AGL015V2-UCG144

AGL1000V2-FGG144I ACTEL | Alldatasheet

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© 2008 Actel Corporation IGLOO Low-Power Flash FPGAs with Flash*Freeze Technology Features and Benefits Low Power

• 1.2 V to 1.5 V Core Voltage Support for Low Power  Supports Single-Voltage System Operation  5 µW Power Consumption in Flash*Freeze Mode  Low-Power Active FPGA Operation  Flash*Freeze Technology Enables Ultra-Low Power Consumption while Maintaining FPGA Content  Easy Entry to / Exit from Ultra-Low-Power Flash*Freeze Mode High Capacity  15 k to 1 Million System Gates  Up to 144 kbits of True Dual-Port SRAM  Up to 300 User I/Os Reprogrammable Flash Technology  130-nm, 7-Layer Metal, Flash-Based CMOS Process  Live-at-Power-Up (LAPU) Level 0 Support  Single-Chip Solution  Retains Programmed Design When Powered Off In-System Programming (ISP) and Security  Secure ISP Using On-Chip 128-Bit Advanced Encryption Standard (AES) Decryption (except ARM ®-enabled IGLOO® devices) via JTAG (IEEE 1532–compliant)1 F l a s h L o c k® to Secure FPGA Contents High-Performance Routing Hierarchy  Segmented, Hierarchical Routing and Clock Structure Advanced I/O  700 Mbps DDR, LVDS-Capable I/Os (AGL250 and above)  Bank-Selectable I/O Voltages—up to 4 Banks per Chip  Single-Ended I/O Standards: LVTTL, LVCMOS 1, and LVCMOS 2.5 V / 5.0 V Input1  Differential I/O Standards: LVPECL, LVDS, B-LVDS, and M- LVDS (AGL250 and above)  I/O Registers on Input, Output, and Enable Paths  Hot-Swappable and Cold-Sparing I/Os ‡  Programmable Output Slew Rate 1 and Drive Strength  Weak Pull-Up/-Down  IEEE 1149.1 (JTAG) Boundary Scan Test  Pin-Compatible Packages across the IGLOO Family Clock Conditioning Circuit (CCC) and PLL1  Six CCC Blocks, One with an Integrated PLL  Configurable Phase Shift, Multiply/Divide, Delay Capabilities, and External Feedback  Wide Input Frequency Range (1.5 MHz up to 250 MHz) Embedded Memory  1 kbit of FlashROM User Nonvolatile Memory  SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit1 RAM Blocks (×1, ×2, ×4, ×9, and ×18 organizations)  True Dual-Port SRAM (except ×18) 1 ARM Processor Support in IGLOO FPGAs  M1 IGLOO Devices—Cortex™-M1 Soft Processor Available with or without Debug 1 AGL015 and AGL030 devices do not support this f eature. ‡ Supported only by AGL015 and AGL030 devices. IGLOO Product Family IGLOO Devices AGL015 AGL030 AGL060 AGL125 AGL250 AGL400 AGL600 AGL1000 ARM-Enabled IGLOO Devices M1AGL250 M1AGL400 M1AGL600 M1AGL1000 System Gates 15 k 30 k 60 k 125 k 250 k 400 k 600 k 1 M Typical Equivalent Macrocells 128 256 512 1,024 2,048 – – – VersaTiles (D-flip-flops) 384 768 1,536 3,072 6,144 9,216 13,824 24,576 Flash*Freeze Mode (typical, µW) 5 5 10 16 24 32 36 53 RAM kbits (1,024 bits) – – 18 36 36 54 108 144 4,608-Bit Blocks –– 4 8 8 1 2 2 4 3 2 FlashROM Bits 1 k 1 k 1 k 1 k 1 k 1 k 1 k 1 k Secure (AES) ISP 1 – – Yes Yes Yes Yes Yes Yes Integrated PLL in CCCs 2 –– 1 1 1 1 11 VersaNet Globals 3 6 6 18 18 18 18 18 18 I/O Banks 22 2 2 4 4 44 Maximum User I/Os 49 81 96 133 143 194 235 300 Package Pins UC/CS QFN VQFP FBGA QN68 UC81/CS81 QN48, QN68, QN132 VQ100 CS121 QN132 VQ100 FG144 5 CS196 QN132 VQ100 FG144 CS196 4 QN132 4,5 VQ100 FG144 CS196 FG144, FG256, FG484 CS281 FG144, FG256, FG484 CS281 FG144, FG256, FG484 Notes: 1. AES is not available for ARM-enabled IGLOO devices. 2. AGL060 in CS121 does not support the PLL. 3. Six chip (main) and twelve quadrant global networks are available for AGL060 and above. 4. The M1AGL250 device does not support this package. 5. Device/package support TBD 6. For higher densities and support of additional features, refer to the IGLOOe Low-Power Flash FPGAs with Flash*Freeze Technology handbook. v1.3

IGLOO Low-Power Flash FPGAs II v1.3 I/Os Per Package1 IGLOO Devices AGL015 AGL030 AGL060 AGL125 AGL250 AGL400 AGL600 AGL1000 ARM-Enabled IGLOO Devices M1AGL250 3 M1AGL400 M1AGL600 M1AGL1000 Package I/O Type Single-Ended I/O Single-Ended I/O Single-Ended I/O Single-Ended I/O Single-Ended I/O 2 Differential I/O Pairs Single-Ended I/O 2 Differential I/O Pairs Single-Ended I/O 2 Differential I/O Pairs Single-Ended I/O 2 Differential I/O Pairs VQ100 – 7 7 7 1 7 1 6 8 1 3 –––– – – QN132 – 8 18 08 4 8 7 7 19 7 –––– – – CS196 – – – 133 143 35 143 35 – – – – FG144 –– 9 6 7 97 97 24 97 25 97 25 97 25 FG256 – – – – – – 178 38 177 43 177 44 FG484 – – – – – – 194 38 235 60 300 74 Notes: 1. When considering migrating your design to a lower- or higher-density device, refer to the IGLOO Low-Power Flash FPGAs handbook to ensure compliance with design and board migration requirements. 2. Each used differential I/O pair reduces the nu mber of single-ended I/Os available by two. 3. The M1AGL250 device does not support QN132 or CS196 packages. Refer to the IGLOO Low-Power Flash FPGAs handbook for position assignments of the 15 LVPECL pairs. 4. FG256 and FG484 are footprint-compatible packages. 5. When the Flash*Freeze pin is used to directly enable Flash*Freeze mode and not used as a regular I/O, the number of single-ended user I/Os available is reduced by one. 6. "G" indicates RoHS-compliant packages. Refer to "IGLOO Ordering Information" on page III for the location of the "G" in the part number. 7. Device/package support TBD. IGLOO FPGAs Package Sizes Dimensions Length × Width (mm\\mm) 4 × 4 5 × 5 6 × 6 8 × 8 8 × 8 8 × 8 10 × 10 13 × 13 14 × 14 17 × 17 23 × 23 Nominal Area (mm2) 16 25 36 64 64 64 100 169 196 289 529

IGLOO Low-Power Flash FPGAs v1.3 III Notes: 1. Marking Information: IGLOO V2 devi ces do not have V2 marking, but IGLOO V5 devices are marked accordingly. 2. The DC and switching characteri stics for the –F speed grade targets are based only on simulation. The characteristics provided for the –F sp eed grade are subject to change after establishing FPGA specifications. Some restrictions might be added and will be reflected in future revisions of th is document. The –F speed grade is only supported in the commercial temperature range. Speed Grade Blank = Standard F = 20% Slower than Standard* Supply Voltage 2 = 1.2 V to 1.5 V 5 = 1.5 V only AGL1000 V2 F G_ Part Number IGLOO Devices Package Type VQ = Very Thin Quad Flat Pack (0.5 mm pitch) QN = Quad Flat Pack No Leads (0.4 mm and 0.5 mm pitch) 144 I Package Lead Count G Lead-Free Packaging Application (Temperature Range) Blank = Commercial (0°C to +70°C Ambient Temperature) I= I n dustrial (–40°C to +85°C Ambient Temperature) Blank = Standard Packaging G= RoH S-Compliant Packaging PP = Pre-Pro duction ES =E n gineering Sample (Room Temperature Only) 30,000 System GatesAGL030 = 15,000 System GatesAGL015 = 60,000 System GatesAGL060= 125,000 System GatesAGL125 = 250,000 System GatesAGL250 = 600,000 System GatesAGL600 = 400,000 System GatesAGL400 = 1,000,000 System GatesAGL1000 = CS = Chip Scale Package (0.4 mm and 0.5 mm pitches) UC = Micro Chip Scale Package (0.4 mm pitch) FG = Fine Pitch Ball Grid Array (1.0 mm pitch) IGLOO Devices with Cortex-M1 250,000 System GatesM1AGL250= 600,000 System GatesM1AGL600= 400,000 System GatesM1AGL400= 1,000,000 System GatesM1AGL1000=

IGLOO Low-Power Flash FPGAs IV v1.3 Temperature Grade Offerings Speed Grade and Temperature Grade Matrix References made to IGLOO devices also apply to ARM-enabled IGLO Oe devices. The ARM-enabled part numbers start with M1 (Cortex-M1). Contact your local Actel representative for device availability: http://www.actel.com/contact/default.aspx. AGL015 and AGL030 The AGL015 and AGL030 are architecturally compatible; there are no RAM or PLL features. Package AGL015 AGL030 AGL060 AGL125 AGL250 AGL400 AGL600 AGL1000 M1AGL250 4 M1AGL400 M1AGL600 M1AGL1000 VQ100 – C, I C, I C, I C, I – – – QN132 –C , I C , I 3 C, I C, I 3 –– – CS196 ––– C , I C , I C , I – – FG144 –– C , I 3 C, I C, I C, I C, I C, I FG256 –––– – C , I C , I C , I FG484 –––– – C , I C , I C , I Notes: 1. C = Commercial temperature range: 0°C to 70°C ambient temperature. 2. I = Industrial temperature range: –40°C to 85°C ambient temperature. 3. Device/package support TBD. 4. The M1AGL250 device does not support FG256 or QN132 packages. Temperature Grade –F 1 Std. C 2 ✓✓ I 3 – ✓ Notes: 1. The characteristics provided for the –F speed grade are subj ect to change after establishi ng FPGA specifications. Some restrictions might be added and will be reflected in future revisions of this document. The –F speed grade is only supported in the commercial temperature range. 2. C = Commercial temperature range: 0°C to 70°C ambient temperature. 3. I = Industrial temperature range: –40°C to 85°C ambient temperature.

v1.3 1-1 1 – IGLOO Device Family Overview General Description The IGLOO family of flash FPGAs, based on a 130-nm flash process, offers the lowest power FPGA, a single-chip solution, small footprint packages, reprogrammability, and an abundance of advanced features. The Flash*Freeze technology used in IGLOO devices enables ente ring and exiting an ultra-low- power mode that consumes as little as 5 µW while retaining SRAM and register data. Flash*Freeze technology simplifies power management through I/O and clock management with rapid recovery to operation mode. The Low Power Active capability (static idle) allows for ultra-low-power consumption (from 12 µW) while the IGLOO device is completely functional in the system. This allows the IGLOO device to control system power management based on external inputs (e.g., scanning for keyboard stimulus) while consuming minimal power. Nonvolatile flash technology gives IGLOO device s the advantage of bein g a secure, low power, single-chip solution that is liv e at power-up (LAPU). IGLOO is reprogrammable and offers time-to- market benefits at an ASIC-level unit cost. These features enable designers to create high-den sity systems using existing ASIC or FPGA design flows and tools. IGLOO devices offer 1 kbit of on-c hip, reprogrammable, nonvolatile FlashROM storage as well as clock conditioning circuitry based on an inte grated phase-locked lo op (PLL). The AGL015 and AGL030 devices have no PLL or RAM support. IGLO O devices have up to 1 million system gates, supported with up to 144 kbits of true dual-port SRAM and up to 300 user I/Os. M1 IGLOO devices support the hi gh-performance, 32-bit Cortex-M1 processor developed by ARM for implementation in FPGAs. Cort ex-M1 is a soft processor that is fully implemented in the FPGA fabric. It has a three-stage pipeline that offers a good balance between low-power consumption and speed when implemented in an M1 IGLOO device. The processor runs the ARMv6-M instruction set, has a configurable nested interrupt controll er, and can be implemented with or without the debug block. Cortex-M1 is available for free from Actel for use in M1 IGLOO FPGAs. The ARM-enabled devices have Actel ordering numbers that begin with M1AGL and do not support AES decryption. Flash*Freeze Technology The IGLOO device offers unique Flash*Freeze tech nology, allowing the device to enter and exit ultra-low-power Flash*Freeze mode. IGLOO devices do not need additional components to turn off I/Os or clocks while retaining the design information, SRAM content, and registers. Flash*Freeze technology is combined with in-system programmability, which enables users to quickly and easily upgrade and update their designs in the final stages of manufacturing or in the field. The ability of IGLOO V2 devices to support a wide range of core voltage (1.2 V to 1.5 V) allows further reduction in power consumption, thus achieving the lowest total system power. When the IGLOO device en ters Flash*Freeze mode , the device automatically shuts off the clocks and inputs to the FPGA co re; when the device exits Flash*Free ze mode, all acti vity resumes and data is retained. The availability of low-power mo des, combined with reprogrammabi lity, a single-chip and single- voltage solution, and availability of small-footprint, high pin-count packages, make IGLOO devices the best fit for portable electronics.

IGLOO Device Family Overview 1-2 v1.3 Flash Advantages Low Power Flash-based IGLOO devices exhibit power characteri stics similar to those of an ASIC, making them an ideal choice for power-sensitive applications. IGLOO devices have only a very limited power-on current surge and no high-current transition period, both of which occur on many FPGAs. IGLOO devices also have low dy namic power consumption to fu rther maximize power savings; power is even further reduced by the use of a 1.2 V core voltage. Low dynamic power consumption, combined with low static power consumption and Flash*Freeze technology, gives the IGLOO device the lowest total system power offered by any FPGA. Security The nonvolatile, flash-based IGLOO devices do not require a boot PROM, so there is no vulnerable external bitstream that can be easily copied. IGLOO devices incorporate FlashLock, which provides a unique combination of reprogrammability and design security withou t external overhead, advantages that only an FPGA with nonvolatile flash programming can offer. IGLOO devices utilize a 128-bit flash-based lock and a separate AES key to secure programmed intellectual property and configuration data. In addition, all FlashROM data in IGLOO devices can be encrypted prior to loading, using the industry-leading AES-128 (FIPS192) bit block cipher encryption standard. AES was ad opted by the National Institute of Standards and Technology (NIST) in 2000 and replaces the 1977 DES standa rd. IGLOO devices have a built-in AES decryption engine and a flash-based AES key that make them the most comprehensive programmable logic device security solution availabl e today. IGLOO devices with AES- based security allow for secure, remote field updates over public networks such as the Internet, and ensure that valuable IP remains out of the hands of system overbuilders, sy stem cloners, and IP thieves. The contents of a programmed IGLOO device cannot be read back, although secure design verification is possible. Security, built into the FPGA fabric , is an inherent component of the IGLOO family. The flash cells are located beneath seven metal layers, and many device design and layout techniques have been used to make invasive attacks extremely diffic ult. The IGLOO family, with FlashLock and AES security, is unique in being highly resistant to both invasive and noninvasive attacks. Your valuable IP is protected and secure, making remote IS P possible. An IGLOO device provides the most impenetrable security for programmable logic designs. Single Chip Flash-based FPGAs store their configuration information in on-chip flash cells. Once programmed, the configuration data is an inherent part of the FPGA structure, and no external configuration data needs to be loaded at system power-up (u nlike SRAM-based FPGAs). Therefore, flash-based IGLOO FPGAs do not require system config uration components such as EEPROMs or microcontrollers to load device configuration da ta. This reduces bill-of-materials costs and PCB area, and increases security and system reliability. Live at Power-Up The Actel flash-based IGLOO devices support Leve l 0 of the LAPU classification standard. This feature helps in system component initialization, execution of critical tasks before the processor wakes up, setup and configuration of memory blocks, clock genera tion, and bus activity management. The LAPU feature of flash-based IGLOO devices greatly simplifies total system design and reduces total system cost, often eliminating the need for CPLDs and cl ock generation PLLs. In addition, glitches and brownouts in system power will not corrupt the IGLOO device's flash configuration, and unlike SRAM-based FPGAs, the device will not have to be reloaded when system power is restored. This enables the reduction or complete removal of the configuration PROM, expensive voltage monitor, brownout detection, and clock generator devices from the PCB design. Flash-based IGLOO devices simplify total system design and reduce cost and design risk while increasing system reliability and improving system initialization time. IGLOO flash FPGAs allow the user to quickly enter and exit Flash*Freeze mode. This is done almost instantly (within 1 µs) and the device retains co nfiguration and data in registers and RAM. Unlike SRAM-based FPGAs the device does not need to reload configuration and design state from

IGLOO Low-Power Flash FPGAs v1.3 1-3 external memory components; instead it retains all necessary informatio n to resume operation immediately. Reduced Cost of Ownership Advantages to the designer extend beyond lo w unit cost, performance, and ease of use. Unlike SRAM-based FPGAs, Flash- based IGLOO devices allow all functionality to be live at power-up; no external boot PROM is required. On-board security mechanisms prev ent access to all the programming information an d enable secure remote updates of the FPGA logic. Designers can perform secure remote in-system reprogramming to supp ort future design iterations and field upgrades with confidence that valuable intellec tual property cannot be compromised or copied. Secure ISP can be performed using the industry- standard AES algorithm. The IGLOO family device architecture mitigates the need for ASIC migratio n at higher user volumes. This makes the IGLOO family a cost-effective ASIC repl acement solution, especially for applications in the consumer, networking/communications, computing, and avionics markets. Firm-Error Immunity Firm errors occur most commonly when high-energy neutrons, generated in the upper atmosphere, strike a configuration cell of an SRAM FPGA. The energy of the collision can change the state of the configuration cell and thus change the logic, routing, or I/O behavior in an unpredictable way. These errors are impossible to prevent in SRAM FPGAs. The consequence of this type of error can be a complete system failure. Firm errors do not ex ist in the configuration memory of IGLOO flash- based FPGAs. Once it is programmed, the flash cell configuration element of IGLOO FPGAs cannot be altered by high-energy neutrons and is theref ore immune to them. Recoverable (or soft) errors occur in the user data SRAM of all FPGA device s. These can easily be mitigated by using error detection and correction (EDAC) circuitry built into the FPGA fabric. Advanced Flash Technology The IGLOO family offers many benefits, including nonvolatility and reprogrammability, through an advanced flash-based, 130-nm LVCMOS process with seven layers of metal. Standard CMOS design techniques are used to implement logic and control functions. The combination of fine granularity, enhanced flexible routing resources, and abunda nt flash switches allows for very high logic utilization without comp romising device routability or perfo rmance. Logic functions within the device are interconnected through a four-level routing hierarchy. IGLOO family FPGAs utilize design and process te chniques to mini mize power consumption in all modes of operation. Advanced Architecture The proprietary IGLOO architecture provides gran ularity comparable to standard-cell ASICs. The IGLOO device consists of fi ve distinct and prog rammable architectural features ( Figure 1-1 on page 1-4 and Figure 1-2 on page 1-4):  Flash*Freeze technology  FPGA VersaTiles  Dedicated FlashROM  Dedicated SRAM/FIFO memory  Extensive CCCs and PLLs †  Advanced I/O structure The FPGA core consists of a sea of VersaTiles. Ea ch VersaTile can be configured as a three-input logic function, a D-flip-flop (with or without enable), or a latch by programming the appropriate flash switch interconnections. The versatility of th e IGLOO core tile as either a three-input lookup table (LUT) equivalent or a D-flip-flop/latch with enable allows for efficient use of the FPGA fabric. The VersaTile capability is un ique to the Actel ProASIC ® family of third-generation-architecture flash FPGAs. VersaTiles are connected with any of the four levels of routing hierarchy. Flash switches are distributed throughout the device to provide nonvolatile, reconfigurable interconnect programming. Maximum core utilization is possible for virtually any design. † The AGL015 and AGL030 do not support PLL or SRAM.

IGLOO Device Family Overview 1-6 v1.3 User Nonvolatile FlashROM Actel IGLOO devices have 1 kbit of on-chip, user -accessible, nonvolatile FlashROM. The FlashROM can be used in diverse system applications:  Internet protocol addressing (wireless or fixed)  System calibration settings  Device serialization and/or inventory control  Subscription-based business mode ls (for example, set-top boxes)  Secure key storage for secu re communications algorithms  Asset management/tracking  Date stamping  Version management The FlashROM is written using the standard IGLOO IEEE 1532 JTAG programming interface. The core can be individually programmed (erased and written), and on-chip AES decryption can be used selectively to securely load data over public networks (exc ept in the AGL015 and AGL030 devices), as in security keys stored in the FlashROM for a user design. The FlashROM can be programmed via the JTAG pr ogramming interface, and its contents can be read back either through the JTAG programming interface or via direct FPGA core addressing. Note that the FlashROM can only be programmed fro m the JTAG interface and cannot be programmed from the internal logic array. The FlashROM is programmed as 8 banks of 128 bi ts; however, reading is performed on a byte-by- byte basis using a synchronous interface. A 7-bit address from the FPGA core defines which of the 8 banks and which of the 16 bytes within that ba nk are being read. The th ree most significant bits (MSBs) of the FlashROM address determine the bank , and the four least sign ificant bits (LSBs) of the FlashROM address define the byte. The Actel IGLOO development software solu tions, Libero ® Integrated Design Environment (IDE) and Designer, have extensive su pport for the FlashROM. One such feature is auto-generation of sequential programming fi les for applications requiring a un ique serial number in each part. Another feature allows the inclusion of static data for system version control. Data for the FlashROM can be generated quickly and easily using Actel Libero IDE and Designer software tools. Comprehensive programming file support is also included to allo w for easy programming of large numbers of parts with differing FlashROM contents. SRAM and FIFO IGLOO devices (except the AGL015 and AGL030 devices) have embedded SRAM blocks along their north and south sides. Each variable-aspect-ratio SRAM block is 4,608 bits in size. Available memory configurations are 256×18, 512× 9, 1k×4, 2k×2, and 4k×1 bits . The individual blocks have independent read and write ports that can be configured with different bit widths on each port. For example, data can be sent through a 4-bit po rt and read as a single bitstream. The embedded SRAM blocks can be initialized via the device JTAG port (ROM emulation mode) using the UJTAG macro (except in the AGL015 and AGL030 devices). In addition, every SRAM block has an embedded FIFO control unit. The control unit allows the SRAM block to be configured as a synchronous FI FO without using additional core VersaTiles. The FIFO width and depth are programmable. The FIFO also features programmable Almost Empty (AEMPTY) and Almost Full (AFULL) flags in additi on to the normal Empt y and Full flags. The embedded FIFO control unit cont ains the counters necessary for ge neration of the read and write address pointers. The embedded SRAM/FIFO blocks can be cascaded to create larger configurations. PLL and CCC IGLOO devices provide designers with very flexible clock conditioning circuit (CCC) capabilities. Each member of the IGLOO family contains six CC Cs. One CCC (center west side) has a PLL. The AGL015 and AGL030 do not have a PLL. The six CCC blocks are located at the four corners and th e centers of the east and west sides. One CCC (center west side) has a PLL.

IGLOO Low-Power Flash FPGAs v1.3 1-7 All six CCC blocks are usable; the four corner CCCs and the east CCC allow simple clock delay operations as well as clock spine access. The inputs of the six CCC blocks are accessible from the FPGA core or fro m one of several inputs located near the CCC that have dedicated connections to the CCC block. The CCC block has these key features:  Wide input frequency range (f IN_CCC) = 1.5 MHz up to 250 MHz  Output frequency range (f OUT_CCC) = 0.75 MHz up to 250 MHz  2 programmable delay types for clock skew minimization  Clock frequency synthesis (for PLL only) Additional CCC specifications:  Internal phase shift = 0°, 90°, 180°, and 270° . Output phase shift depends on the output divider configuration (for PLL only).  Output duty cycle = 50 % ± 1.5% or better (for PLL only)  Low output jitter: worst case < 2.5 % × clock period peak-to-peak period jitter when single global network used (for PLL only)  Maximum acquisition time is 300 µs (for PLL only)  Exceptional tolerance to input period jitter—allowable input jitter is up to 1.5 ns (for PLL only)  Four precise phases; maximum misalignment be tween adjacent phases of 40 ps × 250 MHz / fOUT_CCC (for PLL only) Global Clocking IGLOO devices have extensive support for multiple clocking domains. In addition to the CCC and PLL support described above, there is a comprehensive global clock distribution network. Each VersaTile input and output port has access to nine VersaNets: six chip (main) and three quadrant global networks. The Ve rsaNets can be driven by the CCC or directly accessed from the core via multiplexers (MUXes). The VersaNets can be used to distribute low-skew clock signals or for rapid distribution of high-fanout nets. I/Os with Advanced I/O Standards The IGLOO family of FPGAs features a flexible I/O structure, supporting a range of voltages (1.2 V, and differential. The I/Os are organized into banks, with two or four banks per device. The configuration of these banks determines the I/O standards supported. Each I/O module contains several input, output , and enable registers. These registers allow the implementation of the following:  Single-Data-Rate applications  Double-Data-Rate applications—DDR LVDS, B- LVDS, and M-LVDS I/Os for point-to-point communications IGLOO banks for the AGL250 device and above support LVPECL, LVDS, B-LVDS, and M-LVDS. B-LVDS and M-LVDS can support up to 20 loads.

IGLOO Device Family Overview 1-8 v1.3 Part Number and Revision Date Part Number 51700095-001-6 Revised December 2008 List of Changes The following table lists critical changes that were made in the current version of the document. Previous Version Changes in Current Version (v1.3) Page v1.2 (October 2008) QN48 and QN68 were added to the AGL030 for the following tables: "IGLOO Product Family" "IGLOO Ordering Information" "Temperature Grade Offerings" N/A QN132 is fully supported by AGL125 so footnote 3 was removed. v1.1 (July 2008) This document was updated to include AGL400 device information. The following sections were updated: "IGLOO Product Family" "IGLOO Ordering Information" "Temperature Grade Offerings" "IGLOO Product Family" Figure 1-2 · IGLOO Device Architecture Overview with Four I/O Banks (AGL250, AGL600, AGL400, and AGL1000) N/A v1.0 (March 2008) As a result of the Libero IDE v8.4 releas e, Actel now offers a wide range of core voltage support. The document was upda ted to change 1.2 V / 1.5 V to 1.2 V to 1.5 V. N/A 51700095-001-3 (March 2008) This document was divided into two sections and given a version number, starting at v1.0. The first section of the document includes features , benefits, ordering information, and temperature and speed grade offerings. The second section is a device family overview. N/A 51700095-001-2 (February 2008) The "Low Power" section was updated to change "1.2 V and 1.5 V Core Voltage" to "1.2 V and 1.5 V Core and I/O Voltage." The text "(from 12 µW)" was removed from " Low-Power Active FPGA Operation." 1.2_V was added to the list of core and I/O voltages in the "Advanced I/O" and "I/Os with Advanced I/O Standards" sections. I I, 1-7 The "Embedded Memory" section was updated to remove the footnote reference from the section heading an d place it instead after "4,608-Bit" and "True Dual-Port SRAM (except ×18)." I

IGLOO Low-Power Flash FPGAs v1.3 1-9 51700095-001-1 (January 2008) This document was updated to include AGL015 device information. QN68 is a new package that was added because it is offered in the AGL015. The following sections were updated: "Features and Benefits" "IGLOO Ordering Information" "Temperature Grade Offerings" "IGLOO Product Family" "IGLOO FPGAs Package Sizes Dimensions" "AGL015 and AGL030" note "IGLOO Device Family Overview" N/A The "Temperature Grade Offerings" table was updated to include M1AGL600. IV In the "IGLOO Ordering Information" table, the QN package measurements were updated to include both 0.4 mm and 0.5 mm. III In the "General Description" section, the number of I/Os was updated from 288 to 300. 1-5 51700095-001-0 (January 2008) The "Low Power" section was updated to change th e description of low-power active FPGA operation to "from 12 µW" from "from 25 µW." The same update was made in the "General Description" section and the "Flash*Freeze Technology" section. I, 1-1, 1-5 Advance v0.7 (November 2007) This document was previously in datasheet Advance v0.7. As a result of moving to the handbook format, Actel has restarted the version numbers. The new version number is 51700095-001-0. N/A Advance v0.6 (November 2007) Table 1  IGLOO Product Family, the "I/Os Per Package1" table, and the Temperature Grade Offerings table were updated to reflect the following: CS196 is now supported for AGL250; device/p ackage support for QN132 is to be determined for AGL250; the CS281 package was added for AGL600 and AGL1000. i, ii, iv Table 2  IGLOO FPGAs Package Sizes Dimensions is new, and package sizes were removed from the "I/Os Per Package1" table. ii The "I/Os Per Packag e1"table was updated to reflect 77 instead of 79 single- ended I/Os for the VG100 package for AGL030. ii Advance v0.6 (November 2007) A note was added to "IGLOO Orderi ng Information" regarding marking information. iii Advance v0.5 (September 2007) Table 1  IGLOO Product Family, the "I/O s Per Package1" table, and the "IGLOO Ordering Information", and the Temp erature Grade Offerings table were updated to add the UC81 package. i, ii, iii, iv Advance v0.4 (September 2007) Table 1  IGLOO Product Family was up dated for AGL030 in the Package Pins section to change CS181 to CS81. i Advance v0.3 (August 2007) Cortex-M1 device information was added to Table 1  IGLOO Product Family, the "I/Os Per Package1" table, "IGLOO Ordering Informa tion", and Temperature Grade Offerings. i, ii, iii, iv The number of single-ended I/Os for the CS81 package for AGL030 was updated to 66 in the "I/Os Per Package1" table. ii Advance v0.2 (July 2007) In Table 1  IGLOO Product Family, the CS 81 package was added for AGL030. The CS196 was replaced by the CS121 for AG L060. Table note 3 was moved to the specific packages to which it applies for AGL060: QN132 and FG144. i The CS81 and CS121 packages were adde d to the "I/Os Per Package1" table. The number of single-e nded I/Os was removed for the CS196 package in AGL060. Table note 6 was moved to the specific packages to which it applies for AGL060: QN132 and FG144. ii Previous Version Changes in Current Version (v1.3) Page

IGLOO Device Family Overview 1-10 v1.3 Datasheet Categories Categories In order to provide the latest information to designers, some datasheets are published before data has been fully characterized. Datasheets are designated as "Product Brief," "Advance," "Preliminary," and "Production." The definition of these categories are as follows: Product Brief The product brief is a summarized version of a datasheet (advance or production) and contains general product information. This document give s an overview of specific device and family information. Advance This version contains initial estimated information based on simulation, other products, devices, or speed grades. This information can be used as estimates, but not for production. This label only applies to the DC and Switching Characteristics chapter of the datasheet and will only be used when the data has not been fully characterized. Preliminary The datasheet contains information based on si mulation and/or initia l characterization. The information is believed to be correct, but changes are possible. Unmarked (production) This version contains information that is considered to be final. Export Administration Regulations (EAR) The products described in this do cument are subject to the Expo rt Administration Regulations (EAR). They could require an ap proved export license prior to export from the United States. An export includes release of product or disclosure of technology to a foreign national inside or outside the United States. Actel Safety Critical, Life Support, and High-Reliability Applications Policy The Actel products described in this advance status document may not have completed Actel’s qualification process. Actel may amend or enhance products during the product introduction and qualification process, resulting in changes in device functional ity or performance. It is the responsibility of each customer to ensure the fitn ess of any Actel product (but especially a new product) for a particular purpose, including appr opriateness for safety-cri tical, life-s upport, and other high-reliability applicatio ns. Consult Actel’s Terms and Cond itions for specific liability exclusions relating to life-support applications. A reliability report covering all of Actel’s products is available on the Actel website at http://www.actel.com/documents/ORT_Report.pdf. Actel also offers a variety of enhanced qualification and lot acceptance screening procedures. Contact your local Actel sales office for additional reliability information. The CS81 and CS121 packages were adde d to the Temperature Grade Offerings table. The temperature grade offerings were removed for the CS196 package in AGL060. Table note 3 was moved to the spec ific packages to which it applies for AGL060: QN132 and FG144. iv Advance v0.1 The words "ambient temperature" we re added to the temperature range in the "IGLOO Ordering Information", Temperature Grade Offerings, and "Speed Grade and Temperature Grade Matrix" sections. iii, iv Previous Version Changes in Current Version (v1.3) Page

Advance v0.5 2-1 2 – IGLOO DC and Switching Characteristics General Specifications DC and switching characteristics for –F speed grade targets are based only on simulation. The characteristics provided for the –F speed grad e are subject to change after establishing FPGA specifications. Some restri ctions might be added and will be re flected in future revisions of this document. The –F speed grade is only supported in the commercial temperature range. Operating Conditions Stresses beyond those listed in Table 2-1 may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings are stress ratings only; fu nctional operation of the device at these or any other conditions beyond those listed under the Recommended Operating Conditions specified in Table 2-2 on page 2-2 is not implied. Table 2-1  Absolute Maximum Ratings Symbol Parameter Limits Units VCC DC core supply voltage –0.3 to 1.65 V VJTAG JTAG DC voltage –0.3 to 3.75 V VPUMP Programming voltage –0.3 to 3.75 V VCCPLL Analog power supply (PLL) –0.3 to 1.65 V VCCI and VMV 3 DC I/O buffer supply voltage –0.3 to 3.75 V VI I/O input voltage –0.3 V to 3.6 V (when I/O hot insertion mode is enabled) –0.3 V to (VCCI + 1 V) or 3.6 V, whichever voltage is lower (when I/O hot-insertion mode is disabled) V TSTG

2 Storage Temperature –65 to +150 °C

2 Junction Temperature +125 °C

Notes: 1. The device should be operated within the limits sp ecified by the datasheet. During transitions, the input signal may undershoot or overshoot according to the limits shown in Table 2-4 on page 2-3. 2. For flash programming and rete ntion, maximum limits refer to Table 2-3 on page 2-2 , and for recommended operating limits, refer to Table 2-2 on page 2-2. 3. VMV pins must be connected to the corresponding V CCI pins. See Pin Descriptions for further information.

IGLOO DC and Switching Characteristics 2-2 Advance v0.5 Table 2-2  Recommended Operating Conditions 4 Symbol Parameter Commercial Industrial Units TA Ambient Temperature 0 to +70 6 –40 to +85 7 °C TJ Junction Temperature 8 0 to + 85 –40 to +100 °C VCC 1.2 V–1.5 V wide range core voltage 2 1.14 to 1.575 1.14 to 1.575 V VJTAG JTAG DC voltage 1.4 to 3.6 1.4 to 3.6 V VPUMP Programming voltage Programming Mode 3.15 to 3.45 3.15 to 3.45 V Operation 5 0 to 3.45 0 to 3.45 V VCCPLL 1.2 V–1.5 V wide range core voltage2 1.14 to 1.575 1.14 to 1.575 V VCCI and VMV 10

3.3 V wide range DC supply

2.7 to 3.6 2.7 to 3.6 V LVDS differential I/O 2.375 to 2.625 2.375 to 2.625 V LVPECL differential I/O 3.0 to 3.6 3.0 to 3.6 V Notes: 1. For IGLOO ® V5 devices 2. For IGLOO V2 devices only, operating at VCCI ≥ VCC 3. The ranges given here are for powe r supplies only. The recommended input voltage ranges specific to each I/O standard are given in Table 2-24 on page 2-23. VCCI should be at the same voltage within a given I/O bank. 4. All parameters representing voltages are measured with respect to GND unless otherwise specified. 5. V PUMP can be left floating during operation (not programming mode). 6. Maximum T J = 85 °C. 7. Maximum T J = 100 °C. 8. To ensure targeted reliab ility standards are met across ambient and junction operating temperatures, Actel recommends that the user follow best design practices using Actel’s timing and power simulation tools. 9. V CCPLL pins should be tied to VCC pins. See Pin Descriptions for further information. 10. VMV pins must be connected to the corresponding VCCI pins. See Pin Descriptions for further information. 11. 3.3 V wide range is compliant to the JDEC8a specification and supports 3.0 V VCCI operation. Table 2-3  Flash Programming Limits – Retention, Storage, and Operating Temperature1 Product Grade Programming Cycles Program Retention (biased/unbiased) Maximum Storage Temperature TSTG (°C) 2 Maximum Operating Junction Temperature TJ (°C) 2 Commercial 500 20 years 110 100 Industrial 500 20 years 110 100 Notes: 1. This is a stress rating only; functional operation at any condition other than those indicated is not implied. 2. These limits apply for program/ data retention only. Refer to Table 2-1 on page 2-1 and Table 2-2 for device operating conditions and absolute limits.

IGLOO DC and Switching Characteristics Advance v0.5 2-3 I/O Power-Up and Supply Voltage Thresholds for Power-On Reset (Commercial and Industrial) Sophisticated power-up management circuitry is designed into ev ery IGLOO device. These circuits ensure easy transition from the powered-off state to the powered-up state of the device. The many different supplies can power up in any sequence with minimized current spikes or surges. In addition, the I/O will be in a known state through the power-up sequence. The basic principle is shown in Figure 2-1 on page 2-4 and Figure 2-2 on page 2-5. There are five regions to consider during power-up. IGLOO I/Os are activated only if ALL of the following three conditions are met: 1. V CC and V CCI are above the minimum specified trip points ( Figure 2-1 on page 2-4 and Figure 2-2 on page 2-5). 2. V CCI > VCC – 0.75 V (typical) 3. Chip is in the operating mode. VCCI Trip Point: Ramping up (V5 devices): 0.6 V < trip_point_up < 1.2 V Ramping down (V5 Devices): 0.5 V < trip_point_down < 1.1 V Ramping up (V2 devices): 0.75 V < trip_point_up < 1.05 V Ramping down (V2 devices): 0.65 V < trip_point_down < 0.95 V VCC Trip Point: Ramping up (V5 devices): 0.6 V < trip_point_up < 1.1 V Ramping down (V5 devices): 0.5 V < trip_point_down < 1.0 V Ramping up (V2 devices): 0.65 V < trip_point_up < 1.05 V Ramping down (V2 devices): 0.55 V < trip_point_down < 0.95 V V CC and V CCI ramp-up trip points are about 100 mV hi gher than ramp-dow n trip points. This specifically built-in hysteresis pr events undesirable power-up oscillations and current surges. Note the following:  During programming, I/Os become tri stated and weakly pulled up to VCCI.  JTAG supply, PLL power supplies, and charge pump V PUMP supply have no influence on I/O behavior. Table 2-4  Overshoot and Undershoot Limits 1 VCCI Average VCCI–GND Overshoot or Undershoot Duration as a Percentage of Clock Cycle2 Maximum Overshoot/ Undershoot2 2.7 V or less 10% 1.4 V 5% 1.49 V 3 V 10% 1.1 V 5% 1.19 V 3.3 V 10% 0.79 V 5% 0.88 V 3.6 V 10% 0.45 V 5% 0.54 V Notes: 1. Based on reliability requirements at junction temperature at 85°C. 2. The duration is allowed at one out of six clock cycles. If the overshoot/undershoot occurs at one out of two cycles, the maximum overshoot/undershoot has to be reduced by 0.15 V. 3. This table does not provide PCI overshoot/undershoot limits.

