AF0603

AF0603JR-070RL YAGEO | Alldatasheet

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ANTI-SULFURATED CHIP RESISTORS AUTOMOTIVE GRADE AF series 5%, 1%, 0.5% sizes 0100/0201/0402/0603/0805/1206/1210/1218/2010/2512 RoHS compliant & Halogen free Product specification – January 03, 2023 V.9

Chip Resistor Surface Mount www.yageo.com Jan. 03, 202 3 V.9 Product specification SERIES AF 0100 to 2512 ORDERING INFORMATION - GLOBAL PART NUMBER Part number is identified by the series name, size, tolerance, packaging type, temperature coefficient, taping reel and resistance value. SCOPE This specification describes AF0100 to AF2512 chip resistors with anti-sulfuration capabilities.

APPLICATIONS

 Industrial Equipment  Power Application  Networking Application  High -end Computer & Multimedia Electronics in high sulfur environment  Automotive electronics

FEATURES

 AEC-Q200 qualified  Superior resistance against sulfur containing atmosphere  Halogen free product and production  RoHS compliant  Reduces environmentally hazardous waste  High component and equipment reliability  Saving of PCB space  Moisture sensitivity level: MSL 1  50ppm available GLOBAL PART NUMBER AF XXXX X X X XX XXXX L (1) SIZE 0100/0201/0402/0603/0805/1206/1210/1218/2010/2512 (2) TOLERANCE D = ± 0.5% F = ± 1% J = ± 5% (for jumper ordering, use code of J) (3) PACKAGING TYPE R = Paper taping reel K = Embossed plastic tape reel (4) TEMPERATURE COEFFICIENT OF RESISTANCE – = Base on spec E = ± 50 ppm/°C (5) TAPING REEL 07 = 7 inch dia. Reel 13 = 13 inch dia. Reel 7W = 7 inch dia. Reel & 2 x standard power (6) RESISTANCE VALUE There are 2~4 digits indicated the resistance value. Letter R/K/M is decimal point. Detailed resistance rules are displayed in the table of “Resistance rule of global part number”. (7) DEFAULT CODE Letter L is system default code for ordering only (Note) ORDERING EXAMPLE The ordering code for an AF0402 chip resistor, value 100 KΩ with ±1% tolerance, supplied in 7 -inch tape reel with 10Kpcs quantity is: AF0402FR-07100KL. NOTE 1. All our R-Chip products are RoHS compliant and Halogen free. "LFP" of the internal 2D reel label states "Lead-Free Process" 2. On customized label, "LFP" or specific symbol can be printed Resistance rule of global part number Resistance coding rule Example XRXX (1 to 9.76 Ω) 1R = 1 Ω 1R5 = 1.5 Ω 9R76 = 9.76 Ω XXRX (10 to 97.6 Ω) 10R = 10 Ω 97R6 = 97.6 Ω XXXR (100 to 976 Ω) 100R = 100 Ω XKXX (1 to 9.76 KΩ) 1K = 1,000 Ω 9K76 = 9760 Ω XMXX (1 to 9.76 MΩ) 1M = 1,000,000 Ω 9M76= 9,760,000 Ω

Chip Resistor Surface Mount www.yageo.com Jan. 03, 202 3 V.9 Product specification SERIES AF 0100 to 2512 MARKING AF0100 / AF0201 / AF0402 No marking AF0603 / AF0805 / AF1206 / AF1210 / AF2010 / AF2512 E-24 series: 3 digits, ±5%, ≥10 Ω First two digits for significant figure and 3rd digit for number of zeros AF0603 E-24 series: 3 digits, ±1% One short bar under marking letter E-96 series: 3 digits, ±1% First two digits for E -96 marking rule and 3rd letter for number of zeros AF0805 / AF1206 / AF1210 / AF2010 / AF2512 Both E -24 and E -96 series: 4 digits, ±1% First three digits for significant figure and 4th digit for number of zeros AF1218 E-24 series: 3 digits, ± 5% First two digits for significant figure and 3rd digit for number of zeros Both E-24 and E -96 series: 4 digits, ± 1% First three digits for significant figure and 4th digit for number of zeros NOTE For further marking information, please see special data sheet “Chip resistors marking”. Marking of AF series is the same as RC series Fig. 1 ynsc007 Fig. 2 Value=10 KΩ YNSC001 Fig. 3 Value = 24 Ω YNSC037 Fig. 5 Value = 10 K Ω YNSC004 Fig. 4 Value = 12.4 K Ω Fig. 6 Value = 10 K Ω YNSC099-2 Fig. 7 Value = 10 K Ω YNSC103-2

