix TMROUT to matrix IO output to PAD Unpredictable Determined by External Signals Determined by Input Signals Determined by Input Signals Determined by Input SignalsDetermined by Initial State Determined by Input SignalsDetermined by Initial State Determined by Input Signals OSC to timers/matrix Determined by OSC settings Ready to matrix Unpredictable Hi-Z Logic 0 to matrix LUTOUT to matrix Determined by Input Signals

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 67 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 14. Abbreviations ADJ Adjustable CLK Clock CLK/L Clock/Latch CRV Continuous Registers Verification CM Connection Matrix CMI Connection Matrix Inputs CMO Connection Matrix Outputs CV Counted Value D Data DC Direct Current DFF D Flip-Flop DI Digital Input DIR Direction DILV Digital Input Low Voltage DIO Digital Input/Output ED Edge Detector ESD Electrostatic Discharge EXTCLK External Clock GND Ground IC Integrated Circuit IMC Input Mode Control IN Input IO Input/Output Logic 0 Low Logic Level Logic 1 High Logic Level LSB Least Significant Bit LUT Look Up Table LV Low Voltage MF Multi-Functional MSB Most Significant Bit MUX Multiplexer N/A Not Applicable N/C Not Connected NMOS N channel Metal Oxide Semiconductor NVM Non-Volatile Memory OD Open Drain OSC Oscillator OSG One Shot Generator OUT Output PDLY Programmable Delay PMOS P channel Metal Oxide Semiconductor POR Power On Reset PP Push Pull PROP Propagation PW Pulse Width PWRDWN Power Down REG Register RST Reset SHR Shift Register ST Schmitt Trigger TMR Timer TQFN Thin Quad Flat No Leads VDD Voltage Drain-Drain VSS Voltage Source-Source w/ With w/o Without

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 68 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 15. Appendix A – ALM1108 Register Definition Register Bit Address Register Name Register Definition Connection matrix outputs <4:0> CMO0_IO3_DIN IO3 DIN <9:5> CMO1_IO4_DIN IO4 DIN <14:10> CMO2_IO4_DIR IO4 DIR <15> CRV_B0 CRV bit. If CRV is enabled, please make sure to keep the bit HIGH <20:16> CMO3_MF0_2BLUT0_DFF0_IN0_CLK MF0(2-bit LUT0/DFF0/LATCH0) IN0/CLK/nL <25:21> CMO4_MF0_2BLUT0_DFF0_IN1_D MF0(2-bit LUT0/DFF0/LATCH0) IN1/D <30:26> CMO5_MF1_2BLUT1_DFF1_IN0_CLK MF1(2-bit LUT1/DFF1/LATCH1) IN0/CLK/nL <35:31> CMO6_MF1_2BLUT1_DFF1_IN1_D MF1(2-bit LUT1/DFF1LATCH1) IN1/D <40:36> CMO7_2BLUT2_IN0 2-bit LUT2 IN0 <41> CRV_B1 CRV bit. If CRV is enabled, please make sure to keep the bit LOW <42> CRV_B2 CRV bit. If CRV is enabled, please make sure to keep the bit HIGH <43> CRV_B3 CRV bit. If CRV is enabled, please make sure to keep the bit HIGH <48:44> CMO8_2BLUT2_IN1 2-bit LUT2 IN1 <53:49> CMO9_2BLUT3_IN0 2-bit LUT3 IN0 <58:54> CMO10_2BLUT3_IN1 2-bit LUT3 IN1 <63:59> CMO11_MF2_3BLUT0_DFF2_IN0_CLK MF2(3-bit LUT0/DFF2/LATCH2) IN0/CLK/nL <68:64> CMO12_MF2_3BLUT0_DFF2_IN1_D MF2(3-bit LUT0/DFF2/LATCH2) IN1/D <73:69> CMO13_MF2_3BLUT0_DFF2_IN2_NRST MF2(3-bit LUT0/DFF2/LATCH2) IN2/nRST <78:74> CMO14_MF3_3BLUT1_DFF3_IN0_CLK MF3(3-bit LUT1/DFF3/LATCH3) IN0/CLK/nL <83:79> CMO15_MF3_3BLUT1_DFF3_IN1_D MF3(3-bit LUT1/DFF3/LATCH3) IN1/D <84> CRV_B4 CRV bit. If CRV is enabled, please make sure to keep the bit LOW <89:85> CMO16_MF3_3BLUT1_DFF3_IN2_NRST MF3(3-bit LUT1/DFF3/LATCH3) IN2/nRST <94:90> CMO17_MF4_3BLUT2_DFF4_IN0_CLK MF4(3-bit LUT2/DFF4/LATCH4) IN0/CLK/nL <99:95> CMO18_MF4_3BLUT2_DFF4_IN1_D MF4(3-bit LUT2/DFF4/LATCH4) IN1/D <104:100> CMO19_MF4_3BLUT2_DFF4_IN2_NRST MF4(3-bit LUT2/DFF4/LATCH4) IN2/nRST <109:105> CMO20_MF5_3BLUT3_DFF5_IN0_CLK MF5(3-bit LUT3/DFF5/LATCH5) IN0/CLK/nL <114:110> CMO21_MF5_3BLUT3_DFF5_IN1_D MF5(3-bit LUT3/DFF5/LATCH5) IN1/D <119:115> CMO22_MF5_3BLUT3_DFF5_IN2_NRST MF5(3-bit LUT3/DFF5/LATCH5) IN2/nRST <124:120> CMO23_MF6_3BLUT4_SH_REG_IN0_D MF6(3-bit LUT4/Shift Register) IN0/D <129:125> CMO24_MF6_3BLUT4_SH_REG_IN1_NRST MF6(3-bit LUT4/Shift Register) IN1/nRST <134:130> CMO25_MF6_3BLUT4_SH_REG_IN2_CLK MF6(3-bit LUT4/Shift Register) IN2/CLK <139:135> CMO26_MF8_4BLUT0_16BTMR2_IN0_CLK MF8(4-bit LUT0/16-bit TMR2) IN0/CLK <140> CRV_B5 CRV bit. If CRV is enabled, please make sure to keep the bit LOW <145:141> CMO27_MF8_4BLUT0_16BTMR2_IN1_RST MF8(4-bit LUT0/16-bit TMR2) IN1/RST <150:146> CMO28_MF8_4BLUT0_16BTMR2_IN2_KEEP MF8(4-bit LUT0/16-bit TMR2) IN2/KEEP <155:151> CMO29_MF8_4BLUT0_16BTMR2_IN3_UP MF8(4-bit LUT0/16-bit TMR2) IN3/UP <160:156> CMO30_8BTMR0_IN_RST 8-bit TMR0 IN/RST <165:161> CMO31_8BTMR1_IN_RST 8-bit TMR1 IN/RST <170:166> CMO32_8BTMR0_8BTMR1_CLK 8-bit TMR0/8-bit TMR1 CLK

