AK09912 HUAXINAN | Alldatasheet
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[AK09912] ShortDatasheet-E-00 2014/1 - 1 - AK09912 3-axis Electronic Compass 1. Features A 3-axis electronic compass IC with high sensitive Hall sensor technology. Best adapted to pedestrian city navigation use for cell phone and other portable appliance. Functions: 3-axis magnetometer device suitable for compass application Built-in A to D Converter for magnetometer data out 16-bit data out for each 3-axis magnetic component Sensitivity: 0.15 µT/LSB (typ.) Serial interface I2C bus interface Standard, Fast and High-speed modes (up to 2.5 MHz) compliant with Philips I2C specification Ver.2.1 4-wire SPI Operation mode Power-down, Single measurement, Continuous measurement, External trigger measurement, Self-test and Fuse ROM access DRDY (Data Ready) function for measurement data ready Magnetic sensor overflow monitor function Built-in oscillator for internal clock source Power on Reset circuit Self test function with internal magnetic source Built-in Noise Suppression Filter (NSF) Built-in temperature sensor Operating temperatures: -30˚C to +85˚C Operating supply voltage: Analog power supply +1.7V to +3.6V Digital Interface supply +1.65V to analog power supply voltage Current consumption: Power-down: 3 µA (typ.) Measurement: Average current consumption at 100 Hz repetition rate: 1 mA (typ.) Package: AK09912C 14 -pin WL-CSP (BGA): 1.6 mm 1.6 mm 0.5 mm (typ.) = Short Datasheet =
[AK09912] ShortDatasheet-E-00 2014/1 - 2 - 2. Overview AK09912 is 3-axis electronic compass IC with high sensitive Hall sensor technology. Small package of AK09912 incorporates magnetic sensors for detecting terrestrial magnetism in the X-axis, Y-axis, and Z-axis, a sensor driving circuit, signal amplifier chain, and an arithmetic circuit for processing the signal from each sensor. Self test function is also incorporated. From its compact foot print and thin package feature, it is suitable for map heading up purpose in GPS-equipped cell phone to realize pedestrian navigation function. AK09912 has the following features: (1) Silicon monolithic Hall-effect magnetic sensor with magnetic concentrator realizes 3-axis magnetometer on a silicon chip. Analog circuit, digital logic, power block and interface block are also integrated on a chip. (2) Wide dynamic measurement range and high resolution with lower current consumption. Output data resolution: 16-bit (0.15 µT/LSB) Measurement range: ±4900 µT Average current at 100 Hz repetition rate: 1 mA (typ.) (3) Digital serial interface I2C bus interface to control AK09912 functions and to read out the measured data by external CPU. A dedicated power supply for I2C bus interface can work in low-voltage apply as low as 1.65V . 4-wire SPI is also supported. A dedicated power supply for SPI can work in low-voltage apply as low as 1.65V . (4) DRDY pin and register inform to system that measurement is end and set of data in registers are ready to be read. (5) Device is worked by on-chip oscillator so no external clock source is necessary. (6) Self test function with internal magnetic source to confirm magnetic sensor operation on end products. (7) Built-in NSF (Noise Suppression Filter) keeps magnetic sensor output stable. (8) Built-in temperature sensor to monitor the temperature while operation.
