AL10052N4DL

AL10050N2DL ABC | Alldatasheet

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0.6 I 50sec max. 70sec max. +2.0 ~ 4.0 ℃ AL1005 0.3 Type F ( kgf ) Time ( sec ) c﹒Terminal strength： Ⅳ﹒GENERAL SPECIFICATION： a﹒Storage temp. ：-40℃ ---- +105℃ b﹒Operating temp. ：-55℃ ---- +125℃ d﹒Solderability： AR-001A Temperature ( )℃ Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent Solder temp. : 260 ±5℃ Dip time : 4 ±1 seconds Flux : Rosin 30±5 F 100 150 250 200 Time ( seconds ) 100150 Max time above 230℃ ：50sec max. Max time above 200℃ ：70sec max. 150 ~ 200 / 60 ~ 120sec ℃ Peak Temp：260℃ max. Rising Area +4.0 / sec max.℃ Temperature Preheat AreaReflow Area / sec max. REF : 20080424-A Ⅲ﹒MATERIALS： Ⅱ﹒SCHEMATIC DIAGRAM： Ⅰ﹒CONFIGURATION & DIMENSIONS： c﹒Terminal electrode ：Cu/Ni/Sn d﹒Remark ：Products comply with RoHS' requirements b﹒Internal conductor：Cu a﹒Body：Ceramic THIN FILM CHIP INDUCTOR Series AL1005 NAME PROD. C 0.32±0.05 B A 1.00±0.05 B 0.50±0.05 ab 0.20±0.10 I DCG 0.5 G ( PCB Pattern ) ABC'S ITEM NO. ABC'S DWG NO. SPECIFICATION FOR APPROVAL D D A 260℃ 200250 230℃ -(1.0 ~ 5.0) / sec max.℃ Forced Cooling Area Peak Temperature: H c IH 0.45 Unit : m/m PAGE: 1

AL10053N8DL□-□□□ AL10053N9DL□-□□□ AL10056N8DL□-□□□ AL10055N9DL□-□□□ AL10055N6DL□-□□□ AL10054N7DL□-□□□ 6.8±0.3 5.9±0.3 3.9±0.3 5.6±0.3 4.7±0.3 3.8±0.3 AL10053N2DL□-□□□ AL10053N5DL□-□□□ AL10053N4DL□-□□□ AL10053N3DL□-□□□ AL10053N6DL□-□□□ AL10053N1DL□-□□□ AL10052N9DL□-□□□ AL10053N0DL□-□□□ 3.3±0.3 3.5±0.3 3.6±0.3 3.4±0.3 3.1±0.3 3.2±0.3 3.0±0.3 2.9±0.3 6.050013 500 500 500 500 500 500 6.0 6.0 6.0 6.0 6.0 6.0 500 500 500 500 500 500 500 500 6.0 6.0 6.0 6.0 6.0 6.0 6.0 6.0 3400.55 340 340 260 280 280 320 1.05 0.85 0.55 0.85 0.65 0.55 380 380 380 380 380 380 380 380 0.45 0.55 0.55 0.55 0.45 0.45 0.45 0.45 Ⅴ﹒ELECTRICAL CHARACTERISITCS： SPECIFICATION FOR APPROVAL THIN FILM CHIP INDUCTOR AL10052N2DL□-□□□ AL10052N3DL□-□□□ AL10052N4DL□-□□□ AL10052N5DL□-□□□ AL10052N8DL□-□□□ AL10052N7DL□-□□□ AL10052N6DL□-□□□ AL10052N1DL□-□□□ 2.4±0.3 2.6±0.3 2.7±0.3 2.8±0.3 2.5±0.3 2.2±0.3 2.3±0.3 2.1±0.3 AL10051N3DL□-□□□ AL10051N6DL□-□□□ AL10051N2DL□-□□□ AL10051N9DL□-□□□ AL10051N7DL□-□□□ AL10051N8DL□-□□□ AL10051N5DL□-□□□ AL10051N4DL□-□□□ 1.8±0.3 1.9±0.3 1.6±0.3 1.7±0.3 1.5±0.3 1.4±0.3 1.3±0.3 1.2±0.3 NAME PROD. REF : 20080424-A AL10051N0DL□-□□□ AL10050N2DL□-□□□ AL10050N8DL□-□□□ AL10050N4DL□-□□□ DWG No. 0.2±0.3 0.8±0.3 1.0±0.3 0.4±0.3 Inductance ( nH ) 70012.0500130.15 8.050013 500 500 500 500 500 500 500 500 8.0 8.0 8.0 6.0 8.0 8.0 8.0 8.0 500 500 500 500 500 500 500 500 10.0 8.0 10.0 10.0 10.0 12.0 10.0 10.0 5600.35 440 440 440 440 440 380 440 440 0.35 0.35 0.35 0.45 0.35 0.35 0.35 0.35 700 560 700 560 560 560 700 700 0.25 0.35 0.25 0.25 0.25 0.25 0.25 0.15 DC Resistance 500 500 500 500 Test Freq. ( MHz ) Q min 14.0 14.0 14.0 12.0 ( GHz ) min SRF ABC'S DWG NO. ABC'S ITEM NO. Rated Current max ( mA ) 700 800 700 800 0.10 0.15 0.15 0.10 ( Ω ) max PAGE: 2-1