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 69 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Register Bit Address Register Name Register Definition <175:171> CMO33_8BTMR3_IN_CLK 8-bit TMR3 IN/CLK <180:176> CMO34_MF7_PDLY_ED_IN MF7(PDLY/Edge Detector) IN <185:181> CMO35_OSC_PWR_DWN OSC PWR DWN <190:186> CMO36_IO6_DIN IO6 DIN <191> CRV_B6 CRV bit. If CRV is enabled, please make sure to keep the bit LOW <196:192> CMO37_IO7_DIN IO7 DIN <201:197> CMO38_IO8_DIN IO8 DIN <206:202> CMO39_IO8_DIR IO8 DIR Reserved <214:207> Reserved MF0 (2-bit LUT0/DFF0/LATCH0) <215> MF0_LUT_CTRL_DATA_0_DFF_LATCH_SEL 0th bit of LUT control data: 0: LOW 1: HIGH or DFF/LATCH selection: 0: DFF 1: LATCH <216> MF0_LUT_CTRL_DATA_1 1st bit of LUT control data: 0: LOW 1: HIGH <217> MF0_LUT_CTRL_DATA_2_DFF_LATCH_INIT_STATE 2nd bit of LUT control data: 0: LOW 1: HIGH or Initial state of DFF/LATCH: 0: LOW 1: HIGH <218> MF0_LUT_CTRL_DATA_3 3rd bit of LUT control data: 0: LOW 1: HIGH CRV <219> CRV_B7 CRV bit. If CRV is enabled, please make sure to keep the bit LOW MF1 (2-bit LUT1/DFF1/LATCH1) <220> MF1_LUT_CTRL_DATA_0_DFF_LATCH_SEL 0th bit of LUT control data: 0: LOW 1: HIGH or DFF/LATCH selection: 0: DFF 1: LATCH <221> MF1_LUT_CTRL_DATA_1 1st bit of LUT control data: 0: LOW 1: HIGH <222> MF1_LUT_CTRL_DATA_2_DFF_LATCH_INIT_STATE 2nd bit of LUT control data: 0: LOW 1: HIGH or Initial state of DFF/LATCH: 0: LOW 1: HIGH <223> MF1_LUT_CTRL_DATA_3 3rd bit of LUT control data: 0: LOW 1: HIGH OSC