[AK09912] ShortDatasheet-E-00 2014/1 - 3 - 3. Table of Contents
[AK09912] ShortDatasheet-E-00 2014/1 - 4 - 4. Circuit Configuration 4.1. Block Diagram 3-axis Hall sensor MUX SDA/SI DRDY Chopper SW HE-Drive Pre- AMP Integrator＆ADC Interface, Logic & Register SCL/SK VDD VREF Timing Control VID SO OSC1 CSB Magnetic Source CAD0 VSS POR FUSE ROM CAD1 TST1 TRG T-Sensor RSTN Signal Processing OSC2 TST2 4.2. Block Function Block Function 3-axis Hall sensor Monolithic Hall elements. MUX Multiplexer for selecting Hall elements. Chopper SW Performs chopping. HE-Drive Magnetic sensor drive circuit for constant-current driving of sensor. Pre-AMP Fixed-gain differential amplifier used to amplify the magnetic sensor signal. T-Sensor Temperature sensor. Generate a voltage in proportion to temperature. Integrator & ADC Integrates and amplifies pre-AMP output or T-sensor output and performs analog-to-digital conversion. OSC1 Generates an operating clock for sensor measurement. OSC2 Generates an operating periodic clock for sequencer. POR Power On Reset circuit. Generates reset signal on rising edge of VDD. VREF Generates reference voltage and current. Interface Logic Register Exchanges data with an external CPU. DRDY pin indicates sensor measurement has ended and data is ready to be read. I2C bus interface using two pins, namely, SCL and SDA. Standard, Fast and High-speed modes are supported. The low-voltage specification can be supported by applying 1.65V to the VID pin. 4-wire SPI is also supported by SK, SI, SO and CSB pins. 4-wire SPI works in VID pin voltage down to 1.65 V, too. Signal Processing Noise suppression function by the filtering process. Filtering process can be enabled or disabled. Timing Control Generates a timing signal required for internal operation from a clock generated by the OSC1. Magnetic Source Generates magnetic field for self test of magnetic sensor. FUSE ROM Fuse ROM for adjustment.
[AK09912] ShortDatasheet-E-00 2014/1 - 5 - 4.3. Pin Function Pin No. Pin name I/O Power supply Type Function A1 DRDY O VID CMOS Data Ready output pin. “H” active. Informs measurement ended and data is ready to be read. A2 CSB I VID CMOS Chip select pin for 4-wire SPI. “L” active. Connect to VID when selecting I2C bus interface. A3 SCL I VID CMOS When the I2C bus interface is selected (CSB pin is connected to VID). SCL: Control clock input pin Input: Schmitt trigger SK When the 4-wire SPI is selected. SK: Serial clock input pin. A4 SDA I/O VID CMOS When the I2C bus interface is selected (CSB pin is connected to VID). SDA: Control data input/output pin Input: Schmitt trigger, Output: Open drain SI I When the 4-wire SPI is selected. SI: Serial data input pin B1 VDD - - Power Positive power supply pin. B3 TST2 O VID CMOS Test pin. Connect to VSS or keep this pin non-connected. B4 SO O VID CMOS When the I2C bus interface is selected (CSB pin is connected to VID) Hi-Z output. Keep this pin electrically non-connected. When the 4-wire SPI is selected. Serial data output pin C1 VSS - - Power Ground pin C2 TST1 I VDD CMOS Test pin. Pulled down by 100kΩ internal resister. Keep this pin electrically non-connected or connect to VSS. C3 TRG I VID CMOS External trigger pulse input pin. Enabled only in External trigger measurement mode. Pulled down by 100kΩ internal resister. When External trigger measurement mode is not in use, keep this pin electrically non-connected or connect to VSS. C4 VID - - Power Digital interface positive power supply pin. D1 CAD0 I VDD CMOS When the I2C bus interface is selected (CSB pin is connected to VID) CAD0:Slave address 0 input pin Connect to VSS or VDD. When the 4-wire serial interface is selected. Connect to VSS. D2 CAD1 I VDD CMOS When the I2C bus interface is selected (CSB pin is connected to VID). CAD1:Slave address 1 input pin Connect to VSS or VDD. When the 4-wire serial interface is selected. Connect to VSS. D4 RSTN I VID CMOS Reset pin. Resets registers by setting to “L”. Connect to VID when not in use.
