AF0201DR-071R YAGEO | Alldatasheet
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ANTI-SULFURATED CHIP RESISTORS AF series 5%, 1%, 0.5% sizes 0201/0402/0603/0805/1206/1210/1218/2010/2512 RoHS compliant & Halogen free Product specification – June 21, 2016 V.5
Chip Resistor Surface Mount www.yageo.com Jun. 21, 2016 V.5 Product specification SERIES AF 0201 to 2512 ORDERING INFORMATION - GLOBAL PART NUMBER Part number is identified by the series name, size, tolerance, packaging type, temperature coefficient, taping reel and resistance value. SCOPE This specification describes AF0201 to AF2512 chip resistors with anti-sulfuration capabilities.
APPLICATIONS
Industrial Equipment Power Application Networking Application High -end Computer & Multimedia Electronics in high sulfur environment Automotive electronics
FEATURES
AEC-Q200 qualified Superior resistance against sulfur containing atmosphere Halogen free product and production RoHS compliant Reduces environmentally hazardous waste High component and equipment reliability Saving of PCB space Moist ure sensitivity level: MSL 1 GLOBAL PART NUMBER AF XXXX X X X XX XXXX L (1) SIZE 0201/0402/0603/0805/1206/1210/1218/2010/2512 (2) TOLERANCE D = ± 0.5% F = ± 1% J = ± 5% (for jumper ordering, use code of J) (3) PACKAGING TYPE R = Paper taping reel K = Embossed plastic tape reel (4) TEMPERATURE COEFFICIENT OF RESISTANCE – = Base on spec (5) TAPING REEL 07 = 7 inch dia. Reel 13 = 13 inch dia. Reel (6) RESISTANCE VALUE There are 2~4 digits indicated the resistance value. Letter R/K/M is decimal point. Detailed resistance rules are displayed in the table of “Resistance rule of global part number”. (7) DEFAULT CODE Letter L is system default code for ordering only (Note) ORDERING EXAMPLE The ordering code for an AF0402 chip resistor, value 100 KΩ with ±1% tolerance, supplied in 7 -inch tape reel with 10Kpcs quantity is: AF0402FR-07100KL. NOTE 1. All our R-Chip products are RoHS compliant and Halogen free. "LFP" of the internal 2D reel label states "Lead-Free Process" 2. On customized label, "LFP" or specific symbol can be printed Resistance rule of global part number Resistance coding rule Example XRXX (1 to 9.76 Ω) 1R = 1 Ω 1R5 = 1.5 Ω 9R76 = 9.76 Ω XXRX (10 to 97.6 Ω) 10R = 10 Ω 97R6 = 97.6 Ω XXXR (100 to 976 Ω) 100R = 100 Ω XKXX (1 to 9.76 KΩ) 1K = 1,000 Ω 9K76 = 9760 Ω XMXX (1 to 9.76 MΩ) 1M = 1,000,000 Ω 9M76= 9,760,000 Ω
Chip Resistor Surface Mount www.yageo.com Jun. 21, 2016 V.5 Product specification SERIES AF 0201 to 2512 MARKING AF0201 / AF0402 No marking AF0603 / AF0805 / AF1206 / AF1210 / AF2010 / AF2512 E-24 series: 3 digits, ±5%, ≥10 Ω First two digits for significant figure and 3rd digit for number of zeros AF0603 E-24 series: 3 digits, ±1% One short bar under marking letter E-96 series: 3 digits, ±1% First two digits for E -96 marking rule and 3rd letter for number of zeros AF0805 / AF1206 / AF1210 / AF2010 / AF2512 Both E -24 and E -96 series: 4 digits, ±1% First three digits for significant figure and 4th digit for number of zeros AF1218 E-24 series: 3 digits, ± 5% First two digits for significant figure and 3rd digit for number of zeros Both E-24 and E -96 series: 4 digits, ± 1% First three digits for significant figure and 4th digit for number of zeros NOTE For further marking information, please see special data sheet “Chip resistors marking”. Marking of AF series is the same as RC series Fig. 1 Fig. 2 Value=10 KΩ Fig. 3 Value = 24 Ω Fig. 5 Value = 10 K Ω Fig. 4 Value = 12.4 K Ω Fig. 6 Value = 10 K Ω Fig. 7 Value = 10 K Ω
