AL16084N7DL

AL16081N0DL ABC | Alldatasheet

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SPECIFICATION FOR APPROVAL G ( PCB Pattern ) 150 Time ( seconds ) d﹒Remark：Products comply with RoHS' requirements Ⅳ﹒GENERAL SPECIFICATION： AR-001A 30±5 Type F ( kgf ) Time ( sec ) Solder temp. : 260±5℃ Solder : Sn96.5 / Ag3 / Cu0.5 AL1608 0.5 Dip time : 4 ±1 seconds Flux : Rosin d﹒Solderability： or equivalent c﹒Terminal strength： a﹒Storage temp. ：-40℃ ---- +105℃ b﹒Operating temp. ：-55℃ ---- +125℃ F 100 Temperature ( )℃ 150 250 200 50100 Peak Temp：260℃ max. Max time above 230℃ ：50sec max. Max time above 200℃ ：70sec max. Rising Area +4.0 / sec max.℃ Temperature Preheat Area 150 ~ 200 / 60 ~ 120sec ℃ NAME PROD. REF : 20080424-A Ⅲ﹒MATERIALS： Ⅱ﹒SCHEMATIC DIAGRAM： Ⅰ﹒CONFIGURATION & DIMENSIONS： C c﹒Terminal electrode：Cu/Ni/Sn b﹒Internal conductor：Cu a﹒Body：Ceramic A 1.60±0.10AL1608 Series 0.80±0.10 B a C 0.45±0.10 B 0.30±0.20 D 0.9 G I THIN FILM CHIP INDUCTOR A D D ABC'S ITEM NO. ABC'S DWG NO. 260℃ 250200 70sec max. 50sec max. 230℃ -(1.0 ~ 5.0) / sec max.℃ Forced Cooling AreaReflow Area +2.0 ~ 4.0 ℃ / sec max. Peak Temperature: H cb Unit : m/m 0.9 H 0.6 I I PAGE: 1

150300155.00 1.0AL160868NJL □-□□□ 68.0±5 % 1). □：Packaging Information … A：Bulk B：Taping Reel 100.0±5 % AR-001A AL1608R10JL □-□□□ □ 2)."- ":Reference code□ □ 153001.07.50100 Ⅴ﹒ELECTRICAL CHARACTERISITCS： Inductance ( nH ) 1.0±0.3 SPECIFICATION FOR APPROVAL 22.0±5 % 18.0±5 % 4.7±0.3 5.6±0.3 6.8±0.3 10.0±5 % 8.2±0.3 12.0±5 % 15.0±5 % 3.9±0.3 3.3±0.3 2.2±0.3 2.7±0.3 1.8±0.3 1.5±0.3 THIN FILM CHIP INDUCTOR 1.2±0.3 56.0±5 % 47.0±5 % 27.0±5 % 33.0±5 % 39.0±5 % AL16082N2DL □-□□□ AL160812NJL □-□□□ AL160818NJL □-□□□ AL160822NJL □-□□□ AL160815NJL □-□□□ AL160833NJL □-□□□ AL160827NJL □-□□□ AL160847NJL □-□□□ AL160856NJL □-□□□ AL160839NJL □-□□□ AL16084N7DL □-□□□ AL16085N6DL □-□□□ AL16086N8DL □-□□□ AL16088N2DL □-□□□ AL160810NJL □-□□□ AL16083N3DL □-□□□ AL16083N9DL □-□□□ AL16082N7DL □-□□□ DWG No. AL16081N0DL □-□□□ AL16081N8DL □-□□□ AL16081N5DL □-□□□ AL16081N2DL □-□□□ REF : 20080424-A NAME PROD. 3000.358.030015 3.015300 3002.0 300 300 300 300 1.5 1.0 1.5 1.5 300 300 300 2.0 2.0 3.0 300 300 300 300 4.0 4.0 5.0 5.0 300 300 300 300 6.0 5.0 6.0 6.0 3001.05 2.35 2.75 3.00 5.00 3.00 1.65 1.95 1.35 250 150 200 250 200 300 250 300 0.65 0.95 0.75 0.95 0.55 0.45 0.45 0.45 300 300 300 300 300 300 300 300 Q min 30013.0 300 300 300 10.0 10.0 13.0 Test Freq. ( MHz ) SRF min ( GHz ) ABC'S DWG NO. ABC'S ITEM NO. Rated Current 0.35 0.35 0.35 0.35 ( Ω ) max DC Resistance 800 800 300 800 max ( mA ) PAGE: 2

400 m/m min.200 m/m min. Components AR-001A ( 3 ) Q'TY & G.W. Per pcakage 5,000 Q'TY (pcs) Series AL1608 07 - 08 Style ( 2 ) Dimensions G.W. (gw) Inner : Reel 07 - 08 Style 250,000 Q'TY (pcs) User direction of feed 21±0.8 A 178 BC D 41 x 39 x 22 Size (cm)G.W. (Kg) 7.0 Outer : Carton G 10+0 N -050 Unit:m/m 12.5 T ABC'S DWG NO. ABC'S ITEM NO. SPECIFICATION FOR APPROVAL Carrier tape width : D※ N B A no component Leader End P:4 m/m 4 m/m G ( 1 ) Configuration Ⅵ﹒PACKAGING INFORMATION： THIN FILM CHIP INDUCTOR PROD. NAME REF : 20080424-A 2.0±0.5 T no component Trailer Start Emobossed Carrier D PAGE: 3 Cover Tape

REF : 20080424-A Ⅶ﹒DWGING NUMBER EXPRESSION ： Appendix code 1 ：Product Classification Appendix code 2 ：Package Information AR-001A LA NAME PROD. RemarkInner package T / R ( Reel package ) Code B Inner package Q'TY 5000pcs Appendix code 1 : Classification Appendix code 2 : Package 1 ~ 9：Lead Free Special products comply with RoHS' requirements L：Lead Free Standard products comply with RoHS' requirements Dimension code Type code Electrical code Tolerance code SPECIFICATION FOR APPROVAL ABC'S ITEM NO. ABC'S DWG NO. 0816 Reference code PAGE: 4

SPECIFICATION FOR APPROVAL Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent AR-001A Resistance test High temp. Humidity Test ( Temp. cycle ) Thermal shock test Applied current : Per spec. Time : 96 hours Temperature : 125±5℃ not change more Electrical oharacteristics shall than ±20% Total : 50 cycles Time : 1000 hours Humidity : 90±5% Temperature : 40±2℃ Room temp. 15 minutes 15 minutes Room temp. REF : 20080424-A PROD. NAME Ⅷ﹒RELIABILITY TEST： Solderability THIN FILM CHIP INDUCTOR Specification terminal electrode Shall be covered More than 95% of the With fresh solder. Test itemTest condition Flux : Rosin Dip time : 5±0.5 seconds Solder temp. : 235±5℃ Preheat : 155 / 4 hours.℃ ABC'S DWG No. ABC'S ITEM No. 30 minutes +125 ℃ 30 minutes -55 ℃ PAGE: 5