Chip Resistor Surface Mount www.yageo.com Jan. 03, 202 3 V.9 Product specification SERIES AF 0100 to 2512 Fig. 8 Chip resistor outlines OOUUTTLLIINNEESS For dimensions see Table 1 overcoat primary glass layer resistive layer (Jumper chip is a conductor) inner electrode termination(Ni/matte tin) ceramic substrate marking layer overcoat inner electrode YNSC086 W L H CONSTRUCTION The resistors are constructed on top of a high grade ceramic body. Internal metal electrodes are added at each end and connected by a resistive glaze. The resistive glaze is covered by a glass. The composition of the glaze is adjusted to give the approximate required resistance value and laser trimming of this resistive glaze achieves the value within tolerance. The whole element is covered by a protective overcoat. Size 0603 and bigger is marked with the resistance value on top. Finally, the two external terminations (Ni / matte tin) are added. See fig.8 DIMENSIONS TYPE L (mm) W (mm) H (mm) I1 (mm) I2 (mm) Table 1 For outlines see fig. 8

Chip Resistor Surface Mount www.yageo.com Jan. 03, 202 3 V.9 Product specification SERIES AF 0100 to 2512

ELECTRICAL CHARACTERISTICS

Max. Working Voltage Max. Overload Voltage Dielectric Withstanding Voltage Resistance Range Temperature Coefficient Jumper Criteria AF0100 1/32 W –55 °C to 125°C 15V 30V 30V 5% (E24) 10Ω ≤ R ≤ 1MΩ 1% (E24/E96) 10Ω ≤ R ≤ 1MΩ Jumper < 50mΩ 10Ω ≤ R < 100Ω ±3 00 ppm/°C 100Ω ≤ R ≤ 1MΩ ± 200 ppm/°C Rated Current 0.5A Max. Current 1.0A AF0201 1/20 W –55 °C to 155 °C 25V 50V 50V 5% (E24) 1Ω ≤ R ≤ 10MΩ 0.5%, 1% (E24/E96) 1Ω ≤ R ≤ 10MΩ Jumper < 50mΩ 1Ω ≤ R ≤ 10Ω -100/+350 ppm/°C 10Ω < R ≤ 10MΩ ± 200 ppm/°C Rated Current 0.5A Max. Current 1.0A AF0402 1/16 W 50V 100V 100V 5% (E24) 1Ω ≤ R ≤ 22MΩ 0.5%, 1% (E24/E96) 1Ω ≤ R ≤ 10MΩ Jumper < 50mΩ 1Ω ≤ R ≤ 10Ω ± 200 ppm/°C 10Ω < R ≤ 10MΩ ± 100 ppm/°C 10MΩ < R ≤ 22MΩ ± 200 ppm/°C 100Ω ≤ R ≤ 1MΩ ± 50 ppm/°C Rated Current Max. Current 1/8W 75V 100V 100V 5% (E24) 1Ω ≤ R ≤ 10MΩ 1Ω ≤ R ≤ 10MΩ 1Ω ≤ R < 10Ω ± 200 ppm/°C 10Ω ≤ R ≤ 10MΩ ± 100 ppm/°C AF0603 1/10 W 75V 150V 150V 5% (E24) 1Ω ≤ R ≤ 22MΩ 0.5%, 1% (E24/E96) 1Ω ≤ R ≤ 10MΩ Jumper < 50mΩ 1Ω ≤ R < 10Ω ± 200 ppm/°C 10Ω ≤ R ≤ 10MΩ ± 100 ppm/°C 10MΩ < R ≤ 22MΩ ± 200 ppm/°C 100Ω ≤ R ≤ 10MΩ ± 50 ppm/°C Rated Current Max. Current 1/5 W 75V 150V 150V 5% (E24) 1Ω ≤ R ≤ 10MΩ 1Ω ≤ R ≤ 10MΩ 1Ω ≤ R < 10Ω ± 200 ppm/°C 10Ω ≤ R ≤ 10MΩ ± 100 ppm/°C AF0805 1/8 W 150V 300V 300V 5% (E24) 1Ω ≤ R ≤ 22MΩ 0.5%, 1% (E24/E96) 1Ω ≤ R ≤ 10MΩ Jumper < 50mΩ 1Ω ≤ R < 10Ω ± 200 ppm/°C 10Ω ≤ R ≤ 10MΩ ± 100 ppm/°C 10MΩ < R ≤ 22MΩ ± 200 ppm/°C 100Ω ≤ R ≤ 10MΩ ± 50 ppm/°C Rated Current Max. Current 1/4 W 150V 300V 300V 5% (E24) 1Ω ≤ R ≤ 10MΩ 1Ω ≤ R ≤ 10MΩ 1Ω ≤ R < 10Ω ± 200 ppm/°C 10Ω ≤ R ≤ 10MΩ ± 100 ppm/°C AF1206 1/4 W 200V 400V 500V 5% (E24) 1Ω ≤ R ≤ 22MΩ 0.5%, 1% (E24/E96) 1Ω ≤ R ≤ 10MΩ Jumper < 50mΩ 1Ω ≤ R < 10Ω ± 200 ppm/°C 10Ω ≤ R ≤ 10MΩ ± 100 ppm/°C 10MΩ < R ≤ 22MΩ ± 200 ppm/°C 100Ω ≤ R ≤ 10MΩ ± 50 ppm/°C Rated Current Max. Current 10A 1/2 W 200V 400V 500V 5% (E24) 1Ω ≤ R ≤ 10MΩ 1Ω ≤ R ≤ 10MΩ 1Ω ≤ R < 10Ω ± 200 ppm/°C 10Ω ≤ R ≤ 10MΩ ± 100 ppm/°C

