ADS9217 TI | Alldatasheet

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Technical content

ADS921x Dual, Simultaneous-Sampling, 18-Bit, 20MSPS SAR ADC With Fully Differential ADC Input Driver

1 Features

  • High-speed and low-power: – ADS9219: 20MSPS/ch, 230mW/ch – ADS9218: 10MSPS/ch, 146mW/ch – ADS9217: 5MSPS/ch, 95mW/ch
  • 2-channel, simultaneous sampling
  • Feature integration: – Integrated ADC driver – Integrated precision reference – Common-mode voltage output buffer
  • High performance: – 18-bit no-missing-codes – INL: ±1LSB, DNL: ±0.75LSB – SNR: 95.5dB and 104.5dB SNR with OSR = 16
  • Wide input bandwidth (–3dB): – ADS9219 and ADS9218: 90MHz – ADS9217: 45MHz
  • Serial LVDS interface: – SDR and DDR output modes – Synchronous clock and data output
  • Extended operating range: –40°C to +125°C

2 Applications

  • Power analyzers
  • Source measurement units (SMU)
  • Marine equipment
  • Servo drive position feedback
  • DC power supplies, AC sources, electronic loads

3 Description

The ADS921x is a family of 18-bit, high-speed, dual- channel, simultaneous-sampling, analog-to-digital converters (ADCs) with an integrated driver for the ADC inputs. The integrated ADC driver simplifies the signal chain, reduces power consumption for precision applications, and supports high-frequency signals beyond 1MHz. By not requiring an external decoupling capacitor, the integrated ADC reference buffer is optimized for wide bandwidth applications. The ADS921x uses a serial LVDS (SLVDS) data interface that enables high-speed digital communication while minimizing digital switching noise. Read the dual-channel ADC data using separate SLVDS outputs per ADC channel or one SLVDS output for both ADC channels.

Package Information

PART NUMBER PACKAGE(1) PACKAGE SIZE(2) ADS9217 RHA (VQFN, 40) 6mm × 6mm ADS9218 RHA (VQFN, 40) 6mm × 6mm ADS9219 RHA (VQFN, 40) 6mm × 6mm (1) For more information, see the Mechanical, Packaging, and Orderable Information. (2) The package size (length × width) is a nominal value and includes pins, where applicable. SAR ADC A SAR ADC B SMPL_CLKREFIO AINAP AINAM VCMOUT AINBP AINBM DOUTA DOUTB DCLK VDD_1V8AVDD_5V SCLK SDI SDO Configuration Registers Serial LVDS Data Interface FCLK GND 4.096V CS NCO Temperature Sensor Mixer N N 2.4V Device Block Diagram ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

10.2 Receiving Notification of Documentation Updates..62

12 Mechanical, Packaging, and Orderable

ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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4 Device Comparison Table

PART NUMBER CHANNELS RESOLUTION SPEED ADS9219 20MSPS ADS9218 10MSPS ADS9217 5MSPS ADS9229 20MSPS ADS9228 10MSPS ADS9227 5MSPS ADS9119 20MSPS ADS9118 10MSPS ADS9117 5MSPS ADS9129 20MSPS ADS9128 10MSPS ADS9127 5MSPS www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: ADS9217 ADS9218 ADS9219

5 Pin Configuration and Functions

AVDD_5V AINBM GND SCLK DCLKM VDD_1V8VDD_1V8 GND AVDD_5V 2019 SDI SDO FCLKM FCLKP30 3340 343536373839 3132 SPI_EN VDD_1V8 VDD_1V8 GND VDD_1V8 GND SMPL_SYNC REFIO REFM SMPL_CLKP SMPL_CLKM PWDN RESET CS Figure 5-1. RHA Package, 6mm × 6mm, 40-Pin VQFN (Top View) Pin Functions PIN TYPE(1) DESCRIPTION NAME NO. AINAM 4 I Negative analog input for ADC A. AINAP 3 I Positive analog input for ADC A. AINBM 8 I Negative analog input for ADC B. AINBP 7 I Positive analog input for ADC B. AVDD_5V 1, 10 P 5V analog power-supply pin. CS 17 I Chip-select input pin for the configuration interface; active low. DCLKM 23 O Negative differential data clock output. Connect a 100Ω resistor between DCLKP and DCLKM close to the receiver. DCLKP 24 O Positive differential data clock output. Connect a 100Ω resistor between DCLKP and DCLKM close to the receiver. DOUTAM 27 O Negative differential data output. Connect a 100Ω resistor between DOUTAP and DOUTAM close to the receiver. Transmits ADC A data in 2-lane mode. Transmits ADC A and ADC B data in 1-lane mode. DOUTAP 28 O Positive differential data output corresponding to ADC A. Connect a 100Ω resistor between DOUTAP and DOUTAM close to the receiver. Transmits ADC A data in 2-lane mode. Transmits ADC A and ADC B data in 1-lane mode. ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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Pin Functions (continued) PIN TYPE(1) DESCRIPTION NAME NO. DOUTBM 25 O Negative differential data output corresponding to ADC B in 2-lane mode. Connect a 100Ω resistor between DOUTBP and DOUTBM close to the receiver. Unused in 1-lane mode. DOUTBP 26 O Positive differential data output corresponding to ADC B in 2-lane mode. Connect a 100Ω resistor between DOUTBP and DOUTBM close to the receiver. Unused in 1-lane mode. FCLKM 29 O Negative differential data frame clock output. Connect a 100Ω resistor between FCLKP and FCLKM close to the receiver. FCLKP 30 O Positive differential data frame clock output. Connect a 100Ω resistor between FCLKP and FCLKM close to the receiver. GND 2, 9, 12, 15, 34, 38 P Ground. PWDN 22 I Power-down control; active low. Connect to VDD_1V8 if unused. REFIO 39 I/O Internal reference voltage output. External reference voltage input. Connect a 10μF decoupling capacitor to REFM. REFM 6, 11, 40 P Reference ground. Connect to GND. RESET 21 I Reset input; active low. Connect to VDD_1V8 if unused. SCLK 18 I Serial clock input for the configuration interface. SDI / EXTREF 19 I SDI is a multifunction logic input; pin function is determined by the SPI_EN pin. SDI has an internal 100kΩ pulldown resistor to GND. SPI_EN = 0b: SDI is the logic input to select between the internal or external reference. Connect SDI to GND for the external reference. Connect SDI to VDD_1V8 for the internal reference. SPI_EN = 1b: Serial data input for the configuration interface SDO 20 O Serial data output for the configuration interface. SMPL_CLKM 31 I ADC sampling clock input. Negative differential input for the LVDS sampling clock. Connect this pin to GND for the CMOS sampling clock. SMPL_CLKP 32 I ADC sampling clock input. Positive differential input for the LVDS sampling clock. Clock input for the CMOS sampling clock. SMPL_SYNC 33 I Synchronization input for internal averaging filter. Connect to GND if unused. See the Synchronizing Multiple ADCs section on how to use the SMPL_SYNC pin. SPI_EN 16 I Control to enable configuration of the SPI interface; active high. Connect a pullup resistor to VDD_1V8 to keep the configuration interface enabled. Connect to GND if SPI configuration is unused. When SPI_EN = 0, select the reference voltage with the SDI/EXTREF pin. Thermal Pad — P Exposed thermal pad. Connect to GND. VCMOUT 5 O Common-mode voltage output. Use VCMOUT to set the common-mode voltage at the ADC inputs. Connect a 1μF decoupling capacitor to GND. VDD_1V8 13, 14, 35, 36, 37 P 1.8V power-supply. Connect 1μF and 0.1μF decoupling capacitors to GND. (1) I = input, O = output, I/O = input or output, G = ground, P = power. www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: ADS9217 ADS9218 ADS9219

6 Specifications

6.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)(1) MIN MAX UNIT VDD_1V8 to GND –0.3 2.1 V AVDD_5V to GND –0.3 5.5 V AINAP, AINAM, AINBP, and AINBM to GND GND – 0.3 AVDD_5V + 0.3 V REFIO to REFM REFM – 0.3 AVDD_5V + 0.3 V Digital inputs to GND GND – 0.3 VDD_1V8 + 0.3 V REFM to GND –0.3 0.3 V Input current to any pin except supply pins(2) –10 10 mA Junction temperature, TJ –40 150 °C Storage temperature, Tstg –60 150 °C (1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime. (2) Pin current must be limited to 10 mA or less.

