AF0130 ONSEMI | Alldatasheet

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Technical content

www.onsemi.com  Semiconductor Components Industries, LLC, 2023 June, 2025 − Rev. 0

1 AF0130-PD/D

1.2 MP Smart iToF 1/3.2-inch Stacked BSI Global Shutter Depth Sensor AF0130, AF0131 onsemi AF0130 and AF0131 Smart Indirect Time of Flight (iToF) sensors are a 1/3.2-inch optical format, back side illuminated CMOS global shutter depth and imaging solution. The sensors have on-chip dual laser driver controls and modulation frequencies (up to 200 MHz) as well as on-chip laser eye-safety thresholds. The AF0130 sensor version comes with a depth processing ASIC stacked below its pixel area which calculates depth, confidence and intensity maps at high speeds from its laser modulated exposures. The AF0131 sensor version does not come with on-chip depth processing but does come with the same performance. This sensor is for solutions which prefer their own depth calculations off-chip. Table 1. KEY PERFORMANCE PARAMETERS

  1. Power consumption will increase with exposure time, frame rate and

modulation frequency due to AVDD_MG supply.

  1. /C0113JA is dependent on the customer module design and should not be used for

calculating junction temperature.

ORDERING INFORMATION

XXXX = Specific Device Code Y = Year W = Work Week NNN = Serial Number Request Full Data Sheet Non−NDA Data Sheet Interested in what you see? If you would like more detailed information, please request the full version of our data sheet.

AF0130, AF0131 www.onsemi.com

Features

 1.2 MP CMOS Smart iToF Sensor with Advanced 3.5 /C0109m Pixel Stacked BSI Technology  Superior Low-Light and Ambient-Light Performance  Enhanced NIR Response at 850 nm and 940 nm Wavelength (QE > 40%)  Dual Laser (Frequency) Operation for Increased Depth Range (Disambiguation) in VGA Resolution  Low V oltage Differential Signal (LVDS) Driver for Modulation Control of Two Lasers up to 200 MHz  Two or Four-Wire Serial Interface for Register Access  2 Gbps/Lane, 2-lane MIPI CSI-2 D-PHY Data Interface  Laser Eye Safety Monitoring  Three Output Mode: RAW, Data Reduction (DR), Integrated Depth Processing (DP)  Phase and Pulsed (Hybrid) Modulation Support  Simultaneous Depth, Confidence and Grayscale Output  Horizontal and Vertical Mirroring, Windowing and Pixel Binning  Context State Machine with 64 Programmable Contexts  Automatic Exposure Control (AEC)  Pixel Identification & Correction (PDI & PDC)  Multi Camera and Interference Mitigation  Reduced Motion Artefacts due to Decoupling between Integration and Readout  Hardware Trigger Control  On-Chip Mean and Histogram Statistics for Smart Control  On-Chip Temperature Sensor  These Devices are Pb-Free and RoHS Compliant

Applications

 Computing  Drones, Robotics & Automation  Metrology  Machine Vision  Future Retail & Intelligent Logistics  Security & Access Control  Virtual or Augmented Reality  3D Modeling Table 2. ORDERING INFORMATION − PART Table 3. ORDERING INFORMATION − EVALUATION BOARD

ODCSP87 6.05x4.83x0.63, 0.50P CASE 570AZ ISSUE A DATE 17 JUN 2024 XXXX = Specific Device Code Y = Year W = Work Week NNN = Serial Number *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “/C0071”, may or may not be present. Some products may not follow the Generic Marking. GENERIC MARKING DIAGRAM* MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 98AON62452HDOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1ODCSP87 6.05x4.83x0.63, 0.50P onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2024 www.onsemi.com

onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. ADDITIONAL INFORMATION TECHNICAL PUBLICATIONS: Technical Library: www.onsemi.com/design/resources/technical−documentation onsemi Website: www.onsemi.com ONLINE SUPPORT: www.onsemi.com/support For additional information, please contact your local Sales Representative at www.onsemi.com/support/sales