AFE7681 TI1 | Alldatasheet
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Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA. AFE7681, AFE7683, AFE7684, AFE7685, AFE7686 SLASEQ7D – MAY 2018– REVISED DECEMBER 2018 AFE76xxQuad/Dual-Channel,RFSamplingAnalogFront-End with14-Bit9GSPSDACsand14-Bit3GSPSADCs
1 Device Overview
1.1 Features
- 14-Bit Resolution
- Sample Rate: – DAC: 9 GSPS – ADC: 3 GSPS
- RF Frequency Range: Up to 5.2 GHz
- Maximum RF Signal Bandwidth – Quad-Channel Mode (4T4R): 800 MHz (single- band); 300 MHz (dual-band) – Dual-Channel Mode (2T2R): 1200 MHz (TX)/1000 MHz (RX) (single-band); 800MHz(dual-band)
- On-Chip Dual Selectable DSAs per RX Channel
- Integrated TX DSA Functionality
- Digital: – Dual Band Digital Up-Converters (DUCs) – Dual Band Digital Down-Converters (DDCs) – 32-Bit NCOs for DUCs/DDCs – Interpolation Ratio: 6x, 8x, 9x, 12x, 16x, 18x, 24x, 36x – Decimation Ratio: /2, /3, /4, /6, /8, /9, /12, /16, /18, /24, /32 – RX/FB Dynamic Switching for TDD
- Interface: – 8 SerDes Transceivers up to 15Gbps – 16-Bit and 12-Bit JESD204B Transport Layer Formatting with 8b/10b Encoding – Subclass 1 Multi-Device Synchronization
- Clock: – Internal PLL/VCO to Generate DAC and ADC Clocks
- Package: 17mm x 17mm FC BGA, 0.8mm Pitch
- Power Supplies: 1.85 V, 1.15 V, 1.0 V, –1.8 V
1.2 Applications
- Cellular Base Stations
- Wideband Communications
- Microwave Backhaul
- Distributed Antenna Systems (DAS) (1) For all available packages, see the orderable addendum at the end of the data sheet.
1.3 Description
The AFE76xx is a family of high performance, quad/dual channel, 14-bit, integrated RF sampling analog front ends (AFEs) with 9 GSPS DACs and 3 GSPS ADCs, capable of synthesizing and digitizing wideband signals. High dynamic range allows the AFE76xx to generate and digitize 3G/4G signals for wireless base stations. In TDD mode, the receiver channel can be configured to dynamically switching between traffic receiver (TDD RX) status and wideband feedback receiver (TDD FB) status to assist DPD (Digital Pre- Distortion) of the Power Amplifier (PA) on the transmitter path. The AFE76xx family has integrated DSA on the receiver channels and also supports DSA equivalent functionality on the transmitter channels. Each receiver channel has one analog RF peak power detector and various digital power detectors to assist AGC control for receiver channels, and two RF overload detectors for device reliability protection. The AFE76xx family has 8 of JESD204B compatible SerDes transceivers running up to 15 Gbps. The devices have up to two DUCs per TX channel and two DDCs per RX channel, with multiple interpolation/decimation rates and digital quadrature modulators/demodulators with independent, frequency flexible NCOs. The devices support more than 1000 MHz (800 MHz as 4T4R) RF signal bandwidth in single-band mode, and up to 800 MHz (300 MHz as 4T4R) RF signal bandwidth per band in dual-band mode. A low jitter PLL/VCO simplifies the sampling clock generation by allowing use of a lower frequency reference clock. Device Information(1) PART NUMBER PACKAGE BODY SIZE AFE7685 FC-BGA 17.00 mm x 17.00 mm AFE7686 FC-BGA 17.00 mm x 17.00 mm
/2, /3, /4 SerDes Traffic Controller TXDP/M TXAP/M SYSREFP/M CLKP/M JTAG SRX1P/M STX4P/M SYNCBOUT0P/M SYNCBINP/M STX1P/M SRX4P/M STX8P/M STX5P/M SYNCBIN1P/M SYNCBOUT1P/M SRX5P/M SRX8P/M TXD DSA TXC DSA TXB DSA TXA DSA SPIBSEN SPIBSCLK SPIBSDIO SPIBSDO TXTDD2 RXTDD2 RXFBSW2 FBBANDSEL2 RXCDSA1PD RXCDSA2PD RXDDSA1PD RXDDSA2PD RXCPD2H RXCPD2L RXDPD2H RXDPD2L RXCDSAFAST RXDDSAFAST TX2ENABLE ALARMTX2 SLEEPMODE PLLCLKLD PLLREFLD RESET TX1ENABLE RXBDSAFAST RXADSAFAST RXBPD2L RXBPD2H RXAPD2L RXAPD2H RXBDSA2PD RXBDSA1PD RXADSA2PD RXADSA1PD FBBANDSEL1 RXFBSW1 RXTDD1 TXTDD1 SPIASDO SPIASDIO SPIASCLK SPIASEN ALARMTX1 TCLK TCLK TDI TDO TRSTB Temp Sensor VDDAPLL18 VDDAVCO18 VDDAPLL VDDCLK VDDATX18 VDDATX VDDCLK VDDGPIO18 VEE18AB VDDL1AB VDDL2AB VDDTX18CD VDDTXCD VEE18CD VDDL2CD VDDL1CD FSPICLKD FSPIDD DVDD VDDTX18AB VDDTXAB DVDD DVDD VDDT VDDR VDDA DVDD RX1P8V RX1P2V SYNCB2CMOS SYNCB3CMOS SYNCB1CMOS SYNCB0CMOS RXDSASW TXDSASW FSPICLKA FSPIDA FSPICLKB FSPIDB FSPICLKC FSPIDC RX1P8V RX1P2V DVDD CLKOUTP/M MUX MUX MUXMUX AFE7681, AFE7683, AFE7684, AFE7685, AFE7686 SLASEQ7D – MAY 2018– REVISED DECEMBER 2018 www.ti.com Submit Documentation Feedback Product Folder Links: AFE7681 AFE7683 AFE7684 AFE7685 AFE7686 Device Overview Copyright © 2018, Texas Instruments Incorporated Device Information(1) (continued) PART NUMBER PACKAGE BODY SIZE (2) Advance Information AFE7684 FC-BGA 17.00 mm x 17.00 mm AFE7683 FC-BGA 17.00 mm x 17.00 mm AFE7681(2) FC-BGA 17.00 mm x 17.00 mm
1.4 Functional Block Diagram
Figure 1-1. Functional Block Diagram of AFE7685/AFE7686
/2, /3, /4 SerDes Traffic Controller TXAP/M SYSREFP/M CLKP/M JTAG SRX1P/M STX4P/M SYNCBOUT0P/M SYNCBINP/M STX1P/M SRX4P/M STX8P/M STX5P/M SYNCBIN1P/M SYNCBOUT1P/M SRX5P/M SRX8P/M TXC DSATXA DSA SPIBSEN SPIBSCLK SPIBSDIO SPIBSDO TXTDD2 RXTDD2 RXFBSW2 FBBANDSEL2 RXCDSA1PD RXCDSA2PD RXDDSA1PD RXDDSA2PD RXCPD2H RXCPD2L RXDPD2H RXDPD2L RXCDSAFAST RXDDSAFAST TX2ENABLE ALARMTX2 SLEEPMODE PLLCLKLD PLLREFLD RESET TX1ENABLE RXBDSAFAST RXADSAFAST RXBPD2L RXBPD2H RXAPD2L RXAPD2H RXBDSA2PD RXBDSA1PD RXADSA2PD RXADSA1PD FBBANDSEL1 RXFBSW1 RXTDD1 TXTDD1 SPIASDO SPIASDIO SPIASCLK SPIASEN ALARMTX1 TCLK TCLK TDI TDO TRSTB Temp Sensor VDDAPLL18 VDDAVCO18 VDDAPLL VDDCLK VDDATX18 VDDATX VDDCLK VDDGPIO18 VEE18AB VDDL1AB VDDL2AB VDDTX18CD VDDTXCD VEE18CD VDDL2CD VDDL1CD FSPICLKD FSPIDD DVDD VDDTX18AB VDDTXAB DVDD DVDD VDDT VDDR VDDA DVDD RX1P8V RX1P2V SYNCB2CMOS SYNCB3CMOS SYNCB1CMOS SYNCB0CMOS RXDSASW TXDSASW FSPICLKA FSPIDA FSPICLKB FSPIDB FSPICLKC FSPIDC RX1P8V RX1P2V DVDD CLKOUTP/M MUX MUX MUXMUX AFE7681, AFE7683, AFE7684, AFE7685, AFE7686 www.ti.com SLASEQ7D – MAY 2018– REVISED DECEMBER 2018 Submit Documentation Feedback Product Folder Links: AFE7681 AFE7683 AFE7684 AFE7685 AFE7686 Device OverviewCopyright © 2018, Texas Instruments Incorporated Figure 1-2. Functional Block Diagram of AFE7684
AFE7681, AFE7683, AFE7684, AFE7685, AFE7686 SLASEQ7D – MAY 2018– REVISED DECEMBER 2018 www.ti.com Submit Documentation Feedback Product Folder Links: AFE7681 AFE7683 AFE7684 AFE7685 AFE7686 Revision History Copyright © 2018, Texas Instruments Incorporated
2 Revision History
Changes from Revision C (October 2018) to Revision D Page Changes from Revision B (September 2018) to Revision C Page Changes from Revision A (July 2018) to Revision B Page Changes from Original (May 2018) to Revision A Page
- Changed AFE7684 from Product Preview to Advance Information, AFE7685 from Product Preview to Production
AFE7681, AFE7683, AFE7684, AFE7685, AFE7686 www.ti.com SLASEQ7D – MAY 2018– REVISED DECEMBER 2018 Submit Documentation Feedback Product Folder Links: AFE7681 AFE7683 AFE7684 AFE7685 AFE7686 Device ComparisonCopyright © 2018, Texas Instruments Incorporated (1) Advance Information
3 Device Comparison
Table 3-1. Device Features Comparison DEVICE # of TXs/RXs # of DUCs/TX # of DDCs/RX MAX INPUT/OUTPUT DATA RATE (MSPS) AFE7685 4T4R 1 1 750 AFE7686 4T4R 2 2 1500 AFE7684 2T4R 2 2 1500 AFE7683 2T4R 1 1 750 AFE7681(1) 4T2R 1 1 750
AFE7681, AFE7683, AFE7684, AFE7685, AFE7686 SLASEQ7D – MAY 2018– REVISED DECEMBER 2018 www.ti.com Submit Documentation Feedback Product Folder Links: AFE7681 AFE7683 AFE7684 AFE7685 AFE7686 Device and Documentation Support Copyright © 2018, Texas Instruments Incorporated
4 Device and Documentation Support
4.1 Device Support
4.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
4.2 Documentation Support
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. The current documentation that describes the DSP, related peripherals, and other technical collateral is listed below.
4.2.1 Related Documentation
AFE76xx EVM Design Document User's Guide (SLAU761) AFE76xx Technical Reference Manual (SLAU744) AFE76xx Programmer's User's Guide (SLAU767)
4.3 Related Links
The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 4-1. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY AFE7681 Click here Click here Click here Click here Click here AFE7683 Click here Click here Click here Click here Click here AFE7684 Click here Click here Click here Click here Click here AFE7685 Click here Click here Click here Click here Click here AFE7686 Click here Click here Click here Click here Click here
4.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. TI Embedded Processors Wiki Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.
4.5 Trademarks
E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.
AFE7681, AFE7683, AFE7684, AFE7685, AFE7686 www.ti.com SLASEQ7D – MAY 2018– REVISED DECEMBER 2018 Submit Documentation Feedback Product Folder Links: AFE7681 AFE7683 AFE7684 AFE7685 AFE7686 Device and Documentation SupportCopyright © 2018, Texas Instruments Incorporated
4.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
4.7 Export Control Notice
Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from disclosing party under nondisclosure obligations (if any), or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws.
4.8 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
AFE7681, AFE7683, AFE7684, AFE7685, AFE7686 SLASEQ7D – MAY 2018– REVISED DECEMBER 2018 www.ti.com Submit Documentation Feedback Product Folder Links: AFE7681 AFE7683 AFE7684 AFE7685 AFE7686 Mechanical, Packaging, and Orderable Information Copyright © 2018, Texas Instruments Incorporated
5 Mechanical, Packaging, and Orderable Information
5.1 Packaging Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
www.ti.com 18-Dec-2018 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples AFE7683IABJ ACTIVE FCBGA ABJ 400 90 Green (RoHS & no Sb/Br) SNAGCU Level-4-260C-72 HR -40 to 85 AFE7683I AFE7684IABJ ACTIVE FCBGA ABJ 400 90 Green (RoHS & no Sb/Br) SNAGCU Level-4-260C-72 HR -40 to 85 AFE7684I AFE7685IABJ ACTIVE FCBGA ABJ 400 90 Green (RoHS & no Sb/Br) SNAGCU Level-4-260C-72 HR -40 to 85 AFE7685I AFE7686IABJ ACTIVE FCBGA ABJ 400 90 Green (RoHS & no Sb/Br) SNAGCU Level-4-260C-72 HR -40 to 85 AFE7686I (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
www.ti.com 18-Dec-2018 Addendum-Page 2 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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