AEMD-CM3L BOARDCOM | Alldatasheet
Document overview
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Technical content
Features
High brightness InGaN Available in Green and Blue Typical viewing angle: 33° Tinted appearance Surface mountable Compatible with industrial reflow soldering process MSL 3
Applications
Variable message signs Monocolor signs CAUTION! This LED is ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to application note AN-1142 for additional details. The LED must be kept in a moisture barrier bag with < 5% relative humidity (RH) when not in use because prolonged exposure to the environment might cause the leads to tarnish or rust, which might cause difficulties in soldering. AEMD-CM3L, AEMD-CB3L High Brightness Green and Blue SMT Round Lamps
AEMD-CM3L, AEMD-CB3L Data Sheet High Brightness Green and Blue SMT Round Lamps Figure 1: Package Drawing NOTE: 1. All dimensions in millimeters (mm). 2. Tolerance is ±0.50 mm unless otherwise specified. Lead Configuration Pin 1 Anode Pin 2 Cathode Pin 3 Anode PIN 2 PIN 1 4.2 ±0.2 PIN 3 4.2 ±0.2 3.9 ±0.2 6.8 3.4 2.0 2.1 ±0.1 0.5 ±0.1 4.2 0.5 ±0.2 0.4 ±0.05
AEMD-CM3L, AEMD-CB3L Data Sheet High Brightness Green and Blue SMT Round Lamps Device Selection Guide (TJ = 25°C, IF = 20 mA) Absolute Maximum Ratings Part Number Color Luminous Intensity, IV (mcd)a, b a. The luminous intensity, IV is measured at the mechanical axis of the package and it is tested with a single current pulse condition. The actual peak of the spatial radiation pattern may not be aligned with the axis. b. Tolerance is ±15%. Dominant Wavelength,d (nm)c c. The dominant wavelength, d is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. Min. Max. Min. Max. AEMD-CM3L-Z1002 Green 12000 21000 519 539 AEMD-CM3L-Z1B02 Green 12000 21000 523 531 AEMD-CM3L-Z1C02 Green 12000 21000 527 535 AEMD-CB3L-ST002 Blue 1900 3200 460 480 AEMD-CB3L-STB02 Blue 1900 3200 464 472 AEMD-CB3L-STC02 Blue 1900 3200 468 476 Parameters Green Blue Units DC Forward Currenta a. Derate linearly as shown in Figure 9. 30 20 mA Peak Forward Currentb b. Duty factor = 10%, frequency = 1kHz. 100 100 mA Power Dissipation 114 76 mW Reverse Voltage Not recommended for reverse bias LED Junction Temperature 110 °C Operating Temperature Range –40 to +85 °C Storage Temperature Range –40 to +100 °C
AEMD-CM3L, AEMD-CB3L Data Sheet High Brightness Green and Blue SMT Round Lamps Optical and Electrical Characteristics (TJ = 25°C) Parameters Min. Typ. Max. Units Test Condition Viewing Angle, 2½ a a. ½ is the off-axis angle where the luminous intensity is ½ the peak intensity. —3 3— ° I F = 20 mA Dominant Wavelength, d b Green Blue b. The dominant wavelength, d is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 519.0 460.0 528.0 470.0 539.0 480.0 nm I F = 20 mA Peak Wavelength, p Green Blue 521.0 466.0 nm I F = 20 mA Forward Voltage, VF c Green Blue c. Forward voltage tolerance is ±0.1V. 2.8 2.8 3.8 3.8 VI F = 20 mA Reverse Voltage, VR d Green Blue d. Indicates product final test condition. Long term reverse bias is not recommended. VI R = 100 µA Thermal Resistance, RθJ-P e Green Blue e. Thermal resistance from LED junction to pin. 270 480 °C/W LED junction to pin
AEMD-CM3L, AEMD-CB3L Data Sheet High Brightness Green and Blue SMT Round Lamps Part Numbering System Part Number Example AEMD-CM3L-Z1C02 AEMD -x 1 x2 x3 L- x 4 x5 x6 x7 x8 Code Description Option x1 Package Type C Round InGaN x2 Color B Blue M Green x3 Viewing Angle 3 Typical 33° x4 Minimum Intensity Bin Refer to the Intensity Bin Limits (CAT) table x5 Maximum Intensity Bin x6 Color Bin Option 0 Full distribution B Bin 2, 3 C Bin 3, 4 x 7 x8 Packaging Option 02 Tested at 20 mA x1 : C – Round InGaN x2 : M – Green color x3 : 3 – Typical 33° x4 : Z – Minimum intensity bin Z x5 : 1 – Maximum intensity bin 1 x6 : C – Color bin 3 and bin 4 x7 x8: 02 – Tested at 20 mA
AEMD-CM3L, AEMD-CB3L Data Sheet High Brightness Green and Blue SMT Round Lamps Bin Information Intensity Bin Limits (CAT) Tolerance = ±15% Color Bin Limits (BIN) Tolerance = ±1.0 nm Example of bin information on reel and packaging label: Bin ID Luminous Intensity, Iv (mcd) Min. Max. Green Z 12000 16000 1 16000 21000 Blue S 1900 2500 T 2500 3200 Bin ID Dominant Wavelength, d (nm) Min. Max. Green 15 1 9 5 2 3 25 2 3 5 2 7 35 2 7 5 3 1 45 3 1 5 3 5 55 3 5 5 3 9 Blue 14 6 0 4 6 4 24 6 4 4 6 8 35 6 8 4 7 2 44 7 2 4 7 6 54 7 6 4 8 0 CAT : Z – Intensity bin Z BIN : 2 – Color bin 2
AEMD-CM3L, AEMD-CB3L Data Sheet High Brightness Green and Blue SMT Round Lamps Figure 11: Carrier Tape Dimensions NOTE: 1. All dimensions in millimeters (mm). 2. Tolerance is ± 0.10 mm unless otherwise specified. SECTION X – X 2.45 7.8 5.4 4.65 2.65 8.00 ±0.1 1.5 MIN. 16.0 ±0.3 7.5 1.75 X X 1.5 +0.1 0.0 4.0 2.0 Y 0.4 ±0.2 Y 4.65 1.5 SECTION Y – Y