IGLOO DC and Switching Characteristics 2-4 Advance v0.5 PLL Behavior at Brownout Condition Actel recommends using monotonic power supplies or voltage regulators to ensure proper power- up behavior. Power ramp-up should be monotonic at least until V CC and VCCPLX exceed brownout activation levels (see Figure 2-1 and Figure 2-2 on page 2-5 for more details). When PLL power supply voltage and/or VCC levels drop below the V CC brownout levels (0.75 V ± 0.25 V for V5 devices, and 0.75 V ± 0.2 V for V2 devices), the PLL output lock signal goes low and/or the output clock is lost. Refer to the Brownout Voltage section in the Power-Up/-Down Behavior of Low-Power Flash Devices chapter of the ProASIC®3 and ProASIC3E handbooks for information on clock and lock recovery. Internal Power-Up Activation Sequence 1. Core 2. Input buffers 3. Output buffers, after 200 ns de lay from input buffer activation To make sure the transition from input buffers to output buffers is clean, ensure that there is no path longer than 100 ns from input buffer to output buffer in your design. Figure 2-1  V5 Devices – I/O State as a Function of V CCI and VCC Voltage Levels Region 1: I/O buffers are OFF Region 2: I/O buffers are ON. I/Os are functional (except differential inputs) but slower because VCCI/VCC are below specification. For the same reason, input buffers do not meet VIH/VIL levels, and output buffers do not meet VOH/VOL levels. Min VCCI datasheet specification voltage at a selected I/O standard; i.e., 1.425 V or 1.7 V or 2.3 V or 3.0 V VCC VCC = 1.425 V Region 1: I/O Buffers are OFF Activation trip point: Va = 0.85 V ± 0.25 V Deactivation trip point: Vd = 0.75 V ± 0.25 V Activation trip point: Va = 0.9 V ± 0.3 V Deactivation trip point: Vd = 0.8 V ± 0.3 V VCC = 1.575 V Region 5: I/O buffers are ON and power supplies are within specification. I/Os meet the entire datasheet and timer specifications for speed, VIH/VIL , VOH/VOL , etc. Region 4: I/O buffers are ON. I/Os are functional (except differential but slower because VCCI is below specification. For the same reason, input buffers do not meet VIH/VIL levels, and output buffers do not meet VOH/VOL levels. Region 4: I/O buffers are ON. I/Os are functional (except differential inputs) where VT can be from 0.58 V to 0.9 V (typically 0.75 V) VCCI Region 3: I/O buffers are ON. I/Os are functional; I/O DC specifications are met, but I/Os are slower because the V CC is below specification. VCC = VCCI + VT

IGLOO DC and Switching Characteristics Advance v0.5 2-5 Thermal Characteristics Introduction The temperature variable in the Actel Designer software refers to the junction temperature, not the ambient temperature. This is an important distinction be cause dynamic and static power consumption cause the chip junction to be higher than the ambient temperature. EQ 2-1 can be used to calculate junction temperature. TJ = Junction Temperature = ∆T + TA EQ 2-1 where: TA = Ambient Temperature ∆T = Temperature gradient between junction (silicon) and ambient ∆T = θja * P θja = Junction-to-ambient of the package. θja numbers are located in Table 2-5 on page 2-6. P = Power dissipation Figure 2-2  V2 Devices – I/O State as a Function of VCCI and VCC Voltage Levels Region 1: I/O buffers are OFF Region 2: I/O buffers are ON. I/Os are functional (except differential inputs) but slower because VCCI/VCC are below specification. For the same reason, input buffers do not meet VIH/VIL levels, and output buffers do not meet VOH/VOL levels. Min VCCI datasheet specification voltage at a selected I/O 2.3 V, or 3.0 V VCC VCC = 1.14 V Region 1: I/O Buffers are OFF Activation trip point: Va = 0.85 V ± 0.2 V Deactivation trip point: Vd = 0.75 V ± 0.2 V Activation trip point: Va = 0.9 V ± 0.15 V Deactivation trip point: Vd = 0.8 V ± 0.15 V VCC = 1.575 V Region 5: I/O buffers are ON and power supplies are within specification. I/Os meet the entire datasheet and timer specifications for speed, VIH/VIL , VOH/VOL , etc. Region 4: I/O buffers are ON. I/Os are functional (except differential but slower because VCCI is below specification. For the same reason, input buffers do not meet VIH/VIL levels, and output buffers do not meet VOH/VOL levels. Region 4: I/O buffers are ON. I/Os are functional (except differential inputs) where VT can be from 0.58 V to 0.9 V (typically 0.75 V) VCCI Region 3: I/O buffers are ON. I/Os are functional; I/O DC specifications are met, but I/Os are slower because the V CC is below specification. VCC = VCCI + VT

IGLOO DC and Switching Characteristics 2-6 Advance v0.5 Package Thermal Characteristics The device junction-to-case thermal resistivity is θjc and the junction-to-ambient air thermal resistivity is θja. The thermal characteristics for θja are shown for two air fl ow rates. The absolute maximum junction temperature is 110°C. EQ 2-2 shows a sample calculation of the absolute maximum power dissipation allowed for a 484-pin FBGA package at commercial temperature and in still air. EQ 2-2 Temperature and Voltage Derating Factors Maximum Power Allowed Max. junction temp. (° C) Max. ambient temp. ( ° C)– Table 2-5  Package Thermal Resistivities Package Type Device Pin Count θjc θja UnitsStill Air 200 ft./ min. 500 ft./ min. Quad Flat No Lead AG L015 68 TBD TBD TBD TBD C/W AGL030 132 0.4 21.4 16.8 15.3 C/W AGL060 132 0.3 21.2 16.6 15.0 C/W AGL125 132 0.2 21.1 16.5 14.9 C/W AGL250 132 0.1 21.0 16.4 14.8 C/W Very Thin Quad Flat Pack (VQFP) All devices 100 10.0 35.3 29.4 27.1 C/W Chip Scale Package (CSP) All devices 196 57.8 47.6 43.3 C/W Fine Pitch Ball Grid Array (FBGA) See note* 144 3.8 26.9 22.9 21.5 C/W See note* 256 3.8 26.6 22.8 21.5 C/W See note* 484 3.2 20.5 17.0 15.9 C/W See note* 896 2.4 13.6 10.4 9.4 C/W AGL060 144 18.6 55.2 49.4 47.2 C/W AGL1000 144 6.3 31.6 26.2 24.2 C/W AGL250 256 12.0 38.6 34.7 33.0 C/W AGL1000 256 6.6 28.1 24.4 22.7 C/W AGL1000 484 8.0 23.3 19.0 16.7 C/W * This information applies to all IGLOO devices except those listed below. Detailed device/package thermal information for all IGLOO devices will be available in future revisions of the datasheet. Table 2-6  Temperature and Voltage Derating Factors for Timing Delays (normalized to TJ = 70°C, VCC =1 . 4 2 5V ) For IGLOO V2 or V5 devices, 1.5 V DC Core Supply Voltage Array Voltage VCC (V) Junction Temperature (°C) –40°C 0°C 25°C 70°C 85°C 110°C

IGLOO DC and Switching Characteristics Advance v0.5 2-7 Calculating Power Dissipation Quiescent Supply Current Quiescent supply current (I DD) calculation depends on multiple factors, including operating voltages (VCC, VCCI, and VJTAG), operating temperature, system clock frequency, and power modes usage. Actel recommends using the PowerCalculator and SmartPower software estimation tools to evaluate the projected static and active power based on the user design, power mode usage, operating voltage, and temperature. Table 2-7  Temperature and Voltage Derating Factors for Timing Delays (normalized to TJ = 70°C, VCC =1 . 1 4V ) For IGLOO V2, 1.2 V DC Core Supply Voltage Array Voltage VCC (V) Junction Temperature (°C) –40°C 0°C 25°C 70°C 85°C 110°C Table 2-8  Quiescent Supply Current (IDD) Characteristics, IGLOO Flash*Freeze Mode* Core Voltage AGL015 AGL030 AGL060 AGL125 AGL250 AGL400 AGL600 AGL1000 Units Typical (25°C)

1.2 V 44 81 3 2 02 73 0 4 4 µA

1.5 V 6 6 10 18 34 51 72 127 µA

• IDD includes VCC, VPUMP, VCCI, VJTAG, and VCCPLL currents. Values do not include I/O static contribution (PDC6 and PDC7). Table 2-9  Quiescent Supply Current (IDD) Characteristics, IGLOO Sleep Mode (VCC = 0 V)* Core Voltage AGL015 AGL030 AGL060 AGL125 AGL250 AGL400 AGL600 AGL1000 Units VCCI/V JTAG = 1.2 V (per bank) Typical (25°C) VCCI/VJTAG = 1.5 V (per bank) Typical (25°C)

1.2 V /

1.5 V VCCI / V JTAG = 1.8 V (per bank) Typical (25°C) 1.5 V V CCI / V JTAG = 2.5 V (per bank) Typical (25°C) 1.5 V VCCI / V JTAG = 3.3 V (per bank) Typical (25°C) 1.5 V * IDD includes VCC, VPUMP, and VCCPLL currents. Values do not include I/O static contribution (PDC6 and PDC7). Table 2-10  Quiescent Supply Current (IDD) Characteristics, IGLOO Shutdown Mode (VCC, VCCI = 0 V)* Core Voltage AGL015 AGL030 Units Typical (25°C) 1.2 V / 1.5 V 0 0 µA * I DD includes VCC, VPUMP, VCCI, VJTAG, and VCCPLL currents. Values do not include I/O static contribution (P DC6 and PDC7).

IGLOO DC and Switching Characteristics 2-8 Advance v0.5 Table 2-11  Quiescent Supply Current (IDD), No IGLOO Flash*Freeze Mode1 Core Voltage AGL015 AGL030 AGL060 AGL125 AGL250 AGL400 AGL600 AGL1000 Units ICCA Current2 Typical (25°C) 1.2 V 5 6 10 13 18 25 28 42 µA

1.5 V 14 16 20 28 44 66 82 137 µA

ICCI or IJTAG Current3, 4 VCCI/VJTAG = 1.2 V (per bank) Typical (25°C) VCCI / V JTAG = 1.5 V (per bank) Typical (25°C) 1.5 V VCCI/VJTAG = 1.8 V (per bank) Typical (25°C) 1.5 V VCCI/VJTAG = 2.5 V (per bank) Typical (25°C) 1.5 V VCCI/VJTAG = 3.3 V (per bank) Typical (25°C) 1.5 V Notes: 1. To calculate total device I DD, multiply the number of banks used by ICCI and add ICCA contribution. 2. Includes V CC, VPUMP and VCCPLL currents. 3. Per V CCI or VJTAG bank 4. Values do not include I/O static contribution (P DC6 and PDC7).

IGLOO DC and Switching Characteristics Advance v0.5 2-9 Power per I/O Pin Table 2-12  Summary of I/O Input Buffer Power (per pin) – Default I/O Software Settings Applicable to Advanced I/O Banks VCCI (V) Static Power PDC6 (mW)1 Dynamic Power PAC9 (µW/MHz)2 Single-Ended

3.3 V LVTTL /

3.3 V LVCMOS

3.3 – 16.27 2.5 V LVCMOS 2.5 – 4.65 1.8 V LVCMOS 1.8 – 1.61 1.5 V LVCMOS (JESD8-11) 1.5 – 0.96

1.2 V LVCMOS

3 1.2 – 0.58 3.3 V PCI 3.3 – 17.67 3.3 V PCI-X 3.3 – 17.67 Differential LVDS 2.5 2.26 0.89 LVPECL 3.3 5.72 1.63 Notes: 1. P DC6 is the static power (where applicable) measured on VCCI. 2. P AC9 is the total dynamic power measured on VCCI. 3. Applicable for IGLOO V2 devices only Table 2-13  Summary of I/O Input Buffer Power (per pin) – Default I/O Software Settings Applicable to Standard Plus I/O Banks VCCI (V) Static Power PDC6 (mW)1 Dynamic Power PAC9 (µW/MHz)2 Single-Ended 3.3 – 16.41 2.5 V LVCMOS 2.5 – 4.75 1.8 V LVCMOS 1.8 – 1.66 1.5 V LVCMOS (JESD8-11) 1.5 – 1.00 1.2 V LVCMOS3 1.2 – 0.61 3.3 V PCI 3.3 – 17.78 3.3 V PCI-X 3.3 – 17.78 Notes: 1. P DC6 is the static power (where applicable) measured on VCCI. 2. P AC9 is the total dynamic power measured on VCCI. 3. Applicable for IGLOO V2 devices only.

IGLOO DC and Switching Characteristics 2-10 Advance v0.5 Table 2-14  Summary of I/O Input Buffer Power (per pin) – Default I/O Software Settings Applicable to Standard I/O Banks VCCI (V) Static Power PDC6 (mW)1 Dynamic Power PAC9 (µW/MHz)2 Single-Ended 3.3 – 17.24 2.5 V LVCMOS 2.5 – 5.64 1.8 V LVCMOS 1.8 – 2.63 1.5 V LVCMOS (JESD8-11) 1.5 – 1.97 1.2 V LVCMOS3 1.2 – 0.57 Notes: 1. P DC6 is the static power (where applicable) measured on VCCI. 2. P AC9 is the total dynamic power measured on VCCI. 3. Applicable for IGLOO V2 devices only. Table 2-15  Summary of I/O Output Buffer Power (per pin) – Default I/O Software Settings1 Applicable to Advanced I/O Banks CLOAD (pF) V CCI (V) Static Power PDC7 (mW)2 Dynamic Power PAC10 (µW/MHz)3 Single-Ended 3.3 V LVTTL / 3.3 V LVCMOS 5 3.3 – 136.95 2.5 V LVCMOS 5 2.5 – 76.84 1.8 V LVCMOS 5 1.8 – 49.31 1.5 V LVCMOS (JESD8-11) 5 1.5 – 33.36 4 5 1.2 16.24 3.3 V PCI 10 3.3 – 194.05 3.3 V PCI-X 10 3.3 – 194.05 Differential LVDS – 2.5 7.74 78.72 LVPECL – 3.3 19.54 143.99 Notes: 1. Dynamic power consumption is given for standard lo ad and software default drive strength and output slew. 2. P DC7 is the static power (where applicable) measured on VCCI. 3. P AC10 is the total dynamic power measured on VCCI. 4. Applicable for IGLOO V2 devices only.

IGLOO DC and Switching Characteristics Advance v0.5 2-11 Table 2-16  Summary of I/O Output Buffer Power (per pin) – Default I/O Software Settings1 Applicable to Standard Plus I/O Banks CLOAD (pF) V CCI (V) Static Power PDC7 (mW)2 Dynamic Power PAC10 (µW/MHz)3 Single-Ended 3.3 V LVTTL / 3.3 V LVCMOS 5 3.3 – 122.16 2.5 V LVCMOS 5 2.5 – 68.37 1.8 V LVCMOS 5 1.8 – 34.53 1.5 V LVCMOS (JESD8-11) 5 1.5 – 23.66 4 5 1.2 – 14.90 3.3 V PCI 10 3.3 – 181.06 3.3 V PCI-X 10 3.3 – 181.06 Notes: 1. Dynamic power consumption is given for standard lo ad and software default drive strength and output slew. 2. P DC7 is the static power (where applicable) measured on VCCI. 3. P AC10 is the total dynamic power measured on VCCI. 4. Applicable for IGLOO V2 devices only. Table 2-17  Summary of I/O Output Buffer Power (per pin) – Default I/O Software Settings1 Applicable to Standard I/O Banks CLOAD (pF) V CCI (V) Static Power PDC7 (mW)2 Dynamic Power PAC10 (µW/MHz)3 Single-Ended 3.3 V LVTTL / 3.3 V LVCMOS 5 3.3 – 104.38 2.5 V LVCMOS 5 2.5 – 59.86 1.8 V LVCMOS 5 1.8 – 31.26 1.5 V LVCMOS (JESD8-11) 5 1.5 – 21.96 4 5 1.2 – 13.49 Notes: 1. Dynamic power consumption is given for standard lo ad and software default drive strength and output slew. 2. P DC7 is the static power (where applicable) measured on VCCI. 3. P AC10 is the total dynamic power measured on VCCI. 4. Applicable for IGLOO V2 devices only.

IGLOO DC and Switching Characteristics 2-12 Advance v0.5 Power Consumption of Various Internal Resources Table 2-18  Different Components Contributing to Dynamic Power Consumption in IGLOO Devices For IGLOO V2 or V5 Devices, 1.5 V DC Core Supply Voltage Parameter Definition Device Specific Dynamic Power (µW/MHz) AGL1000 AGL600 AGL400 AGL250 AGL125 AGL060 AGL030 AGL015 PAC1 Clock contribution of a Global Rib PAC2 Clock contribution of a Global Spine PAC3 Clock contribution of a VersaTile row 0.81 PAC4 Clock contribution of a VersaTile used as a sequential module 0.11 PAC5 First contribution of a VersaTile used as a sequential module 0.057 PAC6 Second contribution of a VersaTile used as a sequential module 0.207 PAC7 Contribution of a VersaTile used as a combinatorial module 0.17 PAC8 Average contribution of a routing net 0.7 PAC9 Contribution of an I/O input pin (standard- dependent) See Table 2-12 on page 2-9 through Table 2-14 on page 2-10. P AC10 Contribution of an I/O output pin (standard- dependent) See Table 2-15 on page 2-10 through Table 2-17 on page 2-11. P AC11 Average contribution of a RAM block during a read operation 25.00 P AC12 Average contribution of a RAM block during a write operation 30.00 P AC13 Dynamic PLL contribution 2.70 * For a different output load, drive strength, or slew rate, Actel recommends using the Actel power spreadsheet calculator or SmartPower tool in Actel Libero® Integrated Design Environment (IDE).

IGLOO DC and Switching Characteristics Advance v0.5 2-13 Table 2-19  Different Components Contributing to the Static Power Consumption in IGLOO Devices For IGLOO V2 or V5 Devices, 1.5 V DC Core Supply Voltage Parameter Definition Device-Specific Static Power (mW) AGL1000 AGL600 AGL400 AGL250 AGL125 AGL060 AGL030 AGL015 PDC1 Array static power in Active mode See Table 2-11 on page 2-8. PDC2 Array static power in Static (Idle) mode See Table 2-10 on page 2-7. PDC3 Array static power in Flash*Freeze mode See Table 2-8 on page 2-7. PDC4 Static PLL contribution 1.84 PDC5 Bank quiescent power (VCCI-dependent) See Table 2-11 on page 2-8. PDC6 I/O input pin static power (standard- dependent) See Table 2-12 on page 2-9 through Table 2-14 on page 2-10. PDC7 I/O output pin static power (standard- dependent) See Table 2-15 on page 2-10 through Table 2-17 on page 2-11. * For a different output load, drive strength, or slew rate, Actel recommends using the Actel power spreadsheet calculator or SmartPower tool in Actel Libero® Integrated Design Environment (IDE).

IGLOO DC and Switching Characteristics 2-14 Advance v0.5 Table 2-20  Different Components Contributing to Dynamic Power Consumption in IGLOO Devices For IGLOO V2 Devices, 1.2 V DC Core Supply Voltage Parameter Definition Device Specific Dynamic Power (µW/MHz) AGL1000 AGL600 AGL400 AGL250 AGL125 AGL060 AGL030 AGL015 PAC1 Clock contribution of a Global Rib PAC2 Clock contribution of a Global Spine PAC3 Clock contribution of a VersaTile row 0.52 PAC4 Clock contribution of a VersaTile used as a sequential module 0.07 PAC5 First contribution of a VersaTile used as a sequential module 0.045 PAC6 Second contribution of a VersaTile used as a sequential module 0.186 PAC7 Contribution of a VersaTile used as a combinatorial module 0.11 PAC8 Average contribution of a routing net 0.45 PAC9 Contribution of an I/O input pin (standard- dependent) See Table 2-12 on page 2-9 through Table 2-14 on page 2-10. PAC10 Contribution of an I/O output pin (standard- dependent) See Table 2-15 on page 2-10 through Table 2-17 on page 2-11. PAC11 Average contribution of a RAM block during a read operation 25.00 PAC12 Average contribution of a RAM block during a write operation 30.00 PAC13 Dynamic PLL contribution 2.10 * For a different output load, drive strength, or slew rate, Actel recommends using the Actel power spreadsheet calculator or SmartPower tool in Libero IDE.

IGLOO DC and Switching Characteristics Advance v0.5 2-15 Table 2-21  Different Components Contributing to the Static Power Consumption in IGLOO Device For IGLOO V2 Devices, 1.2 V DC Core Supply Voltage Parameter Definition Device Specific Static Power (mW) AGL1000 AGL600 AGL400 AGL250 AGL125 AGL060 AGL030 AGL015 PDC1 Array static power in Active mode See Table 2-11 on page 2-8. PDC2 Array static power in Static (Idle) mode See Table 2-10 on page 2-7. PDC3 Array static power in Flash*Freeze mode See Table 2-8 on page 2-7. PDC4 Static PLL contribution 0.90 PDC5 Bank quiescent power (VCCI-Dependent) See Table 2-11 on page 2-8. PDC6 I/O input pin static power (standard- dependent) See Table 2-12 on page 2-9 through Table 2-14 on page 2-10. PDC7 I/O output pin static power (standard- dependent) See Table 2-15 on page 2-10 through Table 2-17 on page 2-11. * For a different output load, drive strength, or slew rate, Actel recommends using the Actel power spreadsheet calculator or SmartPower tool in Actel Libero® Integrated Design Environment (IDE).

IGLOO DC and Switching Characteristics 2-16 Advance v0.5 Power Calculation Methodology This section describes a simplified method to estimate power consumptio n of an application. For more accurate and detailed power estimations, use the SmartPower tool in Actel Libero IDE software. The power calculation methodology described below uses the following variables:  The number of PLLs as well as the number and the frequency of each output clock generated  The number of combinatorial and se quential cells used in the design T h e i n t e r n a l clock frequencies  The number and the standard of I/O pins used in the design  The number of RAM blocks used in the design  Toggle rates of I/O pins as well as VersaTiles—guidelines are provided in Table 2-22 on page 2-18.  Enable rates of output buffers—guidelines are provided for typical applications in Table 2-23 on page 2-18.  Read rate and write rate to the memory—guide lines are provided for typical applications in Table 2-23 on page 2-18. The calculation should be repeated for each clock domain defined in the design. Methodology Total Power Consumption—P TOTAL PTOTAL = PSTAT + PDYN PSTAT is the total static power consumption. PDYN is the total dynamic power consumption. Total Static Power Consumption—P STAT PSTAT = (PDC1 or PDC2 or PDC3) + NBANKS * PDC5 + NINPUTS * PDC6 + NOUTPUTS * PDC7 NINPUTS is the number of I/O input buffers used in the design. NOUTPUTS is the number of I/O output buffers used in the design. NBANKS is the number of I/O banks powered in the design. Total Dynamic Power Consumption—P DYN PDYN = PCLOCK + PS-CELL + PC-CELL + PNET + PINPUTS + POUTPUTS + PMEMORY + PPLL Global Clock Contribution—P CLOCK PCLOCK = (PAC1 + NSPINE* PAC2 + NROW * PAC3 + NS-CELL* PAC4) * FCLK NSPINE is the number of global spines used in the user design—guidelines are provided in Table 2-22 on page 2-18. NROW is the number of VersaTile rows used in the design—guidelines are provided in Table 2-22 on page 2-18. FCLK is the global clock signal frequency. NS-CELL is the number of VersaTiles used as sequential modules in the design. PAC1, PAC2, PAC3, and PAC4 are device-dependent. Sequential Cells Contribution—P S-CELL PS-CELL = NS-CELL * (PAC5 + α1 / 2 * PAC6) * FCLK NS-CELL is the number of VersaTiles used as se quential modules in the design. When a multi-tile sequential cell is used, it should be accounted for as 1. α1 is the toggle rate of VersaTile outputs—guidelines are provided in Table 2-22 on page 2-18. FCLK is the global clock signal frequency.

IGLOO DC and Switching Characteristics Advance v0.5 2-17 Combinatorial Cells Contribution—P C-CELL PC-CELL = NC-CELL* α1 / 2 * PAC7 * FCLK NC-CELL is the number of VersaTiles used as combinatorial modules in the design. α1 is the toggle rate of VersaTile outputs—guidelines are provided in Table 2-22 on page 2-18. FCLK is the global clock signal frequency. Routing Net Contribution—P NET PNET = (NS-CELL + NC-CELL) * α1 / 2 * PAC8 * FCLK NS-CELL is the number of VersaTiles used as sequential modules in the design. NC-CELL is the number of VersaTiles used as combinatorial modules in the design. α1 is the toggle rate of VersaTile outputs—guidelines are provided in Table 2-22 on page 2-18. FCLK is the global clock signal frequency. I/O Input Buffer Contribution—P INPUTS PINPUTS = NINPUTS * α2 / 2 * PAC9 * FCLK NINPUTS is the number of I/O input buffers used in the design. α2 is the I/O buffer toggle rate—guidelines are provided in Table 2-22 on page 2-18. FCLK is the global clock signal frequency. I/O Output Buffer Contribution—P OUTPUTS POUTPUTS = NOUTPUTS * α2 / 2 * β1 * PAC10 * FCLK NOUTPUTS is the number of I/O output buffers used in the design. α2 is the I/O buffer toggle rate—guidelines are provided in Table 2-22 on page 2-18. β1 is the I/O buffer enable rate—guidelines are provided in Table 2-23 on page 2-18. FCLK is the global clock signal frequency. RAM Contribution—P MEMORY PMEMORY = PAC11 * NBLOCKS * FREAD-CLOCK * β2 + PAC12 * NBLOCK * FWRITE-CLOCK * β3 NBLOCKS is the number of RAM blocks used in the design. FREAD-CLOCK is the memory read clock frequency. β2 is the RAM enable rate for read operations. FWRITE-CLOCK is the memory write clock frequency. β3 is the RAM enable rate for write operations—guidelines are provided in Table 2-23 on page 2-18. PLL Contribution—P PLL PPLL = PDC4 + PAC13 *FCLKOUT FCLKOUT is the output clock frequency.1 1. If a PLL is used to generate more than one output clock, include each output clock in the formula by adding its corresponding contribution (PAC13* FCLKOUT product) to the total PLL contribution.

IGLOO DC and Switching Characteristics 2-18 Advance v0.5 Guidelines Toggle Rate Definition A toggle rate defines the frequency of a net or logic element relative to a clock. It is a percentage. If the toggle rate of a net is 100 %, this means that this net switch es at half the clock frequency. Below are some examples:  The average toggle rate of a shift register is 100 % because all flip-flop outputs toggle at half of the clock frequency.  The average toggle rate of an 8-bit counter is 25 %: – Bit 0 (LSB) = 100 % – Bit 1 = 50 % – Bit 2 = 25 % – Bit 7 (MSB) = 0.78125 % Enable Rate Definition Output enable rate is the average percentage of time during which tris tate outputs are enabled. When nontristate output buffers are used, the enable rate should be 100%. Table 2-22  Toggle Rate Guidelines Recommended for Power Calculation Component Definition Guideline α1 Toggle rate of VersaTile outputs 10 % α2 I/O buffer toggle rate 10 % Table 2-23  Enable Rate Guidelines Recommended for Power Calculation Component Definition Guideline β1 I/O output buffer enable rate 100 % β2 RAM enable rate for read operations 12.5 % β3 RAM enable rate for write operations 12.5 %

IGLOO DC and Switching Characteristics Advance v0.5 2-19 User I/O Characteristics Timing Model Figure 2-3  Timing Model Operating Conditions: Std. Speed, Commercial Temperature Range (TJ = 70°C), Worst-Case VCC = 1.425 V, for DC 1.5 V Core Voltage, Applicable to V2 and V5 Devices DQ Y Y DQDQ DQY Combinational Cell Combinational Cell Combinational Cell I/O Module (Registered) I/O Module (Non-Registered) Register Cell Register Cell I/O Module (Registered) I/O Module (Non-Registered) LVPECL (Applicable to Advanced I/O Banks Only)L LVPECL (Applicable to Advanced I/O Banks only) LVDS, BLVDS, M-LVDS (Applicable for Advanced I/O Banks only) LVTTL 3.3 V Output drive strength = 12 mA High slew rate Y Combinational Cell Y Combinational Cell Y Combinational Cell I/O Module (Non-Registered) LVTTL Output drive strength = 8 mA High slew rate I/O Module (Non-Registered) LVCMOS 1.5 V Output drive strength = 4 mA High slew rate LVTTL Output drive strength = 12 mA High slew rate I/O Module (Non-Registered) Input LVTTL Clock Input LVTTL Clock Input LVTTL Clock tPD = 1.22 ns tPD = 1.20 ns tDP = 1.72 ns tPD = 1.80 ns tDP = 3.05 ns (Advanced I/O Banks) tPD = 1.49 ns tDP = 4.12 ns (Advanced I/O Banks) tPD = 0.86 ns tDP = 4.42 ns (Advanced I/O Banks) tPD = 0.92 ns tPY = 0.87 ns (Advanced I/O Banks) tCLKQ = 0.90 ns tOCLKQ = 1.02 ns tSUD = 0.82 ns tOSUD = 0.52 ns tDP = 3.05 ns (Advanced I/O Banks) tPY = 0.87 ns (Advanced I/O Banks) tPY = 1.35 ns tCLKQ = 0.90 ns tSUD = 0.82 ns tPY = 0.87 ns (Advanced I/O Banks) tICLKQ = 0.43 ns tISUD = 0.47 ns tPY = 1.20 ns

IGLOO DC and Switching Characteristics 2-20 Advance v0.5 Figure 2-4  Input Buffer Timing Model and Delays (example) tPY (R) PAD Y Vtrip GND tPY (F) Vtrip 50%50% VIH VCC VIL tDOUT (R) DIN GND tDOUT (F) 50%50% VCC PAD Y tPY D CLK Q I/O Interface DIN tDIN To Array tPY = MAX(tPY(R), tPY(F)) tDIN = MAX(tDIN(R), tDIN(F))

IGLOO DC and Switching Characteristics Advance v0.5 2-21 Figure 2-5  Output Buffer Model and Delays (example) tDP (R) PAD VOL tDP (F) VtripVtrip VOH VCC D 50% 50% VCC 0 V DOUT 50% 50% 0 V tDOUT (R) tDOUT (F) From Array PAD tDP Std Load D CLK Q I/O Interface DOUT D tDOUT tDP = MAX(tDP(R), tDP(F)) tDOUT = MAX(tDOUT(R), tDOUT(F))

IGLOO DC and Switching Characteristics 2-22 Advance v0.5 Figure 2-6  Tristate Output Buffer Timing Model and Delays (example) D CLK Q D CLK Q 10% VCCI tZL Vtrip 50% tHZ 90% VCCI tZH Vtrip 50% 50% tLZ 50% EOUT PAD D E 50% tEOUT (R) 50% tEOUT (F) PAD DOUT EOUT D I/O Interface E tEOUT tZLS Vtrip 50% tZHS Vtrip 50%EOUT PAD D E 50% 50%tEOUT (R) tEOUT (F) 50% VCC VCC VCC VCCI VCC VCC VCC VOH VOL VOL tZL, tZH, tHZ, tLZ, tZLS, tZHS tEOUT = MAX(tEOUT(r), tEOUT(f))

IGLOO DC and Switching Characteristics Advance v0.5 2-23 Overview of I/O Performance Summary of I/O DC Input and Output Levels – Default I/O Software Settings Table 2-24  Summary of Maximum and Minimum DC Input and Output Levels Applicable to Commercial and Industrial Conditions—Software Default Settings Applicable to Advanced I/O Banks I/O Standard Drive Strength Slew Rate VIL VIH VOL VOH IOL

1 IOH

0.45 12 12 VCCI 12 12 VCCI

3.3 V PCI Per PCI specifications

3.3 V PCI-X Per PCI-X specifications

Notes: 1. Currents are measured at 85°C junction temperature. 2. All LVMCOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JDEC8a specification. 3. Applicable to V2 Devices only. Table 2-25  Summary of Maximum and Minimum DC Input and Output Levels Applicable to Commercial and Industrial Conditions—Software Default Settings Applicable to Standard Plus I/O Banks I/O Standard Drive Strength Slew Rate V IL VIH VOL VOH IOL IOH Min., V Max, V Min, V Max, V Max, V Min, V mA mA 0.45 8 8 VCCI 4 4 VCCI Notes: 1. Currents are measured at 85°C junction temperature. 2. All LVMCOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JDEC8a specification. 3. Applicable to V2 Devices only.

IGLOO DC and Switching Characteristics 2-24 Advance v0.5 Table 2-26  Summary of Maximum and Minimum DC Input and Output Levels Applicable to Commercial and Industrial Conditions—Software Default Settings Applicable to Standard I/O Banks I/O Standard Drive Strength Slew Rate V IL VIH VOL VOH IOL Min, V Max, V Min, V Max, V Max, V Min, V mA mA 0.45 VCCI VCCI Notes: 1. Currents are measured at 85°C junction temperature. 2. All LVMCOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JDEC8a specification. 3. Applicable to V2 Devices only. Table 2-27  Summary of Maximum and Minimum DC Input Levels Applicable to Commercial and Industrial Conditions DC I/O Standards Commercial

1 Industrial2

µA µA µA µA 3.3 V LVTTL / 3.3 V LVCMOS 10 10 15 15

3.3 V LVCMOS Wide Range 10 10 15 15

2.5 V LVCMOS 10 10 15 15

1.8 V LVCMOS 10 10 15 15

1.5 V LVCMOS 10 10 15 15

3.3 V PCI 10 10 15 15

3.3 V PCI-X 10 10 15 15

Notes: 1. Commercial range (0°C < T A < 70°C) 2. Industrial range (–40°C < T A < 85°C) 3. Applicable to V2 Devices only.

IGLOO DC and Switching Characteristics Advance v0.5 2-25 Summary of I/O Timing Characteristics – Default I/O Software Settings Table 2-28  Summary of AC Measuring Points Standard Measuring Trip Point (V trip) 3.3 V LVTTL / 3.3 V LVCMOS 1.4 V 2.5 V LVCMOS 1.2 V 1.8 V LVCMOS 0.90 V 1.5 V LVCMOS 0.75 V 1.2 V LVCMOS 0.60 V 3.3 V PCI 0.285 * V CCI (RR) 0.615 * VCCI (FF) 3.3 V PCI-X 0.285 * V CCI (RR) 0.615 * VCCI (FF) Table 2-29  I/O AC Parameter Definitions Parameter Parameter Definition tDP Data to Pad delay through the Output Buffer tPY Pad to Data delay through the Input Buffer tDOUT Data to Output Buffer delay through the I/O interface tEOUT Enable to Output Buffer Tristate Control delay through the I/O interface tDIN Input Buffer to Data delay through the I/O interface tHZ Enable to Pad delay through the Output Buffer—HIGH to Z tZH Enable to Pad delay through the Output Buffer—Z to HIGH tLZ Enable to Pad delay through the Output Buffer—LOW to Z tZL Enable to Pad delay through the Output Buffer—Z to LOW tZHS Enable to Pad delay through the Output Buffer with delayed enable—Z to HIGH tZLS Enable to Pad delay through the Output Buffer with delayed enable—Z to LOW

IGLOO DC and Switching Characteristics 2-26 Advance v0.5 Table 2-30  Summary of I/O Timing Characteristics—Software Default Set tings, Std. Speed Grade, Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V Applicable to Advanced I/O Banks I/O Standard Drive Strength (mA) Slew Rate Capacitive Load (pF) External Resistor (Ω) tDOUT (ns) tDP (ns) tDIN (ns) tPY (ns) tEOUT (ns) tZL (ns) tZH (ns) tLZ (ns) tHZ (ns) tZLS (ns) tZHS (ns) Units

3.3 V PCI Per PCI

3.3 V PCI-X Per PCI-X

LVDS 24 mA High – – 0.97 1.67 0.19 1.31 – – – – – – – ns LVPECL 24 mA High – – 0.97 1.67 0.19 1.16 – – – – – – – ns Notes: 1. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. 2. Resistance is used to measure I/O propagation delays as defined in PCI specifications. See Figure 2-12 on page 2-62 for connectivity. This resistor is not required during normal operation.

IGLOO DC and Switching Characteristics Advance v0.5 2-27 Table 2-31  Summary of I/O Timing Characteristics—Software Default Set tings, Std. Speed Grade, Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V Applicable to Standard Plus I/O Banks I/O Standard Drive Strength (mA) Slew Rate Capacitive Load (pF) External Resistor (Ω) tDOUT (ns) tDP (ns) tDIN (ns) tPY (ns) tEOUT (ns) tZL (ns) tZH (ns) tLZ (ns) tHZ (ns) tZLS (ns) tZHS (ns) Units

3.3 V PCI-X Per

Notes: 1. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. 2. Resistance is used to measure I/O propagation delays as defined in PCI specifications. See Figure 2-12 on page 2-62 for connectivity. This resistor is not required during normal operation. Table 2-32  Summary of I/O Timing Characteristics—Software Default Set tings, Std. Speed Grade, Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V Applicable to Standard I/O Banks I/O Standard Drive Strength (mA) Slew Rate Capacitive Load (pF) External Resistor (Ω) tDOUT (ns) tDP (ns) tDIN (ns) tPY (ns) tEOUT (ns) tZL (ns) tZH (ns) tLZ (ns) tHZ (ns) Units Notes: 1. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. 2. Resistance is used to measure I/O propagation delays as defined in PCI specifications. See Figure 2-12 on page 2-62 for connectivity. This resistor is not required during normal operation.

IGLOO DC and Switching Characteristics 2-28 Advance v0.5 Table 2-33  Summary of I/O Timing Characteristics—Software Default Set tings, Std. Speed Grade, Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 3.0 V Applicable to Advanced I/O Banks I/O Standard Drive Strength (mA) Slew Rate Capacitive Load (pF) External Resistor (Ω) tDOUT (ns) tDP (ns) tDIN (ns) tPY (ns) tEOUT (ns) tZL (ns) tZH (ns) tLZ (ns) tHZ (ns) tZLS (ns) tZHS (ns) Units LVDS 24 mA High – – 1.55 2.19 0.25 1.52 – – – – – – – ns LVPECL 24 mA High – – 1.55 2.24 0.25 1.37 – – – – – – – ns Notes: 1. For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values. 2. Resistance is used to measure I/O propagation delays as defined in PCI specifications. See Figure 2-12 on page 2-62 for connectivity. This resistor is not required during normal operation.

IGLOO DC and Switching Characteristics Advance v0.5 2-29 Table 2-34  Summary of I/O Timing Characteristics—Software Default Set tings, Std. Speed Grade, Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 3.0 V Applicable to Standard Plus I/O Banks I/O Standard Drive Strength (mA) Slew Rate Capacitive Load (pF) External Resistor (Ω) tDOUT (ns) tDP (ns) tDIN (ns) tPY (ns) tEOUT (ns) tZL (ns) tZH (ns) tLZ (ns) tHZ (ns) tZLS (ns) tZHS (ns) Units Notes: 1. For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values. 2. Resistance is used to measure I/O propagatio n delays as defined in PCI specifications. See Figure 2-12 on page 2-62 for connectivity. This resistor is not required during normal operation. Table 2-35  Summary of I/O Timing Characteristics—Software Default Set tings, Std. Speed Grade, Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 3.0 V Applicable to Standard I/O Banks I/O Standard Drive Strength (mA) Slew Rate Capacitive Load (pF) External Resistor (Ω) tDOUT (ns) tDP (ns) tDIN (ns) tPY (ns) tEOUT (ns) tZL (ns) tZH (ns) tLZ (ns) tHZ (ns) Units Notes: 1. For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values. 2. Resistance is used to measure I/O propagation delays as defined in PCI specifications. See Figure 2-12 on page 2-62 for connectivity. This resistor is not required during normal operation.

IGLOO DC and Switching Characteristics 2-30 Advance v0.5 Detailed I/O DC Characteristics Table 2-36  Input Capacitance Symbol Definition Conditions Min. Max. Units CIN Input capacitance V IN = 0, f = 1.0 MHz 8 pF CINCLK Input capacitance on the clock pin V IN = 0, f = 1.0 MHz 8 pF Table 2-37  I/O Output Buffer Maximum Resistances1 Applicable to Advanced I/O Banks Standard Drive Strength RPULL-DOWN (Ω)2 RPULL-UP (Ω)3 3.3 V LVTTL / 3.3 V LVCMOS 2 mA 100 300 4 mA 100 300 6 mA 50 150 8 mA 50 150 12 mA 25 75 16 mA 17 50 24 mA 11 33

2.5 V LVCMOS 2 mA 100 300

1.8 V LVCMOS 2 mA 100 200

1.5 V LVCMOS 2 mA 200 224

1.2 V LVCMOS 2 mA TBD TBD

3.3 V PCI/PCI-X Per PCI/PCI-X

Notes: 1. These maximum values are provided for informatio nal reasons only. Minimum output buffer resistance values depend on V CCI, drive strength selection, temperature, and process. For board design considerations and detailed output buffer resistances, use the corres ponding IBIS models located on the Actel website at http://www.actel.com/download/ibis/default.aspx. 2. R (PULL-DOWN-MAX) = (VOLspec) / IOLspec 3. R (PULL-UP-MAX) = (VCCImax – VOHspec) / IOHspec

IGLOO DC and Switching Characteristics Advance v0.5 2-31 Table 2-38  I/O Output Buffer Maximum Resistances1 Applicable to Standard Plus I/O Banks Standard Drive Strength RPULL-DOWN (Ω)2 RPULL-UP (Ω)3 3.3 V LVTTL / 3.3 V LVCMOS 2 mA 100 300 4 mA 100 300 6 mA 50 150 8 mA 50 150 12 mA 25 75 16 mA 25 75

2.5 V LVCMOS 2 mA 100 200

1.8 V LVCMOS 2 mA 200 225

Notes: 1. These maximum values are provided for informatio nal reasons only. Minimum output buffer resistance values depend on V CCI, drive strength selection, temperature, and process. For board design considerations and detailed output buffer resistances, use the corres ponding IBIS models located on the Actel website at http://www.actel.com/download/ibis/default.aspx. 2. R (PULL-DOWN-MAX) = (VOLspec) / IOLspec 3. R (PULL-UP-MAX) = (VCCImax – VOHspec) / IOHspec

IGLOO DC and Switching Characteristics 2-32 Advance v0.5 Table 2-39  I/O Output Buffer Maximum Resistances1 Applicable to Standard I/O Banks Standard Drive Strength RPULL-DOWN (Ω)2 RPULL-UP (Ω)3 3.3 V LVTTL / 3.3 V LVCMOS 2 mA 100 300 4 mA 100 300 6 mA 50 150 8 mA 50 150

1.2 V LVCMOS 1 mA TBD TBD

Notes: 1. These maximum values are provided for informatio nal reasons only. Minimum output buffer resistance values depend on V CCI, drive strength selection, temperature, and process. For board design considerations and detailed output buffer resistances, use the corres ponding IBIS models located on the Actel website at http://www.actel.com/download/ibis/default.aspx. 2. R (PULL-DOWN-MAX) = (VOLspec) / IOLspec 3. R (PULL-UP-MAX) = (VCCImax – VOHspec) / IOHspec Table 2-40  I/O Weak Pull-Up/Pull-Down Resistances Minimum and Maximum Weak Pull-Up/Pull-Down Resistance Values VCCI R(WEAK PULL-UP) (Ω) R(WEAK PULL-DOWN) (Ω) Min. Max. Min. Max.