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 70 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Register Bit Address Register Name Register Definition <225:224> OSC_FREQ_SEL Frequency: 00: Both disable 01: 25kHz 10: 2MHz 11: Both enable <226> Reserved 2-bit LUT2 <230:227> 2BLUT2_CTRL_DATA OUT LUT control data 2-bit LUT3 <234:231> 2BLUT3_CTRL_DATA OUT LUT control data Multifunctional macrocells <235> MF0_MODE MF mode: 0: LUT 1: DFF/LATCH <236> MF1_MODE MF mode: 0: LUT 1: DFF/LATCH MF2 (3-bit LUT0/DFF2/LATCH2) <237> MF2_LUT_CTRL_DATA0_0_DFF_LATCH_SEL 0th bit of OUT0 LUT control data: 0: LOW 1: HIGH or DFF/LATCH selection: 0: DFF 1: LATCH <238> MF2_LUT_CTRL_DATA0_1 1st bit of OUT0 LUT control data: 0: LOW 1: HIGH <239> MF2_LUT_CTRL_DATA0_2_DFF_LATCH_NRST_NSET_SEL 2nd bit of OUT0 LUT control data: 0: LOW 1: HIGH or nRESET/nSET selection: 0: nRST 1: nSET <240> MF2_LUT_CTRL_DATA0_3_DFF_LATCH_INIT_STATE 3rd bit of OUT0 LUT control data: 0: LOW 1: HIGH or Initial state of DFF/LATCH: 0: LOW 1: HIGH <241> MF2_LUT_CTRL_DATA0_4 4th bit of OUT0 LUT control data: 0: LOW 1: HIGH <242> MF2_LUT_CTRL_DATA0_5 5th bit of OUT0 LUT control data: 0: LOW 1: HIGH <243> MF2_LUT_CTRL_DATA0_6 6th bit of OUT0 LUT control data: 0: LOW 1: HIGH <244> MF2_LUT_CTRL_DATA0_7 7th bit of OUT0 LUT control data: 0: LOW 1: HIGH <252:245> MF2_LUT_CTRL_DATA1 OUT1 LUT control data MF3 (3-bit LUT1/DFF3/LATCH3)

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 71 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Register Bit Address Register Name Register Definition <253> MF3_LUT_CTRL_DATA0_0_DFF_LATCH_SEL 0th bit of OUT0 LUT control data: 0: LOW 1: HIGH or DFF/LATCH selection: 0: DFF 1: LATCH <254> MF3_LUT_CTRL_DATA0_1 1st bit of OUT0 LUT control data: 0: LOW 1: HIGH <255> MF3_LUT_CTRL_DATA0_2_DFF_LATCH_NRST_NSET_SEL 2nd bit of OUT0 LUT control data: 0: LOW 1: HIGH or nRESET/nSET selection: 0: nRST 1: nSET <256> MF3_LUT_CTRL_DATA0_3_DFF_LATCH_INIT_STATE 3rd bit of OUT0 LUT control data: 0: LOW 1: HIGH or Initial state of DFF/LATCH: 0: LOW 1: HIGH <257> MF3_LUT_CTRL_DATA0_4 4th bit of OUT0 LUT control data: 0: LOW 1: HIGH <258> MF3_LUT_CTRL_DATA0_5 5th bit of OUT0 LUT control data: 0: LOW 1: HIGH <259> MF3_LUT_CTRL_DATA0_6 6th bit of OUT0 LUT control data: 0: LOW 1: HIGH <260> MF3_LUT_CTRL_DATA0_7 7th bit of OUT0 LUT control data: 0: LOW 1: HIGH <268:261> MF3_LUT_CTRL_DATA1 OUT1 LUT control data MF4 (3-bit LUT2/DFF4/LATCH4) <269> MF4_LUT_CTRL_DATA_0_DFF_LATCH_SEL 0th bit of OUT0 LUT control data: 0: LOW 1: HIGH or DFF/LATCH selection: 0: DFF 1: LATCH <270> MF4_LUT_CTRL_DATA_1_Q_POL 1st bit of OUT0 LUT control data: 0: LOW 1: HIGH or Q polarity of DFF/LATCH: 0: Q 1: nQ <271> MF4_LUT_CTRL_DATA_2_DFF_LATCH_NRST_NSET_SEL 2nd bit of OUT0 LUT control data: 0: LOW 1: HIGH or nRESET/nSET selection: 0: nRST 1: nSET