6.2 ESD Ratings

V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/ JEDEC JS-001, analog input pins AINAP, AINAM, AINBP, and AINBM(1) ±2000 VHuman body model (HBM), per ANSI/ESDA/ JEDEC JS-001, all other pins(1) ±1000 Charged device model (CDM), per ANSI/ESDA/ JEDEC JS-002, all pins(2) ±500 (1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

6.3 Thermal Information

THERMAL METRIC(1) ADS921x UNITRHA (VQFN)

40 PINS

RθJA Junction-to-ambient thermal resistance 25.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 13.3 °C/W RθJB Junction-to-board thermal resistance 7.5 °C/W ΨJT Junction-to-top characterization parameter 0.1 °C/W ΨJB Junction-to-board characterization parameter 7.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 1.1 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note. ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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6.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT POWER SUPPLY AVDD_5V Power supply AVDD_5V to GND 4.75 5 5.25 V VDD_1V8 Power supply VDD_1V8 to GND 1.75 1.8 1.85 V REFERENCE VOLTAGE VREF Reference voltage to the ADC External reference 4.076 4.096 4.116 V ANALOG INPUTS FSR Full-scale input range (AINAP – AINAM) and (AINBP – AINBM) –3.2 3.2 V VCM Common-mode input range(2) (AINAP + AINAM) / 2 and (AINBP + AINBM) / 2 VCMOUT – 0.07 VCMOUT + 0.07 V TEMPERATURE RANGE TA Ambient temperature –40 25 125 °C (1) AINx refers to analog inputs AINAP, AINAM, AINBP, and AINBM. (2) ADC channel is powered down if the input common-mode voltage exceeds specifications. www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: ADS9217 ADS9218 ADS9219

6.5 Electrical Characteristics

otherwise noted); minimum and maximum values at TA = –40°C to +125°C; typical values at TA = 25°C PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ANALOG INPUTS IB Input bias current 0.1 nA Input bias current thermal drift TA = 0°C to 70°C 0.02 nA/℃ TA = –40°C to 125°C 0.1 DC PERFORMANCE Resolution No missing codes 18 Bits DNL Differential nonlinearity –0.9 ±0.4 0.9 LSB INL Integral nonlinearity TA = 0°C to 70°C, all devices –1.125 ±0.8 1.125 LSB TA = –40°C to 125°C, all devices –1.9 ±0.8 1.9 LSB V(OS) Input offset error(1) ±40 LSB dVOS/dT Input offset error thermal drift(1) 0.25 1 ppm/°C GE Gain error(1) –0.05 ±0.01 0.05 %FSR dGE/dT Gain error thermal drift(1) 0.5 2 ppm/°C AC PERFORMANCE SINAD Signal-to-noise + distortion ratio fIN = 2kHz 93 95.4 dB fIN = 1MHz 94.3 SNR Signal-to-noise ratio fIN = 2kHz 93.3 95.5 dBFS fIN = 1MHz 94.9 THD Total harmonic distortion fIN = 2kHz, ADS9217 and ADS9218 –120 dBfIN = 2kHz, ADS9219 at 20MSPS –118 fIN = 1MHz, all devices –104 SFDR Spurious-free dynamic range fIN = 2kHz 118 dB fIN = 1MHz 104 Isolation crosstalk fIN = 2kHz 120 dB Aperture jitter SIngle-ended CMOS clock on SMPL_CLKP 0.3 psRMS Differential LVDS sampling clock 0.8 BW Input Bandwidth (–3dB) ADS9219 90 MHzADS9218 90 ADS9217 45 INTERNAL REFERENCE VREF (2) Voltage on REFIO pin (configured as output) 1µF capacitor on REFIO pin, TA = 25°C 4.092 4.096 4.1 V Reference temperature drift 6 20 ppm/°C COMMON-MODE OUTPUT BUFFER VCMOUT Common-mode output voltage ADS9219 2.2 2.460 2.65 VADS9218 2.2 2.410 2.65 ADS9217 2.2 2.385 2.65 Output current drive 0 5 μA ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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6.5 Electrical Characteristics (continued)

otherwise noted); minimum and maximum values at TA = –40°C to +125°C; typical values at TA = 25°C PARAMETER TEST CONDITIONS MIN TYP MAX UNIT LVDS RECEIVER (SMPL_CLK) VTH High-level input voltage (P – M) AC coupled 100 mV DC coupled 300 VTL Low-level input voltage (P – M) AC coupled –100 mV DC coupled –300 VICM Input common-mode voltage 0.5 1.2 1.4 V LVDS OUTPUT (CLKOUT, DOUTA, and DOUTB) VODIFF Differential output voltage RL = 100Ω 200 350 500 mV VOCM Output common-mode voltage RL = 100Ω 0.88 1.1 1.32 V CMOS INPUTS (CS, SCLK, and SDI) VIL Input low logic level –0.1 0.5 V VIH Input high logic level 1.3 VDD_1V8 V CMOS OUTPUT (SDO) VOL Output low logic level IOL = 200µA sink 0 0.4 V VOH Output high logic level IOH = 200µA source 1.4 VDD_1V8 V POWER SUPPLY IAVDD_5V Supply current from AVDD_5V At 20MSPS throughput (ADS9219) 55 59 mA At 10MSPS throughput (ADS9218) 33 40 At 5MSPS throughput (ADS9217) 20 24 Power-down 2 IVDD_1V8 Supply current from VDD_1V8 At 20MSPS throughput (ADS9219) 103 110 mA At 10MSPS throughput (ADS9218) 70.5 89 At 5MSPS throughput (ADS9217) 50 66 Power-down 2 (1) These specifications include full temperature range variation but not the error contribution from internal reference. (2) Does not include the variation in voltage resulting from solder shift effects. www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: ADS9217 ADS9218 ADS9219