3.3 V 10 k 45 k 10 k 45 k

2.5 V 11 k 55 k 12 k 74 k

1.8 V 18 k 70 k 17 k 110 k

1.5 V 19 k 90 k 19 k 140 k

1.2 V TBD TBD TBD TBD

Notes: 1. R (WEAK PULL-UP-MAX) = (VOLspec) / I(WEAK PULL-UP-MIN) 2. R (WEAK PULL-UP-MAX) = (VCCImax – VOHspec) / I(WEAK PULL-UP-MIN)

IGLOO DC and Switching Characteristics Advance v0.5 2-33 Table 2-41  I/O Short Currents IOSH/IOSL Applicable to Advanced I/O Banks Drive Strength I OSL (mA)* I OSH (mA)* 3.3 V LVTTL / 3.3 V LVCMOS 2 mA 25 27 4 mA 25 27 6 mA 51 54 8 mA 51 54 12 mA 103 109 16 mA 132 127 24 mA 268 181

2.5 V LVCMOS 2 mA 16 18

1.8 V LVCMOS 2 mA 9 11

1.5 V LVCMOS 2 mA 13 16

• T J = 100°C

IGLOO DC and Switching Characteristics 2-34 Advance v0.5 Table 2-42  I/O Short Currents IOSH/IOSL Applicable to Standard Plus I/O Banks Drive Strength I OSL (mA)* I OSH (mA)* 3.3 V LVTTL / 3.3 V LVCMOS 2 mA 25 27 4 mA 25 27 6 mA 51 54 8 mA 51 54 12 mA 103 109 16 mA 103 109

• T J = 100°C Table 2-43  I/O Short Currents IOSH/IOSL Applicable to Standard I/O Banks Drive Strength I OSL (mA)* I OSH (mA)* 3.3 V LVTTL / 3.3 V LVCMOS 2 mA 25 27 4 mA 25 27 6 mA 51 54 8 mA 51 54
• T J = 100°C

IGLOO DC and Switching Characteristics Advance v0.5 2-35 The length of time an I/O can withstand IOSH/IOSL events depends on the junction temperature. The reliability data below is based on a 3.3 V, 12 mA I/O setting, which is the worst case for this type of analysis. For example, at 110°C, the short current condition would have to be sustained for more than three months to cause a reliability concern. The I/O desi gn does not contain any short circuit protection, but such protection would only be needed in extremely prolonged stress conditions. Table 2-44  Duration of Short Circuit Event before Failure Temperature Time before Failure –40°C > 20 years 0°C > 20 years 25°C > 20 years 70°C 5 years 85°C 2 years 100°C 6 months 110°C 3 months Table 2-45  I/O Input Rise Time, Fall Time, and Related I/O Reliability Input Buffer Input Rise/Fall Time (min.) Input Rise/Fall Time (max.) Reliability LVTTL/LVCMOS No requirement 10 ns * 20 years (110°C) LVDS/B-LVDS/M-LVDS/ LVPECL No requirement 10 ns * 10 years (100°C) * The maximum input rise/fall time is related to the noise induced into the input buffer trace. If the noise is low, then the rise time and fall time of input buffers can be increased beyond the maximum value. The longer the rise/fall times, the more susceptible the input signal is to the board noise. Actel recommends signal integrit y evaluation/characterization of the system to ensure that there is no excessive noise coupling into input signals.

IGLOO DC and Switching Characteristics 2-36 Advance v0.5 Single-Ended I/O Characteristics 3.3 V LVTTL / 3.3 V LVCMOS Low-Voltage Transistor–Transistor Logic (LVTTL) is a general-purpose standard (EIA/JESD) for 3.3 V applications. It uses an LVTTL input buffer and push-pull output buffer. Furthermore, all LVCMOS 3.3 V software macros comply with LVCMOS 3.3 V wide range as specified in the JESD8a specification. Table 2-46  Minimum and Maximum DC Input and Output Levels Applicable to Advanced I/O Banks

3.3 V LVCMOS V IL VIH VOL VOH IOL IOH IOSL IOSH IIL IIH

1 Max., mA1 µA2 µA2 Notes: 1. Currents are measured at 100°C junc tion temperature and maximum voltage. 2. Currents are measured at 85°C junction temperature. 3. Software default selection highlighted in gray. Table 2-47  Minimum and Maximum DC Input and Output Levels Applicable to Standard Plus I/O Banks

3.3 V LVCMOS V

IL VIH VOL VOH IOL IOH IOSL IOSH IIL IIH Drive Notes: 1. Currents are measured at 100°C junc tion temperature and maximum voltage. 2. Currents are measured at 85°C junction temperature. 3. Software default selection highlighted in gray.

IGLOO DC and Switching Characteristics Advance v0.5 2-37 Table 2-48  Minimum and Maximum DC Input and Output Levels Applicable to Standard I/O Banks 1 Max., mA1 µA2 µA2 Notes: 1. Currents are measured at 100°C junc tion temperature and maximum voltage. 2. Currents are measured at 85°C junction temperature. 3. Software default selection highlighted in gray. Table 2-49  Minimum and Maximum DC Input and Output Levels for LVCMOS 3.3 V Wide Range Applicable to Advanced, Standard Plus, and Standard I/O Banks

3.3 V LVCMOS Wide

Range V IL VIH VOL VOH IOL IOH IIL IIH Drive Notes: 1. Currents are measured at 100°C junc tion temperature and maximum voltage. 2. All LVMCOS 3.3 V software macros support LVCM OS 3.3 V wide range as specified in the JDEC8a specification. Figure 2-7  AC Loading Table 2-50  AC Waveforms, Measuring Points, and Capacitive Loads Input LOW (V) Input HIGH (V) Measuring Point* (V) C LOAD (pF) 03 . 3 1 . 4 5 * Measuring point = V trip. See Table 2-28 on page 2-25 for a complete table of trip points. Test Point Test Point Enable PathDatapath 5 pF R = 1 k R to VCCI for tLZ/tZL/tZLS R to GND for tHZ/tZH/tZHS 35 pF for tZH/tZHS/tZL/tZLS 5 pF for tHZ/tLZ

IGLOO DC and Switching Characteristics 2-38 Advance v0.5 Timing Characteristics Applies to 1.5 V DC Core Voltage Table 2-51  3.3 V LVTTL / 3.3 V LVCMOS Low Slew – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V Applicable to Advanced I/O Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-52  3.3 V LVTTL / 3.3 V LVCMOS High Slew – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V Applicable to Advanced I/O Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-53  3.3 V LVTTL / 3.3 V LVCMOS Low Slew – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V Applicable to Standard Plus Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.

IGLOO DC and Switching Characteristics Advance v0.5 2-39 Table 2-54  3.3 V LVTTL / 3.3 V LVCMOS High Slew – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V Applicable to Standard Plus Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-55  3.3 V LVTTL / 3.3 V LVCMOS Low Slew – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V Applicable to Standard Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-56  3.3 V LVTTL / 3.3 V LVCMOS High Slew – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V Applicable to Standard Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.

IGLOO DC and Switching Characteristics 2-40 Advance v0.5 Applies to 1.2 V DC Core Voltage Table 2-57  3.3 V LVTTL / 3.3 V LVCMOS Low Slew – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 3.0 V Applicable to Advanced I/O Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values. Table 2-58  3.3 V LVTTL / 3.3 V LVCMOS High Slew – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 3.0 V Applicable to Advanced I/O Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values. Table 2-59  3.3 V LVTTL / 3.3 V LVCMOS Low Slew – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 3.0 V Applicable to Standard Plus Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values.

IGLOO DC and Switching Characteristics Advance v0.5 2-41 Table 2-60  3.3 V LVTTL / 3.3 V LVCMOS High Slew – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 3.0 V Applicable to Standard Plus Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values. Table 2-61  3.3 V LVTTL / 3.3 V LVCMOS Low Slew – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 3.0 V Applicable to Standard Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values. Table 2-62  3.3 V LVTTL / 3.3 V LVCMOS High Slew – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 3.0 V Applicable to Standard Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values.

IGLOO DC and Switching Characteristics 2-42 Advance v0.5

2.5 V LVCMOS

Low-Voltage CMOS for 2.5 V is an extension of the LVCMOS standard (JESD8-5) used for general- purpose 2.5 V applications. It uses a 5 V–tolerant input buffer and push-pull output buffer. Table 2-63  Minimum and Maximum DC Input and Output Levels Applicable to Advanced I/O Banks 2.5 V LVCMOS V IL VIH VOL VOH IOL IOH IOSH IOSL IIL IIH Drive 1 Max., mA1 µA2 µA2 Notes: 1. Currents are measured at 100°C junc tion temperature and maximum voltage. 2. Currents are measured at 85°C junction temperature. 3. Software default selection highlighted in gray. Table 2-64  Minimum and Maximum DC Input and Output Levels Applicable to Standard Plus I/O Banks 2.5 V LVCMOS V IL VIH VOL VOH IOL IOH IOSH IOSL IIL IIH Drive 1 Max., mA1 µA2 µA2 Notes: 1. Currents are measured at 100°C junc tion temperature and maximum voltage. 2. Currents are measured at 85°C junction temperature. 3. Software default selection highlighted in gray.

IGLOO DC and Switching Characteristics Advance v0.5 2-43 Table 2-65  Minimum and Maximum DC Input and Output Levels Applicable to Standard I/O Banks 2.5 V LVCMOS V IL VIH VOL VOH IOL IOH IOSH IOSL IIL IIH Drive 1 Max., mA1 µA2 µA2 Notes: 1. Currents are measured at 100°C junc tion temperature and maximum voltage. 2. Currents are measured at 85°C junction temperature. 3. Software default selection highlighted in gray. Figure 2-8  AC Loading Table 2-66  AC Waveforms, Measuring Points, and Capacitive Loads Input LOW (V) Input HIGH (V) Measuring Point* (V) C LOAD (pF) 02 . 5 1 . 2 5 * Measuring point = Vtrip. See Table 2-28 on page 2-25 for a complete table of trip points. Test Point Test Point Enable PathDatapath 5 pF R = 1 k R to VCCI for tLZ/tZL/tZLS R to GND for tHZ/tZH/tZHS 35 pF for tZH/tZHS/tZL/tZLS 5 pF for tHZ/tLZ

IGLOO DC and Switching Characteristics 2-44 Advance v0.5 Timing Characteristics Applies to 1.5 V DC Core Voltage Table 2-67  2.5 V LVCMOS Low Slew – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V Applicable to Advanced I/O Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-68  2.5 V LVCMOS High Slew – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V Applicable to Advanced I/O Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-69  2.5 V LVCMOS Low Slew – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V Applicable to Standard Plus Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.

IGLOO DC and Switching Characteristics Advance v0.5 2-45 Table 2-70  2.5 V LVCMOS High Slew – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V Applicable to Standard Plus Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-71  2.5 V LVCMOS Low Slew – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V Applicable to Standard Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-72  2.5 V LVCMOS High Slew – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V Applicable to Standard Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.

IGLOO DC and Switching Characteristics 2-46 Advance v0.5 Applies to 1.2 V Core Voltage Table 2-73  2.5 V LCMOS Low Slew – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 2.3 V Applicable to Advanced I/O Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values. Table 2-74  2.5 V LCMOS High Slew – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 2.3 V Applicable to Advanced I/O Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values. Table 2-75  2.5 V LCMOS Low Slew – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 2.3 V Applicable to Standard Plus Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values.

IGLOO DC and Switching Characteristics Advance v0.5 2-47 Table 2-76  2.5 V LCMOS High Slew – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 2.3 V Applicable to Standard Plus Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values. Table 2-77  2.5 V LCMOS Low Slew – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 2.3 V Applicable to Standard Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values. Table 2-78  2.5 V LCMOS High Slew – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 2.3 V Applicable to Standard Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values.

IGLOO DC and Switching Characteristics 2-48 Advance v0.5

1.8 V LVCMOS

Low-voltage CMOS for 1.8 V is an extension of the LVCMOS standard (JESD8-5) used for general- purpose 1.8 V applications. It uses a 1.8 V input buffer and a push-pull output buffer. Table 2-79  Minimum and Maximum DC Input and Output Levels Applicable to Advanced I/O Banks 1.8 V LVCMOS V IL VIH VOL VOH IOL IOH IOSH IOSL IIL IIH Drive 1 Max., mA1 µA2 µA2 Notes: 1. Currents are measured at 100°C junc tion temperature and maximum voltage. 2. Currents are measured at 85°C junction temperature. 3. Software default selection highlighted in gray. Table 2-80  Minimum and Maximum DC Input and Output Levels Applicable to Standard Plus I/O Banks 1.8 V LVCMOS V IL VIH VOL VOH IOL IOH IOSH IOSL IIL IIH Drive Notes: 1. Currents are measured at 100°C junc tion temperature and maximum voltage. 2. Currents are measured at 85°C junction temperature. 3. Software default selection highlighted in gray.

IGLOO DC and Switching Characteristics Advance v0.5 2-49 Table 2-81  Minimum and Maximum DC Input and Output Levels Applicable to Standard I/O Banks 1.8 V LVCMOS V IL VIH VOL VOH IOL IOH IOSH IOSL IIL IIH Drive 1 Max., mA1 µA2 µA2 Notes: 1. Currents are measured at 100°C junc tion temperature and maximum voltage. 2. Currents are measured at 85°C junction temperature. 3. Software default selection highlighted in gray. Figure 2-9  AC Loading Table 2-82  AC Waveforms, Measuring Points, and Capacitive Loads Input LOW (V) Input HIGH (V) Measuring Point* (V) C LOAD (pF) 01 . 8 0 . 9 5 * Measuring point = Vtrip. See Table 2-28 on page 2-25 for a complete table of trip points. Test Point Test Point Enable PathDatapath 5 pF R = 1 k R to VCCI for tLZ/tZL/tZLS R to GND for tHZ/tZH/tZHS 35 pF for tZH/tZHS/tZL/tZLS 5 pF for tHZ/tLZ

IGLOO DC and Switching Characteristics 2-50 Advance v0.5 Timing Characteristics

1.5 V DC Core Voltage

Table 2-83  1.8 V LVCMOS Low Slew – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.7 V Applicable to Advanced I/O Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-84  1.8 V LVCMOS High Slew – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.7 V Applicable to Advanced I/O Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-85  1.8 V LVCMOS Low Slew – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.7 V Applicable to Standard Plus Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.

IGLOO DC and Switching Characteristics Advance v0.5 2-51 Table 2-86  1.8 V LVCMOS High Slew – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.7 V Applicable to Standard Plus Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-87  1.8 V LVCMOS Low Slew – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.7 V Applicable to Standard Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-88  1.8 V LVCMOS High Slew – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.7 V Applicable to Standard Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.

IGLOO DC and Switching Characteristics 2-52 Advance v0.5

1.2 V DC Core Voltage

Table 2-89  1.8 V LCMOS Low Slew – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 1.7 V Applicable to Advanced I/O Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values. Table 2-90  1.8 V LCMOS High Slew – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 1.7 V Applicable to Advanced I/O Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values. Table 2-91  1.8 V LCMOS Low Slew – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 1.7 V Applicable to Standard Plus Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values.

IGLOO DC and Switching Characteristics Advance v0.5 2-53 Table 2-92  1.8 V LCMOS High Slew – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 1.7 V Applicable to Standard Plus Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values. Table 2-93  1.8 V LCMOS Low Slew – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 1.7 V Applicable to Standard Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values. Table 2-94  1.8 V LCMOS High Slew – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 1.7 V Applicable to Standard Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values.

IGLOO DC and Switching Characteristics 2-54 Advance v0.5

1.5 V LVCMOS (JESD8-11)

Low-Voltage CMOS for 1.5 V is an extension of the LVCMOS standard (JESD8-5) used for general- purpose 1.5 V applications. It uses a 1.5 V input buffer and a push-pull output buffer. Table 2-95  Minimum and Maximum DC Input and Output Levels Applicable to Advanced I/O Banks 1.5 V LVCMOS V IL VIH VOL VOH IOL IOH IOSH IOSL IIL IIH Drive m A mA Max., mA 1 Max., mA1 µA2 µA2 Notes: 1. Currents are measured at 100°C junc tion temperature and maximum voltage. 2. Currents are measured at 85°C junction temperature. 3. Software default selection highlighted in gray. Table 2-96  Minimum and Maximum DC Input and Output Levels Applicable to Standard Plus I/O Banks 1.5 V LVCMOS V IL VIH VOL VOH IOL IOH IOSH IOSL IIL IIH Drive Notes: 1. Currents are measured at 100°C junc tion temperature and maximum voltage. 2. Currents are measured at 85°C junction temperature. 3. Software default selection highlighted in gray. Table 2-97  Minimum and Maximum DC Input and Output Levels Applicable to Standard I/O Banks 1.5 V LVCMOS V IL VIH VOL VOH IOL IOH IOSH IOSL IIL IIH Drive 1 Max., mA1 µA2 µA2 Notes: 1. Currents are measured at 100°C junc tion temperature and maximum voltage. 2. Currents are measured at 85°C junction temperature. 3. Software default selection highlighted in gray.

IGLOO DC and Switching Characteristics Advance v0.5 2-55 Timing Characteristics Figure 2-10  AC Loading Table 2-98  AC Waveforms, Measuring Points, and Capacitive Loads Input LOW (V) Input HIGH (V) Measuring Point* (V) C LOAD (pF) 01 . 5 0 . 7 5 5 * Measuring point = V trip. See Table 2-28 on page 2-25 for a complete table of trip points. Test Point Test Point Enable PathDatapath 5 pF R = 1 k R to VCCI for tLZ/tZL/tZLS R to GND for tHZ/tZH/tZHS 35 pF for tZH/tZHS/tZL/tZLS 5 pF for tHZ/tLZ Table 2-99  1.5 V LVCMOS Low Slew – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.4 V Applicable to Advanced I/O Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-100  1.5 V LVCMOS High Slew – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.4 V Applicable to Advanced I/O Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.

IGLOO DC and Switching Characteristics 2-56 Advance v0.5 Table 2-101  1.5 V LVCMOS Low Slew – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.4 V Applicable to Standard Plus Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-102  1.5 V LVCMOS High Slew – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.4 V Applicable to Standard Plus Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-103  1.5 V LVCMOS Low Slew – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.4 V Applicable to Standard Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-104  1.5 V LVCMOS High Slew – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.4 V Applicable to Standard Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.

IGLOO DC and Switching Characteristics Advance v0.5 2-57 Table 2-105  1.5 V LCMOS Low Slew – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 1.4 V Applicable to Advanced I/O Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values. Table 2-106  1.5 V LCMOS High Slew – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 1.4 V Applicable to Advanced I/O Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values. Table 2-107  1.5 V LCMOS Low Slew – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 1.4 V Applicable to Standard Plus Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values. Table 2-108  1.5 V LCMOS High Slew – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 1.4 V Applicable to Standard Plus Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values.

IGLOO DC and Switching Characteristics 2-58 Advance v0.5 Table 2-109  1.5 V LCMOS Low Slew – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 1.4 V Applicable to Standard Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values. Table 2-110  1.5 V LCMOS High Slew – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 1.4 V Applicable to Standard Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values.

IGLOO DC and Switching Characteristics Advance v0.5 2-59

1.2 V LVCMOS (JESD8-12A)

Low-Voltage CMOS for 1.2 V comp lies with the LVCMOS standard JESD8-12A for general purpose 1.2 V applications. It uses a 1.2 V input buffer and a push-pull output buffer. Table 2-111  Minimum and Maximum DC Input and Output Levels Applicable to Advanced I/O Banks 1.2 V LVCMOS V IL VIH VOL VOH IOL IOH IOSH

1 IOSL

1 IIL

2 IIH

Notes: 1. Currents are measured at 100°C junc tion temperature and maximum voltage. 2. Currents are measured at 85°C junction temperature. 3. Software default selection highlighted in gray. Table 2-112  Minimum and Maximum DC Input and Output Levels Applicable to Standard Plus I/O Banks 1.2 V LVCMOS V IL VIH VOL VOH IOL IOH IOSH Notes: 1. Currents are measured at 100°C junc tion temperature and maximum voltage. 2. Currents are measured at 85°C junction temperature. 3. Software default selection highlighted in gray. Table 2-113  Minimum and Maximum DC Input and Output Levels Applicable to Standard I/O Banks 1.2 V LVCMOS V IL VIH VOL VOH IOL IOH IOSH Notes: 1. Currents are measured at 100°C junc tion temperature and maximum voltage. 2. Currents are measured at 85°C junction temperature. 3. Software default selection highlighted in gray. Figure 2-11  AC Loading Test Point Test Point Enable PathDatapath 5 pF R = 1 k R to VCCI for tLZ/tZL/tZLS R to GND for tHZ/tZH/tZHS 35 pF for tZH/tZHS/tZL/tZLS 5 pF for tHZ/tLZ

IGLOO DC and Switching Characteristics 2-60 Advance v0.5 Timing Characteristics Table 2-114  AC Waveforms, Measuring Points, and Capacitive Loads Input LOW (V) Input HIGH (V) Measuring Point* (V) C LOAD (pF) 01 . 2 0 . 6 5 * Measuring point = V trip. See Table 2-28 on page 2-25 for a complete table of trip points. Table 2-115  1.2 V LVCMOS Low Slew Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.4 V Applicable to Advanced I/O Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-116  1.2 V LVCMOS High Slew Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 1.14 V Applicable to Advanced I/O Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-117  1.2 V LVCMOS High Slew Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 1.14 V Applicable to Standard Plus I/O Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-118  1.2 V LVCMOS High Slew Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 1.14 V Applicable to Standard Plus I/O Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-119  1.2 V LVCMOS High Slew Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 1.14 V Applicable to Standard Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values.

IGLOO DC and Switching Characteristics Advance v0.5 2-61 Table 2-120  1.2 V LCMOS High Slew – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 1.14 V Applicable to Standard Banks Drive Strength Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units Notes: 1. Software default select ion highlighted in gray. 2. For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values.

IGLOO DC and Switching Characteristics 2-62 Advance v0.5 3.3 V PCI, 3.3 V PCI-X Peripheral Component Interface for 3.3 V standard specifies support for 33 MHz and 66 MHz PCI Bus applications. AC loadings are defined per the PCI/PCI-X specifications for the datapath; Actel loadings for enable path characterization are described in Figure 2-12. AC loadings are defi ned per PCI/PCI-X specifications for the datapath; Actel loading for tristate is described in Table 2-122. Table 2-121  Minimum and Maximum DC Input and Output Levels Applicable to Advanced and Standard Plus I/Os

3.3 V PCI/PCI-X V IL VIH VOL VOH IOL IOH IOSH IOSL IIL IIH

Drive Strength Min, V Max, V Min, V Max, V Max, V Min, V mA mA Max, mA 1 Max, mA1 µA2 µA2 Per PCI specification Per PCI curves 10 10 Notes: 1. Currents are measured at 100°C junc tion temperature and maximum voltage. 2. Currents are measured at 85°C junction temperature. Figure 2-12  AC Loading Test Point Enable Path R to V for t /t /tCCI LZ ZL ZLS 10 pF for t /t /t /tZH ZHS ZLSZL 5 pF for tHZ /tLZ R to GND for t /t /tHZ ZH ZH S R = 1 k Test Point Datapath R = 25 R to VCCI for tDP (F) R to GND for tDP (R) Table 2-122  AC Waveforms, Measuring Points, and Capacitive Loads Input LOW (V) Input HIGH (V) Measuring Point* (V) C LOAD (pF) 0 3.3 0.285 * V CCI for tDP(R) 0.615 * VCCI for tDP(F) * Measuring point = Vtrip. See Table 2-28 on page 2-25 for a complete table of trip points.

IGLOO DC and Switching Characteristics Advance v0.5 2-63 Timing Characteristics Table 2-123  3.3 V PCI/PCI-X Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V Applicable to Advanced I/O Banks Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-124  3.3 V PCI/PCI-X Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V Applicable to Standard Plus I/O Banks Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-125  3.3 V PCI/PCI-X Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 3.0 V Applicable to Advanced I/O Banks Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values. Table 2-126  3.3 V PCI/PCI-X Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 3.0 V Applicable to Standard Plus I/O Banks Speed Grade t DOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values.

IGLOO DC and Switching Characteristics Advance v0.5 2-65 Timing Characteristics Table 2-127  Minimum and Maximum DC Input and Output Levels DC Parameter Description Min. Typ. Max. Units VCCI Supply Voltage 2.375 2.5 2.625 V VOL Output LOW Voltage 0.9 1.075 1.25 V VOH Output HIGH Voltage 1.25 1.425 1.6 V IOL 4 Output Lower Current 0.65 0.91 1.16 mA IOH 4 Output HIGH Current 0.65 0.91 1.16 mA VI Input Voltage 0 2.925 V IIH

3 Input HIGH Leakage Current 10 µA

3 Input LOW Leakage Current 10 µA

VODIFF Differential Output Voltage 250 350 450 mV VOCM Output Common-Mode Voltage 1.125 1.25 1.375 V VICM Input Common-Mode Voltage 0.05 1.25 2.35 V VIDIFF Input Differential Voltage 100 350 mV Notes: 1. ± 5% 2. Differential input voltage = ±350 mV. 3. Currents are measured at 85°C junction temperature. 4. I OL/IOH is defined by VODIFF/(resistor network). Table 2-128  AC Waveforms, Measuring Points, and Capacitive Loads Input LOW (V) Input HIGH (V) Measuring Point* (V) 1.075 1.325 Cross point * Measuring point = V trip. See Table 2-28 on page 2-25 for a complete table of trip points. Table 2-129  LVDS – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V Applicable to Standard Banks Speed Grade t DOUT tDP tDIN tPY Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 and Table 2-7 on page 2-7 for derating values. Table 2-130  LVDS – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 2.3 V Applicable to Standard Banks Speed Grade t DOUT tDP tDIN tPY Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 and Table 2-7 on page 2-7 for derating values.

IGLOO DC and Switching Characteristics 2-66 Advance v0.5 B-LVDS/M-LVDS Bus LVDS (B-LVDS) and Multipoint LVDS (M-LVDS) specifications extend the existing LVDS standard to high-performance mult ipoint bus applications. Multidrop and multipoint bus configurations may contain any combination of drivers, receivers, and transceivers. Actel LVDS drivers provide the higher drive current required by B-LVDS and M- LVDS to accommodate th e loading. The drivers require series terminations for better signal qua lity and to control voltage swing. Termination is also required at both ends of the bus since the driver can be located anywhere on the bus. These configurations can be implemented using the TRIBUF_LVDS and BIBUF_LVDS macros along with appropriate terminations. Multipoint designs usin g Actel LVDS macros can achieve up to 200 MHz with a maximum of 20 loads. A sa mple application is given in Figure 2-14. The input and output buffer delays are availabl e in the LVDS section in Table 2-129 on page 2-65 and Table 2-130 on page 2-65. Example: For a bus consisting of 20 equidistant loads, the following te rminations provide the required differential voltage, in worst-case Industrial operating conditions, at the farthest receiver: RS =6 0 Ω and RT =7 0 Ω, given Z0 =5 0 Ω (2") and Zstub =5 0 Ω (~1.5"). LVPECL Low-Voltage Positive Emitter-Coupled Logic (LVPECL) is another differential I/O standard. It requires that one data bit be carried through two signal lines. Like LVDS, two pins are needed. It also requires external resistor termination. The full implementation of the LVDS transmitt er and receiver is shown in an example in Figure 2-15. The building blocks of the LVPECL transmitter-receiver are one transmitter macro, one receiver macro, three board resistors at the transm itter end, and one resistor at the receiver end. The values for the three driver resistors are diff erent from those used in the LVDS implementation because the output standard specifications are different. Figure 2-14  B-LVDS/M-LVDS Multipoint Application Using LVDS I/O Buffers ... RT RT BIBUF_LVDS R + - T + - R + - T + - D + - EN EN EN EN EN Receiver Transceiver Receiver Transceiver Driver RS RS RS RS RS RS RS RSRS RS Zstub Zstub Zstub Zstub Zstub Zstub Zstub Zstub Figure 2-15  LVPECL Circuit Diagram and Board-Level Implementation

187 W 100 Ω

Z0 = 50 Ω Z0 = 50 Ω 100 Ω 100 Ω P N P N INBUF_LVPECL OUTBUF_LVPECL FPGA FPGA Bourns Part Number: CAT16-PC4F12

IGLOO DC and Switching Characteristics Advance v0.5 2-67 Timing Characteristics Table 2-131  Minimum and Maximum DC Input and Output Levels VCCI Supply Voltage 3.0 3.3 3.6 V VIL, VIH Input LOW, Input HIGH Voltages 0 3.3 0 3.6 0 3.9 V VIDIFF Input Differential Voltage 300 300 300 mV Table 2-132  AC Waveforms, Measuring Points, and Capacitive Loads Input LOW (V) Input HIGH (V) Measuring Point* (V) 1.64 1.94 Cross point * Measuring point = Vtrip. See Table 2-28 on page 2-87 for a complete table of trip points. Table 2-133  LVPECL – Applies to 1.5 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V Applicable to Standard Banks Speed Grade t DOUT tDP tDIN tPY Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-134  LVPECL – Applies to 1.2 V DC Core Voltage Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 3.0 V Applicable to Standard Banks Speed Grade t DOUT tDP tDIN tPY Units Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values.

IGLOO DC and Switching Characteristics 2-68 Advance v0.5 I/O Register Specifications Fully Registered I/O Buffers with Synchronous Enable and Asynchronous Preset Figure 2-16  Timing Model of Registered I/O Buffers with Synchronous Enable and Asynchronous Preset INBUF INBUF INBUF TRIBUF CLKBUF INBUFINBUFCLKBUF Data Input I/O Register with: Active High Enable Active High Preset Positive-Edge Triggered Data Output Register and Enable Output Register with: Active High Enable Active High Preset Postive-Edge Triggered Pad Out CLK Enable Preset Data_out Data EOUT DOUT Enable CLK DQ DFN1E1P1 PRE DQ DFN1E1P1 PRE DQ DFN1E1P1 PRE D_Enable A B C D E E E E F G H I J L K Y Core Array

IGLOO DC and Switching Characteristics Advance v0.5 2-69 Table 2-135  Parameter Definition and Measuring Nodes Parameter Name Parameter Definition Measuring Nodes (from, to)* tOCLKQ Clock-to-Q of the Output Data Register H, DOUT tOSUD Data Setup Time for the Output Data Register F, H tOHD Data Hold Time for the Output Data Register F , H tOSUE Enable Setup Time for the Output Data Register G, H tOHE Enable Hold Time for the Output Data Register G, H tOPRE2Q Asynchronous Preset-to-Q of the Output Data Register L, DOUT tOREMPRE Asynchronous Preset Removal Time for the Output Data Register L, H tORECPRE Asynchronous Preset Recovery Time for the Output Data Register L, H tOECLKQ Clock-to-Q of the Output Enable Register H, EOUT tOESUD Data Setup Time for the Output Enable Register J, H tOEHD Data Hold Time for the Output Enable Register J, H tOESUE Enable Setup Time for the Output Enable Register K, H tOEHE Enable Hold Time for the Output Enable Register K, H tOEPRE2Q Asynchronous Preset-to-Q of the Output Enable Register I, EOUT tOEREMPRE Asynchronous Preset Removal Time for the Output Enable Register I, H tOERECPRE Asynchronous Preset Recovery Time for the Output Enable Register I, H tICLKQ Clock-to-Q of the Input Data Register A, E tISUD Data Setup Time for the Input Data Register C, A tIHD Data Hold Time for the Input Data Register C, A tISUE Enable Setup Time for the Input Data Register B, A tIHE Enable Hold Time for the Input Data Register B, A tIPRE2Q Asynchronous Preset-to-Q of the Input Data Register D, E tIREMPRE Asynchronous Preset Removal Time for the Input Data Register D, A tIRECPRE Asynchronous Preset Recovery Time for the Input Data Register D, A * See Figure 2-16 on page 2-68 for more information.

IGLOO DC and Switching Characteristics 2-70 Advance v0.5 Fully Registered I/O Buffers with Synchronous Enable and Asynchronous Clear Figure 2-17  Timing Model of the Registered I/O Buffers with Synchronous Enable and Asynchronous Clear Enab le CLK Pad Out CLK Enable CLR Data_out Data Y AA EOUT DOUT Core ArrayDQ DFN1E1C1 E CLR DQ DFN1E1C1 E CLR DQ DFN1E1C1 E CLR D_Enable BB CC DD EE FF GG LL HH JJ KK CLKBUF INBUF INBUF TRIB UF INBUF INBUF CLKBUF INBUF Data Input I/O Register with Active High Enable Active High Clear Positive-Edge Triggered Data Output Register and Enable Output Register with Active High Enable Active High Clear Positive-Edge Triggered

IGLOO DC and Switching Characteristics Advance v0.5 2-71 Table 2-136  Parameter Definition and Measuring Nodes Parameter Name Parameter Definition Measuring Nodes (from, to)* tOCLKQ Clock-to-Q of the Output Data Register HH, DOUT tOSUD Data Setup Time for the Output Data Register FF, HH tOHD Data Hold Time for the Output Data Register FF, HH tOSUE Enable Setup Time for the Output Data Register GG, HH tOHE Enable Hold Time for the Output Data Register GG, HH tOCLR2Q Asynchronous Clear-to-Q of the Output Data Register LL, DOUT tOREMCLR Asynchronous Clear Removal Time for the Output Data Register LL, HH tORECCLR Asynchronous Clear Recovery Time for the Output Data Register LL, HH tOECLKQ Clock-to-Q of the Output Enable Register HH, EOUT tOESUD Data Setup Time for the Output Enable Register JJ, HH tOEHD Data Hold Time for the Output Enable Register JJ, HH tOESUE Enable Setup Time for the Output Enable Register KK, HH tOEHE Enable Hold Time for the Output Enable Register KK, HH tOECLR2Q Asynchronous Clear-to-Q of the Output Enable Register II, EOUT tOEREMCLR Asynchronous Clear Removal Time for the Output Enable Register II, HH tOERECCLR Asynchronous Clear Recovery Time for the Output Enable Register II, HH tICLKQ Clock-to-Q of the Input Data Register AA, EE tISUD Data Setup Time for the Input Data Register CC, AA tIHD Data Hold Time for the Input Data Register CC, AA tISUE Enable Setup Time for the Input Data Register BB, AA tIHE Enable Hold Time for the Input Data Register BB, AA tICLR2Q Asynchronous Clear-to-Q of the Input Data Register DD, EE tIREMCLR Asynchronous Clear Removal Time for the Input Data Register DD, AA tIRECCLR Asynchronous Clear Recovery Time for the Input Data Register DD, AA * See Figure 2-17 on page 2-70 for more information.

IGLOO DC and Switching Characteristics 2-72 Advance v0.5 Input Register Timing Characteristics Figure 2-18  Input Register Timing Diagram 50% Preset Clear Out_1 CLK Data Enable tISUE 50% 50% tISUD tIHD 50% 50% tICLKQ 1 0 tIHE tIRECPRE tIREMPRE tIRECCLR tIREMCLRtIWCLR tIWPRE tIPRE2Q tICLR2Q tICKMPWH tICKMPWL 50% 50% 50% 50% 50% 50% 50% 50% Table 2-137  Input Data Register Propagation Delays Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V Parameter Description Std. Units tICLKQ Clock-to-Q of the Input Data Register 0.42 ns tISUD Data Setup Time for the Input Data Register 0.47 ns tIHD Data Hold Time for the Input Data Register 0.00 ns tISUE Enable Setup Time for the Input Data Register 0.67 ns tIHE Enable Hold Time for the Input Data Register 0.00 ns tICLR2Q Asynchronous Clear-to-Q of the Input Data Register 0.79 ns tIPRE2Q Asynchronous Preset-to-Q of the Input Data Register 0.79 ns tIREMCLR Asynchronous Clear Removal Time for the Input Data Register 0.00 ns tIRECCLR Asynchronous Clear Recovery Time for the Input Data Register 0.24 ns tIREMPRE Asynchronous Preset Removal Time for the Input Data Register 0.00 ns tIRECPRE Asynchronous Preset Recovery Time for the Input Data Register 0.24 ns tIWCLR Asynchronous Clear Minimum Pulse Width for the Input Data Register 0.19 ns tIWPRE Asynchronous Preset Minimum Pulse Width for the Input Data Register 0.19 ns tICKMPWH Clock Minimum Pulse Width HIGH for the Input Data Register 0.31 ns tICKMPWL Clock Minimum Pulse Width LOW for the Input Data Register 0.28 ns Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.

IGLOO DC and Switching Characteristics Advance v0.5 2-73 Table 2-138  Input Data Register Propagation Delays Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V Parameter Description Std. Units tICLKQ Clock-to-Q of the Input Data Register 0.68 ns tISUD Data Setup Time for the Input Data Register 0.97 ns tIHD Data Hold Time for the Input Data Register 0.00 ns tISUE Enable Setup Time for the Input Data Register 1.02 ns tIHE Enable Hold Time for the Input Data Register 0.00 ns tICLR2Q Asynchronous Clear-to-Q of the Input Data Register 1.19 ns tIPRE2Q Asynchronous Preset-to-Q of the Input Data Register 1.19 ns tIREMCLR Asynchronous Clear Removal Time for the Input Data Register 0.00 ns tIRECCLR Asynchronous Clear Recovery Time for the Input Data Register 0.24 ns tIREMPRE Asynchronous Preset Removal Time for the Input Data Register 0.00 ns tIRECPRE Asynchronous Preset Recovery Time for the Input Data Register 0.24 ns tIWCLR Asynchronous Clear Minimum Pulse Width for the Input Data Register 0.19 ns tIWPRE Asynchronous Preset Minimum Pulse Width for the Input Data Register 0.19 ns tICKMPWH Clock Minimum Pulse Width HIGH for the Input Data Register 0.31 ns tICKMPWL Clock Minimum Pulse Width LOW for the Input Data Register 0.28 ns Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values. Figure 2-19  Output Register Timing Diagram Preset Clear DOUT CLK Data_out Enable tOSUE 50% 50% tOSUD tOHD 50% 50% tOCLKQ 1 0 tOHE tORECPRE tOREMPRE tORECCLR tOREMCLRtOWCLR tOWPRE tOPRE2Q tOCLR2Q tOCKMPWH tOCKMPWL 50% 50% 50% 50% 50% 50% 50% 50% 50%

IGLOO DC and Switching Characteristics 2-74 Advance v0.5 Timing Characteristics Table 2-139  Output Data Register Propagation Delays Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V Parameter Description Std. Units tOCLKQ Clock-to-Q of the Output Data Register 1.00 ns tOSUD Data Setup Time for the Output Data Register 0.51 ns tOHD Data Hold Time for the Output Data Register 0.00 ns tOSUE Enable Setup Time for the Output Data Register 0.70 ns tOHE Enable Hold Time for the Output Data Register 0.00 ns tOCLR2Q Asynchronous Clear-to-Q of the Output Data Register 1.34 ns tOPRE2Q Asynchronous Preset-to-Q of the Output Data Register 1.34 ns tOREMCLR Asynchronous Clear Removal Time for the Output Data Register 0.00 ns tORECCLR Asynchronous Clear Recovery Time for the Output Data Register 0.24 ns tOREMPRE Asynchronous Preset Removal Time for the Output Data Register 0.00 ns tORECPRE Asynchronous Preset Recovery Time for the Output Data Register 0.24 ns tOWCLR Asynchronous Clear Minimum Pulse Width for the Output Data Register 0.19 ns tOWPRE Asynchronous Preset Minimum Pulse Width for the Output Data Register 0.19 ns tOCKMPWH Clock Minimum Pulse Width HIGH for the Output Data Register 0.31 ns tOCKMPWL Clock Minimum Pulse Width LOW for the Output Data Register 0.28 ns Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-140  Output Data Register Propagation Delays Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V Parameter Description Std. Units tOCLKQ Clock-to-Q of the Output Data Register 1.52 ns tOSUD Data Setup Time for the Output Data Register 1.15 ns tOHD Data Hold Time for the Output Data Register 0.00 ns tOSUE Enable Setup Time for the Output Data Register 1.11 ns tOHE Enable Hold Time for the Output Data Register 0.00 ns tOCLR2Q Asynchronous Clear-to-Q of the Output Data Register 1.96 ns tOPRE2Q Asynchronous Preset-to-Q of the Output Data Register 1.96 ns tOREMCLR Asynchronous Clear Removal Time for the Output Data Register 0.00 ns tORECCLR Asynchronous Clear Recovery Time for the Output Data Register 0.24 ns tOREMPRE Asynchronous Preset Removal Time for the Output Data Register 0.00 ns tORECPRE Asynchronous Preset Recovery Time for the Output Data Register 0.24 ns tOWCLR Asynchronous Clear Minimum Pulse Width for the Output Data Register 0.19 ns tOWPRE Asynchronous Preset Minimum Pulse Width for the Output Data Register 0.19 ns tOCKMPWH Clock Minimum Pulse Width HIGH for the Output Data Register 0.31 ns tOCKMPWL Clock Minimum Pulse Width LOW for the Output Data Register 0.28 ns Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values.