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 72 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Register Bit Address Register Name Register Definition <272> MF4_LUT_CTRL_DATA_3_DFF_LATCH_INIT_STATE 3rd bit of OUT0 LUT control data: 0: LOW 1: HIGH or Initial state of DFF/LATCH: 0: LOW 1: HIGH <273> MF4_LUT_CTRL_DATA_4 4th bit of OUT0 LUT control data: 0: LOW 1: HIGH <274> MF4_LUT_CTRL_DATA_5 5th bit of OUT0 LUT control data: 0: LOW 1: HIGH <275> MF4_LUT_CTRL_DATA_6 6th bit of OUT0 LUT control data: 0: LOW 1: HIGH <276> MF4_LUT_CTRL_DATA_7 7th bit of OUT0 LUT control data: 0: LOW 1: HIGH MF5 (3-bit LUT3/DFF5/LATCH5) <277> MF5_LUT_CTRL_DATA_0_DFF_LATCH_SEL 0th bit of OUT0 LUT control data: 0: LOW 1: HIGH or DFF/LATCH selection: 0: DFF 1: LATCH <278> MF5_LUT_CTRL_DATA_1_Q_POL 1st bit of OUT0 LUT control data: 0: LOW 1: HIGH or Q polarity of DFF/LATCH: 0: Q 1: nQ <279> MF5_LUT_CTRL_DATA_2_DFF_LATCH_NRST_NSET_SEL 2nd bit of OUT0 LUT control data: 0: LOW 1: HIGH or nRESET/nSET selection: 0: nRST 1: nSET <280> MF5_LUT_CTRL_DATA_3_DFF_LATCH_INIT_STATE 3rd bit of OUT0 LUT control data: 0: LOW 1: HIGH or Initial state of DFF/LATCH: 0: LOW 1: HIGH <281> MF5_LUT_CTRL_DATA_4 4th bit of OUT0 LUT control data: 0: LOW 1: HIGH <282> MF5_LUT_CTRL_DATA_5 5th bit of OUT0 LUT control data: 0: LOW 1: HIGH <283> MF5_LUT_CTRL_DATA_6 6th bit of OUT0 LUT control data: 0: LOW 1: HIGH <284> MF5_LUT_CTRL_DATA_7 7th bit of OUT0 LUT control data: 0: LOW 1: HIGH MF6 (3-bit LUT4 / Shift register) <288:285> MF6_LUT_CTRL_DATA3_0_SHIFT_REG_STAGE_OUT0 Low tetrad of OUT LUT control data or stage of OUT0 shift register

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 73 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Register Bit Address Register Name Register Definition <292:289> MF6_LUT_CTRL_DATA7_4_SHIFT_REG_STAGE_OUT1 High tetrad of OUT LUT control data or stage of OUT1 shift register Multifunctional macrocells <293> MF2_MODE MF mode: 0: LUT 1: DFF/LATCH <294> MF3_MODE MF mode: 0: LUT 1: DFF/LATCH <295> MF4_MODE MF mode: 0: LUT 1: DFF/LATCH <296> MF5_MODE MF mode: 0: LUT 1: DFF/LATCH MF6 (3-bit LUT4 / Shift register) <297> MF6_MODE MF mode: 0: LUT 1: Shift register <298> MF6_SHIFT_REG_OUT1_POL Shift register OUT1 polarity: 0: OUT1 1: nOUT1 MF8 4-bit LUT0/16-bit TMR2) <314:299> MF8_CTRL_DATA MF control data <316:315> MF8_TMR_MODE Timer mode: 00: Delay 01: One shot 10: Frequency detector 11: Counter <319:317> MF8_TMR_CLK CLK source: 000: OSC 001: OSC/4 010: OSC/8 011: OSC/16 100: OSC/64 101: OSC/128 110: External CLK 111: TMR1_OUT <321:320> MF8_TMR_TRIG_EVENT Timer trigger event: 00: On both falling and rising edges 01: On falling edge only 10: On rising edge only 11: High level reset (counter) <322> MF8_TMR_RST_FUNC Reset functionality: 0: Reset to 0 1: Set to Control data <323> MF8_TMR_OUT_POL Polarity of timer output: 0: OUT 1: nOUT <324> MF8_MODE MF mode: 0: LUT 1: Timer OSC <325> OSC_PWR_MODE Power mode: 0: Auto power on 1: Forced power on