Chip Resistor Surface Mount www.yageo.com Jan. 03, 202 3 V.9 Product specification SERIES AF 0100 to 2512 Max. Working Voltage Max. Overload Voltage Dielectric Withstanding Voltage Resistance Range Temperature Coefficient Jumper Criteria AF1210 1/2 W –55 °C to 155 °C 200V 500V 500V 5% (E24) 1Ω ≤ R ≤ 10MΩ 0.5%, 1% (E24/E96) 1Ω ≤ R ≤ 10MΩ Jumper < 50mΩ 1Ω ≤ R < 10Ω ± 200 ppm/°C 10Ω ≤ R ≤ 10MΩ ± 100 ppm/°C 100Ω ≤ R ≤ 1MΩ ± 50 ppm/°C Rated Current Max. Current 10A

1 W 200V 500V 500V

5% (E24) 1Ω ≤ R ≤ 10MΩ 0.5%, 1% (E24/E96) 1Ω ≤ R ≤ 10MΩ 1Ω ≤ R < 10Ω ± 200 ppm/°C 10Ω ≤ R ≤ 10MΩ ± 100 ppm/°C AF1218 5% (E24) 1Ω ≤ R ≤ 1MΩ 0.5%, 1% (E24/E96) 1Ω ≤ R ≤ 1MΩ Jumper < 50mΩ 1Ω ≤ R < 10Ω ± 200 ppm/°C 10Ω ≤ R ≤ 1MΩ ± 100 ppm/°C 100Ω ≤ R ≤ 2.2MΩ ± 50 ppm/°C Rated Current Max. Current 10A

1.5 W 200V 500V 500V

5% (E24) 1Ω ≤ R ≤ 1MΩ 0.5%, 1% (E24/E96) 1Ω ≤ R ≤ 1MΩ 1Ω ≤ R < 10Ω ± 200 ppm/°C 10Ω ≤ R ≤ 1MΩ ± 100 ppm/°C AF2010 3/4 W 200V 500V 500V 5% (E24) 1Ω ≤ R ≤ 10MΩ 0.5%, 1% (E24/E96) 1Ω ≤ R ≤ 10MΩ Jumper < 50mΩ 1Ω ≤ R < 10Ω ± 200 ppm/°C 10Ω ≤ R ≤ 10MΩ ± 100 ppm/°C 100Ω ≤ R ≤ 10MΩ ± 50 ppm/°C Rated Current Max. Current 10A 1.25W 200V 500V 500V 5% (E24) 1Ω ≤ R ≤ 10MΩ 0.5%, 1% (E24/E96) 1Ω ≤ R ≤ 10MΩ 1Ω ≤ R < 10Ω ± 200 ppm/°C 10Ω ≤ R ≤ 10MΩ ± 100 ppm/°C AF2512 5% (E24) 1Ω ≤ R ≤ 10MΩ 0.5%, 1% (E24/E96) 1Ω ≤ R ≤ 10MΩ Jumper < 50mΩ 1Ω ≤ R < 10Ω ± 200 ppm/°C 10Ω ≤ R ≤ 10MΩ ± 100 ppm/°C 100Ω ≤ R ≤ 10MΩ ± 50 ppm/°C Rated Current Max. Current 10A

