AK6-058C LUGUANG | Alldatasheet

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Technical content

Features

t)BMPHFO'SFF t3P)4DPNQMJBOU t 'PMECBL ™ technology for superior clamping factor t (MBTT1BTTJWBUFE+VODUJPO for reliabilty t#JEJSFDUJPOBM t 6MUSBDPNQBDU times less volume than traditional discrete solutions t 7FSZ-PX$MBNQJOH 7PMUBHF t 4IBSQ#SFBLEPXO7PMUBHF t -PX4MPQF3FTJTUBODF Agency Approvals Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted)

Electrical Characteristics

Note: Using 8 x 20μS wave shape as defined in IEC 61000-4-5. Part Numbers Standoff Voltage (VSO) Volts Max. Reverse Leakage (IR) @VSO μA Reverse Breakdown Voltage (VBR) @ IT Test Current IT Max. Clamping Voltage VCL @ Ipp Peak Pulse Current (IPP) (Note 1) Max. Temp Coefficient OF VBR Max. Capacitance

0 Bias 10kHz

Min Volts Max Volts (mA) V CL Volts I PP Amps (%/ OC) (nF) AK6 - 058C 58 20 64 70 10 110 6,000 0.1 8 X AK6 - 076C 76 20 85 95 10 140 6,000 0.1 6.5 X AK6 - 170C 170 20 180 220 10 260 6,000 0.1 2.8 X AK6 - 190C 190 20 200 245 10 290 6,000 0.1 2.5 X AK6 - 240C 240 20 250 285 10 340 6,000 0.1 2.0 X AK6 - 380C 380 20 401 443 10 520 6,000 0.1 1 .4 X AK6 - 430C 430 20 440 490 10 625 6,000 0.1 1 .0 X Parameter Symbol 7BMVF Unit 0QFSBUJOH+VODUJPOBOE Storage Temperature Range T+ T45( (-)55 to 150 °C Current Rating1 IPP 6k A Note: 1 . Rated IPP measured with 8 x 20μS pulse. AK6 Series Transient Voltage Suppression Diodes L2 L1 A G D E F CB Dimensions Dimensions Inches Millimeters A 0.950 24.15 B 0.095 2.4 C - 058C/076C 0.236 6.00 C 0.145 3.68 D 0.570 max. 14.48 max. E 0.050 1 .270 F 0.500 max. 12.70 max. ($$ 0.200 5.08 ($$ 0.320 8.13 ($ 0.370 9.4 ($$ 0.543 13.8 L1 0.310 7 .87 L1 - 380C/430C 0.150 3.81 " ( UPMFSBODF JODI NN http://www.luguang.cn mail:lge@luguang.cn

Flow/Wave Soldering (Solder Dipping) Peak T emperature : 265OC Dipping Time : 10 seconds Soldering : 1 time Temperature (T) Time (t) Ts(min) Ts(max) TL TP ts Preheat tL tp Ramp-up Critical Zone TL to TP Ramp-down t 25˚C to Peak 25˚C Physical Specifications Weight Contact manufacturer Case Epoxy encapsulated T erminal Silver plated leads, solderable per MIL -STD-202 Method 208 Soldering Parameters Reflow Condition Lead–free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Time (min to max) (ts) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (t p) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 280°C 100 120 0 25 50 75 100 125 150 AMBIENT TEMPERATURE (°C) Percent of Rated Value Ratings and Characteristic Curves (TA=25°C unless otherwise noted) Peak Power Derating AK6 Series Transient Voltage Suppression Diodes http://www.luguang.cn mail:lge@luguang.cn