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 74 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Register Bit Address Register Name Register Definition <326> OSC_PWR_ON_TIME Power on time: 0: Normal 1: Fast <327> CRV_B8 CRV bit. If CRV is enabled, please make sure to keep the bit HIGH <329:328> OSC_PRESCALER_MAIN Main prescaler: 00: 1 01: 1/2 10: 1/4 11: 1/8 <332:330> OSC_PRESCALER_OUT0 OUT0 prescaler: 000: OUT0_DISABLE 001: OSC_CLK 010: OSC_CLK/4 011: OSC_CLK/8 100: OSC_CLK/16 101: OSC_CLK/32 110: OSC_CLK/64 111: OSC_CLK/128 <335:333> OSC_PRESCALER_OUT1 OUT1 prescaler: 000: OUT1_DISABLE 001: OSC_CLK/2 010: OSC_CLK/4 011: OSC_CLK/8 100: OSC_CLK/16 101: OSC_CLK/32 110: OSC_CLK/64 111: OSC_CLK/128 <336> OSC_CLK_SOURCE_SEL Clock source: 0: Inner oscillator 1: External CLK IOs <337> IO3_DRIVE_STRENGTH Drive strength: 0: ×1 1: ×2 <338> IO4_DRIVE_STRENGTH Drive strength: 0: ×1 1: ×2 <339> IO6_DRIVE_STRENGTH Drive strength: 0: ×1 1: ×2 <340> IO7_DRIVE_STRENGTH Drive strength: 0: ×1 1: ×2 CRV <342> CRV_B9 CRV bit. If CRV is enabled, please make sure to keep the bit HIGH 8-bit TMR0 <350:343> TMR0_CTRL_DATA Timer control data <352:351> TMR0_TRIG_EVENT Timer trigger event: 00: On both falling and rising edges 01: On falling edge only 10: On rising edge only 11: High level reset (counter)

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 75 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Register Bit Address Register Name Register Definition <355:353> TMR0_CLK CLK source: 000: OSC 001: OSC/4 010: OSC/8 011: OSC/16 100: OSC/64 101: OSC/128 110: External CLK 111: TMR3_OUT <358:356> TMR0_MODE Timer mode: 000: Delay 001: One shot 010: Frequency detector 011: Counter 100: Edge detector 101: Delayed edge detector 110: Reserved 111: Reserved <359> TMR0_OUT_POL Polarity of timer output: 0: OUT 1: nOUT 8-bit TMR1 <367:360> TMR1_CTRL_DATA Timer control data CRV <368> CRV_B10 CRV bit. If CRV is enabled, please make sure to keep the bit LOW IOs <369> IO3_FORCE_IN_EN Force input: 0: Disable 1: Enable (Input is always ON) <370> IO4_FORCE_IN_EN Force input: 0: Disable 1: Enable (Input is always ON) <371> IO6_FORCE_IN_EN Force input: 0: Disable 1: Enable (Input is always ON) <372> IO7_FORCE_IN_EN Force input: 0: Disable 1: Enable (Input is always ON) <373> IO8_FORCE_IN_EN Force input: 0: Disable 1: Enable (Input is always ON) OSC <374> OSC_OUT0_EN OUT0 enable: 0: OUT0 disable 1: OUT0 enable <375> OSC_OUT1_EN OUT1 enable: 0: OUT1 disable 1: OUT1 enable CRV <376> CRV_B11 CRV bit. If CRV is enabled, please make sure to keep the bit LOW <377> CRV_B12 CRV bit. If CRV is enabled, please make sure to keep the bit HIGH 8-bit TMR1

