AFGB20N60SFD-BW ONSEMI | Alldatasheet
Document overview
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- PDF pages: 9
Technical content
Features
- High Current Capability
- Low Saturation V oltage: VCE(sat) = 2.2 V @ IC = 20 A
- High Input Impedance
- Fast Switching
- AEC−Q101 Qualified to Automotive Requirements
- These Devices are Pb−Free and are RoHS Compliant Typical Applications
- Inverters, SMPS, PFC, UPS
- Automotive Chargers, Converters, High V oltage Auxiliaries ABSOLUTE MAXIMUM RATINGS (TC = 25°C unless otherwise stated) Parameter Symbol Value Unit Collector−to−Emitter Voltage VCES 600 V Gate−to−Emitter Voltage VGES ±20 V Collector Current (TC = 25°C) IC 40 A Collector Current (TC = 100°C) 20 A Pulsed Collector Current (Note 1) ICM 60 A Diode Forward Current (TC = 25°C) IF 20 A Diode Forward Current (TC = 100°C) 10 A Pulsed Diode Maximum Forward Current (Note 1) IFM 60 A Maximum Power Dissipation (TC = 25°C) PD 208 W Maximum Power Dissipation (TC = 100°C) 83 W Operating Junction and Storage Temperature Range TJ, TSTG −55 to +150 Maximum Lead Temp. For Soldering Purposes, 1/8” from case for 5 seconds TL 300 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Repetitive rating: pulse width limited by max. junction temperature This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice. www.onsemi.com BVCES VCE(sat) TYP I C MAX
650 V 120 A
Device Package Shipping †
ORDERING INFORMATION
AFGB20N60SFD− BW D2PAK (TO−263)
800 Units /
Tape & Reel MARKING DIAGRAM 1.6 V D2PAK
3 LEAD
G C E G E C †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. &Y = ON Semiconductor Logo &Z = Assembly Plant Code &3 = 3−Digit Date Code &K = 2−Digit Lot Traceability Code AFGB20N60SFD−BW = Specific Device Code &Y&Z&3&K AFGB20N60- SFD−BW
Table 1. THERMAL RESISTANCE RATINGS
- R /C0113JC for D2−PAK: according to Mil standard 883−1012 test method.
− Natural Convection (Still Air). Table 2. ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise stated)
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
Figure 13. Turn−off Characteristics vs. Gate Figure 14. Turn−on Characteristics vs. Figure 15. Turn−off Characteristics vs. Figure 16. Switching Loss vs. Gate Resistance Figure 17. Switching Loss vs. Collector Figure 18. Turn off Switching SOA
1000 Common Emitter
AFGB20N60SFD−BW www.onsemi.com PACKAGE DIMENSIONS D2PAK−3 (TO−263, 3−LEAD) CASE xxx ISSUE ? 0.436 0.366 0.653 2X0.063 0.100 PITCH 0.169 E/2 E H D 2Xbe
0.10 M BA M
A A c A A C NOTE3 B L1 D1 VIEW A−A M L GAUGE PLANE DETAIL C SCALE 4 : 1 B RECOMMENDED MOUNTING FOOTPRINT FOR additional information on our Pb−Free strategy and soldering,please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SEATING PLANE NOTES: 1.DIMENSIONING AND TOLERANCING PER ASME Y14.5M,2009. 2.CONTROLLING DIMENSION:INCHES 3.DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.005PER SIDE. THESE DIMENSIONS ARE MEASURED AT THE OUTERMOST EXTREMS OF THE PLASTC BODY AT DATUM H. 4.THERMAL PAD CONTOUR IS OPTIONAL WITH DIMENSIONS E,L1,D1 AND E1. A 0.160 0.190 4.060 4.830 A1 0.000 0.010 0.000 0.250 b 0.020 0.039 0.510 0.990 c 0.013 0.019 0.327 0.487 c2 0.048 0.054 1.220 1.380 D 0.334 0.350 8.490 8.890 E 0.380 0.420 9.650 10.670 e 0.100 BSC 2.540 BSC H 0.575 0.625 14.600 15.880 L 0.070 0.110 1.780 2.790 L3 0.010 BSC 0.250 BSC M −8 8 −8 8
AFGB20N60SFD−BW www.onsemi.com ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries i n the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . A listing of ON Semiconductor’s product/patent ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the right s of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative