AFE4900YZR

AFE4900 TI1 | Alldatasheet

Document overview

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Technical content

TX_SUP LED1 ADC CLK SPI I2C RESETZ ADC_RDY FIFO Noise Reduction filter (x4) LED2 LED3 PD1 TX1 TX2 TX3 128 kHz Oscillator TIA Offset DAC I2C_SPI_SEL Timing Engine TX_ SUP INP_ECG INM_ECG INA AC/DC Lead-off Detect RLD_OUT Interface circuit Electrodes PD2 INP2 INM2 ENABLE_PTT LED4 TX4RX_SUP 1.8-V LDOs CONTROL1 ALDO_1V8, DLDO_1V8 PD3 INP3 INM3 Decimation Threshold Detection

4 MHz

Oscillator PROG_OUT1 THR_DET_RDY Product Folder Order Now T echnical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. AFE4900 SBAS861 –AUGUST 2017 AFE4900Ultra-LowPower,IntegratedAFEfor WearableOptical,ElectricalBio-SensingWithFIFO

1 Features

1• Synchronized PPG, ECG Signal Acquisition at Data Rates Up to 1 kHz

• ECG Signal Chain: – Standalone ECG Acquisition Up to 4 kHz – Input Bias: 1-Lead ECG With RLD Bias – Programmable INA Gain: 2 to 12 – Input Noise (1 Hz to 150 Hz): 2.5 µVrms at 1 kHz, 1.25 µVrms at 4-kHz Data Rate – AC, DC Lead-Off Detect: 12.5-nA to 100-nA
• PPG Receiver: – Supports Three Time-Multiplexed PD Inputs – 24-Bit Representation of Current From PD – DC Offset Subtraction DAC (Up to ±126-µA) at TIA Input for Each LED, Ambient – Digital Ambient Subtraction at ADC Output – Noise Filtering With Programmable Bandwidth – Transimpedance Gain: 10 kΩ to 2 MΩ – Dynamic Range Up to 100 dB – Receiver Operates in PPG-Only mode at Approximately 1-μA/Hz Sampling Rate – Power-Down Mode: Approximately 0 μA
• PPG Transmitter: – Four LEDs in Common Anode Configuration – 8-Bit LED Current Up to 200 mA – Mode to Fire Two LEDs in Parallel – Programmable LED On-Time – Simultaneous Support of Three LEDs for SpO2, or Multiwavelength HRM – Average Current of 30 μA Adequate for a Typical Heart-Rate Monitoring Scenario: – 20-mA Setting, 60-μs Pulse Duration, 25-Hz Sampling Rate
• Clocking Using an External or Internal Clock
• FIFO With 128-Sample Depth for ECG and PPG
• I2C, SPI™ Interfaces: Selectable by Pin
• Operating Temperature Range: –20°C to +70°C
• 2.6-mm × 2.1-mm, 0.4-mm Pitch DSBGA Package
• Supplies: – Rx: 1.8 V to 1.9 V (LDO Bypass), 2.0 V to 3.6 V (LDO Enabled) – Tx: 3 V to 5.25 V – IO: 1.7 V to Rx_SUP

2 Applications

• Synchronized PPG, ECG for Blood Pressure Estimation
• HRM for Wearables, Hearables
• Heart-Rate Variability (HRV)
• Pulse Oximetry (SpO2) Measurements

3 Description

The AFE4900 device is an analog front-end (AFE) for synchronized electrocardiogram (ECG), photoplethysmogram (PPG) signal acquisition. The device can also be used for optical bio-sensing applications, such as heart-rate monitoring (HRM) and saturation of peripheral capillary oxygen (SpO2). The PPG signal chain supports up to four switching light-emitting diodes (LEDs) and up to three photodiodes (PDs). The LEDs can be switched on using a fully integrated LED driver. The current from the photodiode is converted into voltage by the transimpedance amplifier (TIA) and digitized using an analog-to-digital converter (ADC). The ECG signal chain has an instrumentation amplifier (INA) with a programmable gain that interfaces to the same ADC. A right-leg drive (RLD) amplifier set can be used to the bias for the ECG input pins. AC and dc lead-off detect schemes are supported. The ADC codes from the PPG and ECG phases can be stored in a 128- sample first in, first out (FIFO) block and read out using either an I2C or a serial programming interface (SPI) interface. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) AFE4900 DSBGA (30) 2.60 mm × 2.10 mm (1) For all available packages, see the package option addendum at the end of the datasheet. SPACE Simplified Block Diagram

SBAS861 –AUGUST 2017 www.ti.com Product Folder Links: AFE4900 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated

4 Device and Documentation Support

4.1 Trademarks

All trademarks are the property of their respective owners.

4.2 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

4.3 Glossary

SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.

5 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

0.19 0.13 TYP 0.4 TYP

0.4 TYP

30X 0.25 0.21 1.6 TYP 0.85 B 2.13 2.07 A 4222550/B 12/2015 P ACKAGE OUTLINE DSBGA - 0.5 mm max height NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. YZ0030-C01 PKG BALL A1 CORNER 2.63 2.57

0.5 MAX

C SEATING PLANE BALL TYP 0.05 C F E D C B A 1 2 3 4 5 SYMM S C A LE 5.000 DIE SIZE BALL GRID ARRAY

0.015 C A B

www.ti.com SBAS861 –AUGUST 2017 Product Folder Links: AFE4900 Submit Documentation FeedbackCopyright © 2017, Texas Instruments Incorporated

30X ( 0.23) ( 0.23) MET AL

0.05 MAX

SOLDER MASK( 0.23) SOLDER MASK OPENING

0.05 MIN

DSBGA - 0.5 mm max height DIE SIZE BALL GRID ARRAY (0.85) (0.4) TYP SOLDER MASK DETAILS NOT TO SCALE 4222550/B 12/2015 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009). YZ0030-C01 PKG SYMM C 1 2 3 4 5 A (0.4) TYP B D E F PKG LAND PATTERN EXAMPLE SCALE:30X NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED AFE4900 SBAS861 –AUGUST 2017 www.ti.com Product Folder Links: AFE4900 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated

(R0.05) TYP MET AL TYP (0.85) (0.4) TYP 30X ( 0.25) EXAMPLE STENCIL DESIGN DSBGA - 0.5 mm max height DIE SIZE BALL GRID ARRAY 4222550/B 12/2015 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded c orners may offer better paste release. YZ0030-C01 PKG PKG SYMM SOLDER P ASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:35X 1 2 3 4 5 C A (0.4) TYP B D E F AFE4900 www.ti.com SBAS861 –AUGUST 2017 Product Folder Links: AFE4900 Submit Documentation FeedbackCopyright © 2017, Texas Instruments Incorporated

www.ti.com 11-Aug-2017 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples AFE4900YZR ACTIVE DSBGA YZ 30 3000 Green (RoHS & no Sb/Br) Call TI Level-1-260C-UNLIM -20 to 70 AFE4900 AFE4900YZT ACTIVE DSBGA YZ 30 250 Green (RoHS & no Sb/Br) Call TI Level-1-260C-UNLIM -20 to 70 AFE4900 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

www.ti.com 11-Aug-2017 Addendum-Page 2

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 9-Aug-2017 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) AFE4900YZR DSBGA YZ 30 3000 220.0 220.0 35.0 AFE4900YZT DSBGA YZ 30 250 220.0 220.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 9-Aug-2017 Pack Materials-Page 2

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