6.6 Timing Requirements

otherwise noted); minimum and maximum values at TA = –40°C to +125°C; typical values at TA = 25°C MIN MAX UNIT CONVERSION CYCLE fCYCLE Sampling frequency ADS9219 7 20 MHzADS9218 3.9 10 ADS9217 3.9 5 tCYCLE ADC cycle time period 1 / fCYCLE s tPL_SMPLCLK Sample clock low time 0.4 0.6 tCYCLE tPH_SMPLCLK Sample clock high time 0.4 0.6 tCYCLE fCLK Maximum SCLK frequency 10 MHz tCLK Minimum SCLK time period 100 ns SPI TIMINGS thi_CSZ Pulse duration: CS high 220 ns tPH_CK SCLK high time 0.48 0.52 tCLK tPL_CK SCLK low time 0.48 0.52 tCLK td_CSCK Setup time: CS falling to the first SCLK rising edge 20 ns tsu_CKDI Setup time: SDI data valid to the corresponding SCLK rising edge 10 ns tht_CKDI Hold time: SCLK rising edge to corresponding data valid on SDI 5 ns td_CKCS Delay time: last SCLK falling edge to CS rising 5 ns ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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6.7 Switching Characteristics

otherwise noted); minimum and maximum values at TA = –40°C to +125°C; typical values at TA = 25°C PARAMETER TEST CONDITIONS MIN MAX UNIT RESET tPU Power-up time for device 25 ms LVDS DATA INTERFACE tRT Rise time With 50Ω transmission line of length = 20mm, differential RL = 100Ω, and CL = 1pF 600 ps tFT Fall time 600 ps tCYCLE Sampling clock period ADS9219 50 nsADS9218 100 ADS9217 200 tDCLK Clock output 4.167 ns Clock duty cycle 45 55 % td_DCLKDO Time delay: DCLKP rising to corresponding data valid SDR mode –0.35 0.35 ns toff_DCLKDO_r Time offset: DCLKP rising to corresponding data valid DDR mode tDCLK / 4 – 0.35 tDCLK / 4 + 0.35 ns toff_DCLKDO_f Time offset: DCLKP falling to corresponding data valid DDR mode tDCLK / 4 – 0.35 tDCLK / 4 + 0.35 ns tPD Time delay: SMPL_CLK falling to DCLKP rising tDCLK ns tPU_SMPL_CLK Time delay: Free-running clock connected to SMPL_CLK to ADC data valid 100 µs tLAT (1) Time delay: Internal digital delay to MSB of data output 3 12 ns SPI TIMINGS tden_CKDO Time delay: 8th SCLK rising edge to SDO enable 30 ns tdz_CKDO Time delay: 24th SCLK rising edge to SDO going Hi-Z 30 ns td_CKDO Time delay: SCLK launch edge to corresponding data valid on SDO 30 ns tht_CKDO Hold time: SCLK launch edge to previous data valid on SDO 2 ns (1) See section on ADC Sampling Clock Input for more details on data output latency. www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: ADS9217 ADS9218 ADS9219

6.8 Timing Diagrams

D D D D D D D D D D D D D D D D D D D D D D D tDCLK Sample N tPH_SMPLCLK tPL_SMPLCLK tPD 1 2 3 4 5 6 7 8 9 10 11 12 D SMPL_CLK DOUTAP – DOUTAM FCLKP – FCLKM DCLKP – DCLKM 6 x tDCLK toff_DCLKDO_r toff_DCLKDO_f D D D D D D D D D D D D D D D D D D D D D D D D D DOUTBP – DOUTBM D ADC B Data ADC A Data tCYCLE Figure 6-1. LVDS Data Interface: 2-Lane DDR D23 ADC A tCYCLE SMPL_CLK DOUTAP – DOUTAM Sample N tPH_SMPLCLK tPL_SMPLCLK FCLKP – FCLKM tPD DCLKP – DCLKM 1 2 3 12 13 14 15 16 22 23 24 tDCLK D22 ADC A D12 ADC A D10 ADC A ADC A ADC A ADC A ADC A ADC A 12 x tDCLK td_DCLKDO D23 ADC B DOUTBP – DOUTBM D22 ADC B D12 ADC B D10 ADC B ADC B ADC B ADC B ADC B ADC B D11 ADC A D11 ADC B ADC A Data ADC B Data Figure 6-2. LVDS Data Interface: 2-Lane SDR ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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A A A A A A A A D D D D D D D D D D D D D D D D tsu_CKDI tht_CKDI td_CKDO tht_SDO td_CSCK thi_CS SDO is active only when reading registers; Hi-Z otherwise tdz_CKDO DO DO DO DO DO DO DO DO DO DO DO DO DO DO DO DO td_CKCS Hi-Z tden_CKDO 242322212019181716151413121110987654321 Figure 6-6. Configuration SPI tsu_SYNC_SMPLCLK tht_SYNC_SMPLCLK SMPL_SYNC SMPL_CLK Figure 6-7. SMPL_SYNC Timing Sample N Data MSB for Sample N td_SMPL_DATA SMPL_CLK FCLKP – FCLKM Delay tLAT 1. See the ADC Sampling Clock Input section for more details. Figure 6-8. Sampling Edge to Corresponding Data MSB Output Timing ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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6.9 Typical Characteristics: All Devices

at TA = 25°C, AVDD_5V = 5V, VDD_1V8 = 1.8V, external VREF = 4.096V, and maximum throughput (unless otherwise noted) F r e q u e n c y ( M H z ) Amplitude (dB) 1 2 3 4 5 6 7 8 1 0 2 0 3 0 5 0 7 0 1 0 0 2 0 0 3 0 0 5 0 0 - 3 0 - 2 7 - 2 4 - 2 1 - 1 8 - 1 5 - 1 2 - 9 - 6 - 3 A D S 9 2 1 9 , A D S 9 2 1 8 A D S 9 2 1 7 Figure 6-9. Typical Analog Input Bandwidth T e m p e r a t u r e ( ° C ) Gain Error (%FSR) - 4 0 - 2 0 0 2 0 4 0 6 0 8 0 1 0 0 1 2 0 - 0 . 0 5 - 0 . 0 4 - 0 . 0 3 - 0 . 0 2 - 0 . 0 1 0 . 0 1 0 . 0 2 0 . 0 3 0 . 0 4 Figure 6-10. Gain Error vs Temperature T e m p e r a t u r e ( ° C ) Offset Error (LSB) - 4 0 - 2 0 0 2 0 4 0 6 0 8 0 1 0 0 1 2 0 - 1 0 - 7 . 5 - 5 - 2 . 5 2 . 5 7 . 5 1 0 Figure 6-11. Offset Error vs Temperature T e m p e r a t u r e ( ° C ) Integral Nonlinearity (LSB) - 4 0 - 2 0 0 2 0 4 0 6 0 8 0 1 0 0 1 2 0 - 1 . 5 - 1 . 3 - 1 . 1 - 0 . 9 - 0 . 7 - 0 . 5 - 0 . 3 - 0 . 1 0 . 1 0 . 3 0 . 5 0 . 7 0 . 9 1 . 1 1 . 3 1 . 5 M a x i m u m M i n i m u m Figure 6-12. INL vs Temperature T e m p e r a t u r e ( ° C ) Differential Nonlinearity (LSB) - 4 0 - 2 0 0 2 0 4 0 6 0 8 0 1 0 0 1 2 0 - 0 . 7 5 - 0 . 5 - 0 . 2 5 0 . 2 5 0 . 5 0 . 7 5 M a x i m u m M i n i m u m Figure 6-13. DNL vs Temperature T e m p e r a t u r e ( ° C ) SNR (dBFS), SINAD (dB) THD (dB) - 4 0 - 2 0 0 2 0 4 0 6 0 8 0 1 0 0 1 2 0 9 2 - 1 4 0 9 3 - 1 3 0 9 4 - 1 2 0 9 5 - 1 1 0 9 6 - 1 0 0 9 7 - 9 0 9 8 - 8 0 S N R S I N A D T H D Figure 6-14. SNR, SINAD, and THD vs Temperature www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 15 Product Folder Links: ADS9217 ADS9218 ADS9219