2 W 200V 500V 500V

5% (E24) 1Ω ≤ R ≤ 10MΩ 0.5%, 1% (E24/E96) 1Ω ≤ R ≤ 10MΩ 1Ω ≤ R < 10Ω ± 200 ppm/°C 10Ω ≤ R ≤ 10MΩ ± 100 ppm/°C

Chip Resistor Surface Mount www.yageo.com Jan. 03, 202 3 V.9 Product specification SERIES AF 0100 to 2512 FOOTPRINT AND SOLDERING PROFILES For recommended footprint and soldering profiles of AF -series is the same as RC -series. Please see the special data sheet “Chip resistors mounting”. RESISTANCE RANGE TEMPERATURE COEFFICIENT OF RESISTANCE PT040

100 MΩ TO 910 MΩ

100 mΩ to 910 mΩ ± 200 ppm/°C PT060 ± 200 ppm/°C PT080 ± 200 ppm/°C PT120 6 100 mΩ > 100 mΩ PT201 ± 100 ppm/°C ± 75 ppm/°C PT251 ± 100 ppm/°C ± 75 ppm/°C FUNCTIONAL DESCRIPTION OOPPEERRAATTIINNGG TTEEMMPPEERRAATTUURREE RRAANNGGEE AF0100 Range: -55°C to + 125°C AF0201 - AF2512 Range: -55°C to + 155°C PPOOWWEERR RRAATTIINNGG Each type rated power at 7 0°C: AF0100=1/32W (0.03125W) AF0201=1/20W (0.05W) AF1218=1W; 1.5W AF2512=1W, 2W RATED VOLTAGE The DC or AC (rms) continuous working voltage corresponding to the rated power is determined by the following formula: V = √(P X R) Where V = Continuous rated DC or AC (rms) working voltage (V) P = Rated power (W) R = Resistance value (Ω) Fig. 9 Maximum dissipation (P max) in percentage of rated power as a function of the operating ambient temperature (T amb) 70 10055 50 Tamb( C)o (%P )rated 100 155 P 125 0201 to 2512 0100 MLB206_9-1 PACKING STYLE AND PACKAGING QUANTITY PACKING STYLE REEL DIMENSION AF0100 AF0201 AF0402 AF0603 AF0805 AF1206 AF1210 AF1218 AF2010 AF2512 Paper taping reel (R) 7" (178 mm) 20,000 10,000/20,000 10,000/20,000 5,000 5,000 -- 13" (330 mm) -- 50,000 50,000 20,000 20,000 -- Embossed taping reel (K) 7" (178 mm) -- -- -- -- -- 4,000 NOTE 1. For paper/embossed tape and reel specification/dimensions, please see the special data sheet “Chip resistors packing”. Table 3 Packing style and packaging quantity