[AK09912] ShortDatasheet-E-00 2014/1 - 6 - 5. Overall Characteristics 5.1. Absolute Maximum Ratings Vss=0V Parameter Symbol Min. Max. Unit Power supply voltage (Vdd, Vid) V+ -0.3 +4.3 V Input voltage VIN -0.3 （V+）+0.3 V Input current IIN - ±10 mA Storage temperature Tst -40 +125 ˚C (Note 1) If the device is used in conditions exceeding these values, the device may be destroyed. Normal operations are not guaranteed in such exceeding conditions. 5.2. Recommended Operating Conditions Vss=0V Parameter Remark Symbol Min. Typ. Max. Unit Operating temperature Ta -30 +85 ˚C Power supply voltage VDD pin voltage Vdd 1.7 3.0 3.6 V VID pin voltage Vid 1.65 Vdd V 5.3. Electrical Characteristics The following conditions apply unless otherwise noted: Vdd=1.7V to 3.6V, Vid=1.65V to Vdd, Temperature range=-30 ˚C to 85 ˚C 5.3.1. DC Characteristics Parameter Symbol Pin Condition Min. Typ. Max. Unit High level input voltage 1 VIH1 CSB RSTN TRG 70%Vid V Low level input voltage 1 VIL1 30%Vid V High level input voltage 2 VIH2 SK/SCL SI/SDA 70%Vid Vid+0.3 V Low level input voltage 2 VIL2 -0.3V 30%Vid V High level input voltage 3 VIH3 CAD0 CAD1 TST1 70%Vdd V Low level input voltage 3 VIL3 30%Vdd V Input current 1 IIN1 SK/SCL SI/SDA CSB RSTN Vin=Vss or Vid -10 +10 µA CAD0 CAD1 Vin=Vss or Vdd -10 +10 Input current 2 IIN2 TRG Vin=Vid 100 µA Input current 3 IIN3 TST1 Vin=Vdd 100 µA Hysteresis input voltage (Note 2) VHS SCL SDA Vid≥2V 5%Vid V Vid<2V 10%Vid High level output voltage 1 VOH1 SO DRDY TST2 IOH≥-100µA 80%Vid V Low level output voltage 1 VOL1 IOL≤+100µA 20%Vid V Low level output voltage 2 (Note 3) VOL2 SDA IOL≤+3mA Vid≥2V 0.4 V IOL≤+3mA Vid<2V 20%Vid V
[AK09912] ShortDatasheet-E-00 2014/1 - 7 - IDD1 VDD VID Power-down mode Vdd=Vid=3.0V 3 6 µA IDD2 When magnetic sensor is driven 1.4 2.3 mA IDD3 Self-test mode 3.4 5 mA IDD4 When temperature sensor is driven 1 1.5 mA IDD5 (Note 5) 0.1 5 µA (Note 2) Schmitt trigger input (reference value for design) (Note 3) Output is open-drain. Connect a pull-up resistor externally (Note 4) Without any resistance load (Note 5) (case 1) Vdd=ON, Vid=ON, RSTN pin=“L”. (case 2) Vdd=ON, Vid=OFF (0V), RSTN pin=“L”. (case 3) Vdd=OFF (0V), Vid=ON. 5.3.2. AC Characteristics Parameter Symbol Pin Condition Min. Typ. Max. Unit Power supply rise time (Note 6) PSUP VDD VID Period of time that VDD (VID) changes from 0.2V to Vdd (Vid). 50 ms POR completion time (Note 6) PORT Period of time after PSUP to Power-down mode(Note 7) 100 µs Power supply turn off voltage (Note 6) SDV VDD VID Turn off voltage to enable POR to restart(Note 7) 0.2 V Power supply turn on interval (Note 6) PSINT VDD VID Period of time that voltage lower than SDV needed to be kept to enable POR to restart(Note 7) 100 µs Wait time before mode setting Twat 100 µs Wait time of Fuse ROM reading Twatr Wait time from Fuse ROM access mode setting to accessible Fuse ROM 100 µs (Note 6) Reference value for design. (Note 7) When POR circuit detects the rise of VDD/VID voltage, it resets internal circuits and initializes the registers. After reset, AK09912 transits to Power-down mode. 0V PSINT:100us PSUP:50ms PORT:100us Power-down mode SDV:0.2V Twat:100us VDD/VID Power-down mode Fuse ROM access mode モード Twatr:100us Accessible Fuse ROM