6.9 Typical Characteristics: All Devices (continued)

at TA = 25°C, AVDD_5V = 5V, VDD_1V8 = 1.8V, external VREF = 4.096V, and maximum throughput (unless otherwise noted) T e m p e r a t u r e ( ° ) REFIO (V) - 4 0 - 2 0 0 2 0 4 0 6 0 8 0 1 0 0 1 2 0 4 . 0 8 7 5 4 . 0 9 4 . 0 9 2 5 4 . 0 9 5 4 . 0 9 7 5 4 . 1 1 c u r v e p e r d e v i c e Figure 6-15. REFIO Voltage vs Temperature T e m p e r a t u r e ( ° C ) VCMOUT (V) - 4 0 - 2 0 0 2 0 4 0 6 0 8 0 1 0 0 1 2 0 2 . 3 2 . 3 2 5 2 . 3 5 2 . 3 7 5 2 . 4 2 . 4 2 5 2 . 4 5 2 . 4 7 5 2 . 5 A D S 9 2 1 9 A D S 9 2 1 8 A D S 9 2 1 7 Figure 6-16. VCMOUT Voltage vs Temperature T e m p e r a t u r e ( ° C ) IAVDD_5V(mA) - 4 0 - 2 0 0 2 0 4 0 6 0 8 0 1 0 0 1 2 0 1 0 1 5 2 0 2 5 3 0 3 5 4 0 4 5 5 0 5 5 6 0 6 5 A D S 9 2 1 9 A D S 9 2 1 8 A D S 9 2 1 7 Figure 6-17. AVDD_5V Current vs Temperature T e m p e r a t u r e ( ° C ) IVDD_1V8(mA) - 4 0 - 2 0 0 2 0 4 0 6 0 8 0 1 0 0 1 2 0 3 0 4 0 5 0 6 0 7 0 8 0 9 0 1 0 0 1 1 0 A D S 9 2 1 9 A D S 9 2 1 8 A D S 9 2 1 7 Figure 6-18. VDD_1V8 Current vs Temperature ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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6.10 Typical Characteristics: ADS9219

at TA = 25°C, AVDD_5V = 5V, VDD_1V8 = 1.8V, external VREF = 4.096V, and maximum throughput (unless otherwise noted) O u t p u t C o d e Integral Nonlinearity (LSB) 0 6 5 5 3 6 1 3 1 0 7 2 1 9 6 6 0 8 2 6 2 1 4 4 - 1 - 0 . 8 - 0 . 6 - 0 . 4 - 0 . 2 0 . 2 0 . 4 0 . 6 0 . 8 Typical INL = ±0.4LSB Figure 6-19. Typical INL O u t p u t C o d e Differential Nonlinearity (LSB) 0 6 5 5 3 6 1 3 1 0 7 2 1 9 6 6 0 8 2 6 2 1 4 4 - 0 . 4 - 0 . 3 - 0 . 2 - 0 . 1 0 . 1 0 . 2 0 . 3 0 . 4 Typical DNL = ±0.4LSB Figure 6-20. Typical DNL F r e q u e n c y ( k H z ) Amplitude (dBFS) 0 . 5 1 2 3 4 5 7 1 0 2 0 5 0 1 0 0 2 0 0 1 0 0 0 1 0 0 0 0 - 1 8 0 - 1 5 0 - 1 2 0 - 9 0 - 6 0 - 3 0 fIN = 2kHz, SNR = 95.5dBFS, THD = –118dB Figure 6-21. Typical FFT for fIN = 2kHz F r e q u e n c y ( k H z ) Amplitude (dBFS) 0 . 5 1 2 3 4 5 7 1 0 2 0 5 0 1 0 0 2 0 0 1 0 0 0 1 0 0 0 0 - 1 8 0 - 1 5 0 - 1 2 0 - 9 0 - 6 0 - 3 0 fIN = 100kHz, SNR = 95.4dBFS, THD = –118dB Figure 6-22. Typical FFT for fIN = 100kHz F r e q u e n c y ( k H z ) Amplitude (dBFS) 0 . 5 1 2 3 4 5 7 1 0 2 0 5 0 1 0 0 2 0 0 1 0 0 0 1 0 0 0 0 - 1 8 0 - 1 5 0 - 1 2 0 - 9 0 - 6 0 - 3 0 fIN = 1MHz, SNR = 94.9dBFS, THD = –104.2dB Figure 6-23. Typical FFT for fIN = 1MHz www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 17 Product Folder Links: ADS9217 ADS9218 ADS9219

6.11 Typical Characteristics: ADS9218

at TA = 25°C, AVDD_5V = 5V, VDD_1V8 = 1.8V, external VREF = 4.096V, and maximum throughput (unless otherwise noted) O u t p u t C o d e Integral Nonlinearity (LSB) 0 6 5 5 3 6 1 3 1 0 7 2 1 9 6 6 0 8 2 6 2 1 4 4 - 0 . 7 5 - 0 . 4 5 - 0 . 1 5 0 . 1 5 0 . 4 5 0 . 7 5 Typical INL = ±0.6LSB Figure 6-24. Typical INL Typical DNL = ±0.4LSB Figure 6-25. Typical DNL F r e q u e n c y ( k H z ) Amplitude (dBFS) 0 . 5 1 2 3 4 5 7 1 0 2 0 3 0 5 0 1 0 0 2 0 0 5 0 0 1 0 0 0 5 0 0 0 - 1 8 0 - 1 5 0 - 1 2 0 - 9 0 - 6 0 - 3 0 fIN = 2kHz, SNR = 95.5dB, THD = –131dB Figure 6-26. Typical FFT for fIN = 2kHz F r e q u e n c y ( k H z ) Amplitude (dBFS) 0 . 5 1 2 3 4 5 7 1 0 2 0 3 0 5 0 1 0 0 2 0 0 5 0 0 1 0 0 0 5 0 0 0 - 1 8 0 - 1 5 0 - 1 2 0 - 9 0 - 6 0 - 3 0 fIN = 100kHz, SNR = 95.5dBFS, THD = –118.2dB Figure 6-27. Typical FFT for fIN = 100kHz F r e q u e n c y ( k H z ) Amplitude (dBFS) 0 . 5 1 2 3 4 5 7 1 0 2 0 3 0 5 0 1 0 0 2 0 0 5 0 0 1 0 0 0 5 0 0 0 - 1 8 0 - 1 5 0 - 1 2 0 - 9 0 - 6 0 - 3 0 fIN = 1MHz, SNR = 95dBFS, THD = –106dB Figure 6-28. Typical FFT for fIN = 1MHz Standard deviation = 1.63LSB Figure 6-29. DC Input Histogram ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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6.12 Typical Characteristics: ADS9217