AEMD-CM3L, AEMD-CB3L Data Sheet High Brightness Green and Blue SMT Round Lamps Figure 12: Reel Dimensions NOTE: All dimensions are in millimeters (mm). 13.00 +0.5 - 0.2 16.40 +2.0 - 0 330 MAX. 100 ±0.50 USER FEED DIRECTION PACKAGE MARKING LEADS UNREELING DIRECTION
AEMD-CM3L, AEMD-CB3L Data Sheet High Brightness Green and Blue SMT Round Lamps Broadcom AEMD-Cx3L-DS100 Control for unfinished reel: Store unused LEDs in a sealed MBB with desiccant or a desiccator at < 5% RH. Control of assembled boards: If the PCB soldered with the LEDs is to be subjected to other high-temperature processes, store the PCB in a sealed MBB with desiccant or desiccator at < 5% RH to ensure that all LEDs have not exceeded their floor life of 168 hours. Baking is required if: – The HIC indicator indicates a change in color for 10% and 5%, as stated on the HIC. – The LEDs are exposed to conditions of > 30°C/60% RH at any time. – The LED's floor life exceeded 168 hours. The recommended baking condition is: 60°C ± 5ºC for 20 hours. Baking can only be done once. Storage: The soldering terminals of these Broadcom LEDs are silver plated. If the LEDs are exposed in ambient environments for too long, the silver plating might be oxidized, thus affecting its solderability performance. As such, keep unused LEDs in a sealed MBB with desiccant or in a desiccator at < 5% RH. Application Precautions The drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the data sheet. Constant current driving is recommended to ensure consistent performance. Circuit design must cater to the whole range of forward voltage (VF) of the LEDs to ensure the intended drive current can always be achieved. The LED exhibits slightly different characteristics at different drive currents, which may result in a larger variation of performance (meaning: intensity, wavelength, and forward voltage). Set the application current as close as possible to the test current to minimize these variations. The LED is not intended for reverse bias. Use other appropriate components for such purposes. When driving the LED in matrix form, ensure that the reverse bias voltage does not exceed the allowable limit of the LED. As actual application might not be exactly similar to the test conditions, do verify that the LED will not be damaged by prolonged exposure in the intended environment. Avoid rapid changes in ambient temperature, especially in high-humidity environments, because they cause condensation on the LED. If the LED is intended to be used in harsh or outdoor environments, protect the LED against damages caused by rain water, water, dust, oil, corrosive gases, external mechanical stresses, and so on. The number of reflow cycles and reflow temperature conditions used may affect optical characteristics of the LED. It is recommended to use LEDs with the same number of reflow cycles and the same reflow temperature conditions within the same finished good. Thermal Management The optical, electrical, and reliability characteristics of the LED are affected by temperature. Keep the junction temperature (TJ) of the LED below the allowable limit at all times. TJ can be calculated as follows: TJ = TA + RJ-A × IF × VFmax where: TA = Ambient temperature (°C) RJ-A = Thermal resistance from LED junction to ambient (°C/W) IF = Forward current (A) VFmax = Maximum forward voltage (V) The complication of using this formula lies in TA and RJ-A. Actual TA is sometimes subjective and hard to determine. RJ-A varies from system to system depending on design and is usually not known. Another way of calculating TJ is by using the solder point temperature, TS as follows: TJ = TS + RJ-S × IF × VFmax where: TS = LED solder point temperature as shown in the following figure (°C) RJ-S = Thermal resistance from junction to solder point (°C/W) IF = Forward current (A) VFmax = Maximum forward voltage (V)
AEMD-CM3L, AEMD-CB3L Data Sheet High Brightness Green and Blue SMT Round Lamps Broadcom AEMD-Cx3L-DS100 Figure 15: Solder Point Temperature on PCB TS can be easily measured by mounting a thermocouple on the soldering joint as shown in preceding figure, while RJ-S is provided in the data sheet. Verify the TS of the LED in the final product to ensure that the LEDs are operating within all maximum ratings stated in the data sheet. Eye Safety Precautions LEDs may pose optical hazards when in operation. Do not look directly at operating LEDs because it might be harmful to the eyes. For safety reasons, use appropriate shielding or personal protective equipment.
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