Chip Resistor Surface Mount www.yageo.com Jun. 21, 2016 V.5 Product specification SERIES AF 0201 to 2512 Fig. 8 Chip resistor outlines OOUUTTLLIINNEESS For dimensions see Table 1 CONSTRUCTION The resistors are constructed on top of a high grade ceramic body. Internal metal electrodes are added at each end and connected by a resistive glaze. The resistive glaze is covered by a glass. The composition of the glaze is adjusted to give the approximate required resistance value and laser trimming of this resistive glaze achieves the value within tolerance. The whole element is covered by a protective overcoat. Size 0603 and bigger is marked with the resistance value on top. Finally, the two external terminations (Ni / matte tin) are added. See fig.8 DIMENSIONS TYPE L (mm) W (mm) H (mm) I1 (mm) I2 (mm) Table 1 For outlines see fig. 8
Chip Resistor Surface Mount www.yageo.com Jun. 21, 2016 V.5 Product specification SERIES AF 0201 to 2512 TYPE RESISTANCE RANGE CHARACTERISTICS Operating Temperature Range Max. Working Voltage Max. Overload Voltage Dielectric Withstanding Voltage Temperature Coefficient of Resistance Jumper Criteria AF0201 ±5% (E24), 1Ωto 10MΩ 1Ω to 10MΩ Zero Ohm Jumper < 0.05Ω –55 °C to +155 °C
25 V 50 V 50 V
1Ω≤ R ≤10Ω, -100/+350 ppm/°C 10Ω＜R ≤ 10MΩ, ±200 ppm/° C Rated Current 0.5A Max. Current 1.0A AF0402 ±5% (E24), 1 Ω to 22 MΩ 1 Ω to 10 MΩ Zero Ohm Jumper < 0.05 Ω
50 V 100 V 100 V
1 Ω≤ R ≤ 10 Ω, ±200 ppm/°C 10 Ω< R ≤ 10 MΩ, ±100 ppm/°C
10 MΩ< R ≤ 22 MΩ, ±200 ppm/° C
1.0A Max. Current 2.0A AF0603 75 V 150 V 150 V AF0805 150 V 300 V 300 V Rated Current 2.0A Max. Current 5.0A AF1206 200 V 400 V 500 V Rated Current 2.0A Max. Current 10.0A AF1210 ±5% (E24), 1Ω to 10MΩ 1Ω to 10M Zero Ohm Jumper < 0.05Ω
200 V 500 V 500 V
1Ω≤ R≤ 10Ω, ±200 ppm/°C 10Ω＜R ≤ 10MΩ, ±100 ppm/°C Rated Current 2.0A Max. Current 10.0A AF1218 ±5% (E24), 1Ω to 1MΩ 1Ω to 1M Zero Ohm Jumper < 0.05Ω 2.0A Max. Current 10.0A AF2010 ±5% (E24), 1Ω to 10MΩ 1Ω to 10M Zero Ohm Jumper < 0.05Ω 2.0A Max. Current 10.0A AF2512 200V 500V 500V
ELECTRICAL CHARACTERISTICS
Chip Resistor Surface Mount www.yageo.com Jun. 21, 2016 V.5 Product specification SERIES AF 0201 to 2512 FOOTPRINT AND SOLDERING PROFILES For recommended footprint and soldering profiles of AF -series is the same as RC -series. Please see the special data sheet “Chip resistors mounting”. RESISTANCE RANGE TEMPERATURE COEFFICIENT OF RESISTANCE PT040
100 MΩ TO 910 MΩ
100 mΩ to 910 mΩ ± 200 ppm/°C PT060 3 ± 200 ppm/°C PT080 5 ± 200 ppm/°C PT120 6 100 mΩ > 100 mΩ PT201 0 ± 100 ppm/°C ± 75 ppm/°C PT251 2 ± 100 ppm/°C ± 75 ppm/°C FUNCTIONAL DESCRIPTION OOPPEERRAATTIINNGG TTEEMMPPEERRAATTUURREE RRAANNGGEE AF0201 - AF2512 Range: -55 °C to + 155 °C (Fig. 7) PPOOWWEERR RRAATTIINNGG Each type rated power at 7 0 °C: AF0201=1/20W (0.05W) AF0402=1/16 W (0.0625W) AF0603=1/10 W (0.1W) AF0805=1/8 W (0.125W) AF1206=1/4 W (0.25W) AF1210=1/2W (0.5W) AF1218=1W AF2512=1W RATED VOLTAGE The DC or AC (rms) continuous working voltage corresponding to the rated power is determined by the following formula: V = (P X R) Where V = Continuous rated DC or AC (rms) working voltage (V) P = Rated power (W) R = Resistance value (Ω) PACKING STYLE AND PACKAGING QUANTITY PACKING STYLE REEL DIMENSION AF0201 AF0402 AF0603/0805/ 1206 AF1210 AF1218/2010/ 2512 Paper taping reel (R) 7" (178 mm) 10,000/20,000 10,000/20,000 5,000 5,000 -- 13" (330 mm) 50,000 50,000 20,000 20,000 -- Embossed taping reel (K) 7" (178 mm) -- -- -- -- 4,000 NOTE 1. For paper/embossed tape and reel specification/dimensions, please see the special data sheet “Chip resistors packing”. Table 3 Packing style and packaging quantity Fig. 7 Maximum dissipation (P max) in percentage of rated power as a function of the operating ambient temperature (T amb)