at TA = 25°C, AVDD_5V = 5V, VDD_1V8 = 1.8V, external VREF = 4.096V, and maximum throughput (unless otherwise noted) O u t p u t C o d e Integral Nonlinearity (LSB) 0 6 5 5 3 6 1 3 1 0 7 2 1 9 6 6 0 8 2 6 2 1 4 4 - 0 . 7 5 - 0 . 4 5 - 0 . 1 5 0 . 1 5 0 . 4 5 0 . 7 5 Typical INL = ±0.6LSB Figure 6-30. Typical INL O u t p u t C o d e Differential Nonlinearity (LSB) 0 6 5 5 3 6 1 3 1 0 7 2 1 9 6 6 0 8 2 6 2 1 4 4 - 0 . 4 - 0 . 3 - 0 . 2 - 0 . 1 0 . 1 0 . 2 0 . 3 0 . 4 Typical DNL = ±0.4LSB Figure 6-31. Typical DNL fIN = 2kHz, SNR = 95.5dBFS, THD = –130dB Figure 6-32. Typical FFT for fIN = 2kHz F r e q u e n c y ( k H z ) Amplitude (dBFS) 0 . 5 1 2 3 4 5 7 1 0 2 0 3 0 5 0 1 0 0 2 0 0 5 0 0 1 0 0 0 3 0 0 0 - 1 8 0 - 1 5 0 - 1 2 0 - 9 0 - 6 0 - 3 0 fIN = 100kHz, SNR = 95.4dBFS, THD = –120dB Figure 6-33. Typical FFT for fIN = 100kHz F r e q u e n c y ( k H z ) Amplitude (dBFS) 0 . 5 1 2 3 4 5 7 1 0 2 0 3 0 5 0 1 0 0 2 0 0 5 0 0 1 0 0 0 3 0 0 0 - 1 8 0 - 1 5 0 - 1 2 0 - 9 0 - 6 0 - 3 0 fIN = 1MHz, SNR = 94.9dBFS, THD = –103.5dB Figure 6-34. Typical FFT for fIN = 1MHz A D C O u t p u t C o d e ( L S B ) Number of Hits 1 0 0 2 0 0 3 0 0 4 0 0 5 0 0 6 0 0 7 0 0 8 0 0 9 0 0 1 0 0 0 -10 Standard deviation = 1.61LSB Figure 6-35. DC Input Histogram www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 19 Product Folder Links: ADS9217 ADS9218 ADS9219

7 Detailed Description

7.1 Overview

The ADS921x is an 18-bit, 20MSPS/ch, dual-channel, simultaneous-sampling, analog-to-digital converter (ADC). The ADS921x integrates a high-impedance buffer at the ADC inputs, voltage reference, reference buffer, and common-mode voltage output buffer. The ADS9219 supports unipolar differential analog input signals. The buffer at the ADC inputs is optimized for low-distortion and low-power operation. For DC level shifting of the analog input signals, the device has a common-mode voltage output buffer. The common-mode voltage is derived from the output of the integrated reference buffer. When a conversion is initiated, the differential input between the (AINAP – AINAM) and (AINBP – AINBM) pins is sampled. The ADS921x uses a clock input on the SMPL_CLKP pin to initiate conversions. The ADS921x consumes only 230mW/ch of power when operating at 20MSPS/ch, which includes the buffer power dissipation at the ADC inputs. The serial LVDS (SLVDS) digital interface simplifies board layout, timing, firmware, and supports full throughput at lower clock speeds.

7.2 Functional Block Diagram

A SAR ADC B SMPL_CLKREFIO AINAP AINAM VCMOUT AINBP AINBM DOUTA DOUTB DCLK VDD_1V8AVDD_5V SCLK SDI SDO Configuration Registers Serial LVDS Data Interface FCLK GND 4.096V CS NCO Temperature Sensor Mixer N N 2.4V ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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7.3 Feature Description

7.3.1 Analog Inputs

The ADS921x supports both AC-coupled and DC-coupled differential analog inputs. Make sure the input common-mode voltage of the analog inputs matches the voltage level on the VCMOUT pin. Figure 7-1 shows the equivalent input network diagram of the device. 0.6 0.6 22 pF 22 pF AVDD_5V AVDD_5V AINAP AINBP AINAM AINBM ADC Figure 7-1. Equivalent Input Network

7.3.2 Analog Input Bandwidth

illustrates the analog full-power input bandwidth of the ADS921x device family. The –3dB bandwidth is 90MHz for the ADS9219 and ADS9218, and 45MHz for the ADS9217.

7.3.3 ADC Transfer Function

The ADS921x supports a ±3.2V differential input range. The device outputs 18-bit conversion data in either straight-binary or binary two's-complement formats. As shown in Table 7-1, the format for the output codes is the same across all analog channels. Configure the format for the output codes with the DATA_FORMAT field in register address 0x0D. The least significant bit (LSB) for the ADC is given by 1LSB = 6.4V / 2 18 . Table 7-1. Transfer Characteristics INPUT VOLTAGE DESCRIPTION ADC OUTPUT IN 2's- COMPLEMENT FORMAT ADC OUTPUT IN STRAIGHT- BINARY FORMAT ≤ –3.2V + 1LSB Negative full-scale code 0x20000 0x00000 0V + 1LSB Mid-code 0x00000 0x1FFFF ≥ 3.2V – 1LSB Positive full-scale code 0x1FFFF 0x3FFFF www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 21 Product Folder Links: ADS9217 ADS9218 ADS9219

7.3.4 Reference Voltage

The ADS921x has a precision, low-drift voltage reference internal to the device. For best performance, the internal reference noise is filtered (as shown in Figure 7-2) by connecting a 10µF ceramic bypass capacitor to the REFIO pin. As shown in Figure 7-3, an external reference is also connected at the REFIO pin. When using an external reference, disable the internal reference voltage by either of the following two options:

  • Configure the SPI (SPI_EN pin = logic 1). Write PD_REF = 1b in address 0xC1 of register bank 1.
  • Use the SDI/EXTREF pin (SPI_EN pin = logic 0). Set the SDI/EXTREF pin to logic 0 using a pulldown resistor. REFIO 4.096 V 10 μF GND PD_REF = 0 1 k User register bit External capacitor for reference noise reduction AVDD_5V REFM GND ADC REF Figure 7-2. Internal Reference Voltage REFIO 4.096 V 10 μF GND PD_REF = 1 1 k User register bit REF7040 AVDD_5V OUTF OUTS VIN EN GND REFM GND ADC REF Figure 7-3. External Reference Voltage ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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7.3.5 Temperature Sensor

The ADS921x features a 10-bit temperature sensor for measuring temperature inside the device. Follow the sequence listed in Table 7-2 to read the temperature sensor output with the SPI. Read the temperature sensor data at anytime independent of the ADC data interface. The transfer function for the temperature sensor is given by Equation 1: Temperature = − 85.0172 + (10 bit output × 0.24918) °C (1) Table 7-2. Sequence to Read Temperature Sensor Output REGISTER ADDRESS REGISTER BANK VALUE COMMENT 0x90 1 0x4000 Write register to load temperature sensor output in address 0x91 0x91 1 10 bit temperature sensor data Read register for temperature sensor output 0x90 1 0x0000 Write register