IGLOO DC and Switching Characteristics Advance v0.5 2-75 Output Enable Register Timing Characteristics Figure 2-20  Output Enable Register Timing Diagram 50% Preset Clear EOUT CLK D_Enable Enable tOESUE 50% 50% tOESUD tOEHD 50% 50% tOECLKQ 1 0 tOEHE tOERECPRE tOEREMPRE tOERECCLR tOEREMCLRtOEWCLR tOEWPRE tOEPRE2Q tOECLR2Q tOECKMPWH tOECKMPWL 50% 50% 50% 50% 50% 50% 50% 50% Table 2-141  Output Enable Register Propagation Delays Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V Parameter Description Std. Units tOECLKQ Clock-to-Q of the Output Enable Register 0.75 ns tOESUD Data Setup Time for the Output Enable Register 0.51 ns tOEHD Data Hold Time for the Output Enable Register 0.00 ns tOESUE Enable Setup Time for the Output Enable Register 0.73 ns tOEHE Enable Hold Time for the Output Enable Register 0.00 ns tOECLR2Q Asynchronous Clear-to-Q of the Output Enable Register 1.13 ns tOEPRE2Q Asynchronous Preset-to-Q of the Output Enable Register 1.13 ns tOEREMCLR Asynchronous Clear Removal Time for the Output Enable Register 0.00 ns tOERECCLR Asynchronous Clear Recovery Time for the Output Enable Register 0.24 ns tOEREMPRE Asynchronous Preset Removal Time for the Output Enable Register 0.00 ns tOERECPRE Asynchronous Preset Recovery Time for the Output Enable Register 0.24 ns tOEWCLR Asynchronous Clear Minimum Pulse Width for the Output Enable Register 0.19 ns tOEWPRE Asynchronous Preset Minimum Pulse Width for the Output Enable Register 0.19 ns tOECKMPWH Clock Minimum Pulse Width HIGH for the Output Enable Register 0.31 ns tOECKMPWL Clock Minimum Pulse Width LOW for the Output Enable Register 0.28 ns Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.

IGLOO DC and Switching Characteristics 2-76 Advance v0.5 Table 2-142  Output Enable Register Propagation Delays Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V Parameter Description Std. Units tOECLKQ Clock-to-Q of the Output Enable Register 1.10 ns tOESUD Data Setup Time for the Output Enable Register 1.15 ns tOEHD Data Hold Time for the Output Enable Register 0.00 ns tOESUE Enable Setup Time for the Output Enable Register 1.22 ns tOEHE Enable Hold Time for the Output Enable Register 0.00 ns tOECLR2Q Asynchronous Clear-to-Q of the Output Enable Register 1.65 ns tOEPRE2Q Asynchronous Preset-to-Q of the Output Enable Register 1.65 ns tOEREMCLR Asynchronous Clear Removal Time for the Output Enable Register 0.00 ns tOERECCLR Asynchronous Clear Recovery Time for the Output Enable Register 0.24 ns tOEREMPRE Asynchronous Preset Removal Time for the Output Enable Register 0.00 ns tOERECPRE Asynchronous Preset Recovery Time for the Output Enable Register 0.24 ns tOEWCLR Asynchronous Clear Minimum Pulse Width for the Output Enable Register 0.19 ns tOEWPRE Asynchronous Preset Minimum Pulse Width for the Output Enable Register 0.19 ns tOECKMPWH Clock Minimum Pulse Width HIGH for the Output Enable Register 0.31 ns tOECKMPWL Clock Minimum Pulse Width LOW for the Output Enable Register 0.28 ns Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values.

IGLOO DC and Switching Characteristics Advance v0.5 2-77 DDR Module Specifications Input DDR Module Figure 2-21  Input DDR Timing Model Table 2-143  Parameter Definitions Parameter Name Parameter Definiti on Measuring Nodes (from, to) tDDRICLKQ1 Clock-to-Out Out_QR B, D tDDRICLKQ2 Clock-to-Out Out_QF B, E tDDRISUD Data Setup Time of DDR input A, B tDDRIHD Data Hold Time of DDR input A, B tDDRICLR2Q1 Clear-to-Out Out_QR C, D tDDRICLR2Q2 Clear-to-Out Out_QF C, E tDDRIREMCLR Clear Removal C, B tDDRIRECCLR Clear Recovery C, B Input DDR Data CLK CLKBUF INBUF Out_QF (to core) FF2 FF1 INBUF CLR DDR_IN E A B C D Out_QR (to core)

IGLOO DC and Switching Characteristics 2-78 Advance v0.5 Timing Characteristics Figure 2-22  Input DDR Timing Diagram tDDRICLR2Q2 tDDRIREMCLR tDDRIRECCLR tDDRICLR2Q1 12 3 4 5 6 7 8 9 CLK Data CLR Out_QR Out_QF tDDRICLKQ1 2 4 6 3 5 7 tDDRIHDtDDRISUD tDDRICLKQ2 Table 2-144  Input DDR Propagation Delays Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.25 V Parameter Description Std. Units tDDRICLKQ1 Clock-to-Out Out_QR for Input DDR 0.48 ns tDDRICLKQ2 Clock-to-Out Out_QF for Input DDR 0.65 ns tDDRISUD1 Data Setup for Input DDR (negedge) 0.50 ns tDDRISUD2 Data Setup for Input DDR (posedge) 0.40 ns tDDRIHD1 Data Hold for Input DDR (negedge) 0.00 ns tDDRIHD2 Data Hold for Input DDR (posedge) 0.00 ns tDDRICLR2Q1 Asynchronous Clear-to-Out Out_QR for Input DDR 0.82 ns tDDRICLR2Q2 Asynchronous Clear-to-Out Out_QF for Input DDR 0.98 ns tDDRIREMCLR Asynchronous Clear Removal Time for Input DDR 0.00 ns tDDRIRECCLR Asynchronous Clear Recovery Time for Input DDR 0.23 ns tDDRIWCLR Asynchronous Clear Minimum Pulse Width for Input DDR 0.19 ns tDDRICKMPWH Clock Minimum Pulse Width HIGH for Input DDR 0.31 ns tDDRICKMPWL Clock Minimum Pulse Width LOW for Input DDR 0.28 ns FDDRIMAX Maximum Frequency for Input DDR TBD MHz Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values.

IGLOO DC and Switching Characteristics Advance v0.5 2-79 Table 2-145  Input DDR Propagation Delays Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V Parameter Description Std. Units tDDRICLKQ1 Clock-to-Out Out_QR for Input DDR 0.76 ns tDDRICLKQ2 Clock-to-Out Out_QF for Input DDR 0.94 ns tDDRISUD1 Data Setup for Input DDR (negedge) 0.93 ns tDDRISUD2 Data Setup for Input DDR (posedge) 0.84 ns tDDRIHD1 Data Hold for Input DDR (negedge) 0.00 ns tDDRIHD2 Data Hold for Input DDR (posedge) 0.00 ns tDDRICLR2Q1 Asynchronous Clear-to-Out Out_QR for Input DDR 1.23 ns tDDRICLR2Q2 Asynchronous Clear-to-Out Out_QF for Input DDR 1.42 ns tDDRIREMCLR Asynchronous Clear Removal Time for Input DDR 0.00 ns tDDRIRECCLR Asynchronous Clear Recovery Time for Input DDR 0.24 ns tDDRIWCLR Asynchronous Clear Minimum Pulse Width for Input DDR 0.19 ns tDDRICKMPWH Clock Minimum Pulse Width HIGH for Input DDR 0.31 ns tDDRICKMPWL Clock Minimum Pulse Width LOW for Input DDR 0.28 ns FDDRIMAX Maximum Frequency for Input DDR TBD MHz Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values.

IGLOO DC and Switching Characteristics 2-80 Advance v0.5 Output DDR Module Figure 2-23  Output DDR Timing Model Table 2-146  Parameter Definitions Parameter Name Parameter Definition Measuring Nodes (from, to) tDDROCLKQ Clock-to-Out B, E tDDROCLR2Q Asynchronous Clear-to-Out C, E tDDROREMCLR Clear Removal C, B tDDRORECCLR Clear Recovery C, B tDDROSUD1 Data Setup Data_F A, B tDDROSUD2 Data Setup Data_R D, B tDDROHD1 Data Hold Data_F A, B tDDROHD2 Data Hold Data_R D, B Data_F (from core) CLK CLKBUF Out FF2 INBUF CLR DDR_OUT Output DDR FF1 XX X X X X X X A B D EC C B OUTBUFData_R (from core)

IGLOO DC and Switching Characteristics Advance v0.5 2-81 Timing Characteristics Figure 2-24  Output DDR Timing Diagram 116 91 0 28 3 9 tDDROREMCLR tDDROHD1tDDROREMCLR tDDROHD2tDDROSUD2 tDDROCLKQ tDDRORECCLR CLK Data_R Data_F CLR Out tDDROCLR2Q 71 0 4 Table 2-147  Output DDR Propagation Delays Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC =1 . 1 4V Parameter Description Std. Units tDDROCLKQ Clock-to-Out of DDR for Output DDR 1.07 ns tDDROSUD1 Data_F Data Setup for Output DDR 0.67 ns tDDROSUD2 Data_R Data Setup for Output DDR 0.67 ns tDDROHD1 Data_F Data Hold for Output DDR 0.00 ns tDDROHD2 Data_R Data Hold for Output DDR 0.00 ns tDDROCLR2Q Asynchronous Clear-to-Out for Output DDR 1.38 ns tDDROREMCLR Asynchronous Clear Removal Time for Output DDR 0.00 ns tDDRORECCLR Asynchronous Clear Recovery Time for Output DDR 0.23 ns tDDROWCLR1 Asynchronous Clear Minimum Pulse Width for Output DDR 0.19 ns tDDROCKMPWH Clock Minimum Pulse Width HIGH for the Output DDR 0.31 ns tDDROCKMPWL Clock Minimum Pulse Width LOW for the Output DDR 0.28 ns FDDOMAX Maximum Frequency for the Output DDR TBD MHz Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.

IGLOO DC and Switching Characteristics 2-82 Advance v0.5 Table 2-148  Output DDR Propagation Delays Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC =1 . 1 4V Parameter Description Std. Units tDDROCLKQ Clock-to-Out of DDR for Output DDR 1.60 ns tDDROSUD1 Data_F Data Setup for Output DDR 1.09 ns tDDROSUD2 Data_R Data Setup for Output DDR 1.16 ns tDDROHD1 Data_F Data Hold for Output DDR 0.00 ns tDDROHD2 Data_R Data Hold for Output DDR 0.00 ns tDDROCLR2Q Asynchronous Clear-to-Out for Output DDR 1.99 ns tDDROREMCLR Asynchronous Clear Removal Time for Output DDR 0.00 ns tDDRORECCLR Asynchronous Clear Recovery Time for Output DDR 0.24 ns tDDROWCLR1 Asynchronous Clear Minimum Pulse Width for Output DDR 0.19 ns tDDROCKMPWH Clock Minimum Pulse Width HIGH for the Output DDR 0.31 ns tDDROCKMPWL Clock Minimum Pulse Width LOW for the Output DDR 0.28 ns FDDOMAX Maximum Frequency for the Output DDR TBD MHz Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values.

IGLOO DC and Switching Characteristics Advance v0.5 2-83 VersaTile Characteristics VersaTile Specifications as a Combinatorial Module The IGLOO library offers all combinations of LUT-3 combinatorial functions. In this section, timing characteristics are presented for a sample of the library. For more details, refer to the IGLOO, Fusion, and ProASIC3 Macro Library Guide. Figure 2-25  Sample of Combinatorial Cells MAJ3 A C BY MUX2 B A S Y AY B B A XOR2 Y NOR2 B A Y B A YOR2 INV A YAND2 B A Y NAND3B A C XOR3 YB A C NAND2

IGLOO DC and Switching Characteristics 2-84 Advance v0.5 Figure 2-26  Timing Model and Waveforms Net A Y B Length = 1 VersaTile Net A Y B Length = 1 VersaTile Net A Y B Length = 1 VersaTile Net A Y B Length = 1 VersaTile NAND2 or Any Combinatorial Logic NAND2 or Any Combinatorial Logic NAND2 or Any Combinatorial Logic NAND2 or Any Combinatorial Logic tPD = MAX(tPD(RR), tPD(RF), tPD(FF), tPD(FR)) where edges are applicable for a particular combinatorial cell Fanout = 4 tPD tPD tPD 50% VCC VCC VCC 50% GNDA, B, C 50% 50% 50% (RR) (RF) GND OUT OUT GND 50% (FF) (FR) tPD tPD

IGLOO DC and Switching Characteristics Advance v0.5 2-85 Timing Characteristics Table 2-149  Combinatorial Cell Propagation Delays Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V Combinatorial Cell Equation Parameter Std. Units INV Y =!A t PD 0.80 ns AND2 Y = A · B t PD 0.84 ns NAND2 Y = !(A · B) t PD 0.90 ns OR2 Y = A + B t PD 1.19 ns NOR2 Y = !(A + B) t PD 1.10 ns XOR2 Y = A ⊕ Bt PD 1.37 ns MAJ3 Y = MAJ(A , B, C) t PD 1.33 ns XOR3 Y = A ⊕ B ⊕ Ct PD 1.79 ns MUX2 Y = A !S + B S t PD 1.48 ns AND3 Y = A · B · C t PD 1.21 ns Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-150  Combinatorial Cell Propagation Delays Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V Combinatorial Cell Equation Parameter Std. Units INV Y = !A t PD 1.34 ns AND2 Y = A · B t PD 1.43 ns NAND2 Y = !(A · B) t PD 1.59 ns OR2 Y = A + B t PD 2.30 ns NOR2 Y = !(A + B) t PD 2.07 ns XOR2 Y = A ⊕ Bt PD 2.46 ns MAJ3 Y = MAJ(A , B, C) t PD 2.46 ns XOR3 Y = A ⊕ B ⊕ Ct PD 3.12 ns MUX2 Y = A !S + B S t PD 2.83 ns AND3 Y = A · B · C t PD 2.28 ns Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values.

IGLOO DC and Switching Characteristics 2-86 Advance v0.5 VersaTile Specifications as a Sequential Module The IGLOO library offers a wide variety of sequential cells, including flip-flops and latches. Each has a data input and optional enable, clear, or preset. In this section, timing characteristics are presented for a representative sample from the library. For more details, refer to the IGLOO, Fusion, and ProASIC3 Macro Library Guide. Figure 2-27  Sample of Sequential Cells DQ DFN1 Data CLK Out D Q DFN1C1 Data CLK Out CLR DQ DFI1E1P1 Data CLK Out En PRE D Q DFN1E1 Data CLK Out En

IGLOO DC and Switching Characteristics Advance v0.5 2-87 Timing Characteristics Figure 2-28  Timing Model and Waveforms PRE CLR Out CLK Data EN tSUE 50% 50% tSUD tHD 50% 50% tCLKQ tHE tRECPRE tREMPRE tRECCLR tREMCLRtWCLR tWPRE tPRE2Q tCLR2Q tCKMPWH tCKMPWL 50% 50% 50% 50% 50% 50% 50% 50% 50% Table 2-151  Register Delays Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V Parameter Description Std. Units tCLKQ Clock-to-Q of the Core Register 0.89 ns tSUD Data Setup Time for the Core Register 0.81 ns tHD Data Hold Time for the Core Register 0.00 ns tSUE Enable Setup Time for the Core Register 0.73 ns tHE Enable Hold Time for the Core Register 0.00 ns tCLR2Q Asynchronous Clear-to-Q of the Core Register 0.60 ns tPRE2Q Asynchronous Preset-to-Q of the Core Register 0.62 ns tREMCLR Asynchronous Clear Removal Time for the Core Register 0.00 ns tRECCLR Asynchronous Clear Recovery Time for the Core Register 0.24 ns tREMPRE Asynchronous Preset Removal Time for the Core Register 0.00 ns tRECPRE Asynchronous Preset Recovery Time for the Core Register 0.23 ns tWCLR Asynchronous Clear Minimum Pulse Width for the Core Register 0.30 ns tWPRE Asynchronous Preset Minimum Pulse Width for the Core Register 0.30 ns tCKMPWH Clock Minimum Pulse Width HIGH for the Core Register 0.56 ns tCKMPWL Clock Minimum Pulse Width LOW for the Core Register 0.56 ns Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.

IGLOO DC and Switching Characteristics 2-88 Advance v0.5 Table 2-152  Register Delays Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V Parameter Description Std. Units tCLKQ Clock-to-Q of the Core Register 1.61 ns tSUD Data Setup Time for the Core Register 1.17 ns tHD Data Hold Time for the Core Register 0.00 ns tSUE Enable Setup Time for the Core Register 1.29 ns tHE Enable Hold Time for the Core Register 0.00 ns tCLR2Q Asynchronous Clear-to-Q of the Core Register 0.87 ns tPRE2Q Asynchronous Preset-to-Q of the Core Register 0.89 ns tREMCLR Asynchronous Clear Removal Time for the Core Register 0.00 ns tRECCLR Asynchronous Clear Recovery Time for the Core Register 0.24 ns tREMPRE Asynchronous Preset Removal Time for the Core Register 0.00 ns tRECPRE Asynchronous Preset Recovery Time for the Core Register 0.24 ns tWCLR Asynchronous Clear Minimum Pulse Width for the Core Register 0.46 ns tWPRE Asynchronous Preset Minimum Pulse Width for the Core Register 0.46 ns tCKMPWH Clock Minimum Pulse Width HIGH for the Core Register 0.95 ns tCKMPWL Clock Minimum Pulse Width LOW for the Core Register 0.95 ns Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values.

IGLOO DC and Switching Characteristics Advance v0.5 2-89 Global Resource Characteristics AGL250 Clock Tree Topology Clock delays are device-specific. Figure 2-29 is an example of a global tree used for clock routing. The global tree presented in Figure 2-29 is driven by a CCC located on the west side of the AGL250 device. It is used to drive all D-flip-flops in the device. Figure 2-29  Example of Global Tree Use in an AGL250 Device for Clock Routing Central Global Rib VersaTile Rows Global Spine CCC

IGLOO DC and Switching Characteristics 2-90 Advance v0.5 Global Tree Timing Characteristics Global clock delays include the central rib delay, the spine delay, and the row delay. Delays do not include I/O input buffer clock delays, as these are I/O standard–dependent, and the clock may be driven and conditioned internally by the CCC module. For more details on clock conditioning capabilities, refer to the "Clock Conditioning Circuits" section on page 2-98 . Table 2-153 to Table 2-168 on page 2-97 present minimum and maximum global clock delays within each device. Minimum and maximum delays are measured with minimum and maximum loading. Timing Characteristics Table 2-153  AGL015 Global Resource Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V Parameter Description Std. UnitsMin.1 Max.2 tRCKL Input LOW Delay for Global Clock 1.21 1.42 ns tRCKH Input HIGH Delay for Global Clock 1.23 1.49 ns tRCKMPWH Minimum Pulse Width HIGH for Global Clock ns tRCKMPWL Minimum Pulse Width LOW for Global Clock ns tRCKSW Maximum Skew for Global Clock 0.27 ns FRMAX Maximum Frequency for Global Clock MHz Notes: 1. Value reflects minimum load . The delay is measured from the CCC ou tput to the clock pin of a sequential element, located in a lightly loaded row (single element is connected to the global net). 2. Value reflects maximum load . The delay is measured on the clock pin of the farthest sequential element, located in a fully loaded row (all available flip-flops are connected to the global net in the row). 3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-154  AGL030 Global Resource Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V Parameter Description Std. UnitsMin.1 Max.2 tRCKL Input LOW Delay for Global Clock 1.21 1.42 ns tRCKH Input HIGH Delay for Global Clock 1.23 1.49 ns tRCKMPWH Minimum Pulse Width HIGH for Global Clock ns tRCKMPWL Minimum Pulse Width LOW for Global Clock ns tRCKSW Maximum Skew for Global Clock 0.27 ns FRMAX Maximum Frequency for Global Clock MHz Notes: 1. Value reflects minimum load . The delay is measured from the CCC ou tput to the clock pin of a sequential element, located in a lightly loaded row (single element is connected to the global net). 2. Value reflects maximum load . The delay is measured on the clock pin of the farthest sequential element, located in a fully loaded row (all available flip-flops are connected to the global net in the row). 3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.

IGLOO DC and Switching Characteristics Advance v0.5 2-91 Table 2-155  AGL060 Global Resource Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V Parameter Description Std. UnitsMin.1 Max.2 tRCKL Input LOW Delay for Global Clock 1.33 1.55 ns tRCKH Input HIGH Delay for Global Clock 1.35 1.62 ns tRCKMPWH Minimum Pulse Width HIGH for Global Clock ns tRCKMPWL Minimum Pulse Width LOW for Global Clock ns tRCKSW Maximum Skew for Global Clock 0.27 ns FRMAX Maximum Frequency for Global Clock MHz Notes: 1. Value reflects minimum load . The delay is measured from the CCC ou tput to the clock pin of a sequential element, located in a lightly loaded row (single element is connected to the global net). 2. Value reflects maximum load . The delay is measured on the clock pin of the farthest sequential element, located in a fully loaded row (all available flip-flops are connected to the global net in the row). 3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-156  AGL125 Global Resource Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V Parameter Description Std. UnitsMin.1 Max.2 tRCKL Input LOW Delay for Global Clock 1.36 1.71 ns tRCKH Input HIGH Delay for Global Clock 1.39 1.82 ns tRCKMPWH Minimum Pulse Width HIGH for Global Clock ns tRCKMPWL Minimum Pulse Width LOW for Global Clock ns tRCKSW Maximum Skew for Global Clock 0.43 ns FRMAX Maximum Frequency for Global Clock MHz Notes: 1. Value reflects minimum load . The delay is measured from the CCC ou tput to the clock pin of a sequential element, located in a lightly loaded row (single element is connected to the global net). 2. Value reflects maximum load . The delay is measured on the clock pin of the farthest sequential element, located in a fully loaded row (all available flip-flops are connected to the global net in the row). 3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.

IGLOO DC and Switching Characteristics 2-92 Advance v0.5 Table 2-157  AGL250 Global Resource Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V Parameter Description Std. UnitsMin.1 Max.2 tRCKL Input LOW Delay for Global Clock 1.39 1.73 ns tRCKH Input HIGH Delay for Global Clock 1.41 1.84 ns tRCKMPWH Minimum Pulse Width HIGH for Global Clock ns tRCKMPWL Minimum Pulse Width LOW for Global Clock ns tRCKSW Maximum Skew for Global Clock 0.43 ns FRMAX Maximum Frequency for Global Clock MHz Notes: 1. Value reflects minimum load . The delay is measured from the CCC ou tput to the clock pin of a sequential element, located in a lightly loaded row (single element is connected to the global net). 2. Value reflects maximum load . The delay is measured on the clock pin of the farthest sequential element, located in a fully loaded row (all available flip-flops are connected to the global net in the row). 3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-158  AGL400 Global Resource Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V Parameter Description Std. Units Min. 1 Max. 2 tRCKL Input Low Delay for Global Clock 1.45 1.79 ns tRCKH Input High Delay for Global Clock 1.48 1.91 ns tRCKMPWH Minimum Pulse Width High for Global Clock ns tRCKMPWL Minimum Pulse Width Low for Global Clock ns tRCKSW Maximum Skew for Global Clock 0.43 ns FRMAX Maximum Frequency for Global Clock MHz Notes: 1. Value reflects minimum lo ad. The delay is measured from the CCC output to the clock pin of a sequential element, located in a lightly loaded row (single element is connected to the global net). 2. Value reflects maximum load. The delay is measured on the clock pin of the fa rthest sequential element, located in a fully loaded row (all available flip-flops are connected to the global net in the row). 3. For specific junction temperature and voltage-supply levels, refer to Table 2-6 on page 2-6 for derating values.

IGLOO DC and Switching Characteristics Advance v0.5 2-93 Table 2-159  AGL600 Global Resource Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V Parameter Description Std. UnitsMin.1 Max.2 tRCKL Input LOW Delay for Global Clock 1.48 1.82 ns tRCKH Input HIGH Delay for Global Clock 1.52 1.94 ns tRCKMPWH Minimum Pulse Width HIGH for Global Clock ns tRCKMPWL Minimum Pulse Width LOW for Global Clock ns tRCKSW Maximum Skew for Global Clock 0.42 ns FRMAX Maximum Frequency for Global Clock MHz Notes: 1. Value reflects minimum load . The delay is measured from the CCC ou tput to the clock pin of a sequential element, located in a lightly loaded row (single element is connected to the global net). 2. Value reflects maximum load . The delay is measured on the clock pin of the farthest sequential element, located in a fully loaded row (all available flip-flops are connected to the global net in the row). 3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-160  AGL1000 Global Resource Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V Parameter Description Std. UnitsMin.1 Max.2 tRCKL Input LOW Delay for Global Clock 1.55 1.89 ns tRCKH Input HIGH Delay for Global Clock 1.60 2.02 ns tRCKMPWH Minimum Pulse Width HIGH for Global Clock ns tRCKMPWL Minimum Pulse Width LOW for Global Clock ns tRCKSW Maximum Skew for Global Clock 0.42 ns FRMAX Maximum Frequency for Global Clock MHz Notes: 1. Value reflects minimum load . The delay is measured from the CCC ou tput to the clock pin of a sequential element, located in a lightly loaded row (single element is connected to the global net). 2. Value reflects maximum load . The delay is measured on the clock pin of the farthest sequential element, located in a fully loaded row (all available flip-flops are connected to the global net in the row). 3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.

IGLOO DC and Switching Characteristics 2-94 Advance v0.5 Table 2-161  AGL015 Global Resource Commercial-Case Conditions: TJ = 70°C, VCC = 1.14 V Parameter Description Std. UnitsMin.1 Max.2 tRCKL Input LOW Delay for Global Clock 1.79 2.09 ns tRCKH Input HIGH Delay for Global Clock 1.87 2.26 ns tRCKMPWH Minimum Pulse Width HIGH for Global Clock ns tRCKMPWL Minimum Pulse Width LOW for Global Clock ns tRCKSW Maximum Skew for Global Clock 0.39 ns FRMAX Maximum Frequency for Global Clock MHz Notes: 1. Value reflects minimum load . The delay is measured from the CCC ou tput to the clock pin of a sequential element, located in a lightly loaded row (single element is connected to the global net). 2. Value reflects maximum load . The delay is measured on the clock pin of the farthest sequential element, located in a fully loaded row (all available flip-flops are connected to the global net in the row). 3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-162  AGL030 Global Resource Commercial-Case Conditions: TJ = 70°C, VCC = 1.14 V Parameter Description Std. UnitsMin.1 Max.2 tRCKL Input LOW Delay for Global Clock 1.80 2.09 ns tRCKH Input HIGH Delay for Global Clock 1.88 2.27 ns tRCKMPWH Minimum Pulse Width HIGH for Global Clock ns tRCKMPWL Minimum Pulse Width LOW for Global Clock ns tRCKSW Maximum Skew for Global Clock 0.39 ns FRMAX Maximum Frequency for Global Clock MHz Notes: 1. Value reflects minimum load . The delay is measured from the CCC ou tput to the clock pin of a sequential element, located in a lightly loaded row (single element is connected to the global net). 2. Value reflects maximum load . The delay is measured on the clock pin of the farthest sequential element, located in a fully loaded row (all available flip-flops are connected to the global net in the row). 3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.

IGLOO DC and Switching Characteristics Advance v0.5 2-95 Table 2-163  AGL060 Global Resource Commercial-Case Conditions: TJ = 70°C, VCC = 1.14 V Parameter Description Std. UnitsMin.1 Max.2 tRCKL Input LOW Delay for Global Clock 2.04 2.33 ns tRCKH Input HIGH Delay for Global Clock 2.10 2.51 ns tRCKMPWH Minimum Pulse Width HIGH for Global Clock ns tRCKMPWL Minimum Pulse Width LOW for Global Clock ns tRCKSW Maximum Skew for Global Clock 0.40 ns FRMAX Maximum Frequency for Global Clock MHz Notes: 1. Value reflects minimum load . The delay is measured from the CCC ou tput to the clock pin of a sequential element, located in a lightly loaded row (single element is connected to the global net). 2. Value reflects maximum load . The delay is measured on the clock pin of the farthest sequential element, located in a fully loaded row (all available flip-flops are connected to the global net in the row). 3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-164  AGL125 Global Resource Commercial-Case Conditions: TJ = 70°C, VCC = 1.14 V Parameter Description Std. UnitsMin.1 Max.2 tRCKL Input LOW Delay for Global Clock 2.08 2.54 ns tRCKH Input HIGH Delay for Global Clock 2.15 2.77 ns tRCKMPWH Minimum Pulse Width HIGH for Global Clock ns tRCKMPWL Minimum Pulse Width LOW for Global Clock ns tRCKSW Maximum Skew for Global Clock 0.62 ns FRMAX Maximum Frequency for Global Clock MHz Notes: 1. Value reflects minimum load . The delay is measured from the CCC ou tput to the clock pin of a sequential element, located in a lightly loaded row (single element is connected to the global net). 2. Value reflects maximum load . The delay is measured on the clock pin of the farthest sequential element, located in a fully loaded row (all available flip-flops are connected to the global net in the row). 3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.

IGLOO DC and Switching Characteristics 2-96 Advance v0.5 Table 2-165  AGL250 Global Resource Commercial-Case Conditions: TJ = 70°C, VCC = 1.14 V Parameter Description Std. UnitsMin.1 Max.2 tRCKL Input LOW Delay for Global Clock 2.11 2.57 ns tRCKH Input HIGH Delay for Global Clock 2.19 2.81 ns tRCKMPWH Minimum Pulse Width HIGH for Global Clock ns tRCKMPWL Minimum Pulse Width LOW for Global Clock ns tRCKSW Maximum Skew for Global Clock 0.62 ns FRMAX Maximum Frequency for Global Clock MHz Notes: 1. Value reflects minimum load . The delay is measured from the CCC ou tput to the clock pin of a sequential element, located in a lightly loaded row (single element is connected to the global net). 2. Value reflects maximum load . The delay is measured on the clock pin of the farthest sequential element, located in a fully loaded row (all available flip-flops are connected to the global net in the row). 3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-166  AGL400 Global Resource Commercial-Case Conditions: TJ = 70°C, VCC = 1.14 V Parameter Description Std. UnitsMin.1 Max.2 tRCKL Input LOW Delay for Global Clock 2.18 2.64 ns tRCKH Input HIGH Delay for Global Clock 2.27 2.89 ns tRCKMPWH Minimum Pulse Width HIGH for Global Clock ns tRCKMPWL Minimum Pulse Width LOW for Global Clock ns tRCKSW Maximum Skew for Global Clock 0.62 ns FRMAX Maximum Frequency for Global Clock MHz Notes: 1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential element, located in a lightly loaded row (single element is connected to the global net). 2. Value reflects maximum load . The delay is measured on the clock pin of the farthest sequential element, located in a fully loaded row (all available flip-flops are connected to the global net in the row). 3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.

IGLOO DC and Switching Characteristics Advance v0.5 2-97 Table 2-167  AGL600 Global Resource Commercial-Case Conditions: TJ = 70°C, VCC = 1.14 V Parameter Description Std. UnitsMin.1 Max.2 tRCKL Input LOW Delay for Global Clock 2.22 2.67 ns tRCKH Input HIGH Delay for Global Clock 2.32 2.93 ns tRCKMPWH Minimum Pulse Width HIGH for Global Clock ns tRCKMPWL Minimum Pulse Width LOW for Global Clock ns tRCKSW Maximum Skew for Global Clock 0.61 ns FRMAX Maximum Frequency for Global Clock MHz Notes: 1. Value reflects minimum load . The delay is measured from the CCC ou tput to the clock pin of a sequential element, located in a lightly loaded row (single element is connected to the global net). 2. Value reflects maximum load . The delay is measured on the clock pin of the farthest sequential element, located in a fully loaded row (all available flip-flops are connected to the global net in the row). 3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-168  AGL1000 Global Resource Commercial-Case Conditions: TJ = 70°C, VCC = 1.14 V Parameter Description Std. UnitsMin.1 Max.2 tRCKL Input LOW Delay for Global Clock 2.31 2.76 ns tRCKH Input HIGH Delay for Global Clock 2.42 3.03 ns tRCKMPWH Minimum Pulse Width HIGH for Global Clock ns tRCKMPWL Minimum Pulse Width LOW for Global Clock ns tRCKSW Maximum Skew for Global Clock 0.61 ns FRMAX Maximum Frequency for Global Clock MHz Notes: 1. Value reflects minimum load . The delay is measured from the CCC ou tput to the clock pin of a sequential element, located in a lightly loaded row (single element is connected to the global net). 2. Value reflects maximum load . The delay is measured on the clock pin of the farthest sequential element, located in a fully loaded row (all available flip-flops are connected to the global net in the row). 3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.

IGLOO DC and Switching Characteristics 2-98 Advance v0.5 Clock Conditioning Circuits Timing Characteristics Table 2-169  IGLOO CCC/PLL Specification For IGLOO V2 or V5 Devices, 1.5 V DC Core Supply Voltage Parameter Min. Typ. Max. Units Clock Conditioning Circuitry Input Frequency fIN_CCC 1.5 250 MHz Clock Conditioning Circuitry Output Frequency fOUT_CCC 0.75 250 MHz Delay Increments in Programmable Delay Blocks 1, 2 360 ps Number of Programmable Values in Each Programmable Delay Block 32 Serial Clock (SCLK) for Dynamic PLL3 100 ns Input Cycle-to-Cycle Jitter (peak magnitude) 1 ns CCC Output Peak-to-Peak Period Jitter FCCC_OUT Maximum Peak-to-Peak Period Jitter

1 Global

3 Global

0.75 MHz to 24 MHz 0.50 % 0.75% 0.70% 24 MHz to 100 MHz 1.00 % 1.50% 1.20% 100 MHz to 250 MHz 2.50 % 3.75% 2.75% Acquisition Time LockControl = 0 300 µs LockControl = 1 6.0 ms Tracking Jitter LockControl = 0 2.5 ns LockControl = 1 1.5 ns Output Duty Cycle 48.5 51.5 % Delay Range in Block: Programmable Delay 1 1, 2, 4 1.25 15.65 ns Delay Range in Block: Programmable Delay 2 1, 2, 4 0.025 15.65 ns Delay Range in Block: Fixed Delay 1, 2, 4 3.5 ns Notes: 1. This delay is a function of voltage and temperature. See Table 2-6 on page 2-6 and Table 2-7 on page 2-7 for deratings. 2. T J = 25°C, VCC = 1.5 V 3. Maximum value obtain ed for a Std. speed grade device in Worst-Case Commercial Conditions. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. 4. For the definitions of Type 1 and Type 2, refer to the PLL Block Diagram in the Clock Conditioning Circuits in IGLOO and ProASIC3 Devices chapter of the handbook. 5. The AGL030 device does not support PLL. 6. Tracking jitter is defined as the variation in clock edge position of PLL outputs with reference to the PLL input clock edge. Tracking jitter do es not measure the variation in PLL output period, which is covered by the period jitter parameter.

IGLOO DC and Switching Characteristics Advance v0.5 2-99 Table 2-170  IGLOO CCC/PLL Specification For IGLOO V2 Devices, 1.2 V DC Core Supply Voltage Parameter Min. Typ. Max. Units Clock Conditioning Circuitry Input Frequency fIN_CCC 1.5 160 MHz Clock Conditioning Circuitry Output Frequency fOUT_CCC 0.75 160 MHz Delay Increments in Programmable Delay Blocks 1, 2 580 ps Number of Programmable Values in Each Programmable Delay Block 32 Serial Clock (SCLK) for Dynamic PLL3 60 ns Input Cycle-to-Cycle Jitter (peak magnitude) 0.25 ns CCC Output Peak-to-Peak Period Jitter FCCC_OUT Maximum Peak-to-Peak Period Jitter 0.75 MHz to 24 MHz 0.50 % 0.75% 0.70% 24 MHz to 100 MHz 1.00 % 1.50% 1.20% 100 MHz to 160 MHz 2.50 % 3.75% 2.75% Acquisition Time LockControl = 0 300 µs LockControl = 1 6.0 ms Tracking Jitter LockControl = 0 4 ns LockControl = 1 3 ns Output Duty Cycle 48.5 51.5 % Delay Range in Block: Programmable Delay 1 1, 2, 4 2.3 20.86 ns Delay Range in Block: Programmable Delay 2 1, 2, 4 0.025 20.86 ns Delay Range in Block: Fixed Delay 1, 2, 4 5.7 ns Notes: 1. This delay is a function of voltage and temperature. See Table 2-6 on page 2-6 and Table 2-7 on page 2-7 for deratings. 2. T J = 25°C, VCC = 1.5 V 3. Maximum value obtain ed for a Std. speed grade device in Wor st-Case Commercial Conditions. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. 4. For the definitions of Type 1 and Type 2, refer to the PLL Block Diagram in the Clock Conditioning Circuits in IGLOO and ProASIC3 Devices chapter of the handbook. 5. The AGL030 device does not support PLL. 6. Tracking jitter is defined as the variation in clock edge position of PLL outputs with reference to the PLL input clock edge. Tracking jitter does not measure th e variation in PLL output period, which is covered by the period jitter parameter.

IGLOO DC and Switching Characteristics 2-100 Advance v0.5 Note: Peak-to-peak jitter measurements are defined by Tpeak-to-peak = Tperiod_max – Tperiod_min. Figure 2-30  Peak-to-Peak Jitter Definition Tperiod_max Tperiod_min Output Signal

IGLOO DC and Switching Characteristics Advance v0.5 2-101 Embedded SRAM and FIFO Characteristics SRAM Figure 2-31  RAM Models ADDRA11 DOUTA8 DOUTA7 DOUTA0 DOUTB8 DOUTB7 DOUTB0 ADDRA10 ADDRA0 DINA8 DINA7 DINA0 WIDTHA1 WIDTHA0 PIPEA WMODEA BLKA WENA CLKA ADDRB11 ADDRB10 ADDRB0 DINB8 DINB7 DINB0 WIDTHB1 WIDTHB0 PIPEB WMODEB BLKB WENB CLKB RAM4K9 RADDR8 RD17 RADDR7 RD16 RADDR0 RD0 WD17 WD16 WD0 WW1 WW0 RW1 RW0 PIPE REN RCLK RAM512X18 WADDR8 WADDR7 WADDR0 WEN WCLK RESETRESET

IGLOO DC and Switching Characteristics 2-104 Advance v0.5 Figure 2-36  Write Access after Write onto Same Address CLK1 CLK2 WEN_B1 WEN_B2 ADD1 ADD2 DI1 DI2 DO2 (pass-through) DO2 (pipelined) tAHtAS tAHtAS tDH tCCKH tDS tCKQ1 tCKQ2 Dn D0 Dn D0 A0 A4

IGLOO DC and Switching Characteristics Advance v0.5 2-105 Figure 2-37  Read Access after Write onto Same Address CLK1 CLK2 WEN_B1 WEN_B2 ADD1 ADD2 DI1 DO2 (pass-through) DO2 (pipelined) tAHtAS tAHtAS tDHtDS tWRO tCKQ1 tCKQ2 A0 A1 A4 Dn Dn D0 D0 D1

IGLOO DC and Switching Characteristics Advance v0.5 2-107 Timing Characteristics Table 2-171  RAM4K9 Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V Parameter Description Std. Units tAS Address setup time 0.83 ns tAH Address hold time 0.16 ns tENS REN_B, WEN_B setup time 0.81 ns tENH REN_B, WEN_B hold time 0.16 ns tBKS BLK_B setup time 1.65 ns tBKH BLK_B hold time 0.16 ns tDS Input data (DI) setup time 0.71 ns tDH Input data (DI) hold time 0.36 ns tCKQ1 Clock HIGH to new data valid on DO (output retained, WMODE = 0) 3.53 ns Clock HIGH to new data valid on DO (flow-through, WMODE = 1) 3.06 ns t CKQ2 Clock HIGH to new data valid on DO (pipelined) 1.81 ns tWRO Address collision clk-to-clk delay for reliable read access after write on same address TBD ns tCCKH Address collision clk-to-clk delay for reli able write access after write/read on same address TBD ns tRSTBQ RESET_B LOW to data out LOW on DO (flow-through) 2.06 ns RESET_B LOW to data out LOW on DO (pipelined) 2.06 ns tREMRSTB RESET_B removal 0.61 ns tRECRSTB RESET_B recovery 3.21 ns tMPWRSTB RESET_B minimum pulse width 0.68 ns tCYC Clock cycle time 6.24 ns FMAX Maximum frequency 160 MHz Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.

IGLOO DC and Switching Characteristics 2-108 Advance v0.5 Table 2-172  RAM512X18 Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V Parameter Description Std. Units tAS Address setup time 0.83 ns tAH Address hold time 0.16 ns tENS REN_B, WEN_B setup time 0.73 ns tENH REN_B, WEN_B hold time 0.08 ns tDS Input data (DI) setup time 0.71 ns tDH Input data (DI) hold time 0.36 ns tCKQ1 Clock HIGH to new data valid on DO (output retained, WMODE = 0) 4.21 ns tCKQ2 Clock HIGH to new data valid on DO (pipelined) 1.71 ns tWRO Address collision clk-to-clk delay for reliable read access after write on same address TBD ns tCCKH Address collision clk-to-clk delay for reli able write access after write/read on same address TBD ns tRSTBQ RESET_B LOW to data out LOW on DO (flow-through) 2.06 ns RESET_B LOW to data out LOW on DO (pipelined) 2.06 ns tREMRSTB RESET_B removal 0.61 ns tRECRSTB RESET_B recovery 3.21 ns tMPWRSTB RESET_B minimum pulse width 0.68 ns tCYC Clock cycle time 6.24 ns FMAX Maximum frequency 160 MHz Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.