Chip Resistor Surface Mount www.yageo.com Jan. 03, 202 3 V.9 Product specification SERIES AF 0100 to 2512 TESTS AND REQUIREMENTS TEST TEST METHOD PROCEDURE REQUIREMENTS Temperature Coefficient of Resistance (T.C.R.) IEC 60115-1 4.8 MIL-STD-202 Method 304 At +25/–55°C and +25/+125°C Refer to table 2 Formula: Where t1=+25°C or specified room temperature t2=–55°C or +125°C test temperature R1=resistance at reference temperature in ohms R2=resistance at test temperature in ohms Life/Endurance IEC 60115-1 4.25 MIL-STD-202 Method 108 At 70± 2°C for 1,000 hours, RCWV applied for 1.5 hours on, 0.5 hour off, still-air required Others: ± (1.0%+0.05 Ω) <100 mΩ for Jumper High Temperature Exposure MIL-STD-202 Method 108 0100: 1,000 hours at 125°C Others: 1,000 hours at 155± 3°C unpowered <50 mΩ for Jumper Others: ± (1.0%+0.05 Ω) <100 mΩ for Jumper Moisture Resistance MIL-STD-202 Method 106 Each temperature / humidity cycle is defined at 8 hours, 3 cycles / 24 hours for 10d. with 25°C / 65°C 95% R.H, without steps 7a & 7b, unpowered Parts mounted on test-boards, without condensation on parts <50 mΩ for Jumper Others: ± (1.0%+0.05 Ω) for 5% tol. <100 mΩ for Jumper Thermal Shock MIL-STD-202 Method 107 –55 / +125°C Number of cycles required is 300. Devices mounted Maximum transfer time is 20 seconds. Dwell time is 15 minutes <50 mΩ for Jumper Others: ± (1%+0.05 Ω) for 5% tol. <100 mΩ for Jumper Short Time Overload IEC60115-1 4.13 2.5 times of rated voltage or maximum overload voltage whichever is less for 5 seconds at room temperature Others: ± (1.0%+0.05 Ω) <50 mΩ for Jumper No visible damage Bending IEC 60115-1 4.33 Chips mounted on a 90 mm glass epoxy resin PCB (FR4) Bending : 0100/0201/0402: 5 mm 0603/0805: 3 mm 1206 & above: 2 mm Bending time: 60± 5 seconds ± (1.0%+0.05 Ω) 0100: <50 mΩ for Jumper Others: <100 mΩ for Jumper No visible damage Table 4 Test condition, procedure and requirements R2–R1 R1(t2–t1)

Chip Resistor Surface Mount www.yageo.com Jan. 03, 202 3 V.9 Product specification SERIES AF 0100 to 2512 TEST TEST METHOD PROCEDURE REQUIREMENTS Biased Humidity MIL-STD-202 method 103 1,000 hours; 85°C /85%R.H., 10% of operating power. Measurement at 24± 4 hours after test conclusion. 0100: ± (5%+0.05Ω) <50 mΩ for Jumper Others: <100 mΩ for Jumper Solderability - Resistance to Soldering Heat IEC 60115-1 4.18 MIL-STD-202 Method 215 Condition B, no pre-heat of samples Lead-free solder, 260± 5°C, 10± 1 seconds immersion time Procedure 2 for SMD: devices fluxed and cleaned with isopropanol Others: ± (1.0%+0.05Ω) for 5% tol. <50 mΩ for Jumper No visible damage - Wetting J-STD-002 Electrical test not required Magnification 10X SMD conditions: Others: (a) Method B, aging 4 hours at 155°C dry heat, lead-free solder bath at 245°C (b) Method B, dipping at 215°C for 3 seconds 0100: 1st step: Method B, aging 4 hours at 155°C dry heat 2nd step: Lead free solder bath at 245°C Well tinned (≥95% covered) No visible damage FOS ASTM-B-809-95* * Modified Sulfur 750 hours, 105°C. unpowered 0100: ±( 5.0%+0.05Ω) Others: ± (4.0%+0.05Ω) <100 mΩ for Jumper

Chip Resistor Surface Mount www.yageo.com Jan. 03, 202 3 V.9 Product specification SERIES AF 0100 to 2512

REVISION HISTORY

“ YAGEO reserves all the rights for revising the content of this datasheet without further notification, as long as the products are unchanged. Any product change will be announced by PCN.” REVISION DATE CHANGE NOTIFICATION DESCRIPTION Version 9 Jan. 03, 2023 - - 10ohm TCR upgrade to 100ppm, for 0603~2512 normal power and 0402~2512 double power. Version 8 Mar. 26, 2021 - - Add TCR 50ppm and size 01005 extend Version 7 Nov. 1, 2019 - - Add in AF double power Version 6 Sep. 05, 2019 - - Updated dimensions Version 5 Jun. 21, 2016 - - Update test and requirement Version 4 Dec. 24, 2015 - - Update Dielectric Withstanding Voltage& Resistance value Version 3 Apr. 01, 2015 - - Modified test and requirements Version 2 Nov. 20, 2014 - - Tests and requirement update Version 1 Sep. 27, 2013 - - Size 0201/1210/1218/2010/2512 extend Version 0 Jan 07, 2011 - - First issue of this specification