7.3.6 Data Averaging

The ADS921x features a built-in decimation filter that averages the conversion results from the ADC. The output data rate is reduced with higher data averaging. Table 7-3 compares the ADC output speed against SNR and OSR. The improvement in SNR with averaging in Table 7-4 shows the register settings corresponding to oversampling ratios. Table 7-3. SNR vs OSR OSR SNR (dBFS) ADC OUTPUT SPEED 1 95.5 fCYCLE 2 98.1 fCYCLE / 2 4 100.6 fCYCLE / 4 8 102.9 fCYCLE / 8 16 104.8 fCYCLE / 16 Table 7-4. Register Map Settings for OSR DECIMATION REGISTER INTERFACE MODES(1) 2-LANE SDR AND DDR(2) 1-LANE SDR AND DDR(3) OSR initialization CLK3 (0xC5[9]) 1 0 for OSR = 2 1 for OSR = 4, 8, and 16OSR_INIT1 (0xC0[11:10]) 0 for DATA_LANES = 5 or 7 1 for DATA_LANES = 0 or 2 OSR_INIT2 (0xC4[5:4]) 2 0 for OSR = 2 2 for OSR = 4, 8, and 16 OSR_INIT3 (0xC4[1]) 1 0 for OSR = 2 1 for OSR = 4, 8, and 16 OSR_EN (0x0D[6]) 1 1 OSR_RD (0xC5[6:5]) 1 0 for OSR = 2 1 for OSR = 4, 8, and 16 OSR (0x0D[5:2]) 0 0 OSR_CLK (0xC0[9:7]) 0 0 OSR (0x0D[5:2]) 1 1 OSR_CLK (0xC0[9:7]) 4 0 OSR (0x0D[5:2]) 2 2 OSR_CLK (0xC0[9:7]) 5 4 www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 23 Product Folder Links: ADS9217 ADS9218 ADS9219

Table 7-4. Register Map Settings for OSR (continued) DECIMATION REGISTER INTERFACE MODES(1) 2-LANE SDR AND DDR(2) 1-LANE SDR AND DDR(3) OSR (0x0D[5:2]) 3 3 OSR_CLK (0xC0[9:7]) 6 5 (1) See Table 7-7 and Table 7-8 for DATA_LANES configuration. (2) The ADS9217 functions with all data interface modes. (3) Not applicable for the ADS9217. As shown in Figure 7-4, a pulse on the SMPL_SYNC pin resets the decimation filter. A pulse on SMPL_SYNC synchronizes multiple ADS921x devices when using the decimation filter. SMPL_SYNC SMPL_CLK ADC Data for Decimation by 2 N invalid data S1 S2 S3 S4 S5 S6 S7 S8 S9 (S5 + S6) / 2 ADC Data for Decimation by 4 N invalid data S10 S11 S12 S13 S14 S15 S16 S17 (S5 + S6 + S7 + S8) / 4 (S9 + S10 + S11 + S12) / 4 (S13 + S14 + S7 + S8) / 4 ADC Data for Decimation by 8 N invalid data ADC Data for Decimation by 16 N invalid data (S1 + S2 + . . . + S16) / 16 (S17 + S18) / 2 S18 S19 S20 S21 Figure 7-4. Data Output With Decimation

7.3.7 Digital Down Converter

The ADS921x includes an optional on-chip digital down conversion (DDC) that is configured by register addresses FBh through FEh. As shown in Figure 7-5, the DDC includes a digital mixer and a 24-bit, numerically controlled oscillator (NCO). The digital mixer generates 24-bit I and Q outputs that represent complex mixing of ADC output data with the NCO output frequency. Each channel of the ADC generates a 48-bit output corresponding to the 24-bit I and Q outputs, respectively, from the digital mixer. SAR ADC A SAR ADC B SMPL_CLK DOUTA DOUTB DCLKSerial LVDS Data Interface FCLKNCO N N N = 0, 2, 4, 8, 16 N = 0, 2, 4, 8, 16 Figure 7-5. Data Path When Using a Digital Down Converter ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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The NCO is common for both ADC A and ADC B. The output frequency of the NCO, given by Equation 2, is configured using the NCO_FREQUENCY register (address 0xFD and 0xFE). fNCO = fSMPL_CLK 224 × NCO_FREQUENCY 23: 0 & 0xFFFFF0 Hz (2) The output phase of the NCO is reset by applying a pulse on the SMPL_SYNC pin, see Figure 6-7. As shown in Equation 3 and Table 7-5, the initial phase of the NCO output is configured using the NCO_PHASE register (address 0xFC and 0xFD). NCO_PHASE 23: 0 = Initial phase 2π × 2 24 & 0xFFFFF0 (3) Table 7-5. Initial NCO Phase NCO_PHASE[23:0] INITIAL PHASE 0x000000 0 0x7FFFF0 π 0xFFFFF0 2π Use a decimation factor of either 2, 4, 8, or 16 with the DDC. Table 7-6 shows the register configuration for decimating the DDC output. Table 7-6. Decimation Settings for the DDC DECIMATION REGISTER VALUE OSR_EN (0x0D[6]) 1 OSR (0x0D[5:2] 0 OSR_CLK (0xC0[9:7]) 0 Common settings for decimation factors 4, 8, and 16 CLK3 (0xC5[9]) 1 OSR_INIT1 (0xC0[11:10]) 1 OSR_INIT2 (0xC4[5:4]) 2 OSR_INIT3 (0xC4[1]) 1 OSR_EN (0x0D[6]) 1 OSR_RD (0xC5[6:5]) 1

4 OSR (0x0D[5:2] 1

OSR_CLK (0xC0[9:7]) 0

8 OSR (0x0D[5:2] 2

OSR_CLK (0xC0[9:7]) 4

16 OSR (0x0D[5:2] 3

OSR_CLK (0xC0[9:7]) 5 www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 25 Product Folder Links: ADS9217 ADS9218 ADS9219

7.3.8 Data Interface

The ADS921x features a high-speed, serial LVDS data interface with 2-lane and 1-lane options for data output. The host configures the output data frame width to 20 bits or 24 bits with the single-data rate (SDR) and double-data rate (DDR) modes. Table 7-7 and Table 7-8 configuration. Configure the INIT_1 register field before writing to other register fields, as described in Table 7-7 and Table 7-8. Table 7-7. Register Map Settings for Output Data Interface for the ADS9217 DATA FRAME WIDTH (Bits) DATA RATE OUTPUT LANES INIT_1 0x04[3:0] DATA_LA NES 0x12[2:0] DATA_RA TE 0xC1[8] CLK1 0xC0[12] CLK2 0xC1[0] CLK3 0xC5[9] CLK4 0xC5[3:2] CLK5 0xFB[1] CLK6 0x1C[7:6]

20 SDR 1 0x000B 5 1 1 1 1 3 0 3

20 SDR 2 0x000B 0 1 0 1 0 3 0 3

20 DDR 1 0x000B 5 0 1 1 1 3 0 3

20 DDR 2 0x000B 0 0 0 1 0 3 0 3

24 SDR 1 0x000B 7 1 1 0 1 3 0 3

24 SDR 2 0x0000 2 1 0 0 0 0 0 0

24 DDR 1 0x000B 7 0 1 0 1 3 0 3

24 DDR 2 0x0000 2 0 0 0 0 0 0 0

Table 7-8. Register Map Settings for Output Data Interface for the ADS9219 and ADS9218 DATA FRAME WIDTH (Bits) DATA RATE OUTPUT LANES INIT_1 0x04[3:0] DATA_LA NES 0x12[2:0] DATA_RA TE 0xC1[8] CLK1 0xC0[12] CLK2 0xC1[0] CLK3 0xC5[9] CLK4 0xC5[3:2] CLK5 0xFB[1] CLK6 0x1C[7:6]

