DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 14
Technical content
Features
High brightness AlInGaP Available in Red and Amber Typical viewing angle: 33° Tinted appearance Surface mountable Compatible with industrial reflow soldering process MSL 3
Applications
Variable message signs Solar power signs Monocolor signs CAUTION! This LED is ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to application note AN-1142 for additional details. The LED must be kept in a moisture barrier bag with < 5% relative humidity (RH) when not in use because prolonged exposure to the environment might cause the leads to tarnish or rust, which might cause difficulties in soldering. AEMD-EG3K, AEMD-EL3K High Brightness Red and Amber SMT Round Lamps
AEMD-EG3K, AEMD-EL3K Data Sheet High Brightness Red and Amber SMT Round Lamps Figure 1: Package Drawing NOTE: 1. All dimensions in millimeters (mm). 2. Tolerance is ±0.50 mm unless otherwise specified. Lead Configuration Pin 1 Anode Pin 2 Cathode Pin 3 Anode PIN 2 PIN 1 4.2 ±0.2 PIN 3 4.2 ±0.2 3.9 ±0.2 6.8 3.4 2.0 2.1 ±0.1 0.5 ±0.1 4.2 0.5 ±0.2 0.4 ±0.05
AEMD-EG3K, AEMD-EL3K Data Sheet High Brightness Red and Amber SMT Round Lamps Device Selection Guide (TJ = 25°C, IF = 20 mA) Absolute Maximum Ratings Part Number Color Luminous Intensity, IV (mcd)a, b a. The luminous intensity, IV is measured at the mechanical axis of the package and it is tested with a single current pulse condition. The actual peak of the spatial radiation pattern may not be aligned with the axis. b. Tolerance is ±15%. Dominant Wavelength,d (nm)c c. The dominant wavelength, d is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. Min. Max. Min. Max. AEMD-EG3K-VW002 Red 4200 7200 618.0 630.0 AEMD-EL3K-VW002 Amber 4200 7200 584.5 594.5 AEMD-EL3K-VWK02 Amber 4200 7200 587.0 592.0 AEMD-EL3K-VWL02 Amber 4200 7200 589.5 594.5Parameters Red/Amber Units DC Forward Currenta a. Derate linearly as shown in Figure 9. 50 mA Peak Forward Currentb b. Duty factor = 10%, frequency = 1kHz. 100 mA Power Dissipation 120 mW Reverse Voltage Not recommended for reverse bias V LED Junction Temperature 110 °C Operating Temperature Range –40 to +85 °C Storage Temperature Range –40 to +100 °C
AEMD-EG3K, AEMD-EL3K Data Sheet High Brightness Red and Amber SMT Round Lamps Optical and Electrical Characteristics (TJ = 25°C) Parameters Min. Typ. Max. Units Test Condition Viewing Angle, 2½ a a. ½ is the off-axis angle where the luminous intensity is ½ the peak intensity. —3 3— ° I F = 20 mA Dominant Wavelength, d b Red Amber b. The dominant wavelength, d is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 618.0 584.5 621.0 590.0 630.0 594.5 nm I F = 20 mA Peak Wavelength, p Red Amber 630 594 nm I F = 20 mA Forward Voltage, VF c c. Forward voltage tolerance is ±0.1V. 1.8 2.1 2.4 V I F = 20 mA Reverse Voltage, VR d Red Amber d. Indicates product final test condition. Long-term reverse bias is not recommended. VI R = 100 µA Thermal Resistance, RθJ-P e Red Amber e. Thermal resistance from LED junction to pin. 270 270 °C/W LED junction to pin
AEMD-EG3K, AEMD-EL3K Data Sheet High Brightness Red and Amber SMT Round Lamps Part Numbering System Part Number Example AEMD-EL3K-VWK02 AEMD -x 1 x2 x3 K- x 4 x5 x6 x7 x8 Code Description Option x1 Package Type E Round AlInGaP x2 Color G Red LA m b e r x3 Viewing Angle 3 Typical 33° x4 Minimum Intensity Bin Refer to the Intensity Bin Limits (CAT) table x5 Maximum Intensity Bin x6 Color Bin Option 0 Full distribution K Bin 2, 4 L Bin 4, 6 x 7 x8 Packaging Option 02 Tested at 20 mA x1 : E – Round AlInGaP x2 : L – Amber color x3 : 3 – Typical 33° x4 : V – Minimum intensity bin V x5 : W – Maximum intensity bin W x6 : K – Color bin 2 and bin 4 x7 x8: 02 – Tested at 20 mA
AEMD-EG3K, AEMD-EL3K Data Sheet High Brightness Red and Amber SMT Round Lamps Broadcom AEMD-Ex3K-DS100 Bin Information Intensity Bin Limits (CAT) Tolerance = ±15% Color Bin Limits (BIN) Tolerance = ±1.0 nm Forward Voltage Bin Limits (VF) Tolerance = ±0.1V Example of bin information on reel and packaging label: Bin ID Luminous Intensity, Iv (mcd) Min. Max. V 4200 5500 W 5500 7200 Bin ID Dominant Wavelength, d (nm) Min. Max. Red — 618.0 630.0 Amber 1 584.5 587.0 2 587.0 589.5 4 589.5 592.0 6 592.0 594.5 Bin ID Forward Voltage, VF (V) Min. Max. VD 1.8 2.0 VA 2.0 2.2 VB 2.2 2.4 CAT : V – Intensity bin V BIN : 2 – Color bin 2 VF : VA – Forward voltage bin VA
AEMD-EG3K, AEMD-EL3K Data Sheet High Brightness Red and Amber SMT Round Lamps Figure 11: Carrier Tape Dimensions NOTE: 1. All dimensions in millimeters (mm). 2. Tolerance is ± 0.10 mm unless otherwise specified. SECTION X – X 2.45 7.8 5.4 4.65 2.65 8.00 ±0.1 1.5 MIN. 16.0 ±0.3 7.5 1.75 X X 1.5 +0.1 0.0 4.0 2.0 Y 0.4 ±0.2 Y 4.65 1.5 SECTION Y – Y
AEMD-EG3K, AEMD-EL3K Data Sheet High Brightness Red and Amber SMT Round Lamps Figure 12: Reel Dimensions NOTE: All dimensions are in millimeters (mm). 13.00 +0.5 - 0.2 16.40 +2.0 - 0 330 MAX. 100 ±0.50 USER FEED DIRECTION PACKAGE MARKING LEADS UNREELING DIRECTION
