AFE159RP8 TI2 | Alldatasheet
Document overview
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Technical content
AFE1598 Low-Power, 8-Channel, 24-Bit Analog Front-Ends for Bio-Potential Measurements
1 Features
- Integrated Signal Chain for ECG, Pace Detection, and Respiration Measurement
- ECG Receiver – Eight high resolution channels at low power of 0.37mW/channel – Flexible eight leads selectable from ten electrodes – Programmable gain: 1.25 to 9 – Noise: 4.7μVPP in 150Hz with Gain = 4 – Differential input range: ±1V with Gain = 4 – CMRR: -140dB – Data rate: 125SPS to 128kSPS
- Pace Detection – On-chip digital pace detection algorithm on programmable four leads – High-speed 128kSPS pace output on four channels for software pace detection
- Respiration – Low-noise of 16mΩPP with 2kΩ body impedance and 1kΩ defibrillator protection resistor on each electrode – Supports Sine and Square wave excitation
- Other Features – Built-in right leg drive amplifier steerable to any electrode – DC lead-off detection, AC lead impedance detection, Wilson Center Terminal (WCT), Goldberger Central Terminals (GCT), test signals – Battery voltage monitoring – Flexible power-down and standby modes – Built-in oscillator, PLL, and reference – 1k sample main FIFO and 2k sample pace FIFO – SPI-compatible serial interface – Analog supply voltage 1: 3.15V to 5.25V – Analog supply voltage 2: 1.7V to 1.9V – I/O supply voltage: 1.65V to 3.6V
- Supports systems meeting AAMI EC11, AMI EC13, AMI EC38, IEC60601-1, IEC60601-2-25, IEC60601-2-27, and IEC60601-2-51 standards
2 Applications
- Medical instrumentation (ECG, EMG, and EEG): – Bedside patient monitoring and diagnostic ECG – Portable telemetry – Holter monitor and multi-lead patch
- Event, stress, and vital sign monitors: – ECGs – AEDs – Telemedicine Bispectral Index (BIS) – Evoked Audio Potential (EAP) – Sleep study monitor
3 Description
The AFE1598 is a family of multichannel, simultaneous sampling, 24-bit, delta-sigma ( ΔΣ) analog-to-digital converters (ADCs) with built-in programmable gain Instrumentation Amplifiers (INAs), internal reference, and an on-chip PLL. The AFE supports digital pace pulse detection, thoracic impedance measurement and incorporates all of the features that are commonly required in medical electrocardiogram (ECG) and electroencephalogram (EEG) applications. Multiple AFE159x devices can be cascaded in high channel count systems. With high levels of integration and exceptional performance, the AFE159x enables the development of scalable medical instrumentation systems at significantly reduced size, power, and overall cost.
Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2) AFE1598 QFN 8mm × 8mm AFE1598 WCSP 3.6mm × 5.2mm (1) For all available packages, see Mechanical, Packaging, and Orderable Information. (2) The package size (length × width) is a nominal value and includes pins, where applicable. AFE1598, AFE159P8, AFE159RP8 SLVSKL0 – DECEMBER 2025 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
6 Mechanical, Packaging, and Orderable Information....4 AFE1598, AFE159P8, AFE159RP8 SLVSKL0 – DECEMBER 2025 www.ti.com
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4 Device Comparison