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 76 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Register Bit Address Register Name Register Definition <379:378> TMR1_TRIG_EVENT Timer trigger event: 00: On both falling and rising edges 01: On falling edge only 10: On rising edge only 11: High level reset (counter) <382:380> TMR1_CLK CLK source: 000: OSC 001: OSC/4 010: OSC/8 011: OSC/16 100: OSC/64 101: OSC/128 110: External CLK 111: TMR0_OUT <385:383> TMR1_MODE Timer mode: 000: Delay 001: One shot 010: Frequency detector 011: Counter 100: Edge detector 101: Delayed edge detector 110: Reserved 111: Reserved <386> TMR1_OUT_POL Polarity of timer output: 0: OUT 1: nOUT <387> Reserved 8-bit TMR3 <395:388> TMR3_CTRL_DATA Timer control data <397:396> TMR3_MODE Timer mode: 00: Delay 01: One shot 10: Frequency detector 11: Counter <400:398> TMR3_CLK CLK source: 000: OSC 001: OSC/4 010: OSC/8 011: OSC/16 100: OSC/64 101: OSC/128 110: External CLK 111: TMR0_OUT <402:401> TMR3_TRIG_EVENT Timer trigger event: 00: On both falling and rising edges 01: On falling edge only 10: On rising edge only 11: Reserved <403> TMR3_OUT_POL Polarity of timer output: 0: OUT 1: nOUT IOs <404> IO3_DIR Direction: 0: Input 1: Output <405> IO6_DIR Direction: 0: Input 1: Output

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 77 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Register Bit Address Register Name Register Definition IO2 <408:407> IO2_IMC Input mode control: 00: Digital Input without Schmitt trigger 01: Digital Input with Schmitt trigger 10: Digital Input Low Voltage 11: Reserved <410:409> IO2_PULL_R_VAL Pulled resistor value: 00: Floating 01: 10 k Resistor 10: 100 k Resistor 11: 1 M Resistor CRV <411> CRV_B13 CRV bit. If CRV is enabled, please make sure to keep the bit HIGH IO3 <413:412> IO3_IMC Input mode control: 00: Digital Input without Schmitt trigger 01: Digital Input with Schmitt trigger 10: Digital Input Low Voltage 11: Reserved <415:414> IO3_OMC Output mode control: 00: Push Pull 01: Open Drain NMOS 10: Open Drain PMOS 11: Reserved <417:416> IO3_PULL_R_VAL Pulled resistor value: 00: Floating 01: 10 k Resistor 10: 100 k Resistor 11: 1 M Resistor <418> IO3_PULL_R_DOWN_UP_SEL Pull resistor: 0: Down 1: Up IO4 <420:419> IO4_IMC Input mode control: 00: Digital Input without Schmitt trigger 01: Digital Input with Schmitt trigger 10: Digital Input Low Voltage 11: Reserved <422:421> IO4_OMC Output mode control: 00: Push Pull 01: Open Drain NMOS 10: Open Drain PMOS 11: Reserved <424:423> IO4_PULL_R_VAL Pulled resistor value: 00: Floating 01: 10 k Resistor 10: 100 k Resistor 11: 1 M Resistor <425> IO4_PULL_R_DOWN_UP_SEL Pull resistor: 0: Down 1: Up IO6 <427:426> IO6_IMC Input mode control: 00: Digital Input without Schmitt trigger 01: Digital Input with Schmitt trigger 10: Digital Input Low Voltage 11: Reserved

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 78 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Register Bit Address Register Name Register Definition <429:428> IO6_OMC Output mode control: 00: Push Pull 01: Open Drain NMOS 10: Open Drain PMOS 11: Reserved <431:430> IO6_PULL_R_VAL Pulled resistor value: 00: Floating 01: 10 k Resistor 10: 100 k Resistor 11: 1 M Resistor <432> IO6_PULL_R_DOWN_UP_SEL Pull resistor: 0: Down 1: Up IO7 <434:433> IO7_IMC Input mode control: 00: Digital Input without Schmitt trigger 01: Digital Input with Schmitt trigger 10: Digital Input Low Voltage 11: Reserved <436:435> IO7_OMC Output mode control: 00: Push Pull 01: Open Drain NMOS 10: Open Drain PMOS 11: Reserved <438:437> IO7_PULL_R_VAL Pulled resistor value: 00: Floating 01: 10 k Resistor 10: 100 k Resistor 11: 1 M Resistor <439> IO7_PULL_R_DOWN_UP_SEL Pull resistor: 0: Down 1: Up IO8 <441:440> IO8_IMC Input mode control: 00: Digital Input without Schmitt trigger 01: Digital Input with Schmitt trigger 10: Digital Input Low Voltage 11: Reserved <443:442> IO8_OMC Output mode control: 00: Push Pull 01: Open Drain NMOS 10: Open Drain PMOS 11: Reserved <445:444> IO8_PULL_R_VAL Pulled resistor value: 00: Floating 01: 10 k Resistor 10: 100 k Resistor 11: 1 M Resistor <446> IO8_PULL_R_DOWN_UP_SEL Pull resistor: 0: Down 1: Up System <454:447> SYS_PATTERN_ID Project pattern ID <455> Reserved Security control <456> SYS_SECURITY_CRV_EN Continuous register verification: 0: Disable 1: Enable <457> Reserved MF7 (PDLY/Edge Detector)