AEMD-EG3K, AEMD-EL3K Data Sheet High Brightness Red and Amber SMT Round Lamps Broadcom AEMD-Ex3K-DS100 Control for unfinished reel: Store unused LEDs in a sealed MBB with desiccant or a desiccator at < 5% RH. Control of assembled boards: If the PCB soldered with the LEDs is to be subjected to other high-temperature processes, store the PCB in a sealed MBB with desiccant or desiccator at < 5% RH to ensure that all LEDs have not exceeded their floor life of 168 hours. Baking is required if: – The HIC indicator indicates a change in color for 10% and 5%, as stated on the HIC. – The LEDs are exposed to conditions of > 30°C/60% RH at any time. – The LED's floor life exceeded 168 hours. The recommended baking condition is: 60°C ± 5ºC for 20 hours. Baking can only be done once. Storage: The soldering terminals of these Broadcom LEDs are silver plated. If the LEDs are exposed in ambient environments for too long, the silver plating might be oxidized, thus affecting its solderability performance. As such, keep unused LEDs in a sealed MBB with desiccant or in a desiccator at < 5% RH. Application Precautions The drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the data sheet. Constant current driving is recommended to ensure consistent performance. Circuit design must cater to the whole range of forward voltage (VF) of the LEDs to ensure the intended drive current can always be achieved. The LED exhibits slightly different characteristics at different drive currents, which may result in a larger variation of performance (meaning: intensity, wavelength, and forward voltage). Set the application current as close as possible to the test current to minimize these variations. The LED is not intended for reverse bias. Use other appropriate components for such purposes. When driving the LED in matrix form, ensure that the reverse bias voltage does not exceed the allowable limit of the LED. As actual application might not be exactly similar to the test conditions, do verify that the LED will not be damaged by prolonged exposure in the intended environment. Avoid rapid changes in ambient temperature, especially in high-humidity environments, because they cause condensation on the LED. If the LED is intended to be used in harsh or outdoor environments, protect the LED against damages caused by rain water, water, dust, oil, corrosive gases, external mechanical stresses, and so on. The number of reflow cycles and reflow temperature conditions used may affect optical characteristics of the LED. It is recommended to use LEDs with the same number of reflow cycles and the same reflow temperature conditions within the same finished good. Thermal Management The optical, electrical, and reliability characteristics of the LED are affected by temperature. Keep the junction temperature (TJ) of the LED below the allowable limit at all times. TJ can be calculated as follows: TJ = TA + RJ-A × IF × VFmax where: TA = Ambient temperature (°C) RJ-A = Thermal resistance from LED junction to ambient (°C/W) IF = Forward current (A) VFmax = Maximum forward voltage (V) The complication of using this formula lies in TA and RJ-A. Actual TA is sometimes subjective and hard to determine. RJ-A varies from system to system depending on design and is usually not known. Another way of calculating TJ is by using the solder point temperature, TS as follows: TJ = TS + RJ-S × IF × VFmax where: TS = LED solder point temperature as shown in the following figure (°C) RJ-S = Thermal resistance from junction to solder point (°C/W) IF = Forward current (A) VFmax = Maximum forward voltage (V)
AEMD-EG3K, AEMD-EL3K Data Sheet High Brightness Red and Amber SMT Round Lamps Broadcom AEMD-Ex3K-DS100 Figure 15: Solder Point Temperature on PCB TS can be easily measured by mounting a thermocouple on the soldering joint as shown in preceding figure, while RJ-S is provided in the data sheet. Verify the TS of the LED in the final product to ensure that the LEDs are operating within all maximum ratings stated in the data sheet. Eye Safety Precautions LEDs may pose optical hazards when in operation. Do not look directly at operating LEDs because it might be harmful to the eyes. For safety reasons, use appropriate shielding or personal protective equipment.
Broadcom, the pulse logo, Connecting everything, Avago Technologies, Avago, and the A logo are among the trademarks of Broadcom and/or its affiliates in the United States, certain other countries and/or the EU. Copyright © 2017 by Broadcom. All Rights Reserved. The term “Broadcom” refers to Broadcom Limited and/or its subsidiaries. For more information, please visit www.broadcom.com. Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others. Disclaimer Broadcom's products and software are not specifically designed, manufactured, or authorized for sale as parts, components, or assemblies for the planning, construction, maintenance, or direct operation of a nuclear facility or for use in medical devices or applications. The customer is solely responsible, and waives all rights to make claims against Broadcom or its suppliers, for all loss, damage, expense, or liability in connection with such use.