20 SDR 1 – Not supported

20 SDR 2 – Not supported

20 DDR 1 – Not supported

20 DDR 2 – Not supported

24 SDR 1 – 2 1 0 0 0 0 1 0

24 SDR 2 – 2 1 0 0 0 0 0 0

24 DDR 1 – 2 0 0 0 0 0 1 0

24 DDR 2 – 2 0 0 0 0 0 0 0

The ADS921x generates a data clock DCLK that is a multiple of the ADC sampling clock SMPL_CLK. The data clock frequency depends on the number of data output lanes (1 or 2), data frame width, and data rate. The data frame width is 20 or 24 bits and the data rate is SDR or DDR. Equation 4 calculates the DCLK speed. Table 7-9 lists the possible values for the output data clock frequency. DCLK speed = 2 ADC channels × Data Frame Width 24 bit or 20 bit Data Lanes 1 or 2 × Data Rate SDR = 1, DDR = 2 × SMPL_CLK (4) ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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Table 7-9. Data Clock (DCLK) Speed ADC CHANNELS DATA FRAME WIDTH (Bits) DATA RATE (1 = SDR, 2 = DDR) OUTPUT LANES(1) SMPL_CLK MULTIPLIER DCLK (SMPL_CLK = 5MHz) DCLK (SMPL_CLK = 10MHz) DCLK (SMPL_CLK = 20MHz) 1 48 240MHz — — 1 24 120MHz 240MHz 480MHz 2 12 60MHz 120MHz 240MHz (1) The LVDS output data and clock are specified up to 600MHz. Faster speeds are not supported. (2) For the ADS9219 and ADS9218, 1-lane data output is supported only when data averaging is enabled. See the Data Averaging section. (3) A 20-bit data frame width is not supported for the ADS9219 or ADS9218.

7.3.8.1 Data Frame Width

As shown in Figure 7-6 , the ADS921x supports 24-bit and 20-bit data frame width options. Configure the DATA_WIDTH field in address 0x12 to select the data frame width. The default output data frame width is 24 bits. The ADC resolution is 18-bit, represented by 20 bits. DATA_WIDTH = 0 (20-bit) 18 bit (MSB aligned) ADC A conversion result USER_BITS_ADC_A[1:0] 18 bit (MSB aligned) ADC B conversion result USER_BITS_ADC_B[1:0] ADC A Output ADC B Output DATA_WIDTH = 1 (24-bit) 18 bit (MSB aligned) ADC A conversion result USER_BITS_ADC_A[5:0] 18 bit (MSB aligned) ADC B conversion result USER_BITS_ADC_B[5:0] ADC A Output ADC B Output Figure 7-6. Data Frame Width Composition

7.3.8.2 ADC Output Data Randomizer

The ADS921x features a data output randomizer. When enabled, the ADC conversion result is bit-wise exclusive-ORed (XOR). Figure 7-7 illustrates a diagram of such an XOR operation. Either the LSB of the conversion result (Figure 7-9) or XOR_PRBS bit (default) is appended to the ADC data output ( Figure 7-8). The LSB of the ADC conversion result and XOR_PRBS have equal probability of being either 1 or 0. As a result of the XOR operation, the data output from the ADS921x is randomized. The ground bounce created by the transmission of this randomized result over the data interface is uncorrelated with the analog input voltage. This uncorrelated transmission helps minimize interference between data transmission and analog performance of the ADC when the PCB layout does not minimize ground bounce. www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 27 Product Folder Links: ADS9217 ADS9218 ADS9219

Figure 7-7. Bit-Wise XOR Operation DATA_WIDTH = 0 (20-bit) DATA_WIDTH = 1 (24-bit) 18 bit (MSB aligned) ADC A conversion result USER_BITS_ADC_A[4:0] 18 bit (MSB aligned) ADC B conversion result USER_BITS_ADC_B[4:0] ADC A Output ADC B Output 18 bit (MSB aligned) ADC A conversion result USER_BITS_ ADC_A[0] ADC A Output PR BS 18 bit (MSB aligned) ADC B conversion result USER_BITS_ ADC_B[0] ADC B Output PR BS MSB (bit 19) bit 2 LSB (bit 0)bit 1 PR BS PR BS MSB (bit 23) bit 6 LSB (bit 0)bit 5 Figure 7-8. Data Frame Width Composition With PRBS XOR Enabled DATA_WIDTH = 0 (20-bit) 18 bit (MSB aligned) ADC A conversion result USER_BITS_ADC_A[1:0] 18 bit (MSB aligned) ADC B conversion result USER_BITS_ADC_B[1:0] ADC A Output ADC B Output DATA_WIDTH = 1 (24-bit) 18 bit (MSB aligned) ADC A conversion result USER_BITS_ADC_A[5:0] 18 bit (MSB aligned) ADC B conversion result USER_BITS_ADC_B[5:0] ADC A Output ADC B Output Figure 7-9. Data Frame Width Composition With LSB XOR Enabled

7.3.8.3 Synchronizing Multiple ADCs

Drive the SMPL_CLK pins of the respective ADS921x devices with a common sampling clock. Match the timing delay on the clock path external to the ADCs by using identical PCB trace lengths for SMPL_CLK for the respective ADCs. Use the SMPL_SYNC pin to synchronize multiple ADCs when using the internal decimation filter. The SMPL_SYNC pin is latched by the falling edge of the sampling clock. A pulse on SMPL_SYNC resets the internal decimation filter. ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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7.3.8.4 Test Patterns for Data Interface

The ADS921x features test patterns ( Figure 7-10 ) used by the host for debugging and verifying the data interface. The test patterns replace the ADC output data with predefined digital data. Enable the test patterns by configuring the corresponding register addresses 0x13 through 0x1B in bank 1. Table 7-10 lists the test patterns supported by the ADS921x. TP0_A TP0_ATP1_A LSB MSBLSB TP1_AMSB Bit 15 Bit 0Bit 8 Bit 7Register Address 0x14 0x15 0x16 TP0_B TP0_BTP1_B LSB MSBLSB TP1_BMSB 0x19 0x1A 0x1B Test Patterns for ADC A Fixed Pattern {TP0} Digital ramp Alternating {TP0, TP1} ADC A Test Pattern Control Register0x13 ADC B Test Pattern Control Register0x18 Test Patterns for ADC B Fixed Pattern {TP0} Digital ramp Alternating {TP0, TP1} Figure 7-10. Register Bank for Test Patterns Table 7-10. Test Pattern Configurations ADC OUTPUT TP_EN_CHA TP_EN_CHB TP_MODE_CHA TP_MODE_CHB SECTION RESULT1 ADC conversion result 0 Fixed pattern 1 0 or 1 Fixed Pattern ADC A = TP0_A ADC B = TP0_B Digital ramp 1 2 Digital Ramp ADC A = Digital ramp ADC B = Digital ramp Alternating test patterns 1 3 Alternating Test Pattern ADC A = TP0_A, TP1_A ADC B = TP0_B, TP1_B Note 1. Configure the test patterns for two separate channel groups ADC A and ADC B.

7.3.8.4.1 Fixed Pattern

The ADC outputs fixed patterns defined in the TP0_A and TP0_B registers in place of the ADC A and ADC B data, respectively.