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 79 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. Register Bit Address Register Name Register Definition <458> MF7_OUT_POL Output polarity: 0: OUT 1: nOUT <460:459> MF7_MODE MF mode: 00: Rising edge detector 01: Falling edge detector 10: Both edge detector 11: Both edge delay <462:461> MF7_DELAY_VAL Delay value: 00: 140ns 01: 280ns 10: 420ns 11: 560ns TMRs <470:463> Reserved <472:471> TMR0_INIT_STATE Timer initial state: 00: Initial 0 01: Initial 1 10: Bypass initial 11: Bypass initial <474:473> TMR1_INIT_STATE Timer initial state: 00: Initial 0 01: Initial 1 10: Bypass initial 11: Bypass initial <486:475> Reserved <488:487> MF8_TMR_INIT_STATE Timer initial state: 00: Initial 0 01: Initial 1 10: Bypass initial 11: Bypass initial <494:489> Reserved <496:495> TMR3_INIT_STATE Timer initial state: 00: Initial 0 01: Initial 1 10: Bypass initial 11: Bypass initial IO2 reset <498:497> IO2_RESET_TRIG IO2 Reset Trigger Event: 00: Rising Edge 01: Falling Edge 10: High Level 11: Reserved <499> IO2_RESET_EN IO2 Reset: 0: Disable 1: Enable <500> Reserved CRV <501> CRV_B14 CRV bit. If CRV is enabled, please make sure to keep the bit LOW Reserved <511:502> Reserved

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 80 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 16. Package Top Marking System Definition

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 81 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 17. Package Drawing and Dimensions X1-QFN1012-8 (Type AX) X1-QFN1012-8 (Type AX) Dim Min Max Typ A 0.37 0.47 0.42 A1 -0.005 0.03 -- A2 0.10 0.14 0.12 b -- -- 0.18 D 1.15 1.25 1.20 E 0.95 1.05 1.00 e 0.40 BSC s 0.185 REF L -- -- 0.350 L2 -- -- 0.225 aaa 0.05 ccc 0.05 All Dimensions in mm e L D b(8x) ccc CC A ccc C C E A Pin #1 Index Area aaa C aaa C B L2(7x) A s

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 82 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 18. Tape and Reel Specifications Package Type # of Pins Nominal Package Size, mm Max Units per Reel & Hub Size, mm Leader (min) Trailer (min) Tape Width, mm Part Pitch, mm per Reel per Box Pockets Len gth, mm Pockets Length, mm X1-QFN1012-8 (Type AX) 8 1.0× 1.2× 0.42 3000 3000 178/55 130 520 130 520 8 4 18.1. Carrier Tape Drawing and Dimensions Package Type A0 B0 K0 P0 P1 P2 T E F D0 D1 W X1-QFN1012-8

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 83 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 19. Recommended Land Pattern X1-QFN1012-8 (Type AX) Dimensions Value (in mm) C 0.400 G 0.175 G1 0.365 G2 0.210 G3 0.740 X 0.380 X1 0.505 X2 1.300 Y 0.190 Y1 0.380 Y2 1.500 G G1 X(7x) Y2G3 C Y (8x)

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 84 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 20. Mechanical Data

  • Moisture Sensitivity: Level 1 per J-STD-020
  • Weight: 0.0014 grams (Approximate)

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 85 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 21. Recommended Reflow Soldering Profile Please see IPC/JEDEC J-STD-020: latest revision for reflow profile based on package volume of 0.504 mm3 (nominal). More information can be found at www.jedec.org.