Table 4-1. Comparison of the features between the AFE159x variants AFE159RP8 AFE159P8 AFE1598 Number of ECG electrode pins 10 10 10 Number of ECG channels 8 8 8 Number of Respiration electrode pins 4 4(1) 4(1) Number of Respiration receiver channel 1 - - Number of internal Pace detect channels 4 4 - (1) Only RESP_OUT pins available, RESP_IN pins are NC. www.ti.com AFE1598, AFE159P8, AFE159RP8 SLVSKL0 – DECEMBER 2025 Copyright © 2026 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: AFE1598 AFE159P8 AFE159RP8
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. DATE REVISION NOTES December 2025 * Production Data
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. AFE1598, AFE159P8, AFE159RP8 SLVSKL0 – DECEMBER 2025 www.ti.com
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6.1 Package Option Addendum
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball Finish(6) MSL Peak Temp(3) Op Temp (°C) Device Marking(4) (5) AFE159RP8RTQR Preview VQFN RTQ 56 2000 Green (RoHS & no Sn/Br) NIPDAU Level-2-260C-
1 YEAR
-20 to 85 AFE159RP8 AFE159RP8RTQT Preview VQFN RTQ 56 250 Green (RoHS & no Sn/Br) NIPDAU Level-2-260C- -20 to 85 AFE159RP8 AFE159P8RTQR Preview VQFN RTQ 56 2000 Green (RoHS & no Sn/Br) NIPDAU Level-2-260C- -20 to 85 AFE159P8 AFE159P8RTQT Preview VQFN RTQ 56 250 Green (RoHS & no Sn/Br) NIPDAU Level-2-260C- -20 to 85 AFE159P8 AFE1598RTQR Preview VQFN RTQ 56 2000 Green (RoHS & no Sn/Br) NIPDAU Level-2-260C- -20 to 85 AFE1598 AFE1598RTQT Preview VQFN RTQ 56 250 Green (RoHS & no Sn/Br) NIPDAU Level-2-260C- -20 to 85 AFE1598 AFE159RP8YAFR Preview DSBGA YAF 70 6000 Green (RoHS & no Sn/Br) SNAGCU Level-1-260C- UNLIM -20 to 85 AFE159RP8 AFE159RP8YAFT Preview DSBGA YAF 70 250 Green (RoHS & no Sn/Br) SNAGCU Level-1-260C- UNLIM -20 to 85 AFE159RP8 AFE159P8YAFR Preview DSBGA YAF 70 6000 Green (RoHS & no Sn/Br) SNAGCU Level-1-260C- UNLIM -20 to 85 AFE159P8 AFE159P8YAFT Preview DSBGA YAF 70 250 Green (RoHS & no Sn/Br) SNAGCU Level-1-260C- UNLIM -20 to 85 AFE159P8 AFE159P8YAFR Preview DSBGA YAF 70 6000 Green (RoHS & no Sn/Br) SNAGCU Level-1-260C- UNLIM -20 to 85 AFE159P8 AFE159P8YAFT Preview DSBGA YAF 70 250 Green (RoHS & no Sn/Br) SNAGCU Level-1-260C- UNLIM -20 to 85 AFE159P8 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. www.ti.com AFE1598, AFE159P8, AFE159RP8 SLVSKL0 – DECEMBER 2025 Copyright © 2026 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: AFE1598 AFE159P8 AFE159RP8
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. AFE1598, AFE159P8, AFE159RP8 SLVSKL0 – DECEMBER 2025 www.ti.com
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6.2 Tape and Reel Information
Reel Width (W1) REEL DIMENSIONS W Dimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centers Dimension designed to accommodate the component width TAPE DIMENSIONS B0 W A0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket Quadrants Sprocket Holes Q1 Q1Q2 Q2 Q3 Q3Q4 Q4 Reel Diameter User Direction of Feed Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant www.ti.com AFE1598, AFE159P8, AFE159RP8 SLVSKL0 – DECEMBER 2025 Copyright © 2026 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: AFE1598 AFE159P8 AFE159RP8
TAPE AND REEL BOX DIMENSIONS Width (mm) W L H Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) AFE159RP8RTQR VQFN RTQ 56 2000 367.0 367.0 35.0 AFE159RP8RTQT VQFN RTQ 56 250 210.0 185.0 35.0 AFE159P8RTQR VQFN RTQ 56 2000 367.0 367.0 35.0 AFE159P8RTQT VQFN RTQ 56 250 210.0 185.0 35.0 AFE1598RTQR VQFN RTQ 56 2000 367.0 367.0 35.0 AFE1598RTQT VQFN RTQ 56 250 210.0 185.0 35.0 AFE159RP8YAFR DSBGA YAF 70 6000 335.0 335.0 25.0 AFE159RP8YAFT DSBGA YAF 70 250 182.0 182.0 20.0 AFE159P8YAFR DSBGA YAF 70 6000 335.0 335.0 25.0 AFE159P8YAFT DSBGA YAF 70 250 182.0 182.0 20.0 AFE159P8YAFR DSBGA YAF 70 6000 335.0 335.0 25.0 AFE159P8YAFT DSBGA YAF 70 250 182.0 182.0 20.0 AFE1598, AFE159P8, AFE159RP8 SLVSKL0 – DECEMBER 2025 www.ti.com