[AK09912] ShortDatasheet-E-00 2014/1 - 8 - Parameter Symbol Pin Condition Min. Typ. Max. Unit Trigger input effective pulse width tTRIGH TRG 200 ns Trigger input effective frequency (Note 8) tTRIGf TRG 100 Hz (Note 8) The value when the period of time from the end of the measurement to the next trigger input is 1.3ms. VIH tTRIGH Parameter Symbol Pin Condition Min. Typ. Max. Unit Reset input effective pulse width (“L”) tRSTL RSTN 5 µs VIL tRSTL 5.3.3. Analog Circuit Characteristics Parameter Symbol Condition Min. Typ. Max. Unit Measurement data output bit DBIT - 16 - bit Time for measurement TSM Single measurement mode 7.2 8.5 ms Magnetic sensor sensitivity (Note 9) BSE Tc = 25 ˚C 0.1425 0.15 0.1575 µT/LSB Magnetic sensor measurement range(Note 10) BRG Tc = 25 ˚C ±4912 µT Magnetic sensor initial offset (Note 11) Tc = 25 ˚C -2000 +2000 LSB (Note 9) Value after sensitivity is adjusted using sensitivity fine adjustment data stored in Fuse ROM. (Note 10) Reference value for design (Note 11) Value of measurement data register on shipment without applying magnetic field on purpose.
[AK09912] ShortDatasheet-E-00 2014/1 - 9 - 5.3.4. 4-wire SPI 4-wire SPI is compliant with mode 3 (SPI-mode3). Parameter Symbol Condition Min. Typ. Max. Unit CSB setup time Tcs 50 ns Data setup time Ts 50 ns Data hold time Th 50 ns SK high time Twh Vid2.5V 100 ns 2.5V>Vid1.65V 150 ns SK low time Twl Vid2.5V 100 ns 2.5V>Vid1.65V 150 ns SK setup time Tsd 50 ns SK to SO delay time (Note 12) Tdd 50 ns CSB to SO delay time (Note 12) Tcd 50 ns SK rise time (Note 13) Tr 100 ns SK fall time (Note 13) Tf 100 ns CSB high time Tch 150 ns (Note 12) SO load capacitance:20pF (Note 13) Reference value for design. [4-wire SPI] CSB SK SI Tcs SO Ts Tsd Tcd Th Tdd Hi-Z Hi-Z Twh Twl ｌ Tch [Rise time and fall time] SK Tr Tf 0.9Vid 0.1Vid
[AK09912] ShortDatasheet-E-00 2014/1 - 10 - 5.3.5. I2C Bus Interface CSB pin = “H” I2C bus interface is compliant with Standard mode and Fast mode. Standard/Fast mode is selected automatically by fSCL. Standard mode fSCL≤100kHz Symbol Parameter Min. Typ. Max. Unit fSCL SCL clock frequency 100 kHz tHIGH SCL clock “High” time 4.0 µs tLOW SCL clock “Low” time 4.7 µs tR SDA and SCL rise time 1.0 µs tF SDA and SCL fall time 0.3 µs tHD:STA Start Condition hold time 4.0 µs tSU:STA Start Condition setup time 4.7 µs tHD:DAT SDA hold time (vs. SCL falling edge) 0 µs tSU:DAT SDA setup time (vs. SCL rising edge) 250 ns tSU:STO Stop Condition setup time 4.0 µs tBUF Bus free time 4.7 µs Fast mode 100Hz≤fSCL≤400kHz Symbol Parameter Min. Typ. Max. Unit fSCL SCL clock frequency 400 kHz tHIGH SCL clock “High” time 0.6 µs tLOW SCL clock “Low” time 1.3 µs tR SDA and SCL rise time 0.3 µs tF SDA and SCL fall time 0.3 µs tHD:STA Start Condition hold time 0.6 µs tSU:STA Start Condition setup time 0.6 µs tHD:DAT SDA hold time (vs. SCL falling edge) 0 µs tSU:DAT SDA setup time (vs. SCL rising edge) 100 ns tSU:STO Stop Condition setup time 0.6 µs tBUF Bus free time 1.3 µs tSP Noise suppression pulse width 50 ns [I2C bus interface timing] 1/fSCL SCL VIH2 VIL2 tHIGH SCL SDA VIH2 tLOW tBUF tHD:STA tR tF tHD:DAT tSU:DAT tSU:STA Stop Start Start Stop tSU:STO VIL2 VIH2 VIL2 tSP
