DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 14

Technical content

Features

 GaAs E-pHEMT, pHEMT and FBAR technology  50  all RF ports  Typical Size: 5 x 7 x 1 mm  3 to 5 V supply (Tx Path)  Meets 802.16 masks at 24 dBm Pout , 16 QAM WiMAX with 3.6 V and 420 mA  16 QAM WiMAX EVM -34 dB (2.5%) at 24 dBm  TX gain of 34 dB  PAE of 18% at SEM compliant Pout = 24 dBm  23 dB TX gain step in low power mode with reduced Idsq  Low power Idd, 95 mA at Pout = 0 dBm, 23 dB Gain Step  35 dBc rejection at WiFi ISM band  3.5 dB Noise Figure from ANT to RX  25 dB of TX/RX Isolation  25 dB of Rx1/Rx2 Isolation

Applications

 Portable and fi xed WiMAX applications Package Diagram 12 9 1516 34 56 78 17181920212223 28 29 10 GND Rx2 GND TX GND GND Rx1 GND VDD1_TX TRSW21 PA_EN PA_MOD VREF LNA2_MOD TRSW22 GND ANT2 GND GND ANT1 GND TRSW12 TRSW11 VDD2_TX VDD_RX LNA1_MOD ANTSW1 ANTSW2 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND TOP VIEW

Table 1. Minimum and Maximum Ratings

Table 2. Recommended Operating Range

0 V Logic Low

0.2 V Logic Low

Table 3. TX-ANT Electrical Characteristics (25° C, 3.6 V and 50 )

900 MHz -147 dBm/Hz

1575 MHz -148 dBm/Hz

1800 MHz -148 dBm/Hz

1990 MHz -148 dBm/Hz

2470 MHz -135 dBm/Hz

2473 MHz -134 dBm/Hz

2481 MHz -124 dBm/Hz

Table 4. Electrical Characteristics (25° C, 3.3 V and 50 )

Table 5. Logic Table

  1. VREF is High for all modes except in shutdown mode. In shutdown mode VREF = 0 V.

driven with 3 V0 for logic high. Figure 1. Pins on back of Demoboard Table 6. Pin Description:

1 VDD2_TX 2 VDD2_Sense

3 VDD_RX 4 GND

5 VDD1_TX 6 GND

7 ANTSW1 8 GND

9 PAMODE 10 TRSW11

11 TRSW12 12 TRSW21

13 TRSW22 14 PA_EN

15 VREF 16 GND

17 LNA1_MODE 18 GND

19 LNA2_MODE 20 ANTSW2

Table 7. TX Typical Test Conditions: Table 8. RX Typical Test Conditions:

Figure 2. Front of Demoboard Table 9. Eval Board Confi guration: Note: There is no shutdown mode for LNA only low gain mode.

Figure 3. Demoboard Schematic Figure 4. Recommended footprint vias are filled and then capped with copper. vias will improve the thermal performance.

3.3 KJP1

Figure 6. Recommended Soldermask Figure 7. Recommended Stencil Figure 5. Package dimensions

0.64 TYPICAL

Note: There is no Solder Mask at the bottom layer. There is an oxide layer surrounding the GND and IO pads. and should not be factored in the contactor design. Solder paste stencil 0.3mm SQ with rounded corners.

Typical SMT Refl ow Profi le for Maximum Temperature = 260 +0/-5° C Profi le Feature Sn-Pb Solder Pb-Free Solder Average ramp-up rate (TL to TP) 3°C/sec max 3°C/sec max Preheat – Temperature Min (Tsmin) – Temperature Max (Tsmax) – Time (min to max) (ts) 100° C 150° C 60-120 sec 150° C 200° C 60-180 sec Tsmax to TL – Ramp-up Rate 3°C/sec max Time maintained above: – Temperature (TL) – Time (TL) 183° C 60-150 sec 217° C 60-150 sec Peak temperature (Tp) 240 +0/-5° C 260 +0/-5° C Time within 5° C of actual Peak Temperature (Tp) 10-30 sec 10-30 sec Ramp-down Rate 6°C/sec max 6°C/sec max Time 25° C to Peak Temperature 6 min max. 8 min max. Time Temperature Tp TL tp tL t 25° C to Peak Ramp-up ts Tsmin Ramp-down Preheat Critical Zone TL to Tp Tsmax

5.0 mm 7.0 mm 8° MAX 7° MAX 5.33 ±0.10 (0.210 ±0.004) 8.00 ±0.10 (0.315 ±0.004) 4.00 ±0.10 (0.157 ±0.004) 2.00 ±0.10 (0.079 ±0.004) 1.75 ±0.10 (0.069 ±0.004) 0.318 ±0.13 (0.0125 ±0.0005) 7.40 ±0.10 (0.291 ±0.004) 1.66 ±0.10 (0.065 ±0.004) 1.50 ±0.10 (0.059 ±0.004) 7.50 ±0.10 (0.295 ±0.004) 16.00 +0.30 0.10 1.50 +0.25 (0.059 +0.010)

T Tape Start Slot CCD/KEAC MADE IN MALAYSIA 6 PS CCD/KEAC MADE IN MALAYSIA 6 PS

1.5 Min

20.2 Min

330 Max Diameter

13+/0.20 Arbor Hole 100+/0.50 Hub Dia. Measured At Hub Measured At Hub Measured At Outer Edge TAPE WIDTH W3 16 mm 15.9 Min

19.4 Max

22.4 Max

16.4 +2.0 0.0 T 7 ±0.50

For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved. AV02-2970EN - July 19, 2011 AFEM-S257 Part Number Ordering Information Part Number Devices Per Container Container AFEM-S257-BLKG 100 Antistatic bag AFEM-S257-TR1G 1000 13” Reel AFEM-S257-TR2G 3000 13” Reel