IGLOO DC and Switching Characteristics Advance v0.5 2-109 Table 2-173  RAM4K9 Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V Parameter Description Std. Units tAS Address setup time 1.53 ns tAH Address hold time 0.29 ns tENS REN_B, WEN_B setup time 1.50 ns tENH REN_B, WEN_B hold time 0.29 ns tBKS BLK_B setup time 3.05 ns tBKH BLK_B hold time 0.29 ns tDS Input data (DI) setup time 1.33 ns tDH Input data (DI) hold time 0.66 ns tCKQ1 Clock HIGH to new data valid on DO (output retained, WMODE = 0) 6.61 ns Clock HIGH to new data valid on DO (flow-through, WMODE = 1) 5.72 ns t CKQ2 Clock HIGH to new data valid on DO (pipelined) 3.38 ns tWRO Address collision clk-to-clk delay for reliable read access after write on same address TBD ns tCCKH Address collision clk-to-clk delay for reli able write access after write/read on same address TBD ns tRSTBQ RESET_B LOW to data out LOW on DO (flow-through) 3.86 ns RESET_B LOW to data out LOW on DO (pipelined) 3.86 ns tREMRSTB RESET_B removal 1.12 ns tRECRSTB RESET_B recovery 5.93 ns tMPWRSTB RESET_B minimum pulse width 1.18 ns tCYC Clock cycle time 10.90 ns FMAX Maximum frequency 92 MHz Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values.

IGLOO DC and Switching Characteristics 2-110 Advance v0.5 Table 2-174  RAM512X18 Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V Parameter Description Std. Units tAS Address setup time 1.53 ns tAH Address hold time 0.29 ns tENS REN_B, WEN_B setup time 1.36 ns tENH REN_B, WEN_B hold time 0.15 ns tDS Input data (DI) setup time 1.33 ns tDH Input data (DI) hold time 0.66 ns tCKQ1 Clock HIGH to new data valid on DO (output retained, WMODE = 0) 7.88 ns tCKQ2 Clock HIGH to new data valid on DO (pipelined) 3.20 ns tWRO Address collision clk-to-clk delay for reliable read access after write on same address TBD ns tCCKH Address collision clk-to-clk delay for reliab le write access after write/read on same address TBD ns tRSTBQ RESET_B LOW to data out LOW on DO (flow through) 3.86 ns RESET_B LOW to data out LOW on DO (pipelined) 3.86 ns tREMRSTB RESET_B removal 1.12 ns tRECRSTB RESET_B recovery 5.93 ns tMPWRSTB RESET_B minimum pulse width 1.18 ns tCYC Clock cycle time 10.90 ns FMAX Maximum frequency 92 MHz Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values.

IGLOO DC and Switching Characteristics Advance v0.5 2-111 FIFO Figure 2-40  FIFO Model FIFO4K18 RW2 RD17 RW1 RD16 RW0 WW2 WW1 WW0 RD0 ESTOP FSTOP FULL AFULL EMPTY AFVAL11 AEMPTY AFVAL10 AFVAL0 AEVAL11 AEVAL10 AEVAL0 REN RBLK RCLK WEN WBLK WCLK RPIPE WD17 WD16 WD0 RESET

IGLOO DC and Switching Characteristics 2-114 Advance v0.5 Timing Characteristics Table 2-175  FIFO Worst Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V Parameter Description Std. Units tENS REN_B, WEN_B Setup Time 1.99 ns tENH REN_B, WEN_B Hold Time 0.16 ns tBKS BLK_B Setup Time 0.30 ns tBKH BLK_B Hold Time 0.00 ns tDS Input Data (DI) Setup Time 0.76 ns tDH Input Data (DI) Hold Time 0.25 ns tCKQ1 Clock HIGH to New Data Valid on DO (flow-through) 3.33 ns tCKQ2 Clock HIGH to New Data Valid on DO (pipelined) 1.80 ns tRCKEF RCLK HIGH to Empty Flag Valid 3.53 ns tWCKFF WCLK HIGH to Full Flag Valid 3.35 ns tCKAF Clock HIGH to Almost Empty/Full Flag Valid 12.85 ns tRSTFG RESET_B LOW to Empty/Full Flag Valid 3.48 ns tRSTAF RESET_B LOW to Almost Empty/Full Flag Valid 12.72 ns tRSTBQ RESET_B LOW to Data Out LOW on DO (flow-through) 2.02 ns RESET_B LOW to Data Out LOW on DO (pipelined) 2.02 ns tREMRSTB RESET_B Removal 0.61 ns tRECRSTB RESET_B Recovery 3.21 ns tMPWRSTB RESET_B Minimum Pulse Width 0.68 ns tCYC Clock Cycle Time 6.24 ns FMAX Maximum Frequency for FIFO 160 MHz Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.

IGLOO DC and Switching Characteristics Advance v0.5 2-115 Table 2-176  FIFO Worst Commercial-Case Conditions: TJ = 70°C, VCC = 1.14 V Parameter Description Std. Units tENS REN_B, WEN_B Setup Time 4.13 ns tENH REN_B, WEN_B Hold Time 0.31 ns tBKS BLK_B Setup Time 0.47 ns tBKH BLK_B Hold Time 0.00 ns tDS Input Data (DI) Setup Time 1.56 ns tDH Input Data (DI) Hold Time 0.49 ns tCKQ1 Clock HIGH to New Data Valid on DO (flow-through) 6.80 ns tCKQ2 Clock HIGH to New Data Valid on DO (pipelined) 3.62 ns tRCKEF RCLK HIGH to Empty Flag Valid 7.23 ns tWCKFF WCLK HIGH to Full Flag Valid 6.85 ns tCKAF Clock HIGH to Almost Empty/Full Flag Valid 26.61 ns tRSTFG RESET_B LOW to Empty/Full Flag Valid 7.12 ns tRSTAF RESET_B LOW to Almost Empty/Full Flag Valid 26.33 ns tRSTBQ RESET_B LOW to Data Out LOW on DO (flow-through) 4.09 ns RESET_B LOW to Data Out LOW on DO (pipelined) 4.09 ns tREMRSTB RESET_B Removal 1.23 ns tRECRSTB RESET_B Recovery 6.58 ns tMPWRSTB RESET_B Minimum Pulse Width 1.18 ns tCYC Clock Cycle Time 10.90 ns FMAX Maximum Frequency for FIFO 92 MHz Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-7 for derating values.

IGLOO DC and Switching Characteristics 2-116 Advance v0.5 Embedded FlashROM Characteristics Timing Characteristics Figure 2-46  Timing Diagram A0 A1 tSU tHOLD tSU tHOLD tSU tHOLD tCKQ2 tCKQ2 tCKQ2 CLK Address Data D0 D0 D1 Table 2-177  Embedded FlashROM Access Time Worst Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V Parameter Description Std. Units tSU Address Setup Time 0.57 ns tHOLD Address Hold Time 0.00 ns tCK2Q Clock to Out 34.14 ns FMAX Maximum Clock Frequency 15 MHz Table 2-178  Embedded FlashROM Access Time Worst Commercial-Case Conditions: TJ = 70°C, VCC = 1.14 V Parameter Description Std. Units tSU Address Setup Time 0.59 ns tHOLD Address Hold Time 0.00 ns tCK2Q Clock to Out 52.90 ns FMAX Maximum Clock Frequency 10 MHz

IGLOO DC and Switching Characteristics Advance v0.5 2-117 JTAG 1532 Characteristics JTAG timing delays do not include JTAG I/Os. To obtain complete JTAG timing, add I/O buffer delays to the corresponding standard selected; refer to the I/O timing characteristics in the "User I/O Characteristics" section on page 2-19 for more details. Timing Characteristics Table 2-179  JTAG 1532 Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V Parameter Description Std. Units tDISU Test Data Input Setup Time 1.00 ns tDIHD Test Data Input Hold Time 2.00 ns tTMSSU Test Mode Select Setup Time 1.00 ns tTMDHD Test Mode Select Hold Time 2.00 ns tTCK2Q Clock to Q (data out) 8.00 ns tRSTB2Q Reset to Q (data out) 25.00 ns FTCKMAX TCK Maximum Frequency 15 MHz tTRSTREM ResetB Removal Time 0.58 ns tTRSTREC ResetB Recovery Time 0.00 ns tTRSTMPW ResetB Minimum Pulse TBD ns Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values. Table 2-180  JTAG 1532 Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V Parameter Description Std. Units tDISU Test Data Input Setup Time 1.50 ns tDIHD Test Data Input Hold Time 3.00 ns tTMSSU Test Mode Select Setup Time 1.50 ns tTMDHD Test Mode Select Hold Time 3.00 ns tTCK2Q Clock to Q (data out) 11.00 ns tRSTB2Q Reset to Q (data out) 30.00 ns FTCKMAX TCK Maximum Frequency 9.00 MHz tTRSTREM ResetB Removal Time 1.18 ns tTRSTREC ResetB Recovery Time 0.00 ns tTRSTMPW ResetB Minimum Pulse TBD ns Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.

IGLOO DC and Switching Characteristics 2-118 Advance v0.5 Part Number and Revision Date Part Number 51700095-002-4 Revised October 2008 List of Changes The following table lists critical changes that were made in the current version of the chapter. Previous Version Changes in Current Version (Advance v0.5) Page Advance v0.4 (August 2008) The tables in the "Quiescent Supply Current" section were updated with values for AGL400. 2-7 The tables in the "Power Consumption of Various Internal Resources" section were updated with values for AGL400. 2-12 Table 2-158 · AGL400 Global Resource is new. 2-92 Advance v0.3 (July 2008)

3.0 V LVCMOS wide range support data was added to

Table 2-2 · Recommended Operating Conditions4. 2-2

3.3 V LVCMOS wide range support data was added to T a b l e2 - 2 4·S u m m a r y o f

Maximum and Minimum DC Input an d Output Levels Applicable to Commercial and Industrial Cond itions—Software Default Settings to Table 2-26 · Summary of Maximum and Minimum DC Input and Output Levels Applicable to Commercial and Industrial Conditions—Software Default Settings. 2-23 to 2-24

3.3 V LVCMOS wide range support data was added to T a b l e2 - 2 7·S u m m a r y o f

Maximum and Minimum DC Input Levels. 2-24

3.3 V LVCMOS wide range su pport text was added to T a b l e2 - 4 9·M i n i m u m

and Maximum DC Input and Output Levels for LVCMOS 3.3 V Wide Range. 2-37 Table 2-49 · Minimum and Maximum DC Input and Output Levels for LVCMOS 3.3 V Wide Range is new. 2-37 Advance v0.2 (July 2008) As a result of the Libero IDE v8.4 re lease, Actel now offers a wide range of core voltage support. Th e document was updated to change 1.2 V / 1.5 V to 1.2 V to 1.5 V. N/A Advance v0.1 (January 2008) Tables have been update d to reflect default valu es in the software. The default I/O capacitance is 5 pF. Tables have been updated to include the LVCMOS 1.2 V I/O set. DDR Tables have two additional data po ints added to refl ect both edges for Input DDR setup and hold time. The power data table has been updated to match SmartPower data rather then simulation values. AGL015 global clock delays have been added. N/A Table 2-1 · Absolute Maximum Ratings was updated to combine the V CCI and VMV parameters in one row. The wo rd "output" from the parameter description for VCCI and VMV, and table note 3 was added. 2-1

IGLOO DC and Switching Characteristics Advance v0.5 2-119 Advance v0.1 (January 2008) Table 2-2 · Recommended Operating Conditions 4 was updated to add references to tables notes 4, 6, 7, and 8. VMV was added to the VCCI parameter row, and table note 9 was added. 2-2 In Table 2-3 · Flash Programming Limits – Retention, Storage, and Operating Temperature1, the maximum operating juncti on temperature was changed from 110° to 100°. 2-2 VMV was removed from Table 2-4 · Overshoot and Undershoot Limits 1 . The table title was modified to remove "as measured on quiet I/Os." Table note 2 was revised to remove "estimated SSO de nsity over cycles." Table note 3 was revised to remove "refers only to overshoot/unde rshoot limits for simultaneous switching I/Os." 2-3 The "PLL Behavior at Brownout Condition" section is new. 2-4 Figure 2-2 · V2 Devices – I/O State as a Function of VCCI and VCC Voltage Levels is new. 2-5 EQ 2-2 was updated. The temperature was changed to 100°C, and therefore the end result changed. 2-6 The table notes for Table 2-8 · Quiescent Supply Current (I DD) Characteristics, IGLOO Flash*Freeze Mode* , Table 2-9 · Quiescent Supply Current (I DD) Characteristics, IGLOO Sl eep Mode (VCC = 0 V)* , and T a b l e2 - 1 0·Q u i e s c e n t Supply Current (I DD) Characteristics, IGLOO Shut down Mode (VCC, VCCI = 0 V)* were updated to remove VMV and include P DC6 and PDC7. VCCI and VJTAG were removed from the statement about I DD in the table note for Table 2-9 · Quiescent Supply Current (I DD) Characteristics, IGLOO Sleep Mode (VCC = 0 V)*. 2-7 Note 2 of Table 2-11 · Quiescent Supply Current (IDD), No IGLOO Flash*Freeze Mode1 was updated to include V CCPLL. Note 4 was updated to include P DC6 and PDC7. 2-8 Table 2-12 · Summary of I/O Input Buff er Power (per pin) – Default I/O Software Settings, Table 2-13 · Summary of I/O Input Buffer Power (per pin) – Default I/O Software Settings, Table 2-14 · Summary of I/O Input Buffer Power (per pin) – Default I/O Software Settings , and Table 2-15 · Summary of I/O Output Buffer Power (per pin) – Default I/O Software Settings1 were updated to change P DC2 to P DC6 and P DC3 to P DC7. The table notes were updated to reflect that power was measured on VCCI. 2-9 through 2-10 Table 2-19 · Different Components Con tributing to the Static Power Consumption in IGLOO Devices and Table 2-21 · Different Components Contributing to the Static Power Consumption in IGLOO Device were updated to add PDC6 and PDC7, and to change the definition for PDC5 to bank quiescent power. Subtitles were added to indica te type of devices and core supply voltage. 2-13, 2-15 The "Total Static Power Consumption—P STAT" section was updated to revise the calculation of PSTAT, including PDC6 and PDC7. 2-16 In Table 2-18 · Different Components Contributing to Dynamic Power Consumption in IGLOO Devices , the description for P AC13 was changed from Static to Dynamic. 2-12 Footnote 1 was updated to include information about P AC13. The PLL Contribution equation was changed from: PPLL = PAC13 + PAC14 * FCLKOUT to PPLL = PDC4 + PAC13 * FCLKOUT. 2-17 Previous Version Changes in Current Version (Advance v0.5) Page

IGLOO DC and Switching Characteristics 2-120 Advance v0.5 Advance v0.6 (November 2007) The "Timing Model" was updated to be consistent with the revised timing numbers. 2-19 In Table 2-26 · Summary of Maximum an d Minimum DC Input and Output Levels Applicable to Commercial and Industrial Conditions—Software Default Settings, T J was changed to TA in notes 1 and 2. 2-24 All AC Loading figures for single-e nded I/O standards were changed from Datapaths at 35 pF to 5 pF . N/A The "1.2 V LVCMOS (JESD8-12A)" section is new. 2-59 This document was previously in da tasheet Advance v0.7. As a result of moving to the handbook format, Actel has restarted the version numbers. The new version number is Advance v0.1. N/A Advance v0.6 (continued) Table 2-4  IGLOO CCC/PLL Specificat ion and Table 2-5  IGLOO CCC/PLL Specification were updated. 2-19, 2-20 The former Table 2-16  Maximum I/O Frequency for Single-Ended and Differential I/Os in All Banks in IGLO O Devices (maximum drive strength and high slew selected) was removed. N/A The "During Flash*Freeze Mode" section was updated to include information about the output of the I/O to the FPGA core. 2-57 Table 2-31  Flash*Freeze Pin Location in IGLOO Family Packages (device- independent) was updated to add UC81 and CS281. Flash*Freeze pins were assigned for CS81, CS121, and CS196. 2-61 Figure 2-40  Flash*Freeze Mode Type 2 – Timing Diagram was updated to modify the LSICC Signal. 2-55 Information regarding calculation of the quiescent supply current was added to the "Quiescent Supply Current" section. 3-6 Table 3-8  Quiescent Supply Current (I DD) Characteristics, IGLOO Flash*Freeze Mode† was updated. 3-6 Table 3-9  Quiescent Supply Current (I DD) Characteristics, IGLOO Sleep Mode (VCC = 0 V)† was updated. 3-6 Table 3-11  Quiescent Supply Current (I DD), No IGLOO Flash*Freeze Mode1 was updated. 3-7 Table 3-115  Minimum and Maximum DC Input and Output Levels was updated. 3-58 Table 3-156  JTAG 1532 was updated and Table 3-155  JTAG 1532 is new. 3-104 Advance v0.3 (August 2007) The "Power Conservation Techniques" section was updated to recommend that unused I/O signals be left floating. 2-51 Advance v0.2 (July 2007) The CS81 and CS121 packages were ad ded to Table 2-31  Flash*Freeze Pin Location in IGLOO Family Packages (device-independent). 2-61 Advance v0.1 The T J parameter in Table 3-2  Recommended Operating Conditions was changed to TA, ambient temperature, and table notes 4–6 were added. 3-2 Previous Version Changes in Current Version (Advance v0.5) Page

IGLOO DC and Switching Characteristics Advance v0.5 2-121 Actel Safety Critical, Life Support, and High-Reliability Applications Policy The Actel products described in this advance st atus datasheet may not have completed Actel’s qualification process. Actel may amend or enhance products during the product introduction and qualification process, resulting in changes in device functional ity or performance. It is the responsibility of each customer to ensure the fitn ess of any Actel product (but especially a new product) for a particular purpose, including appr opriateness for safety-cri tical, life-s upport, and other high-reliability applicatio ns. Consult Actel’s Terms and Cond itions for specific liability exclusions relating to life-support applications. A reliability report covering all of Actel’s products is available on the Actel website at http://www.actel.com/documents/ORT_Report.pdf. Actel also offers a variety of enhanced qualification and lot acceptance screening procedures. Contact your local Actel sales office for additional reliability information.

v1.7 3-1 IGLOO Packaging 3 – Package Pin Assignments 81-Pin µCSP Note For Package Manufacturing and Environmental information, visit the Resource Center at http://www.actel.com/products/solutions/package/docs.aspx. Note: This is the bottom view of the package. Figure 3-1  123456789 A B C D E F G H J A1 Ball Pad Corner

3-2 v1.7 81-Pin µCSP Pin Number AGL030 Function A1 IO00RSB0 A2 IO02RSB0 A3 IO06RSB0 A4 IO11RSB0 A5 IO16RSB0 A6 IO19RSB0 A7 IO22RSB0 A8 IO24RSB0 A9 IO26RSB0 B1 IO81RSB1 B2 IO04RSB0 B3 IO10RSB0 B4 IO13RSB0 B5 IO15RSB0 B6 IO20RSB0 B7 IO21RSB0 B8 IO28RSB0 B9 IO25RSB0 C1 IO79RSB1 C2 IO80RSB1 C3 IO08RSB0 C4 IO12RSB0 C5 IO17RSB0 C6 IO14RSB0 C7 IO18RSB0 C8 IO29RSB0 C9 IO27RSB0 D1 IO74RSB1 D2 IO76RSB1 D3 IO77RSB1 D4 V CC D5 V CCIB0 D6 GND D7 IO23RSB0 D8 IO31RSB0 D9 IO30RSB0 E1 GEB0/IO71RSB1 E2 GEA0/IO72RSB1 E3 GEC0/IO73RSB1 E4 V CCIB1 E5 V CC E6 V CCIB0 E7 GDC0/IO32RSB0 E8 GDA0/IO33RSB0 E9 GDB0/IO34RSB0 F1 IO68RSB1 F2 IO67RSB1 F3 IO64RSB1 F4 GND F5 V CCIB1 F6 IO47RSB1 F7 IO36RSB0 F8 IO38RSB0 F9 IO40RSB0 G1 IO65RSB1 G2 IO66RSB1 G3 IO57RSB1 G4 IO53RSB1 G5 IO49RSB1 G6 IO45RSB1 G7 IO46RSB1 G8 V JTAG G9 TRST H1 IO62RSB1 H2 FF/IO60RSB1 H3 IO58RSB1 H4 IO54RSB1 H5 IO48RSB1 H6 IO43RSB1 H7 IO42RSB1 H8 TDI H9 TDO 81-Pin µCSP Pin Number AGL030 Function J1 IO63RSB1 J2 IO61RSB1 J3 IO59RSB1 J4 IO56RSB1 J5 IO52RSB1 J6 IO44RSB1 J7 TCK J8 TMS J9 V PUMP 81-Pin µCSP Pin Number AGL030 Function

v1.7 3-3 81-Pin CSP Note For Package Manufacturing and Environmental information, visit the Resource Center at http://www.actel.com/products/solutions/package/docs.aspx. Note: This is the bottom view of the package. Figure 3-2  123456789 A B C D E F G H J A1 Ball Pad Corner

3-4 v1.7 81-Pin CSP Pin Number AGL030 Function A1 IO00RSB0 A2 IO02RSB0 A3 IO06RSB0 A4 IO11RSB0 A5 IO16RSB0 A6 IO19RSB0 A7 IO22RSB0 A8 IO24RSB0 A9 IO26RSB0 B1 IO81RSB1 B2 IO04RSB0 B3 IO10RSB0 B4 IO13RSB0 B5 IO15RSB0 B6 IO20RSB0 B7 IO21RSB0 B8 IO28RSB0 B9 IO25RSB0 C1 IO79RSB1 C2 IO80RSB1 C3 IO08RSB0 C4 IO12RSB0 C5 IO17RSB0 C6 IO14RSB0 C7 IO18RSB0 C8 IO29RSB0 C9 IO27RSB0 D1 IO74RSB1 D2 IO76RSB1 D3 IO77RSB1 D4 V CC D5 V CCIB0 D6 GND D7 IO23RSB0 D8 IO31RSB0 D9 IO30RSB0 E1 GEB0/IO71RSB1 E2 GEA0/IO72RSB1 E3 GEC0/IO73RSB1 E4 V CCIB1 E5 V CC E6 V CCIB0 E7 GDC0/IO32RSB0 E8 GDA0/IO33RSB0 E9 GDB0/IO34RSB0 F1 IO68RSB1 F2 IO67RSB1 F3 IO64RSB1 F4 GND F5 V CCIB1 F6 IO47RSB1 F7 IO36RSB0 F8 IO38RSB0 F9 IO40RSB0 G1 IO65RSB1 G2 IO66RSB1 G3 IO57RSB1 G4 IO53RSB1 G5 IO49RSB1 G6 IO44RSB1 G7 IO46RSB1 G8 V JTAG G9 TRST H1 IO62RSB1 H2 FF/IO60RSB1 H3 IO58RSB1 H4 IO54RSB1 H5 IO48RSB1 H6 IO43RSB1 H7 IO42RSB1 H8 TDI H9 TDO 81-Pin CSP Pin Number AGL030 Function J1 IO63RSB1 J2 IO61RSB1 J3 IO59RSB1 J4 IO56RSB1 J5 IO52RSB1 J6 IO45RSB1 J7 TCK J8 TMS J9 V PUMP 81-Pin CSP Pin Number AGL030 Function

v1.7 3-5 121-Pin CSP Note For Package Manufacturing and Environmental information, visit the Resource Center at http://www.actel.com/products/solutions/package/docs.aspx. Note: This is the bottom view of the package. Figure 3-3  11 10 1 23456789 A B C D E F G H J K L

3-6 v1.7 121-Pin CSP Pin Number AGL060 Function A1 GNDQ A2 IO01RSB0 A3 GAA1/IO03RSB0 A4 GAC1/IO07RSB0 A5 IO15RSB0 A6 IO13RSB0 A7 IO17RSB0 A8 GBB1/IO22RSB0 A9 GBA1/IO24RSB0 A10 GNDQ A11 VMV0 B1 GAA2/IO95RSB1 B2 IO00RSB0 B3 GAA0/IO02RSB0 B4 GAC0/IO06RSB0 B5 IO08RSB0 B6 IO12RSB0 B7 IO16RSB0 B8 GBC1/IO20RSB0 B9 GBB0/IO21RSB0 B10 GBB2/IO27RSB0 B11 GBA2/IO25RSB0 C1 IO89RSB1 C2 GAC2/IO91RSB1 C3 GAB1/IO05RSB0 C4 GAB0/IO04RSB0 C5 IO09RSB0 C6 IO14RSB0 C7 GBA0/IO23RSB0 C8 GBC0/IO19RSB0 C9 IO26RSB0 C10 IO28RSB0 C11 GBC2/IO29RSB0 D1 IO88RSB1 D2 IO90RSB1 D3 GAB2/IO93RSB1 D4 IO10RSB0 D5 IO11RSB0 D6 IO18RSB0 D7 IO32RSB0 D8 IO31RSB0 D9 GCA2/IO41RSB0 D10 IO30RSB0 D11 IO33RSB0 E1 IO87RSB1 E2 GFC0/IO85RSB1 E3 IO92RSB1 E4 IO94RSB1 E5 V CC E6 V CCIB0 E7 GND E8 GCC0/IO36RSB0 E9 IO34RSB0 E10 GCB1/IO37RSB0 E11 GCC1/IO35RSB0 F1 V COMPLF F2 GFB0/IO83RSB1 F3 GFA0/IO82RSB1 F4 GFC1/IO86RSB1 F5 V CCIB1 F6 V CC F7 V CCIB0 F8 GCB2/IO42RSB0 F9 GCC2/IO43RSB0 F10 GCB0/IO38RSB0 F11 GCA1/IO39RSB0 G1 V CCPLF G2 GFB2/IO79RSB1 G3 GFA1/IO81RSB1 G4 GFB1/IO84RSB1 G5 GND G6 V CCIB1 G7 V CC G8 GDC0/IO46RSB0 G9 GDA1/IO49RSB0 G10 GDB0/IO48RSB0 G11 GCA0/IO40RSB0 H1 IO75RSB1 H2 IO76RSB1 H3 GFC2/IO78RSB1 H4 GFA2/IO80RSB1 H5 IO77RSB1 121-Pin CSP Pin Number AGL060 Function H6 GEC2/IO66RSB1 H7 IO54RSB1 H8 GDC2/IO53RSB1 H9 V JTAG H10 TRST H11 IO44RSB0 J1 GEC1/IO74RSB1 J2 GEC0/IO73RSB1 J3 GEB1/IO72RSB1 J4 GEA0/IO69RSB1 J5 FF/GEB2/IO67RSB1 J6 IO62RSB1 J7 GDA2/IO51RSB1 J8 GDB2/IO52RSB1 J9 TDI J10 TDO J11 GDC1/IO45RSB0 K1 GEB0/IO71RSB1 K2 GEA1/IO70RSB1 K3 GEA2/IO68RSB1 K4 IO64RSB1 K5 IO60RSB1 K6 IO59RSB1 K7 IO56RSB1 K8 TCK K9 TMS K10 V PUMP K11 GDB1/IO47RSB0 L1 VMV1 L2 GNDQ L3 IO65RSB1 L4 IO63RSB1 L5 IO61RSB1 L6 IO58RSB1 L7 IO57RSB1 L8 IO55RSB1 L9 GNDQ L10 GDA0/IO50RSB0 L11 VMV1 121-Pin CSP Pin Number AGL060 Function

v1.7 3-7 196-Pin CSP Note For Package Manufacturing and Environmental information, visit the Resource Center at http://www.actel.com/products/solutions/package/docs.aspx. Note: This is the bottom view of the package. Figure 3-4  A1 Ball Pad Corner 1011121314 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P

3-8 v1.7 196-Pin CSP Pin Number AGL125 Function A1 GND A2 GAA0/IO00RSB0 A3 GAC0/IO04RSB0 A4 GAC1/IO05RSB0 A5 IO09RSB0 A6 IO15RSB0 A7 IO18RSB0 A8 IO22RSB0 A9 IO27RSB0 A10 GBC0/IO35RSB0 A11 GBB0/IO37RSB0 A12 GBB1/IO38RSB0 A13 GBA1/IO40RSB0 A14 GND B1 V CCIB1 B2 VMV0 B3 GAA1/IO01RSB0 B4 GAB1/IO03RSB0 B5 GND B6 IO16RSB0 B7 IO20RSB0 B8 IO24RSB0 B9 IO28RSB0 B10 GND B11 GBC1/IO36RSB0 B12 GBA0/IO39RSB0 B13 GBA2/IO41RSB0 B14 GBB2/IO43RSB0 C1 GAC2/IO128RSB1 C2 GAB2/IO130RSB1 C3 GNDQ C4 V CCIB0 C5 GAB0/IO02RSB0 C6 IO14RSB0 C7 V CCIB0 C8 NC C9 IO23RSB0 C10 IO29RSB0 C11 V CCIB0 C12 IO42RSB0 C13 GNDQ C14 IO44RSB0 D1 IO127RSB1 D2 IO129RSB1 D3 GAA2/IO132RSB1 D4 IO126RSB1 D5 IO06RSB0 D6 IO13RSB0 D7 IO19RSB0 D8 IO21RSB0 D9 IO26RSB0 D10 IO31RSB0 D11 IO30RSB0 D12 VMV0 D13 IO46RSB0 D14 GBC2/IO45RSB0 E1 IO125RSB1 E2 GND E3 IO131RSB1 E4 V CCIB1 E5 NC E6 IO08RSB0 E7 IO17RSB0 E8 IO12RSB0 E9 IO11RSB0 E10 NC E11 V CCIB0 E12 IO32RSB0 E13 GND E14 IO34RSB0 F1 IO124RSB1 F2 IO114RSB1 196-Pin CSP Pin Number AGL125 Function F3 IO113RSB1 F4 IO112RSB1 F5 IO111RSB1 F6 NC F7 V CC F8 V CC F9 NC F10 IO07RSB0 F11 IO25RSB0 F12 IO10RSB0 F13 IO33RSB0 F14 IO47RSB0 G1 GFB1/IO121RSB1 G2 GFA0/IO119RSB1 G3 GFA2/IO117RSB1 G4 V COMPLF G5 GFC0/IO122RSB1 G6 V CC G7 GND G8 GND G9 V CC G10 GCC0/IO52RSB0 G11 GCB1/IO53RSB0 G12 GCA0/IO56RSB0 G13 IO48RSB0 G14 GCC2/IO59RSB0 H1 GFB0/IO120RSB1 H2 GFA1/IO118RSB1 H3 V CCPLF H4 GFB2/IO116RSB1 H5 GFC1/IO123RSB1 H6 V CC H7 GND H8 GND H9 V CC H10 GCC1/IO51RSB0 196-Pin CSP Pin Number AGL125 Function

v1.7 3-9 H11 GCB0/IO54RSB0 H12 GCA1/IO55RSB0 H13 IO49RSB0 H14 GCA2/IO57RSB0 J1 GFC2/IO115RSB1 J2 IO110RSB1 J3 IO94RSB1 J4 IO93RSB1 J5 IO89RSB1 J6 NC J7 V CC J8 V CC J9 NC J10 IO60RSB0 J11 GCB2/IO58RSB0 J12 IO50RSB0 J13 GDC1/IO61RSB0 J14 GDC0/IO62RSB0 K1 IO99RSB1 K2 GND K3 IO95RSB1 K4 V CCIB1 K5 NC K6 IO86RSB1 K7 IO80RSB1 K8 IO74RSB1 K9 IO72RSB1 K10 NC K11 V CCIB0 K12 GDA1/IO65RSB0 K13 GND K14 GDB1/IO63RSB0 L1 GEB1/IO107RSB1 L2 GEC1/IO109RSB1 L3 GEC0/IO108RSB1 L4 IO96RSB1 196-Pin CSP Pin Number AGL125 Function L5 IO91RSB1 L6 IO90RSB1 L7 IO83RSB1 L8 IO81RSB1 L9 IO71RSB1 L10 IO70RSB1 L11 V PUMP L12 V JTAG L13 GDA0/IO66RSB0 L14 GDB0/IO64RSB0 M1 GEB0/IO106RSB1 M2 GEA1/IO105RSB1 M3 GNDQ M4 V CCIB1 M5 IO92RSB1 M6 IO88RSB1 M7 NC M8 V CCIB1 M9 IO76RSB1 M10 GDB2/IO68RSB1 M11 V CCIB1 M12 VMV1 M13 TRST M14 V CCIB0 N1 GEA0/IO104RSB1 N2 VMV1 N3 GEC2/IO101RSB1 N4 IO100RSB1 N5 GND N6 IO87RSB1 N7 IO82RSB1 N8 IO78RSB1 N9 IO73RSB1 N10 GND N11 TCK N12 TDI 196-Pin CSP Pin Number AGL125 Function N13 GNDQ N14 TDO P1 GND P2 GEA2/IO103RSB1 P3 FF/GEB2/IO102RSB1 P4 IO98RSB1 P5 IO97RSB1 P6 IO85RSB1 P7 IO84RSB1 P8 IO79RSB1 P9 IO77RSB1 P10 IO75RSB1 P11 GDC2/IO69RSB1 P12 GDA2/IO67RSB1 P13 TMS P14 GND 196-Pin CSP Pin Number AGL125 Function

3-10 v1.7 196-Pin CSP Pin Number AGL250 Function A1 GND A2 GAA0/IO00RSB0 A3 GAC0/IO04RSB0 A4 GAC1/IO05RSB0 A5 IO10RSB0 A6 IO13RSB0 A7 IO17RSB0 A8 IO19RSB0 A9 IO23RSB0 A10 GBC0/IO35RSB0 A11 GBB0/IO37RSB0 A12 GBB1/IO38RSB0 A13 GBA1/IO40RSB0 A14 GND B1 V CCIB3 B2 VMV0 B3 GAA1/IO01RSB0 B4 GAB1/IO03RSB0 B5 GND B6 IO12RSB0 B7 IO16RSB0 B8 IO22RSB0 B9 IO24RSB0 B10 GND B11 GBC1/IO36RSB0 B12 GBA0/IO39RSB0 B13 GBA2/IO41PPB1 B14 GBB2/IO42PDB1 C1 GAC2/IO116UDB3 C2 GAB2/IO117UDB3 C3 GNDQ C4 V CCIB0 C5 GAB0/IO02RSB0 C6 IO11RSB0 C7 V CCIB0 C8 IO20RSB0 C9 IO30RSB0 C10 IO33RSB0 C11 V CCIB0 C12 IO41NPB1 C13 GNDQ C14 IO42NDB1 D1 IO116VDB3 D2 IO117VDB3 D3 GAA2/IO118UDB3 D4 IO113PPB3 D5 IO08RSB0 D6 IO14RSB0 D7 IO15RSB0 D8 IO18RSB0 D9 IO25RSB0 D10 IO32RSB0 D11 IO44PPB1 D12 VMV1 D13 IO43NDB1 D14 GBC2/IO43PDB1 E1 IO112PDB3 E2 GND E3 IO118VDB3 E4 V CCIB3 E5 IO114USB3 E6 IO07RSB0 E7 IO09RSB0 E8 IO21RSB0 E9 IO31RSB0 E10 IO34RSB0 E11 V CCIB1 E12 IO44NPB1 E13 GND E14 IO45PDB1 F1 IO112NDB3 F2 IO107NPB3 196-Pin CSP Pin Number AGL250 Function F3 IO111PDB3 F4 IO111NDB3 F5 IO113NPB3 F6 IO06RSB0 F7 V CC F8 V CC F9 IO28RSB0 F10 IO54PDB1 F11 IO54NDB1 F12 IO47NDB1 F13 IO47PDB1 F14 IO45NDB1 G1 GFB1/IO109PDB3 G2 GFA0/IO108NDB3 G3 GFA2/IO107PPB3 G4 V COMPLF G5 GFC0/IO110NDB3 G6 V CC G7 GND G8 GND G9 V CC G10 GCC0/IO48NDB1 G11 GCB1/IO49PDB1 G12 GCA0/IO50NDB1 G13 IO53NDB1 G14 GCC2/IO53PDB1 H1 GFB0/IO109NDB3 H2 GFA1/IO108PDB3 H3 V CCPLF H4 GFB2/IO106PPB3 H5 GFC1/IO110PDB3 H6 V CC H7 GND H8 GND H9 V CC H10 GCC1/IO48PDB1 196-Pin CSP Pin Number AGL250 Function

v1.7 3-11 H11 GCB0/IO49NDB1 H12 GCA1/IO50PDB1 H13 IO51NDB1 H14 GCA2/IO51PDB1 J1 GFC2/IO105PDB3 J2 IO104PPB3 J3 IO106NPB3 J4 IO103PDB3 J5 IO103NDB3 J6 IO80RSB2 J7 V CC J8 V CC J9 IO64RSB2 J10 IO56PDB1 J11 GCB2/IO52PDB1 J12 IO52NDB1 J13 GDC1/IO58UDB1 J14 GDC0/IO58VDB1 K1 IO105NDB3 K2 GND K3 IO104NPB3 K4 V CCIB3 K5 IO101PPB3 K6 IO91RSB2 K7 IO81RSB2 K8 IO73RSB2 K9 IO77RSB2 K10 IO56NDB1 K11 V CCIB1 K12 GDA1/IO60UPB1 K13 GND K14 GDB1/IO59UDB1 L1 GEB1/IO99PDB3 L2 GEC1/IO100PDB3 L3 GEC0/IO100NDB3 L4 IO101NPB3 196-Pin CSP Pin Number AGL250 Function L5 IO89RSB2 L6 IO92RSB2 L7 IO75RSB2 L8 IO66RSB2 L9 IO65RSB2 L10 IO71RSB2 L11 V PUMP L12 V JTAG L13 GDA0/IO60VPB1 L14 GDB0/IO59VDB1 M1 GEB0/IO99NDB3 M2 GEA1/IO98PPB3 M3 GNDQ M4 V CCIB2 M5 IO88RSB2 M6 IO87RSB2 M7 IO82RSB2 M8 V CCIB2 M9 IO67RSB2 M10 GDB2/IO62RSB2 M11 V CCIB2 M12 VMV2 M13 TRST M14 V CCIB1 N1 GEA0/IO98NPB3 N2 VMV3 N3 GEC2/IO95RSB2 N4 IO94RSB2 N5 GND N6 IO86RSB2 N7 IO78RSB2 N8 IO74RSB2 N9 IO69RSB2 N10 GND N11 TCK N12 TDI 196-Pin CSP Pin Number AGL250 Function N13 GNDQ N14 TDO P1 GND P2 GEA2/IO97RSB2 P3 GEB2/IO96RSB2 P4 IO90RSB2 P5 IO85RSB2 P6 IO83RSB2 P7 IO79RSB2 P8 IO76RSB2 P9 IO72RSB2 P10 IO68RSB2 P11 GDC2/IO63RSB2 P12 GDA2/IO61RSB2 P13 TMS P14 GND 196-Pin CSP Pin Number AGL250 Function

3-12 v1.7 196-pin CSP Pin Number AGL400 Function A1 GND A2 GAA0/IO00RSB0 A3 GAC0/IO04RSB0 A4 GAC1/IO05RSB0 A5 IO14RSB0 A6 IO18RSB0 A7 IO26RSB0 A8 IO29RSB0 A9 IO36RSB0 A10 GBC0/IO54RSB0 A11 GBB0/IO56RSB0 A12 GBB1/IO57RSB0 A13 GBA1/IO59RSB0 A14 GND B1 V CCIB3 B2 VMV0 B2 VMV0 B3 GAA1/IO01RSB0 B4 GAB1/IO03RSB0 B5 GND B6 IO17RSB0 B7 IO25RSB0 B8 IO34RSB0 B9 IO39RSB0 B10 GND B11 GBC1/IO55RSB0 B12 GBA0/IO58RSB0 B13 GBA2/IO60PPB1 B14 GBB2/IO61PDB1 C1 GAC2/IO153UDB3 C2 GAB2/IO154UDB3 C3 GNDQ C4 V CCIB0 C5 GAB0/IO02RSB0 C6 IO15RSB0 C7 V CCIB0 C8 IO31RSB0 C9 IO44RSB0 C10 IO49RSB0 C11 V CCIB0 C12 IO60NPB1 C13 GNDQ C14 IO61NDB1 D1 IO153VDB3 D2 IO154VDB3 D3 GAA2/IO155UDB3 D4 IO150PPB3 D5 IO11RSB0 D6 IO20RSB0 D7 IO23RSB0 D8 IO28RSB0 D9 IO41RSB0 D10 IO47RSB0 D11 IO63PPB1 D12 VMV1 D13 IO62NDB1 D14 GBC2/IO62PDB1 E1 IO149PDB3 E2 GND E3 IO155VDB3 E4 V CCIB3 E5 IO151USB3 E6 IO09RSB0 E7 IO12RSB0 E8 IO32RSB0 E9 IO46RSB0 E10 IO51RSB0 E11 V CCIB1 E12 IO63NPB1 E13 GND E14 IO64PDB1 F1 IO149NDB3 196-pin CSP Pin Number AGL400 Function F2 IO144NPB3 F3 IO148PDB3 F4 IO148NDB3 F5 IO150NPB3 F6 IO07RSB0 F7 V CC F8 V CC F9 IO43RSB0 F10 IO73PDB1 F11 IO73NDB1 F12 IO66NDB1 F13 IO66PDB1 F14 IO64NDB1 G1 GFB1/IO146PDB3 G2 GFA0/IO145NDB3 G3 GFA2/IO144PPB3 G4 V COMPLF G5 GFC0/IO147NDB3 G6 V CC G7 GND G8 GND G9 V CC G10 GCC0/IO67NDB1 G11 GCB1/IO68PDB1 G12 GCA0/IO69NDB1 G13 IO72NDB1 G14 GCC2/IO72PDB1 H1 GFB0/IO146NDB3 H2 GFA1/IO145PDB3 H3 V CCPLF H4 GFB2/IO143PPB3 H5 GFC1/IO147PDB3 H6 V CC H7 GND H8 GND H9 V CC 196-pin CSP Pin Number AGL400 Function

v1.7 3-13 H10 GCC1/IO67PDB1 H11 GCB0/IO68NDB1 H12 GCA1/IO69PDB1 H13 IO70NDB1 H14 GCA2/IO70PDB1 J1 GFC2/IO142PDB3 J2 IO141PPB3 J3 IO143NPB3 J4 IO140PDB3 J5 IO140NDB3 J6 IO109RSB2 J7 V CC J8 V CC J9 IO84RSB2 J10 IO75PDB1 J11 GCB2/IO71PDB1 J12 IO71NDB1 J13 GDC1/IO77UDB1 J14 GDC0/IO77VDB1 K1 IO142NDB3 K2 GND K3 IO141NPB3 K4 V CCIB3 K5 IO138PPB3 K6 IO125RSB2 K7 IO110RSB2 K8 IO98RSB2 K9 IO104RSB2 K10 IO75NDB1 K11 V CCIB1 K12 GDA1/IO79UPB1 K13 GND K14 GDB1/IO78UDB1 L1 GEB1/IO136PDB3 L2 GEC1/IO137PDB3 L3 GEC0/IO137NDB3 196-pin CSP Pin Number AGL400 Function L4 IO138NPB3 L5 IO122RSB2 L6 IO128RSB2 L7 IO101RSB2 L8 IO88RSB2 L9 IO86RSB2 L10 IO94RSB2 L11 V PUMP L12 V JTAG L13 GDA0/IO79VPB1 L14 GDB0/IO78VDB1 M1 GEB0/IO136NDB3 M2 GEA1/IO135PPB3 M3 GNDQ M4 V CCIB2 M5 IO120RSB2 M6 IO119RSB2 M7 IO112RSB2 M8 V CCIB2 M9 IO89RSB2 M10 GDB2/IO81RSB2 M11 V CCIB2 M12 VMV2 M12 VMV2 M13 TRST M14 V CCIB1 N1 GEA0/IO135NPB3 N2 VMV3 N3 GEC2/IO132RSB2 N4 IO130RSB2 N5 GND N6 IO117RSB2 N7 IO106RSB2 N8 IO100RSB2 N9 IO92RSB2 N10 GND 196-pin CSP Pin Number AGL400 Function N11 TCK N12 TDI N13 GNDQ N14 TDO P1 GND P2 GEA2/IO134RSB2 P3 FF/GEB2/IO133RSB2 P4 IO123RSB2 P5 IO116RSB2 P6 IO114RSB2 P7 IO107RSB2 P8 IO103RSB2 P9 IO95RSB2 P10 IO91RSB2 P11 GDC2/IO82RSB2 P12 GDA2/IO80RSB2 P13 TMS P14 GND 196-pin CSP Pin Number AGL400 Function

3-14 v1.7 281-Pin CSP Note For Package Manufacturing and Environmental information, visit the Resource Center at http://www.actel.com/products/solutions/package/docs.aspx. Note: This is the bottom view of the package. Figure 3-5  10 9 8 7 6 54321111213141516171819 M N P R T U V W D E F A B C G H J K L

v1.7 3-15 281-Pin CSP Pin Number AGL600 Function A1 GND A2 GAB0/IO02RSB0 A3 GAC1/IO05RSB0 A4 IO07RSB0 A5 IO10RSB0 A6 IO14RSB0 A7 IO18RSB0 A8 IO21RSB0 A9 IO22RSB0 A10 V CCIB0 A11 IO33RSB0 A12 IO40RSB0 A13 IO37RSB0 A14 IO48RSB0 A15 IO51RSB0 A16 IO53RSB0 A17 GBC1/IO55RSB0 A18 GBA0/IO58RSB0 A19 GND B1 GAA2/IO174PPB3 B2 V CCIB0 B3 GAB1/IO03RSB0 B4 GAC0/IO04RSB0 B5 IO06RSB0 B6 GND B7 IO15RSB0 B8 IO20RSB0 B9 IO23RSB0 B10 IO24RSB0 B11 IO36RSB0 B12 IO35RSB0 B13 IO44RSB0 B14 GND B15 IO52RSB0 B16 GBC0/IO54RSB0 B17 GBA1/IO59RSB0 B18 V CCIB1 B19 IO61NDB1 C1 GAB2/IO173PPB3 C2 IO174NPB3 C6 IO12RSB0 C14 IO50RSB0 C18 IO60NPB1 C19 GBB2/IO61PDB1 D1 IO170PPB3 D2 IO172NPB3 D4 GAA0/IO00RSB0 D5 GAA1/IO01RSB0 D6 IO09RSB0 D7 IO16RSB0 D8 IO19RSB0 D9 IO26RSB0 D10 GND D11 IO34RSB0 D12 IO45RSB0 D13 IO49RSB0 D14 IO47RSB0 D15 GBB0/IO56RSB0 D16 GBA2/IO60PPB1 D18 GBC2/IO62PPB1 D19 IO66NPB1 E1 IO169NPB3 E2 IO171PPB3 E4 IO171NPB3 E5 IO08RSB0 E6 IO11RSB0 E7 IO13RSB0 E8 IO17RSB0 E9 IO25RSB0 E10 IO30RSB0 E11 IO41RSB0 E12 IO42RSB0 281-Pin CSP Pin Number AGL600 Function E13 IO46RSB0 E14 GBB1/IO57RSB0 E15 IO62NPB1 E16 IO63PPB1 E18 IO64PPB1 E19 IO65NPB1 F1 IO168NPB3 F2 GND F3 IO169PPB3 F4 IO170NPB3 F5 IO173NPB3 F15 IO63NPB1 F16 IO65PPB1 F17 IO64NPB1 F18 GND F19 IO68PPB1 G1 IO167NPB3 G2 IO165NDB3 G4 IO168PPB3 G5 IO167PPB3 G7 GAC2/IO172PPB3 G8 VCCIB0 G9 IO28RSB0 G10 IO32RSB0 G11 IO43RSB0 G12 VCCIB0 G13 IO66PPB1 G15 IO67NDB1 G16 IO67PDB1 G18 GCC0/IO69NPB1 G19 GCB1/IO70PPB1 H1 GFB0/IO163NPB3 H2 IO165PDB3 H4 GFC1/IO164PPB3 H5 GFB1/IO163PPB3 H7 V CCIB3 281-Pin CSP Pin Number AGL600 Function

3-16 v1.7 H8 V CC H9 V CCIB0 H10 V CC H11 V CCIB0 H12 V CC H13 V CCIB1 H15 IO68NPB1 H16 GCB0/IO70NPB1 H18 GCA1/IO71PPB1 H19 GCA2/IO72PPB1 J1 V COMPLF J2 GFA0/IO162NDB3 J4 V CCPLF J5 GFC0/IO164NPB3 J7 GFA2/IO161PDB3 J8 V CCIB3 J9 GND J10 GND J11 GND J12 V CCIB1 J13 GCC1/IO69PPB1 J15 GCA0/IO71NPB1 J16 GCB2/IO73PPB1 J18 IO72NPB1 J19 IO75PSB1 K1 V CCIB3 K2 GFA1/IO162PDB3 K4 GND K5 IO159NPB3 K7 IO161NDB3 K8 V CC K9 GND K10 GND K11 GND K12 V CC K13 GCC2/IO74PPB1 281-Pin CSP Pin Number AGL600 Function K15 IO73NPB1 K16 GND K18 IO74NPB1 K19 V CCIB1 L1 GFB2/IO160PDB3 L2 IO160NDB3 L4 GFC2/IO159PPB3 L5 IO153PPB3 L7 IO153NPB3 L8 V CCIB3 L9 GND L10 GND L11 GND L12 V CCIB1 L13 IO76PPB1 L15 IO76NPB1 L16 IO77PPB1 L18 IO78NPB1 L19 IO77NPB1 M1 IO158PDB3 M2 IO158NDB3 M4 IO154NPB3 M5 IO152PPB3 M7 V CCIB3 M8 V CC M9 V CCIB2 M10 V CC M11 V CCIB2 M12 V CC M13 VCCIB1 M15 IO79NPB1 M16 IO81NPB1 M18 IO79PPB1 M19 IO78PPB1 N1 IO154PPB3 N2 IO152NPB3 281-Pin CSP Pin Number AGL600 Function N4 IO150PPB3 N5 IO148NPB3 N7 GEA2/IO143RSB2 N8 VCCIB2 N9 IO117RSB2 N10 IO115RSB2 N11 IO114RSB2 N12 VCCIB2 N13 V PUMP N15 IO82PPB1 N16 IO85PPB1 N18 IO82NPB1 N19 IO81PPB1 P1 IO151PDB3 P2 GND P3 IO151NDB3 P4 IO149PPB3 P5 GEA0/IO144NPB3 P15 IO83NDB1 P16 IO83PDB1 P17 GDC1/IO86PPB1 P18 GND P19 IO85NPB1 R1 IO150NPB3 R2 IO149NPB3 R4 GEC1/IO146PPB3 R5 GEB1/IO145PPB3 R6 IO138RSB2 R7 IO127RSB2 R8 IO123RSB2 R9 IO118RSB2 R10 IO111RSB2 R11 IO106RSB2 R12 IO103RSB2 R13 IO97RSB2 R14 IO95RSB2 281-Pin CSP Pin Number AGL600 Function

v1.7 3-17 R15 IO94RSB2 R16 GDA1/IO88PPB1 R18 GDB0/IO87NPB1 R19 GDC0/IO86NPB1 T1 IO148PPB3 T2 GEC0/IO146NPB3 T4 GEB0/IO145NPB3 T5 IO132RSB2 T6 IO136RSB2 T7 IO130RSB2 T8 IO126RSB2 T9 IO120RSB2 T10 GND T11 IO113RSB2 T12 IO104RSB2 T13 IO101RSB2 T14 IO98RSB2 T15 GDC2/IO91RSB2 T16 TMS T18 V JTAG T19 GDB1/IO87PPB1 U1 IO147PDB3 U2 GEA1/IO144PPB3 U6 IO131RSB2 U14 IO99RSB2 U18 TRST U19 GDA0/IO88NPB1 V1 IO147NDB3 V2 V CCIB3 V3 GEC2/IO141RSB2 V4 IO140RSB2 V5 IO135RSB2 V6 GND V7 IO125RSB2 V8 IO122RSB2 V9 IO116RSB2 281-Pin CSP Pin Number AGL600 Function V10 IO112RSB2 V11 IO110RSB2 V12 IO108RSB2 V13 IO102RSB2 V14 GND V15 IO93RSB2 V16 GDA2/IO89RSB2 V17 TDI V18 V CCIB2 V19 TDO W1 GND W2 FF/GEB2/IO142RSB2 W3 IO139RSB2 W4 IO137RSB2 W5 IO134RSB2 W6 IO133RSB2 W7 IO128RSB2 W8 IO124RSB2 W9 IO119RSB2 W10 V CCIB2 W11 IO109RSB2 W12 IO107RSB2 W13 IO105RSB2 W14 IO100RSB2 W15 IO96RSB2 W16 IO92RSB2 W17 GDB2/IO90RSB2 W18 TCK W19 GND 281-Pin CSP Pin Number AGL600 Function

3-18 v1.7 281-Pin CSP Pin Number AGL1000 Function A1 GND A2 GAB0/IO02RSB0 A3 GAC1/IO05RSB0 A4 IO13RSB0 A5 IO11RSB0 A6 IO16RSB0 A7 IO20RSB0 A8 IO24RSB0 A9 IO29RSB0 A10 V CCIB0 A11 IO39RSB0 A12 IO45RSB0 A13 IO48RSB0 A14 IO58RSB0 A15 IO61RSB0 A16 IO62RSB0 A17 GBC1/IO73RSB0 A18 GBA0/IO76RSB0 A19 GND B1 GAA2/IO225PPB3 B2 V CCIB0 B3 GAB1/IO03RSB0 B4 GAC0/IO04RSB0 B5 IO12RSB0 B6 GND B7 IO21RSB0 B8 IO26RSB0 B9 IO34RSB0 B10 IO35RSB0 B11 IO36RSB0 B12 IO46RSB0 B13 IO52RSB0 B14 GND B15 IO59RSB0 B16 GBC0/IO72RSB0 B17 GBA1/IO77RSB0 B18 V CCIB1 B19 IO79NDB1 C1 GAB2/IO224PPB3 C2 IO225NPB3 C6 IO18RSB0 C14 IO63RSB0 C18 IO78NPB1 C19 GBB2/IO79PDB1 D1 IO219PPB3 D2 IO223NPB3 D4 GAA0/IO00RSB0 D5 GAA1/IO01RSB0 D6 IO15RSB0 D7 IO19RSB0 D8 IO27RSB0 D9 IO32RSB0 D10 GND D11 IO38RSB0 D12 IO44RSB0 D13 IO47RSB0 D14 IO60RSB0 D15 GBB0/IO74RSB0 D16 GBA2/IO78PPB1 D18 GBC2/IO80PPB1 D19 IO88NPB1 E1 IO217NPB3 E2 IO221PPB3 E4 IO221NPB3 E5 IO10RSB0 E6 IO14RSB0 E7 IO25RSB0 E8 IO28RSB0 E9 IO31RSB0 E10 IO33RSB0 E11 IO42RSB0 E12 IO49RSB0 281-Pin CSP Pin Number AGL1000 Function E13 IO53RSB0 E14 GBB1/IO75RSB0 E15 IO80NPB1 E16 IO85PPB1 E18 IO83PPB1 E19 IO84NPB1 F1 IO214NPB3 F2 GND F3 IO217PPB3 F4 IO219NPB3 F5 IO224NPB3 F15 IO85NPB1 F16 IO84PPB1 F17 IO83NPB1 F18 GND F19 IO90PPB1 G1 IO212NPB3 G2 IO211NDB3 G4 IO214PPB3 G5 IO212PPB3 G7 GAC2/IO223PPB3 G8 V CCIB0 G9 IO30RSB0 G10 IO37RSB0 G11 IO43RSB0 G12 V CCIB0 G13 IO88PPB1 G15 IO89NDB1 G16 IO89PDB1 G18 GCC0/IO91NPB1 G19 GCB1/IO92PPB1 H1 GFB0/IO208NPB3 H2 IO211PDB3 H4 GFC1/IO209PPB3 H5 GFB1/IO208PPB3 H7 V CCIB3 281-Pin CSP Pin Number AGL1000 Function

v1.7 3-19 H8 V CC H9 V CCIB0 H10 V CC H11 V CCIB0 H12 V CC H13 V CCIB1 H15 IO90NPB1 H16 GCB0/IO92NPB1 H18 GCA1/IO93PPB1 H19 GCA2/IO94PPB1 J1 V COMPLF J2 GFA0/IO207NDB3 J4 V CCPLF J5 GFC0/IO209NPB3 J7 GFA2/IO206PDB3 J8 V CCIB3 J9 GND J10 GND J11 GND J12 V CCIB1 J13 GCC1/IO91PPB1 J15 GCA0/IO93NPB1 J16 GCB2/IO95PPB1 J18 IO94NPB1 J19 IO102PSB1 K1 V CCIB3 K2 GFA1/IO207PDB3 K4 GND K5 IO204NPB3 K7 IO206NDB3 K8 V CC K9 GND K10 GND K11 GND K12 V CC K13 GCC2/IO96PPB1 281-Pin CSP Pin Number AGL1000 Function K15 IO95NPB1 K16 GND K18 IO96NPB1 K19 V CCIB1 L1 GFB2/IO205PDB3 L2 IO205NDB3 L4 GFC2/IO204PPB3 L5 IO203PPB3 L7 IO203NPB3 L8 V CCIB3 L9 GND L10 GND L11 GND L12 V CCIB1 L13 IO103PPB1 L15 IO103NPB1 L16 IO97PPB1 L18 IO98NPB1 L19 IO97NPB1 M1 IO202PDB3 M2 IO202NDB3 M4 IO201NPB3 M5 IO198PPB3 M7 V CCIB3 M8 V CC M9 V CCIB2 M10 V CC M11 V CCIB2 M12 V CC M13 V CCIB1 M15 IO104NPB1 M16 IO100NPB1 M18 IO104PPB1 M19 IO98PPB1 N1 IO201PPB3 N2 IO198NPB3 281-Pin CSP Pin Number AGL1000 Function N4 IO196PPB3 N5 IO197NPB3 N7 GEA2/IO187RSB2 N8 V CCIB2 N9 IO155RSB2 N10 IO154RSB2 N11 IO150RSB2 N12 V CCIB2 N13 V PUMP N15 IO107PPB1 N16 IO105PPB1 N18 IO107NPB1 N19 IO100PPB1 P1 IO195PDB3 P2 GND P3 IO195NDB3 P4 IO194PPB3 P5 GEA0/IO188NPB3 P15 IO108NDB1 P16 IO108PDB1 P17 GDC1/IO111PPB1 P18 GND P19 IO105NPB1 R1 IO196NPB3 R2 IO194NPB3 R4 GEC1/IO190PPB3 R5 GEB1/IO189PPB3 R6 IO184RSB2 R7 IO173RSB2 R8 IO168RSB2 R9 IO160RSB2 R10 IO151RSB2 R11 IO141RSB2 R12 IO136RSB2 R13 IO127RSB2 R14 IO124RSB2 281-Pin CSP Pin Number AGL1000 Function

3-20 v1.7 R15 IO122RSB2 R16 GDA1/IO113PPB1 R18 GDB0/IO112NPB1 R19 GDC0/IO111NPB1 T1 IO197PPB3 T2 GEC0/IO190NPB3 T4 GEB0/IO189NPB3 T5 IO181RSB2 T6 IO172RSB2 T7 IO171RSB2 T8 IO156RSB2 T9 IO159RSB2 T10 GND T11 IO139RSB2 T12 IO138RSB2 T13 IO129RSB2 T14 IO123RSB2 T15 GDC2/IO116RSB2 T16 TMS T18 V JTAG T19 GDB1/IO112PPB1 U1 IO193PDB3 U2 GEA1/IO188PPB3 U6 IO167RSB2 U14 IO128RSB2 U18 TRST U19 GDA0/IO113NPB1 V1 IO193NDB3 V2 V CCIB3 V3 GEC2/IO185RSB2 V4 IO182RSB2 V5 IO175RSB2 V6 GND V7 IO161RSB2 V8 IO143RSB2 V9 IO146RSB2 281-Pin CSP Pin Number AGL1000 Function V10 IO145RSB2 V11 IO144RSB2 V12 IO134RSB2 V13 IO133RSB2 V14 GND V15 IO119RSB2 V16 GDA2/IO114RSB2 V17 TDI V18 V CCIB2 V19 TDO W1 GND W2 FF/GEB2/IO186RSB2 W3 IO183RSB2 W4 IO176RSB2 W5 IO170RSB2 W6 IO162RSB2 W7 IO157RSB2 W8 IO152RSB2 W9 IO149RSB2 W10 V CCIB2 W11 IO140RSB2 W12 IO135RSB2 W13 IO130RSB2 W14 IO125RSB2 W15 IO120RSB2 W16 IO118RSB2 W17 GDB2/IO115RSB2 W18 TCK W19 GND 281-Pin CSP Pin Number AGL1000 Function

v1.7 3-21 48-Pin QFN Note For Package Manufacturing and Environmental information, visit the Resource Center at http://www.actel.com/products/solutions/package/docs.aspx. Notes: 1. This is the bottom view of the package. 2. The die attach paddle center of th e package is tied to ground (GND). Figure 3-6  Pin 1

3-22 v1.7 48-Pin QFP Pin Number AGL030 Function

1 IO82RSB1

2 GEC0/IO73RSB1

3 GEA0/IO72RSB1

4 GEB0/IO71RSB1

5 GND

7 IO68RSB1

8 IO67RSB1

9 IO66RSB1

10 IO65RSB1

11 IO64RSB1

12 IO62RSB1

13 IO61RSB1

14 FF/IO60RSB1

15 IO57RSB1

16 IO55RSB1

17 IO53RSB1

19 V CCIB1

20 IO46RSB1

21 IO42RSB1

22 TCK

23 TDI

24 TMS

26 TDO

27 TRST

28 V JTAG

29 IO38RSB0

30 GDB0/IO34RSB0

31 GDA0/IO33RSB0

32 GDC0/IO32RSB0

33 V CCIB0

34 GND

36 IO25RSB0

37 IO24RSB0

38 IO22RSB0

39 IO20RSB0

40 IO18RSB0

41 IO16RSB0

42 IO14RSB0

43 IO10RSB0

44 IO08RSB0

45 IO06RSB0

46 IO04RSB0

47 IO02RSB0

48 IO00RSB0

Pin Number AGL030 Function

v1.7 3-23 68-Pin QFN Note For Package Manufacturing and Environmental information, visit the Resource Center at http://www.actel.com/products/solutions/package/docs.aspx. Notes: 1. This is the bottom view of the package. 2. The die attach paddle center of th e package is tied to ground (GND). Figure 3-7  Pin A1 Mark

3-24 v1.7 68-Pin QFN Pin Number AGL015 Function 1I O 8 2 R S B 1 2I O 8 0 R S B 1 3I O 7 8 R S B 1 4I O 7 6 R S B 1

5 GEC0/IO73RSB1

6 GEA0/IO72RSB1

7 GEB0/IO71RSB1

9 GND

10 V CCIB1

11 IO68RSB1

12 IO67RSB1

13 IO66RSB1

14 IO65RSB1

15 IO64RSB1

16 IO63RSB1

17 IO62RSB1

18 FF/IO60RSB1

19 IO58RSB1

20 IO56RSB1

21 IO54RSB1

22 IO52RSB1

23 IO51RSB1

25 GND

27 IO50RSB1

28 IO48RSB1

29 IO46RSB1

30 IO44RSB1

31 IO42RSB1

32 TCK

33 TDI

34 TMS

36 TDO

37 TRST

38 V JTAG

39 IO40RSB0

40 IO37RSB0

41 GDB0/IO34RSB0

42 GDA0/IO33RSB0

43 GDC0/IO32RSB0

45 GND

46 V CC

47 IO31RSB0

48 IO29RSB0

49 IO28RSB0

50 IO27RSB0

51 IO25RSB0

52 IO24RSB0

53 IO22RSB0

54 IO21RSB0

55 IO19RSB0

56 IO17RSB0

57 IO15RSB0

58 IO14RSB0

60 GND

61 V CC

62 IO12RSB0

63 IO10RSB0

64 IO08RSB0

65 IO06RSB0

66 IO04RSB0

67 IO02RSB0

68 IO00RSB0

Pin Number AGL015 Function

v1.7 3-25 68-Pin QFN Pin Number AGL030 Function

2 IO80RSB1

3 IO78RSB1

4 IO76RSB1

Pin Number AGL030 Function

3-26 v1.7 132-Pin QFN Note For Package Manufacturing and Environmental information, visit the Resource Center at http://www.actel.com/products/solutions/package/docs.aspx. Notes: 1. This is the bottom view of the package. 2. The die attach paddle center of th e package is tied to ground (GND). Figure 3-8  A37 A12 A36 A25 A48 A24 A13 B34 B11 B44 B22 B12 C31 C10 B33 B23 C30 C21 C40 C20 C11 Optional Corner Pad (4x) Pin A1Mark

v1.7 3-27 132-Pin QFN Pin Number AGL030 Function A1 IO80RSB1 A2 IO77RSB1 A3 NC A4 IO76RSB1 A5 GEC0/IO73RSB1 A6 NC A7 GEB0/IO71RSB1 A8 IO69RSB1 A9 NC A10 V CC A11 IO67RSB1 A12 IO64RSB1 A13 IO59RSB1 A14 IO56RSB1 A15 NC A16 IO55RSB1 A17 IO53RSB1 A18 V CC A19 IO50RSB1 A20 IO48RSB1 A21 IO45RSB1 A22 IO44RSB1 A23 IO43RSB1 A24 TDI A25 TRST A26 IO40RSB0 A27 NC A28 IO39RSB0 A29 IO38RSB0 A30 IO36RSB0 A31 IO35RSB0 A32 GDC0/IO32RSB0 A33 NC A34 V CC A35 IO30RSB0 A36 IO27RSB0 A37 IO22RSB0 A38 IO19RSB0 A39 NC A40 IO18RSB0 A41 IO16RSB0 A42 IO14RSB0 A43 V CC A44 IO11RSB0 A45 IO08RSB0 A46 IO06RSB0 A47 IO05RSB0 A48 IO02RSB0 B1 IO81RSB1 B2 IO78RSB1 B3 GND B4 IO75RSB1 B5 NC B6 GND B7 IO70RSB1 B8 NC B9 GND B10 IO66RSB1 B11 IO63RSB1 B12 FF/IO60RSB1 B13 IO57RSB1 B14 GND B15 IO54RSB1 B16 IO52RSB1 B17 GND B18 IO49RSB1 B19 IO46RSB1 B20 GND B21 IO42RSB1 B22 TMS B23 TDO B24 IO41RSB0 132-Pin QFN Pin Number AGL030 Function B25 GND B26 NC B27 IO37RSB0 B28 GND B29 GDA0/IO33RSB0 B30 NC B31 GND B32 IO29RSB0 B33 IO26RSB0 B34 IO23RSB0 B35 IO20RSB0 B36 GND B37 IO17RSB0 B38 IO15RSB0 B39 GND B40 IO12RSB0 B41 IO09RSB0 B42 GND B43 IO04RSB0 B44 IO01RSB0 C1 IO82RSB1 C2 IO79RSB1 C3 NC C4 IO74RSB1 C5 GEA0/IO72RSB1 C6 NC C7 NC C8 V CCIB1 C9 IO65RSB1 C10 IO62RSB1 C11 IO61RSB1 C12 IO58RSB1 C13 NC C14 NC C15 IO51RSB1 C16 V CCIB1 132-Pin QFN Pin Number AGL030 Function

3-28 v1.7 C17 IO47RSB1 C18 NC C19 TCK C20 NC C21 V PUMP C22 V JTAG C23 NC C24 NC C25 NC C26 GDB0/IO34RSB0 C27 NC C28 V CCIB0 C29 IO28RSB0 C30 IO25RSB0 C31 IO24RSB0 C32 IO21RSB0 C33 NC C34 NC C35 V CCIB0 C36 IO13RSB0 C37 IO10RSB0 C38 IO07RSB0 C39 IO03RSB0 C40 IO00RSB0 D1 GND D2 GND D3 GND D4 GND 132-Pin QFN Pin Number AGL030 Function

v1.7 3-29 132-Pin QFN Pin Number AGL125 Function A1 GAB2/IO69RSB1 A2 IO130RSB1 A3 V CCIB1 A4 GFC1/IO126RSB1 A5 GFB0/IO123RSB1 A6 V CCPLF A7 GFA1/IO121RSB1 A8 GFC2/IO118RSB1 A9 IO115RSB1 A10 V CC A11 GEB1/IO110RSB1 A12 GEA0/IO107RSB1 A13 GEC2/IO104RSB1 A14 IO100RSB1 A15 V CC A16 IO99RSB1 A17 IO96RSB1 A18 IO94RSB1 A19 IO91RSB1 A20 IO85RSB1 A21 IO79RSB1 A22 V CC A23 GDB2/IO71RSB1 A24 TDI A25 TRST A26 GDC1/IO61RSB0 A27 V CC A28 IO60RSB0 A29 GCC2/IO59RSB0 A30 GCA2/IO57RSB0 A31 GCA0/IO56RSB0 A32 GCB1/IO53RSB0 A33 IO49RSB0 A34 V CC A35 IO44RSB0 A36 GBA2/IO41RSB0 A37 GBB1/IO38RSB0 A38 GBC0/IO35RSB0 A39 V CCIB0 A40 IO28RSB0 A41 IO22RSB0 A42 IO18RSB0 A43 IO14RSB0 A44 IO11RSB0 A45 IO07RSB0 A46 V CC A47 GAC1/IO05RSB0 A48 GAB0/IO02RSB0 B1 IO68RSB1 B2 GAC2/IO131RSB1 B3 GND B4 GFC0/IO125RSB1 B5 V COMPLF B6 GND B7 GFB2/IO119RSB1 B8 IO116RSB1 B9 GND B10 GEB0/IO109RSB1 B11 VMV1 B12 FF/GEB2/IO105RSB1 B13 IO101RSB1 B14 GND B15 IO98RSB1 B16 IO95RSB1 B17 GND B18 IO87RSB1 B19 IO81RSB1 B20 GND B21 GNDQ B22 TMS B23 TDO B24 GDC0/IO62RSB0 132-Pin QFN Pin Number AGL125 Function B25 GND B26 NC B27 GCB2/IO58RSB0 B28 GND B29 GCB0/IO54RSB0 B30 GCC1/IO51RSB0 B31 GND B32 GBB2/IO43RSB0 B33 VMV0 B34 GBA0/IO39RSB0 B35 GBC1/IO36RSB0 B36 GND B37 IO26RSB0 B38 IO21RSB0 B39 GND B40 IO13RSB0 B41 IO08RSB0 B42 GND B43 GAC0/IO04RSB0 B44 GNDQ C1 GAA2/IO67RSB1 C2 IO132RSB1 C3 V CC C4 GFB1/IO124RSB1 C5 GFA0/IO122RSB1 C6 GFA2/IO120RSB1 C7 IO117RSB1 C8 V CCIB1 C9 GEA1/IO108RSB1 C10 GNDQ C11 GEA2/IO106RSB1 C12 IO103RSB1 C13 V CCIB1 C14 IO97RSB1 C15 IO93RSB1 C16 IO89RSB1 132-Pin QFN Pin Number AGL125 Function

3-30 v1.7 C17 IO83RSB1 C18 V CCIB1 C19 TCK C20 VMV1 C21 V PUMP C22 V JTAG C23 V CCIB0 C24 NC C25 NC C26 GCA1/IO55RSB0 C27 GCC0/IO52RSB0 C28 V CCIB0 C29 IO42RSB0 C30 GNDQ C31 GBA1/IO40RSB0 C32 GBB0/IO37RSB0 C33 V CC C34 IO24RSB0 C35 IO19RSB0 C36 IO16RSB0 C37 IO10RSB0 C38 V CCIB0 C39 GAB1/IO03RSB0 C40 VMV0 D1 GND D2 GND D3 GND D4 GND 132-Pin QFN Pin Number AGL125 Function

v1.7 3-31 100-Pin VQFP Note For Package Manufacturing and Environmental information, visit the Resource Center at http://www.actel.com/products/solutions/package/docs.aspx. Note: This is the top view of the package. Figure 3-9  100

3-32 v1.7 100-Pin VQFP Pin Number AGL030 Function

1 GND

10 IO75RSB1

11 IO74RSB1

12 GEC0/IO73RSB1

13 GEA0/IO72RSB1

14 GEB0/IO71RSB1

15 IO70RSB1

16 IO69RSB1

18 V CCIB1

19 IO68RSB1

20 IO67RSB1

21 IO66RSB1

22 IO65RSB1

23 IO64RSB1

24 IO63RSB1

25 IO62RSB1

26 IO61RSB1

27 FF/IO60RSB1

28 IO59RSB1

29 IO58RSB1

30 IO57RSB1

31 IO56RSB1

32 IO55RSB1

33 IO54RSB1

34 IO53RSB1

35 IO52RSB1

36 IO51RSB1

37 V CC

38 GND

39 V CCIB1

40 IO49RSB1

41 IO47RSB1

42 IO46RSB1

43 IO45RSB1

44 IO44RSB1

45 IO43RSB1

46 IO42RSB1

47 TCK

48 TDI

49 TMS

51 GND

54 TDO

55 TRST

56 V JTAG

57 IO41RSB0

58 IO40RSB0

59 IO39RSB0

60 IO38RSB0

61 IO37RSB0

62 IO36RSB0

63 GDB0/IO34RSB0

64 GDA0/IO33RSB0

65 GDC0/IO32RSB0

67 GND

68 V CC

69 IO31RSB0

70 IO30RSB0

71 IO29RSB0

72 IO28RSB0

Pin Number AGL030 Function

73 IO27RSB0

74 IO26RSB0

75 IO25RSB0

76 IO24RSB0

77 IO23RSB0

78 IO22RSB0

79 IO21RSB0

80 IO20RSB0

81 IO19RSB0

82 IO18RSB0

83 IO17RSB0

84 IO16RSB0

85 IO15RSB0

86 IO14RSB0

88 GND

89 V CC

90 IO12RSB0

91 IO10RSB0

92 IO08RSB0

93 IO07RSB0

94 IO06RSB0

95 IO05RSB0

96 IO04RSB0

97 IO03RSB0

98 IO02RSB0

99 IO01RSB0

100 IO00RSB0

Pin Number AGL030 Function

v1.7 3-33 100-Pin VQFP Pin Number AGL060 Function

2 GAA2/IO51RSB1

3 IO52RSB1

4 GAB2/IO53RSB1

5 IO95RSB1

6 GAC2/IO94RSB1

7 IO93RSB1

8 IO92RSB1

10 GFB1/IO87RSB1

11 GFB0/IO86RSB1

13 GFA0/IO85RSB1

15 GFA1/IO84RSB1

16 GFA2/IO83RSB1

17 V CC

19 GEC1/IO77RSB1

20 GEB1/IO75RSB1

21 GEB0/IO74RSB1

22 GEA1/IO73RSB1

23 GEA0/IO72RSB1

24 VMV1

25 GNDQ

26 GEA2/IO71RSB1

27 FF/GEB2/IO70RSB1

28 GEC2/IO69RSB1

29 IO68RSB1

30 IO67RSB1

31 IO66RSB1

32 IO65RSB1

33 IO64RSB1

34 IO63RSB1

35 IO62RSB1

36 IO61RSB1

40 IO60RSB1

41 IO59RSB1

42 IO58RSB1

43 IO57RSB1

44 GDC2/IO56RSB1

45 GDB2/IO55RSB1

46 GDA2/IO54RSB1

50 VMV1

57 GDA1/IO49RSB0

58 GDC0/IO46RSB0

59 GDC1/IO45RSB0

60 GCC2/IO43RSB0

61 GCB2/IO42RSB0

62 GCA0/IO40RSB0

63 GCA1/IO39RSB0

64 GCC0/IO36RSB0

65 GCC1/IO35RSB0

70 GBC2/IO29RSB0

71 GBB2/IO27RSB0

72 IO26RSB0

Pin Number AGL060 Function

73 GBA2/IO25RSB0

74 VMV0

75 GNDQ

76 GBA1/IO24RSB0

77 GBA0/IO23RSB0

78 GBB1/IO22RSB0

79 GBB0/IO21RSB0

80 GBC1/IO20RSB0

81 GBC0/IO19RSB0

84 IO15RSB0

85 IO13RSB0

86 IO11RSB0

90 IO10RSB0

91 IO09RSB0

93 GAC1/IO07RSB0

94 GAC0/IO06RSB0

95 GAB1/IO05RSB0

96 GAB0/IO04RSB0

97 GAA1/IO03RSB0

98 GAA0/IO02RSB0

Pin Number AGL060 Function

3-34 v1.7 100-Pin VQFP Pin Number AGL125 Function

2 GAA2/IO67RSB1

3 IO68RSB1

4 GAB2/IO69RSB1

5 IO132RSB1

6 GAC2/IO131RSB1

7 IO130RSB1

8 IO129RSB1

10 GFB1/IO124RSB1

11 GFB0/IO123RSB1

13 GFA0/IO122RSB1

15 GFA1/IO121RSB1

16 GFA2/IO120RSB1

19 GEC0/IO111RSB1

20 GEB1/IO110RSB1

21 GEB0/IO109RSB1

22 GEA1/IO108RSB1

23 GEA0/IO107RSB1

26 GEA2/IO106RSB1

27 FF/GEB2/IO105RSB1

28 GEC2/IO104RSB1

29 IO102RSB1

30 IO100RSB1

31 IO99RSB1

32 IO97RSB1

33 IO96RSB1

34 IO95RSB1

35 IO94RSB1

36 IO93RSB1

40 IO87RSB1

41 IO84RSB1

42 IO81RSB1

43 IO75RSB1

44 GDC2/IO72RSB1

45 GDB2/IO71RSB1

46 GDA2/IO70RSB1

57 GDA1/IO65RSB0

58 GDC0/IO62RSB0

59 GDC1/IO61RSB0

60 GCC2/IO59RSB0

61 GCB2/IO58RSB0

62 GCA0/IO56RSB0

63 GCA1/IO55RSB0

64 GCC0/IO52RSB0

65 GCC1/IO51RSB0

69 IO47RSB0

70 GBC2/IO45RSB0

71 GBB2/IO43RSB0

72 IO42RSB0

Pin Number AGL125 Function

73 GBA2/IO41RSB0

76 GBA1/IO40RSB0

77 GBA0/IO39RSB0

78 GBB1/IO38RSB0

79 GBB0/IO37RSB0

80 GBC1/IO36RSB0

81 GBC0/IO35RSB0

82 IO32RSB0

83 IO28RSB0

84 IO25RSB0

85 IO22RSB0

86 IO19RSB0

90 IO15RSB0

91 IO13RSB0

92 IO11RSB0

93 IO09RSB0

94 IO07RSB0

95 GAC1/IO05RSB0

96 GAC0/IO04RSB0

97 GAB1/IO03RSB0

98 GAB0/IO02RSB0

99 GAA1/IO01RSB0

100 GAA0/IO00RSB0

Pin Number AGL125 Function

v1.7 3-35 100-Pin VQFP Pin Number AGL250 Function

2 GAA2/IO118UDB3

3 IO118VDB3

4 GAB2/IO117UDB3

5 IO117VDB3

6 GAC2/IO116UDB3

7 IO116VDB3

8 IO112PSB3

10 GFB1/IO109PDB3

11 GFB0/IO109NDB3

13 GFA0/IO108NPB3

15 GFA1/IO108PPB3

16 GFA2/IO107PSB3

18 V CCIB3

19 GFC2/IO105PSB3

20 GEC1/IO100PDB3

21 GEC0/IO100NDB3

22 GEA1/IO98PDB3

23 GEA0/IO98NDB3

24 VMV3

26 GEA2/IO97RSB2

27 FF/GEB2/IO96RSB2

28 GEC2/IO95RSB2

29 IO93RSB2

30 IO92RSB2

31 IO91RSB2

32 IO90RSB2

33 IO88RSB2

34 IO86RSB2

35 IO85RSB2

36 IO84RSB2

39 V CCIB2

40 IO77RSB2

41 IO74RSB2

42 IO71RSB2

43 GDC2/IO63RSB2

44 GDB2/IO62RSB2

45 GDA2/IO61RSB2

46 GNDQ

50 VMV2

57 GDA1/IO60USB1

58 GDC0/IO58VDB1

59 GDC1/IO58UDB1

60 IO52NDB1

61 GCB2/IO52PDB1

62 GCA1/IO50PDB1

63 GCA0/IO50NDB1

64 GCC0/IO48NDB1

65 GCC1/IO48PDB1

69 IO43NDB1

70 GBC2/IO43PDB1

71 GBB2/IO42PSB1

72 IO41NDB1

Pin Number AGL250 Function

73 GBA2/IO41PDB1

74 VMV1

82 IO29RSB0

83 IO27RSB0

85 IO23RSB0

86 IO21RSB0

93 GAC1/IO05RSB0

94 GAC0/IO04RSB0

95 GAB1/IO03RSB0

96 GAB0/IO02RSB0

97 GAA1/IO01RSB0

98 GAA0/IO00RSB0

99 GNDQ

100 VMV0

Pin Number AGL250 Function

3-36 v1.7 144-Pin FBGA Note For Package Manufacturing and Environmental information, visit the Resource Center at http://www.actel.com/products/solutions/package/docs.aspx. Note: This is the bottom view of the package. Figure 3-10  123456789101112 A B C D E F G H J K L M A1 Ball Pad Corner

v1.7 3-37 144-Pin FBGA Pin Number AGL125 Function A1 GNDQ A2 VMV0 A3 GAB0/IO02RSB0 A4 GAB1/IO03RSB0 A5 IO11RSB0 A6 GND A7 IO18RSB0 A8 V CC A9 IO25RSB0 A10 GBA0/IO39RSB0 A11 GBA1/IO40RSB0 A12 GNDQ B1 GAB2/IO69RSB1 B2 GND B3 GAA0/IO00RSB0 B4 GAA1/IO01RSB0 B5 IO08RSB0 B6 IO14RSB0 B7 IO19RSB0 B8 IO22RSB0 B9 GBB0/IO37RSB0 B10 GBB1/IO38RSB0 B11 GND B12 VMV0 C1 IO132RSB1 C2 GFA2/IO120RSB1 C3 GAC2/IO131RSB1 C4 V CC C5 IO10RSB0 C6 IO12RSB0 C7 IO21RSB0 C8 IO24RSB0 C9 IO27RSB0 C10 GBA2/IO41RSB0 C11 IO42RSB0 C12 GBC2/IO45RSB0 D1 IO128RSB1 D2 IO129RSB1 D3 IO130RSB1 D4 GAA2/IO67RSB1 D5 GAC0/IO04RSB0 D6 GAC1/IO05RSB0 D7 GBC0/IO35RSB0 D8 GBC1/IO36RSB0 D9 GBB2/IO43RSB0 D10 IO28RSB0 D11 IO44RSB0 D12 GCB1/IO53RSB0 E1 V CC E2 GFC0/IO125RSB1 E3 GFC1/IO126RSB1 E4 V CCIB1 E5 IO68RSB1 E6 V CCIB0 E7 V CCIB0 E8 GCC1/IO51RSB0 E9 V CCIB0 E10 V CC E11 GCA0/IO56RSB0 E12 IO46RSB0 F1 GFB0/IO123RSB1 F2 V COMPLF F3 GFB1/IO124RSB1 F4 IO127RSB1 F5 GND F6 GND F7 GND F8 GCC0/IO52RSB0 F9 GCB0/IO54RSB0 F10 GND F11 GCA1/IO55RSB0 F12 GCA2/IO57RSB0 144-Pin FBGA Pin Number AGL125 Function G1 GFA1/IO121RSB1 G2 GND G3 V CCPLF G4 GFA0/IO122RSB1 G5 GND G6 GND G7 GND G8 GDC1/IO61RSB0 G9 IO48RSB0 G10 GCC2/IO59RSB0 G11 IO47RSB0 G12 GCB2/IO58RSB0 H1 V CC H2 GFB2/IO119RSB1 H3 GFC2/IO118RSB1 H4 GEC1/IO112RSB1 H5 V CC H6 IO50RSB0 H7 IO60RSB0 H8 GDB2/IO71RSB1 H9 GDC0/IO62RSB0 H10 V CCIB0 H11 IO49RSB0 H12 V CC J1 GEB1/IO110RSB1 J2 IO115RSB1 J3 V CCIB1 J4 GEC0/IO111RSB1 J5 IO116RSB1 J6 IO117RSB1 J7 V CC J8 TCK J9 GDA2/IO70RSB1 J10 TDO J11 GDA1/IO65RSB0 J12 GDB1/IO63RSB0 144-Pin FBGA Pin Number AGL125 Function