SPECIFICATION FOR APPROVAL ( GHz ) SRF ABC'S ITEM NO. ABC'S DWG NO. 1). □：Packaging Information … A：Bulk B：Taping Reel 2)."- ":Reference code AL100533NJL□-□□□ □ □ □ AL100521NJL□-□□□ AL100522NJL□-□□□ AL100517NJL□-□□□ AL100512NJL□-□□□ AL100514NJL□-□□□ AL100518NJL□-□□□ AL100527NJL□-□□□ AL100515NJL□-□□□ 5001333.0±5 % 20.8±5 % 22.0±5 % 27.0±5 % 18.0±5 % 17.0±5 % 12.0±5 % 13.8±5 % 15.0±5 % 500 500 500 500 500 500 500 500 THIN FILM CHIP INDUCTOR AL10059N1DL□-□□□ AL10058N0DL□-□□□ AL10057N2DL□-□□□ AL10058N2DL□-□□□ DWG No. REF : 20080424-A NAME PROD. min Q 7.2±0.3 9.1±0.3 8.0±0.3 8.2±0.3 Inductance ( nH ) 500 500 500 500 ( MHz ) Test Freq. 2001.354.5 754.502.5 2.8 2.5 2.8 3.1 2.65 3.25 2.55 2.15 3.1 3.3 3.7 3.7 1.95 1.75 1.55 1.75 100 100 180 180 130 PAGE: 2-2 DC Resistance 6.01.05 5.5 5.5 5.5 1.25 1.25 1.25 min ( Ω ) max 260 220 220 220 ( mA ) max Rated Current

200 m/m min. ( 1 ) Configuration A 07 - 08 Style ( 2 ) Dimensions Ⅵ﹒PACKAGING INFORMATION： Series AL1005 ( 3 ) Q'TY & G.W. Per pcakage REF : 20080424-A THIN FILM CHIP INDUCTOR AR-001A End PROD. NAME 400 m/m min.Components Unit:m/m 12.5 User direction of feed Inner : Reel G.W. (gw) 10,000 Q'TY (pcs) 07 - 0860 Style 21±0.8178 ABC Outer : Carton 500,000 Q'TY (pcs) 5.5 G.W. (Kg) 41x 39 x 22 Size (cm) D G 10+0 N -050 T no component Cover Tape N B 4 m/m G P:2 m/m Trailer Carrier tape width : D※ Emobossed Carrier ABC'S DWG NO. ABC'S ITEM NO. SPECIFICATION FOR APPROVAL 2.0±0.5 T Start D PAGE: 3

Appendix code 1 : Classification Appendix code 2 : Package Electrical code Appendix code 1 ：Product Classification Appendix code 2 ：Package Information AR-001A T / R ( Reel package )B10000pcs Inner package 1 ~ 9：Lead Free Special products comply with RoHS' requirements L：Lead Free Standard products comply with RoHS' requirements Code Inner package Q'TY Dimension code Type code THIN FILM CHIP INDUCTOR REF : 20080424-A Ⅶ﹒DWGING NUMBER EXPRESSION： LA NAME PROD. ABC'S ITEM NO. ABC'S DWG NO. 0510 Tolerance code Reference code SPECIFICATION FOR APPROVAL Remark PAGE: 4

than ±20% Electrical oharacteristics shall AR-001A Resistance test High temp. Humidity Test Thermal shock test ( Temp. cycle ) Applied current : Per spec. Temperature : 125±5℃ Time : 96 hours Temperature : 40±2℃ Time : 1000 hours Humidity : 90±5% 15 minutes Room temp. Total : 50 cycles Room temp. 15 minutes +125 ℃ 30 minutes 30 minutes -55 ℃ Specification terminal electrode Shall be covered More than 95% of the With fresh solder. THIN FILM CHIP INDUCTOR SPECIFICATION FOR APPROVAL REF : 20080424-A PROD. NAME Solderability Ⅷ﹒RELIABILITY TEST： Test item PAGE: 5 Test condition Dip time : 5±0.5 seconds Solder temp. : 235±5℃ Preheat : 155 / 4 hours.℃ Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent Flux : Rosin ABC'S DWG No. ABC'S ITEM No.