Chip Resistor Surface Mount www.yageo.com Jun. 21, 2016 V.5 Product specification SERIES AF 0201 to 2512 TESTS AND REQUIREMENTS TEST TEST METHOD PROCEDURE REQUIREMENTS Temperature Coefficient of Resistance (T.C.R.) IEC 60115-1 4.8 MIL-STD-202 Method 304 At +25/–55 °C and +25/+125 °C Refer to table 2 Formula: Where t1=+25 °C or specified room temperature t2=–55 °C or +125 °C test temperature R1=resistance at reference temperature in ohms R2=resistance at test temperature in ohms Life/Endurance IEC 60115-1 4.25 MIL-STD-202 Method 108 At 70± 2 °C for 1,000 hours, RCWV applied for 1.5 hours on, 0.5 hour off, still-air required ± (1.0%+0.05 Ω) <100 mΩ for Jumper High Temperature Exposure MIL-STD-202 Method 108 1,000 hours at 155±3℃ unpowered ± (1.0%+0.05 Ω) <100 mΩ for Jumper Moisture Resistance MIL-STD-202 Method 106 Each temperature / humidity cycle is defined at 8 hours, 3 cycles / 24 hours for 10d. with 25 °C / 65 °C 95% R.H, without steps 7a & 7b, unpowered Parts mounted on test-boards, without condensation on parts tol. ± (1.0%+0.05 Ω) for 5% tol. <100 mΩ for Jumper Thermal Shock MIL-STD-202 Method 107 –55 / +125 °C Number of cycles required is 300. Devices mounted Maximum transfer time is 20 seconds. Dwell time is 15 minutes tol. ± (1%+0.05 Ω) for 5% tol. <100 mΩ for Jumper Short Time Overload IEC60115-1 4.13 2.5 times of rated voltage or maximum overload voltage whichever is less for 5 seconds at room temperature ± (1.0%+0.05 Ω) No visible damage Bending IEC 60115-1 4.33 Chips mounted on a 90 mm glass epoxy resin PCB (FR4) Bending: 0201/0402: 5 mm 0603/0805: 3 mm 1206 & above: 2 mm Bending time: 60± 5 seconds ± (1.0%+0.05 Ω) <100 mΩ for Jumper No visible damage Table 4 Test condition, procedure and requirements R2–R1 R1(t2–t1)
Chip Resistor Surface Mount www.yageo.com Jun. 21, 2016 V.5 Product specification SERIES AF 0201 to 2512 TEST TEST METHOD PROCEDURE REQUIREMENTS Biased Humidity MIL-STD-202 method 103 1,000 hours; 85℃/85%R.H., 10% of operating power. Measurement at 24± 4 hours after test conclusion. 1MΩ<R≤10MΩ: ±(5%+0.05Ω) Solderability - Resistance to Soldering Heat IEC 60115-1 4.18 MIL-STD-202 Method 215 Condition B, no pre-heat of samples Lead-free solder, 260± 5 °C, 10± 1 seconds immersion time Procedure 2 for SMD: devices fluxed and cleaned with isopropanol ± (1.0%+0.05Ω) for 5% tol. <50 mΩfor Jumper No visible damage - Wetting J-STD-002 Electrical test not required Magnification 10X SMD conditions: (a) Method B, aging 4 hours at 155 °C dry heat, lead-free solder bath at 245 °C (b) Method B, dipping at 215 °C for 3 seconds Well tinned (≥95% covered) No visible damage FOS ASTM-B-809-95* * Modified Sulfur 750 hours, 105 °C. unpowered ± (4.0%+0.05Ω)
Chip Resistor Surface Mount www.yageo.com Jun. 21, 2016 V.5 Product specification SERIES AF 0201 to 2512
REVISION HISTORY
“ Yageo reserves all the rights for revising the content of this datasheet without further notification, as long as the products are unchanged. Any product change will be announced by PCN.” REVISION DATE CHANGE NOTIFICATION DESCRIPTION Version 5 Jun. 21, 2016 - - Update test and requirement Version 4 Dec. 24, 2015 - - Update Dielectric Withstanding Voltage& Resistance value Version 3 Apr. 01, 2015 - - Modified test and requirements Version 2 Nov. 20, 2014 - - Tests and requirement update Version 1 Sep. 27, 2013 - - Size 0201/1210/1218/2010/2512 extend Version 0 Jan 07, 2011 - - First issue of this specification