3-38 v1.7 K1 GEB0/IO109RSB1 K2 GEA1/IO108RSB1 K3 GEA0/IO107RSB1 K4 GEA2/IO106RSB1 K5 IO100RSB1 K6 IO98RSB1 K7 GND K8 IO73RSB1 K9 GDC2/IO72RSB1 K10 GND K11 GDA0/IO66RSB0 K12 GDB0/IO64RSB0 L1 GND L2 VMV1 L3 FF/GEB2/IO105RSB1 L4 IO102RSB1 L5 V CCIB1 L6 IO95RSB1 L7 IO85RSB1 L8 IO74RSB1 L9 TMS L10 V JTAG L11 VMV1 L12 TRST M1 GNDQ M2 GEC2/IO104RSB1 M3 IO103RSB1 M4 IO101RSB1 M5 IO97RSB1 M6 IO94RSB1 M7 IO86RSB1 M8 IO75RSB1 M9 TDI M10 V CCIB1 M11 V PUMP M12 GNDQ 144-Pin FBGA Pin Number AGL125 Function

v1.7 3-39 144-Pin FBGA Pin Number AGL250 Function A1 GNDQ A2 VMV0 A3 GAB0/IO02RSB0 A4 GAB1/IO03RSB0 A5 IO16RSB0 A6 GND A7 IO29RSB0 A8 V CC A9 IO33RSB0 A10 GBA0/IO39RSB0 A11 GBA1/IO40RSB0 A12 GNDQ B1 GAB2/IO117UDB3 B2 GND B3 GAA0/IO00RSB0 B4 GAA1/IO01RSB0 B5 IO14RSB0 B6 IO19RSB0 B7 IO22RSB0 B8 IO30RSB0 B9 GBB0/IO37RSB0 B10 GBB1/IO38RSB0 B11 GND B12 VMV1 C1 IO117VDB3 C2 GFA2/IO107PPB3 C3 GAC2/IO116UDB3 C4 V CC C5 IO12RSB0 C6 IO17RSB0 C7 IO24RSB0 C8 IO31RSB0 C9 IO34RSB0 C10 GBA2/IO41PDB1 C11 IO41NDB1 C12 GBC2/IO43PPB1 D1 IO112NDB3 D2 IO112PDB3 D3 IO116VDB3 D4 GAA2/IO118UPB3 D5 GAC0/IO04RSB0 D6 GAC1/IO05RSB0 D7 GBC0/IO35RSB0 D8 GBC1/IO36RSB0 D9 GBB2/IO42PDB1 D10 IO42NDB1 D11 IO43NPB1 D12 GCB1/IO49PPB1 E1 V CC E2 GFC0/IO110NDB3 E3 GFC1/IO110PDB3 E4 V CCIB3 E5 IO118VPB3 E6 V CCIB0 E7 V CCIB0 E8 GCC1/IO48PDB1 E9 V CCIB1 E10 V CC E11 GCA0/IO50NDB1 E12 IO51NDB1 F1 GFB0/IO109NPB3 F2 V COMPLF F3 GFB1/IO109PPB3 F4 IO107NPB3 F5 GND F6 GND F7 GND F8 GCC0/IO48NDB1 F9 GCB0/IO49NPB1 F10 GND F11 GCA1/IO50PDB1 F12 GCA2/IO51PDB1 144-Pin FBGA Pin Number AGL250 Function G1 GFA1/IO108PPB3 G2 GND G3 V CCPLF G4 GFA0/IO108NPB3 G5 GND G6 GND G7 GND G8 GDC1/IO58UPB1 G9 IO53NDB1 G10 GCC2/IO53PDB1 G11 IO52NDB1 G12 GCB2/IO52PDB1 H1 V CC H2 GFB2/IO106PDB3 H3 GFC2/IO105PSB3 H4 GEC1/IO100PDB3 H5 V CC H6 IO79RSB2 H7 IO65RSB2 H8 GDB2/IO62RSB2 H9 GDC0/IO58VPB1 H10 V CCIB1 H11 IO54PSB1 H12 V CC J1 GEB1/IO99PDB3 J2 IO106NDB3 J3 V CCIB3 J4 GEC0/IO100NDB3 J5 IO88RSB2 J6 IO81RSB2 J7 V CC J8 TCK J9 GDA2/IO61RSB2 J10 TDO J11 GDA1/IO60UDB1 J12 GDB1/IO59UDB1 144-Pin FBGA Pin Number AGL250 Function

3-40 v1.7 K1 GEB0/IO99NDB3 K2 GEA1/IO98PDB3 K3 GEA0/IO98NDB3 K4 GEA2/IO97RSB2 K5 IO90RSB2 K6 IO84RSB2 K7 GND K8 IO66RSB2 K9 GDC2/IO63RSB2 K10 GND K11 GDA0/IO60VDB1 K12 GDB0/IO59VDB1 L1 GND L2 VMV3 L3 FF/GEB2/IO96RSB2 L4 IO91RSB2 L5 V CCIB2 L6 IO82RSB2 L7 IO80RSB2 L8 IO72RSB2 L9 TMS L10 V JTAG L11 VMV2 L12 TRST M1 GNDQ M2 GEC2/IO95RSB2 M3 IO92RSB2 M4 IO89RSB2 M5 IO87RSB2 M6 IO85RSB2 M7 IO78RSB2 M8 IO76RSB2 M9 TDI M10 V CCIB2 M11 V PUMP M12 GNDQ 144-Pin FBGA Pin Number AGL250 Function

v1.7 3-41 144-pin FBGA Pin Number AGL400 Function A1 GNDQ A2 VMV0 A3 GAB0/IO02RSB0 A4 GAB1/IO03RSB0 A5 IO16RSB0 A6 GND A7 IO30RSB0 A8 V CC A9 IO34RSB0 A10 GBA0/IO58RSB0 A11 GBA1/IO59RSB0 A12 GNDQ B1 GAB2/IO154UDB3 B2 GND B3 GAA0/IO00RSB0 B4 GAA1/IO01RSB0 B5 IO14RSB0 B6 IO19RSB0 B7 IO23RSB0 B8 IO31RSB0 B9 GBB0/IO56RSB0 B10 GBB1/IO57RSB0 B11 GND B12 VMV1 C1 IO154VDB3 C2 GFA2/IO144PPB3 C3 GAC2/IO153UDB3 C4 V CC C5 IO12RSB0 C6 IO17RSB0 C7 IO25RSB0 C8 IO32RSB0 C9 IO53RSB0 C10 GBA2/IO60PDB1 C11 IO60NDB1 C12 GBC2/IO62PPB1 D1 IO149NDB3 D2 IO149PDB3 D3 IO153VDB3 D4 GAA2/IO155UPB3 D5 GAC0/IO04RSB0 D6 GAC1/IO05RSB0 D7 GBC0/IO54RSB0 D8 GBC1/IO55RSB0 D9 GBB2/IO61PDB1 D10 IO61NDB1 D11 IO62NPB1 D12 GCB1/IO68PPB1 E1 V CC E2 GFC0/IO147NDB3 E3 GFC1/IO147PDB3 E4 V CCIB3 E5 IO155VPB3 E6 V CCIB0 E7 V CCIB0 E8 GCC1/IO67PDB1 E9 V CCIB1 E10 V CC E11 GCA0/IO69NDB1 E12 IO70NDB1 F1 GFB0/IO146NPB3 F2 V COMPLF F3 GFB1/IO146PPB3 F4 IO144NPB3 F5 GND F6 GND F7 GND F8 GCC0/IO67NDB1 F9 GCB0/IO68NPB1 F10 GND F11 GCA1/IO69PDB1 F12 GCA2/IO70PDB1 144-pin FBGA Pin Number AGL400 Function G1 GFA1/IO145PPB3 G2 GND G3 V CCPLF G4 GFA0/IO145NPB3 G5 GND G6 GND G7 GND G8 GDC1/IO77UPB1 G9 IO72NDB1 G10 GCC2/IO72PDB1 G11 IO71NDB1 G12 GCB2/IO71PDB1 H1 V CC H2 GFB2/IO143PDB3 H3 GFC2/IO142PSB3 H4 GEC1/IO137PDB3 H5 V CC H6 IO75PDB1 H7 IO75NDB1 H8 GDB2/IO81RSB2 H9 GDC0/IO77VPB1 H10 V CCIB1 H11 IO73PSB1 H12 V CC J1 GEB1/IO136PDB3 J2 IO143NDB3 J3 V CCIB3 J4 GEC0/IO137NDB3 J5 IO125RSB2 J6 IO116RSB2 J7 V CC J8 TCK J9 GDA2/IO80RSB2 J10 TDO J11 GDA1/IO79UDB1 J12 GDB1/IO78UDB1 144-pin FBGA Pin Number AGL400 Function

3-42 v1.7 K1 GEB0/IO136NDB3 K2 GEA1/IO135PDB3 K3 GEA0/IO135NDB3 K4 GEA2/IO134RSB2 K5 IO127RSB2 K6 IO121RSB2 K7 GND K8 IO104RSB2 K9 GDC2/IO82RSB2 K10 GND K11 GDA0/IO79VDB1 K12 GDB0/IO78VDB1 L1 GND L2 VMV3 L3 FF/GEB2/IO133RSB2 L4 IO128RSB2 L5 V CCIB2 L6 IO119RSB2 L7 IO114RSB2 L8 IO110RSB2 L9 TMS L10 V JTAG L11 VMV2 L12 TRST M1 GNDQ M2 GEC2/IO132RSB2 M3 IO129RSB2 M4 IO126RSB2 M5 IO124RSB2 M6 IO122RSB2 M7 IO117RSB2 M8 IO115RSB2 M9 TDI M10 V CCIB2 M11 V PUMP M12 GNDQ 144-pin FBGA Pin Number AGL400 Function

v1.7 3-43 144-Pin FBGA Pin Number AGL600 Function A1 GNDQ A2 VMV0 A3 GAB0/IO02RSB0 A4 GAB1/IO03RSB0 A5 IO10RSB0 A6 GND A7 IO34RSB0 A8 V CC A9 IO50RSB0 A10 GBA0/IO58RSB0 A11 GBA1/IO59RSB0 A12 GNDQ B1 GAB2/IO173PDB3 B2 GND B3 GAA0/IO00RSB0 B4 GAA1/IO01RSB0 B5 IO13RSB0 B6 IO19RSB0 B7 IO31RSB0 B8 IO39RSB0 B9 GBB0/IO56RSB0 B10 GBB1/IO57RSB0 B11 GND B12 VMV1 C1 IO173NDB3 C2 GFA2/IO161PPB3 C3 GAC2/IO172PDB3 C4 V CC C5 IO16RSB0 C6 IO25RSB0 C7 IO28RSB0 C8 IO42RSB0 C9 IO45RSB0 C10 GBA2/IO60PDB1 C11 IO60NDB1 C12 GBC2/IO62PPB1 D1 IO169PDB3 D2 IO169NDB3 D3 IO172NDB3 D4 GAA2/IO174PPB3 D5 GAC0/IO04RSB0 D6 GAC1/IO05RSB0 D7 GBC0/IO54RSB0 D8 GBC1/IO55RSB0 D9 GBB2/IO61PDB1 D10 IO61NDB1 D11 IO62NPB1 D12 GCB1/IO70PPB1 E1 V CC E2 GFC0/IO164NDB3 E3 GFC1/IO164PDB3 E4 V CCIB3 E5 IO174NPB3 E6 V CCIB0 E7 V CCIB0 E8 GCC1/IO69PDB1 E9 V CCIB1 E10 V CC E11 GCA0/IO71NDB1 E12 IO72NDB1 F1 GFB0/IO163NPB3 F2 V COMPLF F3 GFB1/IO163PPB3 F4 IO161NPB3 F5 GND F6 GND F7 GND F8 GCC0/IO69NDB1 F9 GCB0/IO70NPB1 F10 GND F11 GCA1/IO71PDB1 F12 GCA2/IO72PDB1 144-Pin FBGA Pin Number AGL600 Function G1 GFA1/IO162PPB3 G2 GND G3 VCCPLF G4 GFA0/IO162NPB3 G5 GND G6 GND G7 GND G8 GDC1/IO86PPB1 G9 IO74NDB1 G10 GCC2/IO74PDB1 G11 IO73NDB1 G12 GCB2/IO73PDB1 H1 V CC H2 GFB2/IO160PDB3 H3 GFC2/IO159PSB3 H4 GEC1/IO146PDB3 H5 V CC H6 IO80PDB1 H7 IO80NDB1 H8 GDB2/IO90RSB2 H9 GDC0/IO86NPB1 H10 V CCIB1 H11 IO84PSB1 H12 V CC J1 GEB1/IO145PDB3 J2 IO160NDB3 J3 V CCIB3 J4 GEC0/IO146NDB3 J5 IO129RSB2 J6 IO131RSB2 J7 V CC J8 TCK J9 GDA2/IO89RSB2 J10 TDO J11 GDA1/IO88PDB1 J12 GDB1/IO87PDB1 144-Pin FBGA Pin Number AGL600 Function

3-44 v1.7 K1 GEB0/IO145NDB3 K2 GEA1/IO144PDB3 K3 GEA0/IO144NDB3 K4 GEA2/IO143RSB2 K5 IO119RSB2 K6 IO111RSB2 K7 GND K8 IO94RSB2 K9 GDC2/IO91RSB2 K10 GND K11 GDA0/IO88NDB1 K12 GDB0/IO87NDB1 L1 GND L2 VMV3 L3 FF/GEB2/IO142RSB2 L4 IO136RSB2 L5 V CCIB2 L6 IO115RSB2 L7 IO103RSB2 L8 IO97RSB2 L9 TMS L10 V JTAG L11 VMV2 L12 TRST M1 GNDQ M2 GEC2/IO141RSB2 M3 IO138RSB2 M4 IO123RSB2 M5 IO126RSB2 M6 IO134RSB2 M7 IO108RSB2 M8 IO99RSB2 M9 TDI M10 V CCIB2 M11 V PUMP M12 GNDQ 144-Pin FBGA Pin Number AGL600 Function

v1.7 3-45 144-Pin FBGA Pin Number AGL1000 Function A1 GNDQ A2 VMV0 A3 GAB0/IO02RSB0 A4 GAB1/IO03RSB0 A5 IO10RSB0 A6 GND A7 IO44RSB0 A8 V CC A9 IO69RSB0 A10 GBA0/IO76RSB0 A11 GBA1/IO77RSB0 A12 GNDQ B1 GAB2/IO224PDB3 B2 GND B3 GAA0/IO00RSB0 B4 GAA1/IO01RSB0 B5 IO13RSB0 B6 IO26RSB0 B7 IO35RSB0 B8 IO60RSB0 B9 GBB0/IO74RSB0 B10 GBB1/IO75RSB0 B11 GND B12 VMV1 C1 IO224NDB3 C2 GFA2/IO206PPB3 C3 GAC2/IO223PDB3 C4 V CC C5 IO16RSB0 C6 IO29RSB0 C7 IO32RSB0 C8 IO63RSB0 C9 IO66RSB0 C10 GBA2/IO78PDB1 C11 IO78NDB1 C12 GBC2/IO80PPB1 D1 IO213PDB3 D2 IO213NDB3 D3 IO223NDB3 D4 GAA2/IO225PPB3 D5 GAC0/IO04RSB0 D6 GAC1/IO05RSB0 D7 GBC0/IO72RSB0 D8 GBC1/IO73RSB0 D9 GBB2/IO79PDB1 D10 IO79NDB1 D11 IO80NPB1 D12 GCB1/IO92PPB1 E1 V CC E2 GFC0/IO209NDB3 E3 GFC1/IO209PDB3 E4 V CCIB3 E5 IO225NPB3 E6 V CCIB0 E7 V CCIB0 E8 GCC1/IO91PDB1 E9 V CCIB1 E10 V CC E11 GCA0/IO93NDB1 E12 IO94NDB1 F1 GFB0/IO208NPB3 F2 V COMPLF F3 GFB1/IO208PPB3 F4 IO206NPB3 F5 GND F6 GND F7 GND F8 GCC0/IO91NDB1 F9 GCB0/IO92NPB1 F10 GND F11 GCA1/IO93PDB1 F12 GCA2/IO94PDB1 144-Pin FBGA Pin Number AGL1000 Function G1 GFA1/IO207PPB3 G2 GND G3 V CCPLF G4 GFA0/IO207NPB3 G5 GND G6 GND G7 GND G8 GDC1/IO111PPB1 G9 IO96NDB1 G10 GCC2/IO96PDB1 G11 IO95NDB1 G12 GCB2/IO95PDB1 H1 V CC H2 GFB2/IO205PDB3 H3 GFC2/IO204PSB3 H4 GEC1/IO190PDB3 H5 V CC H6 IO105PDB1 H7 IO105NDB1 H8 GDB2/IO115RSB2 H9 GDC0/IO111NPB1 H10 V CCIB1 H11 IO101PSB1 H12 V CC J1 GEB1/IO189PDB3 J2 IO205NDB3 J3 V CCIB3 J4 GEC0/IO190NDB3 J5 IO160RSB2 J6 IO157RSB2 J7 V CC J8 TCK J9 GDA2/IO114RSB2 J10 TDO J11 GDA1/IO113PDB1 J12 GDB1/IO112PDB1 144-Pin FBGA Pin Number AGL1000 Function

3-46 v1.7 K1 GEB0/IO189NDB3 K2 GEA1/IO188PDB3 K3 GEA0/IO188NDB3 K4 GEA2/IO187RSB2 K5 IO169RSB2 K6 IO152RSB2 K7 GND K8 IO117RSB2 K9 GDC2/IO116RSB2 K10 GND K11 GDA0/IO113NDB1 K12 GDB0/IO112NDB1 L1 GND L2 VMV3 L3 FF/GEB2/IO186RSB2 L4 IO172RSB2 L5 V CCIB2 L6 IO153RSB2 L7 IO144RSB2 L8 IO140RSB2 L9 TMS L10 V JTAG L11 VMV2 L12 TRST M1 GNDQ M2 GEC2/IO185RSB2 M3 IO173RSB2 M4 IO168RSB2 M5 IO161RSB2 M6 IO156RSB2 M7 IO145RSB2 M8 IO141RSB2 M9 TDI M10 V CCIB2 M11 V PUMP M12 GNDQ 144-Pin FBGA Pin Number AGL1000 Function

v1.7 3-47 256-Pin FBGA Note For Package Manufacturing and Environmental information, visit the Resource Center at http://www.actel.com/products/solutions/package/docs.aspx. Note: This is the bottom view of the package. Figure 3-11  13579111315 246810121416 C E G J L N R D F H K M P T B A A1 Ball Pad Corner

3-48 v1.7 256-Pin FBGA Pin Number AGL400 Function A1 GND A2 GAA0/IO00RSB0 A3 GAA1/IO01RSB0 A4 GAB0/IO02RSB0 A5 IO16RSB0 A6 IO17RSB0 A7 IO22RSB0 A8 IO28RSB0 A9 IO34RSB0 A10 IO37RSB0 A11 IO41RSB0 A12 IO43RSB0 A13 GBB1/IO57RSB0 A14 GBA0/IO58RSB0 A15 GBA1/IO59RSB0 A16 GND B1 GAB2/IO154UDB3 B2 GAA2/IO155UDB3 B3 IO12RSB0 B4 GAB1/IO03RSB0 B5 IO13RSB0 B6 IO14RSB0 B7 IO21RSB0 B8 IO27RSB0 B9 IO32RSB0 B10 IO38RSB0 B11 IO42RSB0 B12 GBC1/IO55RSB0 B13 GBB0/IO56RSB0 B14 IO44RSB0 B15 GBA2/IO60PDB1 B16 IO60NDB1 C1 IO154VDB3 C2 IO155VDB3 C3 IO11RSB0 C4 IO07RSB0 C5 GAC0/IO04RSB0 C6 GAC1/IO05RSB0 C7 IO20RSB0 C8 IO24RSB0 C9 IO33RSB0 C10 IO39RSB0 C11 IO45RSB0 C12 GBC0/IO54RSB0 C13 IO48RSB0 C14 VMV0 C15 IO61NPB1 C16 IO63PDB1 D1 IO151VDB3 D2 IO151UDB3 D3 GAC2/IO153UDB3 D4 IO06RSB0 D5 GNDQ D6 IO10RSB0 D7 IO19RSB0 D8 IO26RSB0 D9 IO30RSB0 D10 IO40RSB0 D11 IO46RSB0 D12 GNDQ D13 IO47RSB0 D14 GBB2/IO61PPB1 D15 IO53RSB0 D16 IO63NDB1 E1 IO150PDB3 E2 IO08RSB0 E3 IO153VDB3 E4 IO152VDB3 E5 VMV0 E6 V CCIB0 E7 V CCIB0 E8 IO25RSB0 256-Pin FBGA Pin Number AGL400 Function E9 IO31RSB0 E10 V CCIB0 E11 V CCIB0 E12 VMV1 E13 GBC2/IO62PDB1 E14 IO65RSB1 E15 IO52RSB0 E16 IO66PDB1 F1 IO150NDB3 F2 IO149NPB3 F3 IO09RSB0 F4 IO152UDB3 F5 V CCIB3 F6 GND F7 V CC F8 V CC F9 V CC F10 V CC F11 GND F12 V CCIB1 F13 IO62NDB1 F14 IO49RSB0 F15 IO64PPB1 F16 IO66NDB1 G1 IO148NDB3 G2 IO148PDB3 G3 IO149PPB3 G4 GFC1/IO147PPB3 G5 V CCIB3 G6 V CC G7 GND G8 GND G9 GND G10 GND G11 V CC G12 V CCIB1 256-Pin FBGA Pin Number AGL400 Function

v1.7 3-49 G13 GCC1/IO67PPB1 G14 IO64NPB1 G15 IO73PDB1 G16 IO73NDB1 H1 GFB0/IO146NPB3 H2 GFA0/IO145NDB3 H3 GFB1/IO146PPB3 H4 V COMPLF H5 GFC0/IO147NPB3 H6 V CC H7 GND H8 GND H9 GND H10 GND H11 V CC H12 GCC0/IO67NPB1 H13 GCB1/IO68PPB1 H14 GCA0/IO69NPB1 H15 NC H16 GCB0/IO68NPB1 J1 GFA2/IO144PPB3 J2 GFA1/IO145PDB3 J3 V CCPLF J4 IO143NDB3 J5 GFB2/IO143PDB3 J6 V CC J7 GND J8 GND J9 GND J10 GND J11 V CC J12 GCB2/IO71PPB1 J13 GCA1/IO69PPB1 J14 GCC2/IO72PPB1 J15 NC J16 GCA2/IO70PDB1 256-Pin FBGA Pin Number AGL400 Function K1 GFC2/IO142PDB3 K2 IO144NPB3 K3 IO141PPB3 K4 IO120RSB2 K5 V CCIB3 K6 V CC K7 GND K8 GND K9 GND K10 GND K11 V CC K12 V CCIB1 K13 IO71NPB1 K14 IO74RSB1 K15 IO72NPB1 K16 IO70NDB1 L1 IO142NDB3 L2 IO141NPB3 L3 IO125RSB2 L4 IO139RSB3 L5 V CCIB3 L6 GND L7 V CC L8 V CC L9 V CC L10 V CC L11 GND L12 V CCIB1 L13 GDB0/IO78VPB1 L14 IO76VDB1 L15 IO76UDB1 L16 IO75PDB1 M1 IO140PDB3 M2 IO130RSB2 M3 IO138NPB3 M4 GEC0/IO137NPB3 256-Pin FBGA Pin Number AGL400 Function M5 VMV3 M6 V CCIB2 M7 V CCIB2 M8 IO108RSB2 M9 IO101RSB2 M10 V CCIB2 M11 V CCIB2 M12 VMV2 M13 IO83RSB2 M14 GDB1/IO78UPB1 M15 GDC1/IO77UDB1 M16 IO75NDB1 N1 IO140NDB3 N2 IO138PPB3 N3 GEC1/IO137PPB3 N4 IO131RSB2 N5 GNDQ N6 GEA2/IO134RSB2 N7 IO117RSB2 N8 IO111RSB2 N9 IO99RSB2 N10 IO94RSB2 N11 IO87RSB2 N12 GNDQ N13 IO93RSB2 N14 V JTAG N15 GDC0/IO77VDB1 N16 GDA1/IO79UDB1 P1 GEB1/IO136PDB3 P2 GEB0/IO136NDB3 P3 VMV2 P4 IO129RSB2 P5 IO128RSB2 P6 IO122RSB2 P7 IO115RSB2 P8 IO110RSB2 256-Pin FBGA Pin Number AGL400 Function

3-50 v1.7 P9 IO98RSB2 P10 IO95RSB2 P11 IO88RSB2 P12 IO84RSB2 P13 TCK P14 V PUMP P15 TRST P16 GDA0/IO79VDB1 R1 GEA1/IO135PDB3 R2 GEA0/IO135NDB3 R3 IO127RSB2 R4 GEC2/IO132RSB2 R5 IO123RSB2 R6 IO118RSB2 R7 IO112RSB2 R8 IO106RSB2 R9 IO100RSB2 R10 IO96RSB2 R11 IO89RSB2 R12 IO85RSB2 R13 GDB2/IO81RSB2 R14 TDI R15 NC R16 TDO T1 GND T2 IO126RSB2 T3 FF/GEB2/IO133RSB T4 IO124RSB2 T5 IO116RSB2 T6 IO113RSB2 T7 IO107RSB2 T8 IO105RSB2 T9 IO102RSB2 T10 IO97RSB2 T11 IO92RSB2 256-Pin FBGA Pin Number AGL400 Function T12 GDC2/IO82RSB2 T13 IO86RSB2 T14 GDA2/IO80RSB2 T15 TMS T16 GND 256-Pin FBGA Pin Number AGL400 Function

v1.7 3-51 256-Pin FBGA Pin Number AGL600 Function A1 GND A2 GAA0/IO00RSB0 A3 GAA1/IO01RSB0 A4 GAB0/IO02RSB0 A5 IO11RSB0 A6 IO16RSB0 A7 IO18RSB0 A8 IO28RSB0 A9 IO34RSB0 A10 IO37RSB0 A11 IO41RSB0 A12 IO43RSB0 A13 GBB1/IO57RSB0 A14 GBA0/IO58RSB0 A15 GBA1/IO59RSB0 A16 GND B1 GAB2/IO173PDB3 B2 GAA2/IO174PDB3 B3 GNDQ B4 GAB1/IO03RSB0 B5 IO13RSB0 B6 IO14RSB0 B7 IO21RSB0 B8 IO27RSB0 B9 IO32RSB0 B10 IO38RSB0 B11 IO42RSB0 B12 GBC1/IO55RSB0 B13 GBB0/IO56RSB0 B14 IO52RSB0 B15 GBA2/IO60PDB1 B16 IO60NDB1 C1 IO173NDB3 C2 IO174NDB3 C3 VMV3 C4 IO07RSB0 C5 GAC0/IO04RSB0 C6 GAC1/IO05RSB0 C7 IO20RSB0 C8 IO24RSB0 C9 IO33RSB0 C10 IO39RSB0 C11 IO44RSB0 C12 GBC0/IO54RSB0 C13 IO51RSB0 C14 VMV0 C15 IO61NPB1 C16 IO63PDB1 D1 IO171NDB3 D2 IO171PDB3 D3 GAC2/IO172PDB3 D4 IO06RSB0 D5 GNDQ D6 IO10RSB0 D7 IO19RSB0 D8 IO26RSB0 D9 IO30RSB0 D10 IO40RSB0 D11 IO45RSB0 D12 GNDQ D13 IO50RSB0 D14 GBB2/IO61PPB1 D15 IO53RSB0 D16 IO63NDB1 E1 IO166PDB3 E2 IO167NPB3 E3 IO172NDB3 E4 IO169NDB3 E5 VMV0 E6 V CCIB0 E7 V CCIB0 E8 IO25RSB0 E9 IO31RSB0 E10 V CCIB0 E11 V CCIB0 E12 VMV1 256-Pin FBGA Pin Number AGL600 Function E13 GBC2/IO62PDB1 E14 IO67PPB1 E15 IO64PPB1 E16 IO66PDB1 F1 IO166NDB3 F2 IO168NPB3 F3 IO167PPB3 F4 IO169PDB3 F5 V CCIB3 F6 GND F7 V CC F8 V CC F9 V CC F10 V CC F11 GND F12 V CCIB1 F13 IO62NDB1 F14 IO64NPB1 F15 IO65PPB1 F16 IO66NDB1 G1 IO165NDB3 G2 IO165PDB3 G3 IO168PPB3 G4 GFC1/IO164PPB3 G5 V CCIB3 G6 V CC G7 GND G8 GND G9 GND G10 GND G11 V CC G12 V CCIB1 G13 GCC1/IO69PPB1 G14 IO65NPB1 G15 IO75PDB1 G16 IO75NDB1 H1 GFB0/IO163NPB3 H2 GFA0/IO162NDB3 256-Pin FBGA Pin Number AGL600 Function

3-52 v1.7 H3 GFB1/IO163PPB3 H4 V COMPLF H5 GFC0/IO164NPB3 H6 V CC H7 GND H8 GND H9 GND H10 GND H11 V CC H12 GCC0/IO69NPB1 H13 GCB1/IO70PPB1 H14 GCA0/IO71NPB1 H15 IO67NPB1 H16 GCB0/IO70NPB1 J1 GFA2/IO161PPB3 J2 GFA1/IO162PDB3 J3 VCCPLF J4 IO160NDB3 J5 GFB2/IO160PDB3 J6 V CC J7 GND J8 GND J9 GND J10 GND J11 V CC J12 GCB2/IO73PPB1 J13 GCA1/IO71PPB1 J14 GCC2/IO74PPB1 J15 IO80PPB1 J16 GCA2/IO72PDB1 K1 GFC2/IO159PDB3 K2 IO161NPB3 K3 IO156PPB3 K4 IO129RSB2 K5 V CCIB3 K6 V CC K7 GND K8 GND 256-Pin FBGA Pin Number AGL600 Function K9 GND K10 GND K11 V CC K12 V CCIB1 K13 IO73NPB1 K14 IO80NPB1 K15 IO74NPB1 K16 IO72NDB1 L1 IO159NDB3 L2 IO156NPB3 L3 IO151PPB3 L4 IO158PSB3 L5 V CCIB3 L6 GND L7 V CC L8 V CC L9 V CC L10 V CC L11 GND L12 V CCIB1 L13 GDB0/IO87NPB1 L14 IO85NDB1 L15 IO85PDB1 L16 IO84PDB1 M1 IO150PDB3 M2 IO151NPB3 M3 IO147NPB3 M4 GEC0/IO146NPB3 M5 VMV3 M6 V CCIB2 M7 V CCIB2 M8 IO117RSB2 M9 IO110RSB2 M10 V CCIB2 M11 V CCIB2 M12 VMV2 M13 IO94RSB2 M14 GDB1/IO87PPB1 256-Pin FBGA Pin Number AGL600 Function M15 GDC1/IO86PDB1 M16 IO84NDB1 N1 IO150NDB3 N2 IO147PPB3 N3 GEC1/IO146PPB3 N4 IO140RSB2 N5 GNDQ N6 GEA2/IO143RSB2 N7 IO126RSB2 N8 IO120RSB2 N9 IO108RSB2 N10 IO103RSB2 N11 IO99RSB2 N12 GNDQ N13 IO92RSB2 N14 V JTAG N15 GDC0/IO86NDB1 N16 GDA1/IO88PDB1 P1 GEB1/IO145PDB3 P2 GEB0/IO145NDB3 P3 VMV2 P4 IO138RSB2 P5 IO136RSB2 P6 IO131RSB2 P7 IO124RSB2 P8 IO119RSB2 P9 IO107RSB2 P10 IO104RSB2 P11 IO97RSB2 P12 VMV1 P13 TCK P14 VPUMP P15 TRST P16 GDA0/IO88NDB1 R1 GEA1/IO144PDB3 R2 GEA0/IO144NDB3 R3 IO139RSB2 R4 GEC2/IO141RSB2 256-Pin FBGA Pin Number AGL600 Function

v1.7 3-53 R5 IO132RSB2 R6 IO127RSB2 R7 IO121RSB2 R8 IO114RSB2 R9 IO109RSB2 R10 IO105RSB2 R11 IO98RSB2 R12 IO96RSB2 R13 GDB2/IO90RSB2 R14 TDI R15 GNDQ R16 TDO T1 GND T2 IO137RSB2 T3 FF/GEB2/IO142RSB2 T4 IO134RSB2 T5 IO125RSB2 T6 IO123RSB2 T7 IO118RSB2 T8 IO115RSB2 T9 IO111RSB2 T10 IO106RSB2 T11 IO102RSB2 T12 GDC2/IO91RSB2 T13 IO93RSB2 T14 GDA2/IO89RSB2 T15 TMS T16 GND 256-Pin FBGA Pin Number AGL600 Function

3-54 v1.7 256-Pin FBGA Pin Number AGL1000 Function A1 GND A2 GAA0/IO00RSB0 A3 GAA1/IO01RSB0 A4 GAB0/IO02RSB0 A5 IO16RSB0 A6 IO22RSB0 A7 IO28RSB0 A8 IO35RSB0 A9 IO45RSB0 A10 IO50RSB0 A11 IO55RSB0 A12 IO61RSB0 A13 GBB1/IO75RSB0 A14 GBA0/IO76RSB0 A15 GBA1/IO77RSB0 A16 GND B1 GAB2/IO224PDB3 B2 GAA2/IO225PDB3 B3 GNDQ B4 GAB1/IO03RSB0 B5 IO17RSB0 B6 IO21RSB0 B7 IO27RSB0 B8 IO34RSB0 B9 IO44RSB0 B10 IO51RSB0 B11 IO57RSB0 B12 GBC1/IO73RSB0 B13 GBB0/IO74RSB0 B14 IO71RSB0 B15 GBA2/IO78PDB1 B16 IO81PDB1 C1 IO224NDB3 C2 IO225NDB3 C3 VMV3 C4 IO11RSB0 C5 GAC0/IO04RSB0 C6 GAC1/IO05RSB0 C7 IO25RSB0 C8 IO36RSB0 C9 IO42RSB0 C10 IO49RSB0 C11 IO56RSB0 C12 GBC0/IO72RSB0 C13 IO62RSB0 C14 VMV0 C15 IO78NDB1 C16 IO81NDB1 D1 IO222NDB3 D2 IO222PDB3 D3 GAC2/IO223PDB3 D4 IO223NDB3 D5 GNDQ D6 IO23RSB0 D7 IO29RSB0 D8 IO33RSB0 D9 IO46RSB0 D10 IO52RSB0 D11 IO60RSB0 D12 GNDQ D13 IO80NDB1 D14 GBB2/IO79PDB1 D15 IO79NDB1 D16 IO82NSB1 E1 IO217PDB3 E2 IO218PDB3 E3 IO221NDB3 E4 IO221PDB3 E5 VMV0 E6 V CCIB0 E7 V CCIB0 E8 IO38RSB0 E9 IO47RSB0 E10 V CCIB0 E11 V CCIB0 E12 VMV1 256-Pin FBGA Pin Number AGL1000 Function E13 GBC2/IO80PDB1 E14 IO83PPB1 E15 IO86PPB1 E16 IO87PDB1 F1 IO217NDB3 F2 IO218NDB3 F3 IO216PDB3 F4 IO216NDB3 F5 V CCIB3 F6 GND F7 V CC F8 V CC F9 V CC F10 V CC F11 GND F12 V CCIB1 F13 IO83NPB1 F14 IO86NPB1 F15 IO90PPB1 F16 IO87NDB1 G1 IO210PSB3 G2 IO213NDB3 G3 IO213PDB3 G4 GFC1/IO209PPB3 G5 V CCIB3 G6 V CC G7 GND G8 GND G9 GND G10 GND G11 V CC G12 V CCIB1 G13 GCC1/IO91PPB1 G14 IO90NPB1 G15 IO88PDB1 G16 IO88NDB1 H1 GFB0/IO208NPB3 H2 GFA0/IO207NDB3 256-Pin FBGA Pin Number AGL1000 Function

v1.7 3-55 H3 GFB1/IO208PPB3 H4 V COMPLF H5 GFC0/IO209NPB3 H6 V CC H7 GND H8 GND H9 GND H10 GND H11 V CC H12 GCC0/IO91NPB1 H13 GCB1/IO92PPB1 H14 GCA0/IO93NPB1 H15 IO96NPB1 H16 GCB0/IO92NPB1 J1 GFA2/IO206PSB3 J2 GFA1/IO207PDB3 J3 V CCPLF J4 IO205NDB3 J5 GFB2/IO205PDB3 J6 V CC J7 GND J8 GND J9 GND J10 GND J11 V CC J12 GCB2/IO95PPB1 J13 GCA1/IO93PPB1 J14 GCC2/IO96PPB1 J15 IO100PPB1 J16 GCA2/IO94PSB1 K1 GFC2/IO204PDB3 K2 IO204NDB3 K3 IO203NDB3 K4 IO203PDB3 K5 V CCIB3 K6 V CC K7 GND K8 GND 256-Pin FBGA Pin Number AGL1000 Function K9 GND K10 GND K11 V CC K12 V CCIB1 K13 IO95NPB1 K14 IO100NPB1 K15 IO102NDB1 K16 IO102PDB1 L1 IO202NDB3 L2 IO202PDB3 L3 IO196PPB3 L4 IO193PPB3 L5 V CCIB3 L6 GND L7 V CC L8 V CC L9 V CC L10 V CC L11 GND L12 V CCIB1 L13 GDB0/IO112NPB1 L14 IO106NDB1 L15 IO106PDB1 L16 IO107PDB1 M1 IO197NSB3 M2 IO196NPB3 M3 IO193NPB3 M4 GEC0/IO190NPB3 M5 VMV3 M6 V CCIB2 M7 V CCIB2 M8 IO147RSB2 M9 IO136RSB2 M10 V CCIB2 M11 V CCIB2 M12 VMV2 M13 IO110NDB1 M14 GDB1/IO112PPB1 256-Pin FBGA Pin Number AGL1000 Function M15 GDC1/IO111PDB1 M16 IO107NDB1 N1 IO194PSB3 N2 IO192PPB3 N3 GEC1/IO190PPB3 N4 IO192NPB3 N5 GNDQ N6 GEA2/IO187RSB2 N7 IO161RSB2 N8 IO155RSB2 N9 IO141RSB2 N10 IO129RSB2 N11 IO124RSB2 N12 GNDQ N13 IO110PDB1 N14 V JTAG N15 GDC0/IO111NDB1 N16 GDA1/IO113PDB1 P1 GEB1/IO189PDB3 P2 GEB0/IO189NDB3 P3 VMV2 P4 IO179RSB2 P5 IO171RSB2 P6 IO165RSB2 P7 IO159RSB2 P8 IO151RSB2 P9 IO137RSB2 P10 IO134RSB2 P11 IO128RSB2 P12 VMV1 P13 TCK P14 V PUMP P15 TRST P16 GDA0/IO113NDB1 R1 GEA1/IO188PDB3 R2 GEA0/IO188NDB3 R3 IO184RSB2 R4 GEC2/IO185RSB2 256-Pin FBGA Pin Number AGL1000 Function