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 86 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 22. Revision History Date Version Change February 02, 2022 Rev.001 Initial release. July 12, 2022 Rev.002 Section Macrocell function summary updated with Macrocell Manifest at the beginning of the datasheet. September 07, 2022 Rev.003 Updated IO structure diagrams April 06, 2023 Rev.004 Updated section 4. Electrical Specifications September 12, 2023 Rev.005 Updated Section 4. Electrical Specifications. Completed section 22. Worldwide Sales and Customer Support. Updated section 12. Oscillator (OSC). January 26, 2024 Rev.006 Updated diagrams and figures. Fixed typos. Added initial states for timers: TMR0_INIT_STATE, TMR1_INIT_STATE, MF8_TMR_INIT_STATE, and TMR3_INIT_STATE. September 26, 2024 Rev.007 Updated the section 16. Package Top Marking System Definition. Updated oscillator settling time definition. Updated Electrical Specifications. Fixed typos. September 23, 2025 Rev.008 Updated electrical specifications. Updated Figure 13.1. POR sequence. Added a section Mechanical Data. Updated the section Data Protection. Updated Package Dimensions. March 3, 2026 Rev.009 Updated Tape and Reel Specification. Updated section 4. Electrical Specifications: IO high-level input voltage VIH for digital input low voltage mode; HIGH-Level Output Current IOH for Push-Pull ×2, and Opdan Drain PMOS ×2.

μASIC ALM1108 ALM1108 Document number: DS46635 Rev. 2 - 2 87 of 87 www.diodes.com March 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. 23. Legal Statement IMPORTANT NOTICE 1. DIODES INCORPORATED (Diodes) AND ITS SUBSIDIARIES MAKE NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO ANY INFORMATION CONTAINED IN THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICUL AR PURPOSE OR NON -INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 2. The Information contained herein is for informational purpose only and is provided only to illustrate the operation of Diodes’ products described herein and application examples. Diodes does not assume any liability arising out of the application or use o f this document or any product described herein. This document is intended for skilled and technically trained engineering customers and users who design with Diodes’ products. Diodes’ products may be used to facilitate safety-related applications; however, in all instances customers and users are responsible for (a) selecting the appropriate Diodes products for their applications, (b) evaluating the suitability of Diodes’ products for their intended applications, (c) ensuring their applications, which incorporate Diodes’ products, comply the applicable legal and regulatory requirements as well as safety and functional-safety related standards, and (d) ensuring they design with appropriate safeguards (including testing, validation, quality control techniques, redundancy, malfunction prevention, and appropriate treatment for aging degradation) to minimize the risks associated with their applications. 3. Diodes assumes no liability for any application -related information, support, assistance or feedback that may be provided by Diodes from time to time. Any customer or user of this document or products described herein will assume all risks and liabilities associated with such use, and will hold Diodes and all companies whose products are represented herein or on Diodes’ websites, harmless against all damages and liabilities. 4. Products described herein may be covered by one or more United States, international or foreign patents and pending patent applications. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks and trademark applications. Diodes does not convey any license under any of its intellectual property rights or the rights of any third parties (including third parties whose products and services may be described in this document or on Diodes’ website) under this document. 5. Diodes’ products are provided subject to Diodes’ Standard Terms and Conditions of Sale ( https://www.diodes.com/about/company/terms-and- conditions/terms-and-conditions-of-sales/) or other applicable terms. This document does not alter or expand the applicable warranties provided by Diodes. Diodes does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. 6. Diodes’ products and technology may not be used for or incorporated into any products or systems whose manufacture, use or sa le is prohibited under any applicable laws and regulations. Should customers or users use Diodes’ products in contravention of any applicable laws or regulations, or for any unintended or unauthorized application, customers and users will (a) be solely responsible for any damages, losses or penalties arising in connection therewith or as a result thereof, and (b) indemnify and hold D iodes and its representatives and agents harmless against any and all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim relating to any noncompliance with the applicable laws and regulations, as well as any unintended or unauthorized application. 7. While efforts have been made to ensure the information contained in this document is accurate, complete and current, it may c ontain technical inaccuracies, omissions and typographical errors. Diodes does not warrant that information contained in this docu ment is error-free and Diodes is under no obligation to update or otherwise correct this information. Notwithstanding the foregoing, Diodes reserves the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes. 8. Any unauthorized copying, modification, distribution, transmission, display or other use of this document (or any portion hereof) is prohibited. Diodes assumes no responsibility for any losses incurred by the customers or users or any third parties arising from any such unauthorized use. 9. This Notice may be periodically updated with the most recent version available at https://www.diodes.com/about/company/terms-and-conditions/important- notice The Diodes logo is a registered trademark of Diodes Incorporated in the United States and other countries. All other trademarks are the property of their respective owners. © 2026 Diodes Incorporated. All Rights Reserved. www.diodes.com