AFE44I30 TI | Alldatasheet

Document overview

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Technical content

LED_DRV1 LED_DRV2 TX8TX7TX4TX3TX2TX1 LED2 LED1 LED3 LED4 LED7 LED8 1.8-V LDO ALDO_1V8, DLDO_1V8 RX_SUP EN_LDO_BYP INP1 INM1 INP2 INM2 INP3 INM3 INP4 INM4 ADC FIFO I2C Timing Engine 128 kHz Oscillator

4 MHz

Processing, Decimation Filters Threshold Detection CLK I2C ADC_RDY GPIO2 Rf1 Cf1 Rf1 Cf1 IOFFDAC_AMB1 IOFFDAC_LED1 TIA1 AACM Noise Reduction Filter

2 PPG RX Channels

TX_SUP Product Folder Order Now T echnical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. AFE44I30 SBASA32 –FEBRUARY 2020 AFE44I30Ultra-Small,IntegratedAFEWithFIFOforMulti-SensorWearable,OpticalHeart- RateMonitoringandBio-sensing

1 Features

1• Supports signal acquisition of up to 24 phases

  • Flexible allocation of 6 LED, 4 PD in each phase
  • Simultaneous signal acquisition from different sensors at different data rates
  • Accurate, continuous heart-rate monitoring: – System SNR up to 108-dB at 16 μA PD current – Low current for continuous operation on a wearable device with a typical value: 15 μA for an LED, 20 μA for the receiver
  • Transmitter: – Supports common anode LED configuration – 8-Bit programmable LED current with range adjustable from 25 mA to 250 mA – Mode to fire two LEDs in parallel with independent per-phase current control – Programmable LED on-time per-phase – Simultaneous support of 6 LEDs for SpO2, HRM, or multi-wavelength HRM
  • Receiver: – Supports 4 time-multiplexed photodiode inputs – 2 parallel receivers (two sets of TIA/filter) – Individual ambient offset subtraction DAC at each TIA Input with 8-bit per-phase control and range adjustable up to 255-μA – Individual LED offset subtraction DAC at each TIA input with 5-bit per-phase control and 15.5- µA range – Close to 100 dB ambient rejection up to 10 Hz – Noise filtering with programmable bandwidth – Transimpedance Gain: 3.7 kΩ to 1 MΩ
  • Supports external clock and internal oscillator modes
  • Option to acquire data synchronized with a system master clock
  • Automatic cancellation of DC from ambient, LED
  • FIFO with 128-sample depth
  • I2C interface
  • 2.6-mm × 2.1-mm DSBGA, 0.4-mm pitch
  • Supplies: Rx: 1.7 V-1.9 V (LDO bypass); 1.9 V-3.6 V (LDO enabled), Tx: 3 V-5.5 V, IO: 1.7-3.6 V

2 Applications

  • Optical heart-rate monitoring (HRM) for wearables, hearables
  • Heart-rate variability (HRV)
  • Pulse oximetry (SpO2) measurements

3 Description

The AFE44I30 is an analog front-end for optical bio- sensing applications, such as heart-rate monitoring (HRM) and saturation of peripheral capillary oxygen (SpO2). The device supports up to six switching light- emitting diodes (LEDs) and up to four photodiodes. Up to 24 signal phases can be defined and the signal can be acquired from each phase in a synchronized manner. The current from the photodiode is converted into voltage by the transimpedance amplifier (TIA) and digitized using an analog-to-digital converter (ADC). The ADC code can be stored in a 128-sample First in, First out (FIFO) block. The FIFO can be read out using a I2C interface. The AFE also has a fully-integrated LED driver with an 8-bit current control. The device has a high dynamic range transmit-and-receive circuitry that helps with the sensing of very small signal levels. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) AFE44I30 DSBGA (30) 2.60 mm × 2.10 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic

SBASA32 –FEBRUARY 2020 www.ti.com Product Folder Links: AFE44I30 Submit Documentation Feedback Copyright © 2020, Texas Instruments Incorporated

4 Device and Documentation Support

4.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

4.2 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

4.3 Trademarks

E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.

4.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

4.5 Glossary

SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.

5 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) AFE44I30YZR Active Production DSBGA (YZ) | 30 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 AFE44I30 AFE44I30YZR.A Active Production DSBGA (YZ) | 30 3000 | LARGE T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 AFE44I30 AFE44I30YZT Active Production DSBGA (YZ) | 30 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 AFE44I30 AFE44I30YZT.A Active Production DSBGA (YZ) | 30 250 | SMALL T&R Yes SNAGCU Level-1-260C-UNLIM -40 to 85 AFE44I30 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 13-May-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 13-May-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) AFE44I30YZR DSBGA YZ 30 3000 210.0 185.0 35.0 AFE44I30YZT DSBGA YZ 30 250 210.0 185.0 35.0 Pack Materials-Page 2

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