AFCT-5701XXZ

AFCT-5701XXZ BOARDCOM | Alldatasheet

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AFCT-5701xxZ, AFCT-5705xxZ, AFCT-5710xxZ, AFCT-5715xxZ, AFCT-5765xxZ Single-Mode SFP Optical Transceivers with Optional DMI for Gigabit Ethernet and Fibre Channel Reliability Data Sheet Introduction Avago Technologies Quality System includes an ongoing Reliability Monitoring program to generate a database from which this reliability datasheet is published.

Description

This reliability data sheet addresses reliability parameters for the single-mode AFCT-5701xxZ, AFCT-5705xxZ, AFCT- 5710xxZ, AFCT-5715xxZ, and AFCT-5765xxZ families of SFP optical transceivers. These transceivers are primarily targeted at serving Gigabit Ethernet or Fibre Channel links interconnecting optical networking and storage equipment. Reliability Qualification The Optical Transceivers have been qualified in accor - dance with the requirements of Telcordia Document GR-468-CORE. Reliability predictions follow the method of Telcordia SR-332 Issue 3. Avago internal test specifications have also been applied. Testing was carried out under the supervision of Avago Technologies Quality & Reliability Department. Stress Test Pass Criteria Product failure has occurred when the units fails to respond properly to a functional test condition. The func- tional test condition should not exceed the absolute maximum data sheet limits for the product. FIT Rate Summary The mean and standard deviation of the AFCT-5701xxZ, AFCT-5705xxZ, AFCT-5710xxZ, and AFCT-5715xxZ families of SFP Optical Transceiver steady-state failure rate is calcu- lated as 118.4 FIT and 66.6 FIT at 40 °C, respectively. Conclusion Avago Technologies AFCT-5701xxZ, AFCT-5705xxZ, AFCT- 5710xxZ, AFCT-5715xxZ, and AFCT-5765xxZ families of SFP Optical Transceivers have completed and passed the reliability qualification criteria defined by Avago Technol- ogies’ Quality & Reliability requirements. Random Failure Rate (FIT) Calculation Failure in time rate, or FIT, is defined as the number of failures per billion device hours. In the product useful life region, the random failure rate is considered as a constant failure rate. In this region MTTF, Mean Time to Failure, is defined as MTTF = 1/FIT. FITs Prediction Based on Telcordia SR-332 Parts Count Procedure The Telcordia Parts Count Method assumes that the module failure rate is equal to the sum of the device component failure rates. Modifiers are included to take into consideration variations in module operation envi - ronments, device quality requirements, temperature, and stress. Table 1a shows the FITs for the components used in the module and the total FITs that has been calculated for a case temperature of 40 °C.

For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. AV02-3018EN - November 22, 2013 Table 1b. FIT rates at different operating case temperatures, following the Telcordia Parts Count Method Tcase (° C) FITs 25 61.6 40 118.4 50 177.6 60 260.5 Table 1a. Reliability Prediction Based On Telcordia SR-332 Issue 3 – Parts Count Method Temperature Factor @ 40 °C 1 Stress Factor at 50% 1 Environmental Factor 1 Component Telcordia Information Quantity Component Failure Rate (FITs) Component Standard Deviation (FITs) Quality Factor Total Component Failure Rate (FITs) Total Component Standard Deviation (FITs) 1G FP Laser Diode Laser 1 100 81 0.8 80 64.8 Capacitors Fixed Ceramic 3 0.1 0.01 1 0.3 0.03 Resistor Thick Film 5 0.18 0.13 1 0.9 0.65 IC 8-BIT MCU W/8K FLASH 256B RAM 36-LFBGA CMOS Technology 1 3.8 3.9 1 3.8 3.9 Connector PCB, Edge / Multi-Pin 20 0.13 0.088 1 2.6 1.76 Module Failure @ 40 °C (Total FITs) 118.4 66.6 MTTF @ 40 °C (Hours) 8.45E+06 1.50E+07 Table 1c. FIT rates at 40 °C at 60% and 90% Upper Confidence Level, following the Telcordia Parts Count Method UCL FITs 60% 122.8 90% 207.7 FITs at other temperatures can be derived following the procedure of Telcordia SR-332, assuming activation energy, Ea, of 0.35 eV to determine the component tem - perature factor πT. Table 1b shows the FITs at different temperatures for the transceiver. FITs between 60% and 90% Upper Confidence Levels (UCLs) can be derived following the procedure of Telcordia SR-332 to determine the shape κ and scale θ of the gamma distribution. Table 1c shows the FITs at the UCLs. The limitations of the FIT prediction based on the Parts Count Method include the fact that the piece part failure rates are obtained from Telcordia database, which may not be exhaustive for state-of-the-art piece parts, and that the results are independent of true module environmen - tal stress tests. Nevertheless, the information obtained from the Parts Count Method is a useful reference during design-in and evaluation. Whenever possible, Avago sub- stitutes internal data for the FIT rates of individual com - ponents, and predictions will be updated as more current data becomes available.