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6.3 Mechanical Data
www.ti.com AFE1598, AFE159P8, AFE159RP8 SLVSKL0 – DECEMBER 2025 Copyright © 2026 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: AFE1598 AFE159P8 AFE159RP8
AFE1598, AFE159P8, AFE159RP8 SLVSKL0 – DECEMBER 2025 www.ti.com
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Product Folder Links: AFE1598 AFE159P8 AFE159RP8
www.ti.com AFE1598, AFE159P8, AFE159RP8 SLVSKL0 – DECEMBER 2025 Copyright © 2026 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: AFE1598 AFE159P8 AFE159RP8
AFE1598, AFE159P8, AFE159RP8 SLVSKL0 – DECEMBER 2025 www.ti.com
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Product Folder Links: AFE1598 AFE159P8 AFE159RP8
www.ti.com AFE1598, AFE159P8, AFE159RP8 SLVSKL0 – DECEMBER 2025 Copyright © 2026 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links: AFE1598 AFE159P8 AFE159RP8
AFE1598, AFE159P8, AFE159RP8 SLVSKL0 – DECEMBER 2025 www.ti.com
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Product Folder Links: AFE1598 AFE159P8 AFE159RP8
www.ti.com 27-May-2026 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) AFE159RP8RTQR Active Production QFN (RTQ) | 56 2000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -20 to 85 AFE159RP8 AFE159RP8RTQT Active Production QFN (RTQ) | 56 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -20 to 85 AFE159RP8 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
www.ti.com GENERIC PACKAGE VIEW Images above are just a representation of the package family, actual package may vary. Refer to the product data sheet for package details. VQFN - 1 mm max heightRTQ 56 PLASTIC QUAD FLATPACK - NO LEAD8 x 8, 0.5 mm pitch 4224653/A
www.ti.com PACKAGE OUTLINE C 8.1 7.9 8.1 7.9 1.0 0.8 0.05 0.00 2X 6.5 52X 0.5 2X 6.5 56X 0.5 0.3 56X 0.30 0.18 6.6 0.1 (0.1) TYP (0.19) TYP VQFN - 1 mm max heightRTQ0056L PLASTIC QUAD FLATPACK - NO LEAD 4230588/A 03/2024 0.08 C
0.1 C A B
0.05 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. PIN 1 INDEX AREA SEATING PLANE PIN 1 ID (45 X 0.3) SYMMEXPOSED THERMAL PAD SYMM 15 28 4356 SCALE 1.500 AB
www.ti.com EXAMPLE BOARD LAYOUT 52X (0.5) 0.2) TYP VIA (R0.05) TYP
0.07 MAX
0.07 MIN
(1.24) TYP (3.05) TYP (0.62) TYP (3.05) TYP (1.24) TYP56X (0.6) 56X (0.24) (7.8) (7.8) ( 6.6) (0.62) TYP VQFN - 1 mm max heightRTQ0056L PLASTIC QUAD FLATPACK - NO LEAD 4230588/A 03/2024 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SYMM SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SEE SOLDER MASK DETAIL 15 28 4356 METAL EDGE SOLDER MASK OPENING EXPOSED METAL METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METAL NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS
www.ti.com EXAMPLE STENCIL DESIGN (1.24) TYP (1.24) TYP 56X (0.6) 56X (0.24) 52X (0.5) (7.8) (7.8) (R0.05) TYP 25X ( 1.04) VQFN - 1 mm max heightRTQ0056L PLASTIC QUAD FLATPACK - NO LEAD 4230588/A 03/2024 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SOLDER PASTE EXAMPLE BASED ON 0.125 MM THICK STENCIL SCALE: 10X EXPOSED PAD 57 62% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SYMM SYMM 15 28 4356
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