3-56 v1.7 R5 IO168RSB2 R6 IO163RSB2 R7 IO157RSB2 R8 IO149RSB2 R9 IO143RSB2 R10 IO138RSB2 R11 IO131RSB2 R12 IO125RSB2 R13 GDB2/IO115RSB2 R14 TDI R15 GNDQ R16 TDO T1 GND T2 IO183RSB2 T3 FF/GEB2/IO186RSB2 T4 IO172RSB2 T5 IO170RSB2 T6 IO164RSB2 T7 IO158RSB2 T8 IO153RSB2 T9 IO142RSB2 T10 IO135RSB2 T11 IO130RSB2 T12 GDC2/IO116RSB2 T13 IO120RSB2 T14 GDA2/IO114RSB2 T15 TMS T16 GND 256-Pin FBGA Pin Number AGL1000 Function

v1.7 3-57 484-Pin FBGA Note For Package Manufacturing and Environmental information, visit the Resource Center at http://www.actel.com/products/solutions/package/docs.aspx. Note: This is the bottom view of the package. Figure 3-12  A B C D E F G H J K L M N P R T U V W Y AA AB 12345678910111213141516171819202122 A1 Ball Pad Corner

3-58 v1.7 484-Pin FBGA Pin Number AGL400 Function A1 GND A2 GND A3 V CCIB0 A4 NC A5 NC A6 IO15RSB0 A7 IO18RSB0 A8 NC A9 NC A10 IO23RSB0 A11 IO29RSB0 A12 IO35RSB0 A13 IO36RSB0 A14 NC A15 NC A16 IO50RSB0 A17 IO51RSB0 A18 NC A19 NC A20 V CCIB0 A21 GND A22 GND AA1 GND AA2 V CCIB3 AA3 NC AA4 NC AA5 NC AA6 NC AA7 NC AA8 NC AA9 NC AA10 NC AA11 NC AA12 NC AA13 NC AA14 NC AA15 NC AA16 NC AA17 NC AA18 NC AA19 NC AA20 NC AA21 V CCIB1 AA22 GND AB1 GND AB2 GND AB3 V CCIB2 AB4 NC AB5 NC AB6 IO121RSB2 AB7 IO119RSB2 AB8 IO114RSB2 AB9 IO109RSB2 AB10 NC AB11 NC AB12 IO104RSB2 AB13 IO103RSB2 AB14 NC AB15 NC AB16 IO91RSB2 AB17 IO90RSB2 AB18 NC AB19 NC AB20 V CCIB2 AB21 GND AB22 GND B1 GND B2 V CCIB3 B3 NC B4 NC B5 NC B6 NC 484-Pin FBGA Pin Number AGL400 Function B7 NC B8 NC B9 NC B10 NC B11 NC B12 NC B13 NC B14 NC B15 NC B16 NC B17 NC B18 NC B19 NC B20 NC B21 V CCIB1 B22 GND C1 V CCIB3 C2 NC C3 NC C4 NC C5 GND C6 NC C7 NC C8 V CC C9 V CC C10 NC C11 NC C12 NC C13 NC C14 V CC C15 V CC C16 NC C17 NC C18 GND C19 NC C20 NC 484-Pin FBGA Pin Number AGL400 Function

v1.7 3-59 C21 NC C22 V CCIB1 D1 NC D2 NC D3 NC D4 GND D5 GAA0/IO00RSB0 D6 GAA1/IO01RSB0 D7 GAB0/IO02RSB0 D8 IO16RSB0 D9 IO17RSB0 D10 IO22RSB0 D11 IO28RSB0 D12 IO34RSB0 D13 IO37RSB0 D14 IO41RSB0 D15 IO43RSB0 D16 GBB1/IO57RSB0 D17 GBA0/IO58RSB0 D18 GBA1/IO59RSB0 D19 GND D20 NC D21 NC D22 NC E1 NC E2 NC E3 GND E4 GAB2/IO154UDB3 E5 GAA2/IO155UDB3 E6 IO12RSB0 E7 GAB1/IO03RSB0 E8 IO13RSB0 E9 IO14RSB0 E10 IO21RSB0 E11 IO27RSB0 E12 IO32RSB0 484-Pin FBGA Pin Number AGL400 Function E13 IO38RSB0 E14 IO42RSB0 E15 GBC1/IO55RSB0 E16 GBB0/IO56RSB0 E17 IO44RSB0 E18 GBA2/IO60PDB1 E19 IO60NDB1 E20 GND E21 NC E22 NC F1 NC F2 NC F3 NC F4 IO154VDB3 F5 IO155VDB3 F6 IO11RSB0 F7 IO07RSB0 F8 GAC0/IO04RSB0 F9 GAC1/IO05RSB0 F10 IO20RSB0 F11 IO24RSB0 F12 IO33RSB0 F13 IO39RSB0 F14 IO45RSB0 F15 GBC0/IO54RSB0 F16 IO48RSB0 F17 VMV0 F18 IO61NPB1 F19 IO63PDB1 F20 NC F21 NC F22 NC G1 NC G2 NC G3 NC G4 IO151VDB3 484-Pin FBGA Pin Number AGL400 Function G5 IO151UDB3 G6 GAC2/IO153UDB3 G7 IO06RSB0 G8 GNDQ G9 IO10RSB0 G10 IO19RSB0 G11 IO26RSB0 G12 IO30RSB0 G13 IO40RSB0 G14 IO46RSB0 G15 GNDQ G16 IO47RSB0 G17 GBB2/IO61PPB1 G18 IO53RSB0 G19 IO63NDB1 G20 NC G21 NC G22 NC H1 NC H2 NC H3 V CC H4 IO150PDB3 H5 IO08RSB0 H6 IO153VDB3 H7 IO152VDB3 H8 VMV0 H9 V CCIB0 H10 V CCIB0 H11 IO25RSB0 H12 IO31RSB0 H13 V CCIB0 H14 V CCIB0 H15 VMV1 H16 GBC2/IO62PDB1 H17 IO65RSB1 H18 IO52RSB0 484-Pin FBGA Pin Number AGL400 Function

3-60 v1.7 H19 IO66PDB1 H20 V CC H21 NC H22 NC J1 NC J2 NC J3 NC J4 IO150NDB3 J5 IO149NPB3 J6 IO09RSB0 J7 IO152UDB3 J8 V CCIB3 J9 GND J10 V CC J11 V CC J12 V CC J13 V CC J14 GND J15 V CCIB1 J16 IO62NDB1 J17 IO49RSB0 J18 IO64PPB1 J19 IO66NDB1 J20 NC J21 NC J22 NC K1 NC K2 NC K3 NC K4 IO148NDB3 K5 IO148PDB3 K6 IO149PPB3 K7 GFC1/IO147PPB3 K8 V CCIB3 K9 V CC K10 GND 484-Pin FBGA Pin Number AGL400 Function K11 GND K12 GND K13 GND K14 V CC K15 V CCIB1 K16 GCC1/IO67PPB1 K17 IO64NPB1 K18 IO73PDB1 K19 IO73NDB1 K20 NC K21 NC K22 NC L1 NC L2 NC L3 NC L4 GFB0/IO146NPB3 L5 GFA0/IO145NDB3 L6 GFB1/IO146PPB3 L7 V COMPLF L8 GFC0/IO147NPB3 L9 V CC L10 GND L11 GND L12 GND L13 GND L14 V CC L15 GCC0/IO67NPB1 L16 GCB1/IO68PPB1 L17 GCA0/IO69NPB1 L18 NC L19 GCB0/IO68NPB1 L20 NC L21 NC L22 NC M1 NC M2 NC 484-Pin FBGA Pin Number AGL400 Function M3 NC M4 GFA2/IO144PPB3 M5 GFA1/IO145PDB3 M6 V CCPLF M7 IO143NDB3 M8 GFB2/IO143PDB3 M9 V CC M10 GND M11 GND M12 GND M13 GND M14 V CC M15 GCB2/IO71PPB1 M16 GCA1/IO69PPB1 M17 GCC2/IO72PPB1 M18 NC M19 GCA2/IO70PDB1 M20 NC M21 NC M22 NC N1 NC N2 NC N3 NC N4 GFC2/IO142PDB3 N5 IO144NPB3 N6 IO141PPB3 N7 IO120RSB2 N8 V CCIB3 N9 V CC N10 GND N11 GND N12 GND N13 GND N14 V CC N15 V CCIB1 N16 IO71NPB1 484-Pin FBGA Pin Number AGL400 Function

v1.7 3-61 N17 IO74RSB1 N18 IO72NPB1 N19 IO70NDB1 N20 NC N21 NC N22 NC P1 NC P2 NC P3 NC P4 IO142NDB3 P5 IO141NPB3 P6 IO125RSB2 P7 IO139RSB3 P8 V CCIB3 P9 GND P10 V CC P11 V CC P12 V CC P13 V CC P14 GND P15 V CCIB1 P16 GDB0/IO78VPB1 P17 IO76VDB1 P18 IO76UDB1 P19 IO75PDB1 P20 NC P21 NC P22 NC R1 NC R2 NC R3 V CC R4 IO140PDB3 R5 IO130RSB2 R6 IO138NPB3 R7 GEC0/IO137NPB3 R8 VMV3 484-Pin FBGA Pin Number AGL400 Function R9 V CCIB2 R10 V CCIB2 R11 IO108RSB2 R12 IO101RSB2 R13 V CCIB2 R14 V CCIB2 R15 VMV2 R16 IO83RSB2 R17 GDB1/IO78UPB1 R18 GDC1/IO77UDB1 R19 IO75NDB1 R20 V CC R21 NC R22 NC T1 NC T2 NC T3 NC T4 IO140NDB3 T5 IO138PPB3 T6 GEC1/IO137PPB3 T7 IO131RSB2 T8 GNDQ T9 GEA2/IO134RSB2 T10 IO117RSB2 T11 IO111RSB2 T12 IO99RSB2 T13 IO94RSB2 T14 IO87RSB2 T15 GNDQ T16 IO93RSB2 T17 V JTAG T18 GDC0/IO77VDB1 T19 GDA1/IO79UDB1 T20 NC T21 NC T22 NC 484-Pin FBGA Pin Number AGL400 Function U1 NC U2 NC U3 NC U4 GEB1/IO136PDB3 U5 GEB0/IO136NDB3 U6 VMV2 U7 IO129RSB2 U8 IO128RSB2 U9 IO122RSB2 U10 IO115RSB2 U11 IO110RSB2 U12 IO98RSB2 U13 IO95RSB2 U14 IO88RSB2 U15 IO84RSB2 U16 TCK U17 V PUMP U18 TRST U19 GDA0/IO79VDB1 U20 NC U21 NC U22 NC V1 NC V2 NC V3 GND V4 GEA1/IO135PDB3 V5 GEA0/IO135NDB3 V6 IO127RSB2 V7 GEC2/IO132RSB2 V8 IO123RSB2 V9 IO118RSB2 V10 IO112RSB2 V11 IO106RSB2 V12 IO100RSB2 V13 IO96RSB2 V14 IO89RSB2 484-Pin FBGA Pin Number AGL400 Function

3-62 v1.7 V15 IO85RSB2 V16 GDB2/IO81RSB2 V17 TDI V18 NC V19 TDO V20 GND V21 NC V22 NC W1 NC W2 NC W3 NC W4 GND W5 IO126RSB2 W6 FF/GEB2/IO133RSB2 W7 IO124RSB2 W8 IO116RSB2 W9 IO113RSB2 W10 IO107RSB2 W11 IO105RSB2 W12 IO102RSB2 W13 IO97RSB2 W14 IO92RSB2 W15 GDC2/IO82RSB2 W16 IO86RSB2 W17 GDA2/IO80RSB2 W18 TMS W19 GND W20 NC W21 NC W22 NC Y1 V CCIB3 Y2 NC Y3 NC Y4 NC Y5 GND Y6 NC 484-Pin FBGA Pin Number AGL400 Function Y7 NC Y8 V CC Y9 V CC Y10 NC Y11 NC Y12 NC Y13 NC Y14 V CC Y15 V CC Y16 NC Y17 NC Y18 GND Y19 NC Y20 NC Y21 NC Y22 V CCIB1 484-Pin FBGA Pin Number AGL400 Function

v1.7 3-63 484-Pin FBGA Pin Number AGL600 Function A1 GND A2 GND A3 V CCIB0 A4 NC A5 NC A6 IO09RSB0 A7 IO15RSB0 A8 NC A9 NC A10 IO22RSB0 A11 IO23RSB0 A12 IO29RSB0 A13 IO35RSB0 A14 NC A15 NC A16 IO46RSB0 A17 IO48RSB0 A18 NC A19 NC A20 V CCIB0 A21 GND A22 GND AA1 GND AA2 V CCIB3 AA3 NC AA4 NC AA5 NC AA6 IO135RSB2 AA7 IO133RSB2 AA8 NC AA9 NC AA10 NC AA11 NC AA12 NC AA13 NC AA14 NC AA15 NC AA16 IO101RSB2 AA17 NC AA18 NC AA19 NC AA20 NC AA21 V CCIB1 AA22 GND AB1 GND AB2 GND AB3 V CCIB2 AB4 NC AB5 NC AB6 IO130RSB2 AB7 IO128RSB2 AB8 IO122RSB2 AB9 IO116RSB2 AB10 NC AB11 NC AB12 IO113RSB2 AB13 IO112RSB2 AB14 NC AB15 NC AB16 IO100RSB2 AB17 IO95RSB2 AB18 NC AB19 NC AB20 V CCIB2 AB21 GND AB22 GND B1 GND B2 V CCIB3 B3 NC B4 NC B5 NC B6 IO08RSB0 484-Pin FBGA Pin Number AGL600 Function B7 IO12RSB0 B8 NC B9 NC B10 IO17RSB0 B11 NC B12 NC B13 IO36RSB0 B14 NC B15 NC B16 IO47RSB0 B17 IO49RSB0 B18 NC B19 NC B20 NC B21 V CCIB1 B22 GND C1 V CCIB3 C2 NC C3 NC C4 NC C5 GND C6 NC C7 NC C8 V CC C9 V CC C10 NC C11 NC C12 NC C13 NC C14 V CC C15 V CC C16 NC C17 NC C18 GND C19 NC C20 NC 484-Pin FBGA Pin Number AGL600 Function

3-64 v1.7 C21 NC C22 V CCIB1 D1 NC D2 NC D3 NC D4 GND D5 GAA0/IO00RSB0 D6 GAA1/IO01RSB0 D7 GAB0/IO02RSB0 D8 IO11RSB0 D9 IO16RSB0 D10 IO18RSB0 D11 IO28RSB0 D12 IO34RSB0 D13 IO37RSB0 D14 IO41RSB0 D15 IO43RSB0 D16 GBB1/IO57RSB0 D17 GBA0/IO58RSB0 D18 GBA1/IO59RSB0 D19 GND D20 NC D21 NC D22 NC E1 NC E2 NC E3 GND E4 GAB2/IO173PDB3 E5 GAA2/IO174PDB3 E6 GNDQ E7 GAB1/IO03RSB0 E8 IO13RSB0 E9 IO14RSB0 E10 IO21RSB0 E11 IO27RSB0 E12 IO32RSB0 484-Pin FBGA Pin Number AGL600 Function E13 IO38RSB0 E14 IO42RSB0 E15 GBC1/IO55RSB0 E16 GBB0/IO56RSB0 E17 IO52RSB0 E18 GBA2/IO60PDB1 E19 IO60NDB1 E20 GND E21 NC E22 NC F1 NC F2 NC F3 NC F4 IO173NDB3 F5 IO174NDB3 F6 VMV3 F7 IO07RSB0 F8 GAC0/IO04RSB0 F9 GAC1/IO05RSB0 F10 IO20RSB0 F11 IO24RSB0 F12 IO33RSB0 F13 IO39RSB0 F14 IO44RSB0 F15 GBC0/IO54RSB0 F16 IO51RSB0 F17 VMV0 F18 IO61NPB1 F19 IO63PDB1 F20 NC F21 NC F22 NC G1 IO170NDB3 G2 IO170PDB3 G3 NC G4 IO171NDB3 484-Pin FBGA Pin Number AGL600 Function G5 IO171PDB3 G6 GAC2/IO172PDB3 G7 IO06RSB0 G8 GNDQ G9 IO10RSB0 G10 IO19RSB0 G11 IO26RSB0 G12 IO30RSB0 G13 IO40RSB0 G14 IO45RSB0 G15 GNDQ G16 IO50RSB0 G17 GBB2/IO61PPB1 G18 IO53RSB0 G19 IO63NDB1 G20 NC G21 NC G22 NC H1 NC H2 NC H3 V CC H4 IO166PDB3 H5 IO167NPB3 H6 IO172NDB3 H7 IO169NDB3 H8 VMV0 H9 V CCIB0 H10 V CCIB0 H11 IO25RSB0 H12 IO31RSB0 H13 V CCIB0 H14 V CCIB0 H15 VMV1 H16 GBC2/IO62PDB1 H17 IO67PPB1 H18 IO64PPB1 484-Pin FBGA Pin Number AGL600 Function

v1.7 3-65 H19 IO66PDB1 H20 V CC H21 NC H22 NC J1 NC J2 NC J3 NC J4 IO166NDB3 J5 IO168NPB3 J6 IO167PPB3 J7 IO169PDB3 J8 V CCIB3 J9 GND J10 V CC J11 V CC J12 V CC J13 V CC J14 GND J15 V CCIB1 J16 IO62NDB1 J17 IO64NPB1 J18 IO65PPB1 J19 IO66NDB1 J20 NC J21 IO68PDB1 J22 IO68NDB1 K1 IO157PDB3 K2 IO157NDB3 K3 NC K4 IO165NDB3 K5 IO165PDB3 K6 IO168PPB3 K7 GFC1/IO164PPB3 K8 V CCIB3 K9 V CC K10 GND 484-Pin FBGA Pin Number AGL600 Function K11 GND K12 GND K13 GND K14 V CC K15 V CCIB1 K16 GCC1/IO69PPB1 K17 IO65NPB1 K18 IO75PDB1 K19 IO75NDB1 K20 NC K21 IO76NDB1 K22 IO76PDB1 L1 NC L2 IO155PDB3 L3 NC L4 GFB0/IO163NPB3 L5 GFA0/IO162NDB3 L6 GFB1/IO163PPB3 L7 V COMPLF L8 GFC0/IO164NPB3 L9 V CC L10 GND L11 GND L12 GND L13 GND L14 V CC L15 GCC0/IO69NPB1 L16 GCB1/IO70PPB1 L17 GCA0/IO71NPB1 L18 IO67NPB1 L19 GCB0/IO70NPB1 L20 IO77PDB1 L21 IO77NDB1 L22 IO78NPB1 M1 NC M2 IO155NDB3 484-Pin FBGA Pin Number AGL600 Function M3 IO158NPB3 M4 GFA2/IO161PPB3 M5 GFA1/IO162PDB3 M6 V CCPLF M7 IO160NDB3 M8 GFB2/IO160PDB3 M9 V CC M10 GND M11 GND M12 GND M13 GND M14 V CC M15 GCB2/IO73PPB1 M16 GCA1/IO71PPB1 M17 GCC2/IO74PPB1 M18 IO80PPB1 M19 GCA2/IO72PDB1 M20 IO79PPB1 M21 IO78PPB1 M22 NC N1 IO154NDB3 N2 IO154PDB3 N3 NC N4 GFC2/IO159PDB3 N5 IO161NPB3 N6 IO156PPB3 N7 IO129RSB2 N8 V CCIB3 N9 V CC N10 GND N11 GND N12 GND N13 GND N14 V CC N15 V CCIB1 N16 IO73NPB1 484-Pin FBGA Pin Number AGL600 Function

3-66 v1.7 N17 IO80NPB1 N18 IO74NPB1 N19 IO72NDB1 N20 NC N21 IO79NPB1 N22 NC P1 NC P2 IO153PDB3 P3 IO153NDB3 P4 IO159NDB3 P5 IO156NPB3 P6 IO151PPB3 P7 IO158PPB3 P8 V CCIB3 P9 GND P10 V CC P11 V CC P12 V CC P13 V CC P14 GND P15 V CCIB1 P16 GDB0/IO87NPB1 P17 IO85NDB1 P18 IO85PDB1 P19 IO84PDB1 P20 NC P21 IO81PDB1 P22 NC R1 NC R2 NC R3 V CC R4 IO150PDB3 R5 IO151NPB3 R6 IO147NPB3 R7 GEC0/IO146NPB3 R8 VMV3 484-Pin FBGA Pin Number AGL600 Function R9 V CCIB2 R10 V CCIB2 R11 IO117RSB2 R12 IO110RSB2 R13 V CCIB2 R14 V CCIB2 R15 VMV2 R16 IO94RSB2 R17 GDB1/IO87PPB1 R18 GDC1/IO86PDB1 R19 IO84NDB1 R20 V CC R21 IO81NDB1 R22 IO82PDB1 T1 IO152PDB3 T2 IO152NDB3 T3 NC T4 IO150NDB3 T5 IO147PPB3 T6 GEC1/IO146PPB3 T7 IO140RSB2 T8 GNDQ T9 GEA2/IO143RSB2 T10 IO126RSB2 T11 IO120RSB2 T12 IO108RSB2 T13 IO103RSB2 T14 IO99RSB2 T15 GNDQ T16 IO92RSB2 T17 V JTAG T18 GDC0/IO86NDB1 T19 GDA1/IO88PDB1 T20 NC T21 IO83PDB1 T22 IO82NDB1 484-Pin FBGA Pin Number AGL600 Function U1 IO149PDB3 U2 IO149NDB3 U3 NC U4 GEB1/IO145PDB3 U5 GEB0/IO145NDB3 U6 VMV2 U7 IO138RSB2 U8 IO136RSB2 U9 IO131RSB2 U10 IO124RSB2 U11 IO119RSB2 U12 IO107RSB2 U13 IO104RSB2 U14 IO97RSB2 U15 VMV1 U16 TCK U17 V PUMP U18 TRST U19 GDA0/IO88NDB1 U20 NC U21 IO83NDB1 U22 NC V1 NC V2 NC V3 GND V4 GEA1/IO144PDB3 V5 GEA0/IO144NDB3 V6 IO139RSB2 V7 GEC2/IO141RSB2 V8 IO132RSB2 V9 IO127RSB2 V10 IO121RSB2 V11 IO114RSB2 V12 IO109RSB2 V13 IO105RSB2 V14 IO98RSB2 484-Pin FBGA Pin Number AGL600 Function

v1.7 3-67 V15 IO96RSB2 V16 GDB2/IO90RSB2 V17 TDI V18 GNDQ V19 TDO V20 GND V21 NC V22 NC W1 NC W2 IO148PDB3 W3 NC W4 GND W5 IO137RSB2 W6 FF/GEB2/IO142RSB2 W7 IO134RSB2 W8 IO125RSB2 W9 IO123RSB2 W10 IO118RSB2 W11 IO115RSB2 W12 IO111RSB2 W13 IO106RSB2 W14 IO102RSB2 W15 GDC2/IO91RSB2 W16 IO93RSB2 W17 GDA2/IO89RSB2 W18 TMS W19 GND W20 NC W21 NC W22 NC Y1 V CCIB3 Y2 IO148NDB3 Y3 NC Y4 NC Y5 GND Y6 NC 484-Pin FBGA Pin Number AGL600 Function Y7 NC Y8 V CC Y9 V CC Y10 NC Y11 NC Y12 NC Y13 NC Y14 V CC Y15 V CC Y16 NC Y17 NC Y18 GND Y19 NC Y20 NC Y21 NC Y22 V CCIB1 484-Pin FBGA Pin Number AGL600 Function

3-68 v1.7 484-Pin FBGA Pin Number AGL1000 Function A1 GND A2 GND A3 V CCIB0 A4 IO07RSB0 A5 IO09RSB0 A6 IO13RSB0 A7 IO18RSB0 A8 IO20RSB0 A9 IO26RSB0 A10 IO32RSB0 A11 IO40RSB0 A12 IO41RSB0 A13 IO53RSB0 A14 IO59RSB0 A15 IO64RSB0 A16 IO65RSB0 A17 IO67RSB0 A18 IO69RSB0 A19 NC A20 V CCIB0 A21 GND A22 GND AA1 GND AA2 V CCIB3 AA3 NC AA4 IO181RSB2 AA5 IO178RSB2 AA6 IO175RSB2 AA7 IO169RSB2 AA8 IO166RSB2 AA9 IO160RSB2 AA10 IO152RSB2 AA11 IO146RSB2 AA12 IO139RSB2 AA13 IO133RSB2 AA14 NC AA15 NC AA16 IO122RSB2 AA17 IO119RSB2 AA18 IO117RSB2 AA19 NC AA20 NC AA21 V CCIB1 AA22 GND AB1 GND AB2 GND AB3 V CCIB2 AB4 IO180RSB2 AB5 IO176RSB2 AB6 IO173RSB2 AB7 IO167RSB2 AB8 IO162RSB2 AB9 IO156RSB2 AB10 IO150RSB2 AB11 IO145RSB2 AB12 IO144RSB2 AB13 IO132RSB2 AB14 IO127RSB2 AB15 IO126RSB2 AB16 IO123RSB2 AB17 IO121RSB2 AB18 IO118RSB2 AB19 NC AB20 V CCIB2 AB21 GND AB22 GND B1 GND B2 V CCIB3 B3 NC B4 IO06RSB0 B5 IO08RSB0 B6 IO12RSB0 484-Pin FBGA Pin Number AGL1000 Function B7 IO15RSB0 B8 IO19RSB0 B9 IO24RSB0 B10 IO31RSB0 B11 IO39RSB0 B12 IO48RSB0 B13 IO54RSB0 B14 IO58RSB0 B15 IO63RSB0 B16 IO66RSB0 B17 IO68RSB0 B18 IO70RSB0 B19 NC B20 NC B21 V CCIB1 B22 GND C1 V CCIB3 C2 IO220PDB3 C3 NC C4 NC C5 GND C6 IO10RSB0 C7 IO14RSB0 C8 V CC C9 V CC C10 IO30RSB0 C11 IO37RSB0 C12 IO43RSB0 C13 NC C14 V CC C15 V CC C16 NC C17 NC C18 GND C19 NC C20 NC 484-Pin FBGA Pin Number AGL1000 Function

v1.7 3-69 C21 NC C22 V CCIB1 D1 IO219PDB3 D2 IO220NDB3 D3 NC D4 GND D5 GAA0/IO00RSB0 D6 GAA1/IO01RSB0 D7 GAB0/IO02RSB0 D8 IO16RSB0 D9 IO22RSB0 D10 IO28RSB0 D11 IO35RSB0 D12 IO45RSB0 D13 IO50RSB0 D14 IO55RSB0 D15 IO61RSB0 D16 GBB1/IO75RSB0 D17 GBA0/IO76RSB0 D18 GBA1/IO77RSB0 D19 GND D20 NC D21 NC D22 NC E1 IO219NDB3 E2 NC E3 GND E4 GAB2/IO224PDB3 E5 GAA2/IO225PDB3 E6 GNDQ E7 GAB1/IO03RSB0 E8 IO17RSB0 E9 IO21RSB0 E10 IO27RSB0 E11 IO34RSB0 E12 IO44RSB0 484-Pin FBGA Pin Number AGL1000 Function E13 IO51RSB0 E14 IO57RSB0 E15 GBC1/IO73RSB0 E16 GBB0/IO74RSB0 E17 IO71RSB0 E18 GBA2/IO78PDB1 E19 IO81PDB1 E20 GND E21 NC E22 IO84PDB1 F1 NC F2 IO215PDB3 F3 IO215NDB3 F4 IO224NDB3 F5 IO225NDB3 F6 VMV3 F7 IO11RSB0 F8 GAC0/IO04RSB0 F9 GAC1/IO05RSB0 F10 IO25RSB0 F11 IO36RSB0 F12 IO42RSB0 F13 IO49RSB0 F14 IO56RSB0 F15 GBC0/IO72RSB0 F16 IO62RSB0 F17 VMV0 F18 IO78NDB1 F19 IO81NDB1 F20 IO82PPB1 F21 NC F22 IO84NDB1 G1 IO214NDB3 G2 IO214PDB3 G3 NC G4 IO222NDB3 484-Pin FBGA Pin Number AGL1000 Function G5 IO222PDB3 G6 GAC2/IO223PDB3 G7 IO223NDB3 G8 GNDQ G9 IO23RSB0 G10 IO29RSB0 G11 IO33RSB0 G12 IO46RSB0 G13 IO52RSB0 G14 IO60RSB0 G15 GNDQ G16 IO80NDB1 G17 GBB2/IO79PDB1 G18 IO79NDB1 G19 IO82NPB1 G20 IO85PDB1 G21 IO85NDB1 G22 NC H1 NC H2 NC H3 V CC H4 IO217PDB3 H5 IO218PDB3 H6 IO221NDB3 H7 IO221PDB3 H8 VMV0 H9 V CCIB0 H10 V CCIB0 H11 IO38RSB0 H12 IO47RSB0 H13 V CCIB0 H14 V CCIB0 H15 VMV1 H16 GBC2/IO80PDB1 H17 IO83PPB1 H18 IO86PPB1 484-Pin FBGA Pin Number AGL1000 Function

3-70 v1.7 H19 IO87PDB1 H20 V CC H21 NC H22 NC J1 IO212NDB3 J2 IO212PDB3 J3 NC J4 IO217NDB3 J5 IO218NDB3 J6 IO216PDB3 J7 IO216NDB3 J8 V CCIB3 J9 GND J10 V CC J11 V CC J12 V CC J13 V CC J14 GND J15 V CCIB1 J16 IO83NPB1 J17 IO86NPB1 J18 IO90PPB1 J19 IO87NDB1 J20 NC J21 IO89PDB1 J22 IO89NDB1 K1 IO211PDB3 K2 IO211NDB3 K3 NC K4 IO210PPB3 K5 IO213NDB3 K6 IO213PDB3 K7 GFC1/IO209PPB3 K8 V CCIB3 K9 V CC K10 GND 484-Pin FBGA Pin Number AGL1000 Function K11 GND K12 GND K13 GND K14 V CC K15 V CCIB1 K16 GCC1/IO91PPB1 K17 IO90NPB1 K18 IO88PDB1 K19 IO88NDB1 K20 IO94NPB1 K21 IO98NDB1 K22 IO98PDB1 L1 NC L2 IO200PDB3 L3 IO210NPB3 L4 GFB0/IO208NPB3 L5 GFA0/IO207NDB3 L6 GFB1/IO208PPB3 L7 V COMPLF L8 GFC0/IO209NPB3 L9 V CC L10 GND L11 GND L12 GND L13 GND L14 V CC L15 GCC0/IO91NPB1 L16 GCB1/IO92PPB1 L17 GCA0/IO93NPB1 L18 IO96NPB1 L19 GCB0/IO92NPB1 L20 IO97PDB1 L21 IO97NDB1 L22 IO99NPB1 M1 NC M2 IO200NDB3 484-Pin FBGA Pin Number AGL1000 Function M3 IO206NDB3 M4 GFA2/IO206PDB3 M5 GFA1/IO207PDB3 M6 V CCPLF M7 IO205NDB3 M8 GFB2/IO205PDB3 M9 V CC M10 GND M11 GND M12 GND M13 GND M14 V CC M15 GCB2/IO95PPB1 M16 GCA1/IO93PPB1 M17 GCC2/IO96PPB1 M18 IO100PPB1 M19 GCA2/IO94PPB1 M20 IO101PPB1 M21 IO99PPB1 M22 NC N1 IO201NDB3 N2 IO201PDB3 N3 NC N4 GFC2/IO204PDB3 N5 IO204NDB3 N6 IO203NDB3 N7 IO203PDB3 N8 V CCIB3 N9 V CC N10 GND N11 GND N12 GND N13 GND N14 V CC N15 V CCIB1 N16 IO95NPB1 484-Pin FBGA Pin Number AGL1000 Function

v1.7 3-71 N17 IO100NPB1 N18 IO102NDB1 N19 IO102PDB1 N20 NC N21 IO101NPB1 N22 IO103PDB1 P1 NC P2 IO199PDB3 P3 IO199NDB3 P4 IO202NDB3 P5 IO202PDB3 P6 IO196PPB3 P7 IO193PPB3 P8 V CCIB3 P9 GND P10 V CC P11 V CC P12 V CC P13 V CC P14 GND P15 V CCIB1 P16 GDB0/IO112NPB1 P17 IO106NDB1 P18 IO106PDB1 P19 IO107PDB1 P20 NC P21 IO104PDB1 P22 IO103NDB1 R1 NC R2 IO197PPB3 R3 V CC R4 IO197NPB3 R5 IO196NPB3 R6 IO193NPB3 R7 GEC0/IO190NPB3 R8 VMV3 484-Pin FBGA Pin Number AGL1000 Function R9 V CCIB2 R10 V CCIB2 R11 IO147RSB2 R12 IO136RSB2 R13 V CCIB2 R14 V CCIB2 R15 VMV2 R16 IO110NDB1 R17 GDB1/IO112PPB1 R18 GDC1/IO111PDB1 R19 IO107NDB1 R20 V CC R21 IO104NDB1 R22 IO105PDB1 T1 IO198PDB3 T2 IO198NDB3 T3 NC T4 IO194PPB3 T5 IO192PPB3 T6 GEC1/IO190PPB3 T7 IO192NPB3 T8 GNDQ T9 GEA2/IO187RSB2 T10 IO161RSB2 T11 IO155RSB2 T12 IO141RSB2 T13 IO129RSB2 T14 IO124RSB2 T15 GNDQ T16 IO110PDB1 T17 V JTAG T18 GDC0/IO111NDB1 T19 GDA1/IO113PDB1 T20 NC T21 IO108PDB1 T22 IO105NDB1 484-Pin FBGA Pin Number AGL1000 Function U1 IO195PDB3 U2 IO195NDB3 U3 IO194NPB3 U4 GEB1/IO189PDB3 U5 GEB0/IO189NDB3 U6 VMV2 U7 IO179RSB2 U8 IO171RSB2 U9 IO165RSB2 U10 IO159RSB2 U11 IO151RSB2 U12 IO137RSB2 U13 IO134RSB2 U14 IO128RSB2 U15 VMV1 U16 TCK U17 V PUMP U18 TRST U19 GDA0/IO113NDB1 U20 NC U21 IO108NDB1 U22 IO109PDB1 V1 NC V2 NC V3 GND V4 GEA1/IO188PDB3 V5 GEA0/IO188NDB3 V6 IO184RSB2 V7 GEC2/IO185RSB2 V8 IO168RSB2 V9 IO163RSB2 V10 IO157RSB2 V11 IO149RSB2 V12 IO143RSB2 V13 IO138RSB2 V14 IO131RSB2 484-Pin FBGA Pin Number AGL1000 Function

3-72 v1.7 V15 IO125RSB2 V16 GDB2/IO115RSB2 V17 TDI V18 GNDQ V19 TDO V20 GND V21 NC V22 IO109NDB1 W1 NC W2 IO191PDB3 W3 NC W4 GND W5 IO183RSB2 W6 FF/GEB2/IO186RSB2 W7 IO172RSB2 W8 IO170RSB2 W9 IO164RSB2 W10 IO158RSB2 W11 IO153RSB2 W12 IO142RSB2 W13 IO135RSB2 W14 IO130RSB2 W15 GDC2/IO116RSB2 W16 IO120RSB2 W17 GDA2/IO114RSB2 W18 TMS W19 GND W20 NC W21 NC W22 NC Y1 V CCIB3 Y2 IO191NDB3 Y3 NC Y4 IO182RSB2 Y5 GND Y6 IO177RSB2 484-Pin FBGA Pin Number AGL1000 Function Y7 IO174RSB2 Y8 V CC Y9 V CC Y10 IO154RSB2 Y11 IO148RSB2 Y12 IO140RSB2 Y13 NC Y14 V CC Y15 V CC Y16 NC Y17 NC Y18 GND Y19 NC Y20 NC Y21 NC Y22 V CCIB1 484-Pin FBGA Pin Number AGL1000 Function

v1.7 3-73 Part Number and Revision Date Part Number 51700095-003-7 Revised December 2008 List of Changes The following table lists critical changes that were made in the current version of the chapter. Previous Version Changes in Current Version (v1.7) Page v1.6 (October 2008) The "48-Pin QFP" pin table is new. 3-22 The "68-Pin QFN" pin table is new. 3-25 The AGL600 Function for pin K15 in the "484-Pin FBGA" table was changed to VCCIB1. 3-64 v1.5 (June 2008) The "196-pin CSP" table for the AGL400 device is new. 3-12 The "144-Pin FBGA" table for the AGL400 device is new. 3-44 The "256-Pin FBGA" table for the AGL400 device is new. 3-55 The "484-Pin FBGA" table for the AGL400 device is new. 3-64 v1.4 (June 2008) Pin numbers were added to the "68-Pin QFN" package diagram. Note 2 was added below the diagram. 3-23 The "132-Pin QFN" package diagram was updated to include D1 to D4. In addition, note 1 was changed from top view to bottom view, and note 2 is new. 3-26 v1.3 (February 2008) The "68-Pin QFN" package drawing was updated to include numbers on pins 1 and 68. 3-23 The "281-Pin CSP" package and pin table was added for AGL1000. 3-18 v1.2 (February 2008) The "196-Pin CSP" package and pin table was added for AGL250. 3-10 v1.1 (January 2008) The "68-Pin QFN" section is new. 3-23 v1.0 (January 2008) The "196-Pin CSP" package and pin table was added for AGL125. 3-7 Advance v0.7 (November 2007) This document was previously in da tasheet Advance v0.7. As a result of moving to the handbook format, Actel has restarted the version numbers. The new version number is v1.0. N/A Advance v0.6 (November 2007) The "121-Pin CSP" and "281-Pin CSP" packages are new. 4-5, 4-7 The "81-Pin CSP" table for the AGL030 device was updated to change the G6 pin function to IO44RSB1 and the JG pin function to IO45RSB1. 4-4 The "121-Pin CSP" table for the AGL060 device is new. 4-6 The "256-Pin FBGA" table for the AGL1000 device is new. 4-34 The "281-Pin CSP" table for the AGL 600 device is new. 4-8 The "100-Pin VQFP" table for the AGL060 device is new. 4-18 The "144-Pin FBGA" table for the AGL250 device is new. 4-24 The "144-Pin FBGA" table for the AGL1000 device is new. 4-28 The "484-Pin FBGA" table for the AGL600 device is new. 4-38 The "484-Pin FBGA" table for the AGL1000 device is new. 4-43 Advance v0.5 (September 2007) The "81-Pin µCSP" table for the AGL030 device is new. 4-3 The "81-Pin CSP" table for the AGL030 device is new. 4-1

3-74 v1.7 Datasheet Categories Categories In order to provide the latest information to designers, some datasheets are published before data has been fully characterized. Datasheets are designated as "Product Brief," "Advance," "Preliminary," and "Production." The definitions of these categories are as follows: Product Brief The product brief is a summarized version of a datasheet (advance or production) and contains general product information. This document give s an overview of specific device and family information. Advance This version contains initial estimated information based on simulation, other products, devices, or speed grades. This information can be used as estimates, but not for production. This label only applies to the DC and Switching Characteristics chapter of the datasheet and will only be used when the data has not been fully characterized. Preliminary The datasheet contains information based on si mulation and/or initia l characterization. The information is believed to be correct, but changes are possible. Unmarked (production) This version contains information that is considered to be final. Export Administration Regulations (EAR) The products described in this do cument are subject to the Expo rt Administration Regulations (EAR). They could require an ap proved export license prior to export from the United States. An export includes release of product or disclosure of technology to a foreign national inside or outside the United States. Actel Safety Critical, Life Support, and High-Reliability Applications Policy The Actel products described in this advance status document may not have completed Actel’s qualification process. Actel may amend or enhance products during the product introduction and qualification process, resulting in changes in device functional ity or performance. It is the responsibility of each customer to ensure the fitn ess of any Actel product (but especially a new product) for a particular purpose, including appr opriateness for safety-cri tical, life-s upport, and other high-reliability applicatio ns. Consult Actel’s Terms and Cond itions for specific liability exclusions relating to life-support applications. A reliability report covering all of Actel’s products is available on the Actel website at http://www.actel.com/documents/ORT_Report.pdf. Actel also offers a variety of enhanced qualification and lot acceptance screening procedures. Contact your local Actel sales office for additional reliability information.

v1.7 3-75

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