[AK09912] ShortDatasheet-E-00 2014/1 - 11 - High-speed mode (Hs-mode) Cb≤100pF (Cb: load capacitance) fSCLH≤2.5MHz Symbol Parameter Min. Typ. Max. Unit fSCLH SCLH clock frequency 2.5 MHz tHIGH SCLH clock “High” time 110 ns tLOW SCLH clock “Low” time 220 ns tR_CL SCLH rise time 10 40 ns tR_CL1 SCLH rise time after a repeated START condition and after an acknowledge bit 10 80 ns tR_DA SDAH rise time 10 80 ns tF_CL SCLH fall time - 40 ns tF_DA SDAH fall time - 80 ns tHD:STA Start Condition hold time 160 ns tSU:STA Start Condition setup time 160 ns tHD:DAT SDAH hold time (vs. SCLH falling edge) 0 ns tSU:DAT SDAH setup time (vs. SCLH rising edge) 10 ns tSU:STO Stop Condition setup time 160 ns tSP Noise suppression pulse width 10 ns Cb≤400pF fSCLH≤1.7MHz Symbol Parameter Min. Typ. Max. Unit fSCLH SCLH clock frequency 1.7 MHz tHIGH SCLH clock “High” time 120 ns tLOW SCLH clock “Low” time 320 ns tR_CL SCLH rise time 20 80 ns tR_CL1 SCLH rise time after a repeated START condition and after an acknowledge bit 20 160 ns tR_DA SDAH rise time 20 160 ns tF_CL SCLH fall time - 80 ns tF_DA SDAH fall time - 160 ns tHD:STA Start Condition hold time 160 ns tSU:STA Start Condition setup time 160 ns tHD:DAT SDAH hold time (vs. SCLH falling edge) 0 ns tSU:DAT SDAH setup time (vs. SCLH rising edge) 10 ns tSU:STO Stop Condition setup time 160 ns tSP Noise suppression pulse width 10 ns
[AK09912] ShortDatasheet-E-00 2014/1 - 12 - [I2C bus interface timing of Hs-mode] VIH2 VIL2 VIH2 VIL2 SDAH SCLH START START STOP tF_DA tR_DA tR_CL1 tR_CL1 tR_CL tF_CL tHIGH tLOW tHIGH tHD:DAT tSU:DAT tSU:STO tSU:STA tHD:STA SCLH VIH2 VIL2 1/fSCLH
[AK09912] ShortDatasheet-E-00 2014/1 - 13 - 6. Function Explanation 6.1. Power States When VDD and VID are turned on from Vdd=OFF (0V) and Vid=OFF (0V), all registers in AK09912 are initialized by POR circuit and AK09912 transits to Power-down mode. All the states in the table below can be set, although the transition from state 2 to state 3 and the transition from state 3 to state 2 are prohibited. Table 6.1 Power state State VDD VID Power state 1 OFF (0V) OFF (0V) OFF (0V). It doesn’t affect external interface. Digital input pins other than SCL and SDA pin should be fixed to “L” (0V). 2 OFF (0V) 1.65V to 3.6V OFF (0V) It doesn’t affect external interface. 3 1.7V to 3.6V OFF (0V) OFF(0V) It doesn’t affect external interface. Digital input pins other than SCL and SDA pin should be fixed to “L” (0V). 4 1.7V to 3.6V 1.65V to Vdd ON 6.2. Reset Functions When the power state is ON, always keep Vid≤Vdd. Power-on reset (POR) works until Vdd reaches to the operation effective voltage (about 1.1V: reference value for design) on power-on sequence. After POR is deactivated, all registers are initialized and transits to power down mode. When Vdd=1.7 to 3.6V, POR circuit and VID monitor circuit are active. When Vid=0V, AK09912 is in reset status and it consumes the current of reset state (IDD5). AK09912 has four types of reset; (1) Power on reset (POR) When Vdd rise is detected, POR circuit operates, and AK09912 is reset. (2) VID monitor When VID is turned OFF (0V), AK09912 is reset. (3) Reset pin (RSTN) AK09912 is reset by Reset pin. When Reset pin is not used, connect to VID. (4) Soft reset AK09912 is reset by setting SRST bit. When AK09912 is reset, all registers (without ASAX, ASAY and ASAZ) are initialized and AK09912 transits to Power-down mode.
[AK09912] ShortDatasheet-E-00 2014/1 - 14 - 6.3. Operation Mode AK09912 has following nine operation modes: (1) Power-down mode (2) Single measurement mode (3) Continuous measurement mode 1 (4) Continuous measurement mode 2 (5) Continuous measurement mode 3 (6) Continuous measurement mode 4 (7) External trigger measurement mode (8) Self-test mode (9) Fuse ROM access mode By setting CNTL2 register MODE[4:0] bits, the operation set for each mode is started. A transition from one mode to another is shown below. MODE[4:0]=“00001” MODE[4:0]=“00000” Transits automatically MODE[4:0]=“00010” MODE[4:0]=“00000” MODE[4:0]=“00100” MODE[4:0]=“00000” MODE[4:0]=“00110” MODE[4:0]=“00000” MODE[4:0]=“01000” MODE[4:0]=“00000” MODE[4:0]=“01010” MODE[4:0]=“00000” MODE[4:0]=“10000” MODE[4:0]=“00000” Transits automatically MODE[4:0]=“11111” MODE[4:0]=“00000” Power-down mode Continuous measurement mode 2 Sensor is measured periodically in 20Hz. Transits to Power-down mode by writing MODE[4:0]=“00000”. Self-test mode Sensor is self-tested and the result is output. Transits to Power-down mode automatically. Single measurement mode Sensor is measured for one time and data is output. Transits to Power-down mode automatically after measurement ended. External trigger measurement mode Sensor is measured for one time by external trigger. Waits for next trigger after data is output. Transits to Power-down mode by writing MODE[4:0]=“00000”. Continuous measurement mode 1 Sensor is measured periodically in 10Hz. Transits to Power-down mode by writing Continuous measurement mode 3 Sensor is measured periodically in 50Hz. Transits to Power-down mode by writing MODE[4:0]=“00000”. Continuous measurement mode 4 Sensor is measured periodically in 100Hz. Transits to Power-down mode by writing MODE[4:0]=“00000”. Fuse ROM access mode Turn on the needed to read out Fuse ROM. Transits to Power-down mode by writing MODE[4:0]=“00000”. Figure 6.1 Operation mode When power is turned ON, AK09912 is in Power-down mode. When a specified value is set to MODE[4:0], AK09912 transits to the specified mode and starts operation. When user wants to change operation mode, transit to power-down mode first and then transit to other modes. After Power-down mode is set, at least 100 µs (Twat) is needed before setting another mode.
[AK09912] ShortDatasheet-E-00 2014/1 - 15 - 7. Example of Recommended External Connection 7.1. I2C Bus Interface Pins of dot circle should be kept non-connected. AK09912C (Top view) Interrupt Host CPU I2C I/F Power for I/F VID POWER 1.65V to Vdd VDD POWER 1.7V to 3.6V 0.1µF 0.1µF TST2 RSTN VID SO SDA /SI TRG TST2 SCL /SK CSB TST1 CAD0 CAD1 VSS VDD DRDY Slave address select CAD1 CAD0 address VSS VSS 0 0 0 1 1 0 0 R/W VSS VDD 0 0 0 1 1 0 1 R/W VDD VSS 0 0 0 1 1 1 0 R/W VDD VDD 0 0 0 1 1 1 1 R/W GPIO 4 3 2 1 D C B A
[AK09912] ShortDatasheet-E-00 2014/1 - 16 - 7.2. 4-wire SPI Pins of dot circle should be kept non-connected. AK09912C (Top view) Interrupt Host CPU SPI I/F Power for I/F VID POWER 1.65V to Vdd VDD POWER 1.7V to 3.6V 0.1µF 0.1µF TST2 RSTN VID SO SDA /SI TRG TST2 SCL /SK CSB TST1 CAD0 CAD1 VSS VDD DRDY GPIO 4 3 2 1 D C B A
[AK09912] ShortDatasheet-E-00 2014/1 - 17 - 8. Package 8.1. Marking Product name: 09912 Date code: X1X2X3X4X5 X1 = ID X2 = Year code X3X4 = Week code X5 = Lot 8.2. Pin Assignment 4 3 2 1 D RSTN CAD1 CAD0 C VID TRG TST1 VSS B SO TST2 VDD A SDA/SI SCL/SK CSB DRDY <Top view> 09912 X1X2X3X4X5 <Top view>
[AK09912] ShortDatasheet-E-00 2014/1 - 18 - 8.3. Outline Dimensions 8.4. Recommended Foot Print Pattern <Top view> 0.05 C 0.57 max. C 0.40 0.13 0.4 1.2 1.2 0.4 0.240.03 4 3 2 1 1.590.03 D 1.590.03 C B A 1 2 3 4 <Top view> <Bottom view> <Side view> 0.4 0.23 a 0.4
[AK09912] ShortDatasheet-E-00 2014/1 - 19 - 9. Relationship between the Magnetic Field and Output Code The measurement data increases as the magnetic flux density increases in the arrow directions.
[AK09912] ShortDatasheet-E-00 2014/1 - 20 - Important Notice 0. Asahi Kasei Microdevices Corporation (“AKM”) reserves the right to make changes to the information contained in this document without notice. When you consider any use or application of AKM product stipulated in this document (“Product”), please make inquiries the sales office of AKM or authorized distributors as to current status of the Products. 1. All information included in this document are provided only to illustrate the operation and application examples of AKM Products. AKM neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of AKM or any third party with respect to the information in this document. You are fully responsible for use of such information contained in this document in your product design or applications. AKM ASSUMES NO LIABILITY FOR ANY LOSSES INCURRED BY YOU OR THIRD PARTIES ARISING FROM THE USE OF SUCH INFORMATION IN YOUR PRODUCT DESIGN OR APPLICATIONS. 2. The Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact, including but not limited to, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for the above use unless specifically agreed by AKM in writing. 3. Though AKM works continually to improve the Product’s quality and reliability, you are responsible for complying with safety standards and for providing adequate designs and safeguards for your hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of the Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. 4. Do not use or otherwise make available the Product or related technology or any information contained in this document for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). When exporting the Products or related technology or any information contained in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. The Products and related technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. 5. Please contact AKM sales representative for details as to environmental matters such as the RoHS compatibility of the Product. Please use the Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. AKM assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 6. Resale of the Product with provisions different from the statement and/or technical features set forth in this document shall immediately void any warranty granted by AKM for the Product and shall not create or extend in any manner whatsoever, any liability of AKM. 7. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of AKM.