  • Configure the test patterns in TP0_A and TP0_B
  • Set TP_EN_A = 1, TP_MODE_A = 0 (address = 0x13), TP_EN_B = 1, and TP_MODE_B = 0 (address = 0x18)

7.3.8.4.2 Alternating Test Pattern

The ADC outputs alternating test patterns defined in the TP0_A, TP1_A and TP0_B, TP1_B registers in place of ADC A and ADC B data, respectively.

  • Configure the test patterns in TP0_A, TP1_A, TP0_B, and TP1_B
  • Set TP_EN_A = 1, TP_MODE_A = 3 (address = 0x13), TP_EN_B = 1, and TP_MODE_B = 3 (address = 0x18) www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 29 Product Folder Links: ADS9217 ADS9218 ADS9219

7.3.8.4.3 Digital Ramp

The ADC outputs digital ramp values with increments specified in the RAMP_INC_A and RAMP_INC_B registers in place of ADC A and ADC B data, respectively.

  • Configure the increment value between two successive steps of the digital ramp in the RAMP_INC_A (address = 0x13) and RAMP_INC_B (address = 0x18) registers, respectively. The digital ramp increments by N + 1, where N is the value configured in these registers.
  • Set TP_EN_A = 1, TP_MODE_A = 2 (address = 0x13), TP_EN_B = 1, and TP_MODE_B = 2 (address = 0x18)

7.3.9 ADC Sampling Clock Input

Use a low-jitter external clock with a high slew rate to maximize SNR performance. Operate the ADS921x with a differential or single-ended clock input. Clock amplitude impacts the ADC aperture jitter and, consequently, the SNR. For maximum SNR performance, provide a clock signal with fast slew rates that maximizes swing between VDD_1V8 and GND levels. Make sure the sampling clock is a free-running continuous clock. The ADC generates a valid output data, data clock, and frame clock t PU_SMPL_CLK, as specified in the Switching Characteristics after a free-running sampling clock is applied. When the sampling clock is stopped, the ADC is in power-down and the output data, data clock, and frame clock are invalid. Figure 7-11 shows a diagram of the differential sampling clock input. For this configuration, connect the differential sampling clock input to the SMPL_CLKP and SMPL_CLKM pins. Figure 7-12 shows a diagram of the single-ended sampling clock input. In this configuration, connect the single-ended sampling clock to SMPL_CLKP and connect SMPL_CLKM to ground. 5.4 k 5.4 k Bias SMPL_CLKP SMPL_CLKM Differential sampling clock 100 Figure 7-11. AC-Coupled Differential Sampling Clock SMPL_CLKP SMPL_CLKM GND VDD_1V8 ADS92XX Figure 7-12. Single-Ended Sampling Clock Figure 6-8 shows the latency from analog input sampling instant to corresponding data MSB output marked by FCLK rising edge. The equations for data output latency depend on the output data frame width and are given in Table 7-11. Table 7-11. Data Output Latency DEVICE 24-BIT DATA FRAME 20-BIT DATA FRAME ADS9219 2 × tSMPL_CLK + tLAT Not supported ADS9218 1.83 × tSMPL_CLK + tLAT Not supported ADS9217 1.83 × tSMPL_CLK + tLAT 2 × tSMPL_CLK + tLAT 1. For tLAT, see the Switching Characteristics. ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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7.4 Device Functional Modes

7.4.1 Reset

Power down the ADS921x with a logic 0 on the RESET pin or write 1b to the RESET field (address 0x00, register bank 0). The device registers are initialized to the default values after reset. Register write operations are not required for initializing the ADS9218.

7.4.2 Power-Down Options

Power down the ADS921x with a logic 0 on the PWDN pin or write 11b to the PD_CH field (address 0xC0, register bank 1). The device registers are initialized to the default values after power-up. Register write operations are not required for initializing the ADS9218.

7.4.3 Normal Operation

In normal operating mode, the ADS921x is powered-up and digitizes the analog inputs at the falling edge of the sampling clock. The ADC outputs the data clock, frame clock, and MSB-aligned, 18-bit conversion result.

7.4.4 Initialization Sequence

The ADS921x register map is initialized with default values on power-up. Table 7-12 lists the steps to enable gain-error calibration (recommended) and change the output data interface. For the ADS9219 only, follow the initialization steps in Table 7-13. Table 7-12. User-Defined Configuration for the ADS9219, ADS9218, and ADS9217 STEP NUMBER REGISTER COMMENT BANK ADDRESS VALUE[15:0] 1 1 0x0D User defined Enable gain error calibration and select ADC output data format 2 1 0x33 0x2040 Enable gain error calibration 3 0 0x04 0x0000 for data frame width = 24 bits and output lanes = 2 0x000B for other combinations of data frame width and output lanes Table 7-13. Initialization Configuration for the ADS9219 Only STEP NUMBER REGISTER BANK ADDRESS VALUE[15:0] 1 1 0x0D [9:8] 0x3 2 1 0x34 [1] 0x1 www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 31 Product Folder Links: ADS9217 ADS9218 ADS9219

7.5 Programming

7.5.1 Register Write

Register write access is enabled by setting SPI_RD_EN = 0b. The 16-bit configuration registers are grouped in three register banks and are addressable with an 8-bit register address. Register bank 1 and register bank 2 are selected for read or write operation by configuring the REG_BANK_SEL bits. Registers in bank 0 are always accessible, irrespective of the REG_BANK_SEL bits. The register addresses in bank 0 are unique and are not used in register banks 1 and 2. As shown in Figure 7-13, steps to write to a register are: 1. Frame 1: Write to register address 0x03 in register bank 0 to select either register bank 1 or bank 2 for a subsequent register write. This frame has no effect when writing to registers in bank 0. 2. Frame 2: Write to a register in the bank selected in frame 1. Repeat this step for writing to multiple registers in the same register bank. 24-bits CS SCLK { addr[23:16] = 0x03, data[15:0] = 0x0002 or 0x0010 } Register Write for Bank Selection (ADDR = 0x03) Not Required for Register Bank 0 Register Write { addr[23:16] = REG_ADDR, data[15:0] = DATA }SDI Logic 0 (when SPI_MODE = 0b) and Hi-Z (when SPI_MODE = 1b)SDO Frame 1 Frame 2 Figure 7-13. Register Write

7.5.2 Register Read

Select the desired register bank by writing to register address 0x03 in register bank 0. Register read access is enabled by setting SPI_RD_EN = 1b and SPI_MODE = 1b in register bank 0. As illustrated in Figure 7-14, registers are read using two 24-bit SPI frames after SPI_RD_EN and SPI_MODE are set. The first SPI frame selects the register bank. The ADC returns the 16-bit register value in the second SPI frame corresponding to the 8-bit register address. As illustrated in Figure 7-14, steps to read a register are: 1. Frame 1: With SPI_RD_EN = 0b, write to register address 0x03 in register bank 0 to select the desired register bank for reading. 2. Frame 2: Set SPI_RD_EN = 1b and SPI_MODE = 1b in register address 0x00 in register bank 0. 3. Frame 3: Read any register in the selected bank using a 24-bit SPI frame containing the desired register address. Repeat this step with the address of any register in the selected bank to read the corresponding register. 4. Frame 4: Set SPI_RD_EN = 0 to disable register reads and re-enable register writes. 5. Repeat steps 1 through 4 to read registers in a different bank. ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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{ addr[23:16] = 0x03, data[15:0] = 0x0002 or 0x0010 } Register Write for Bank Selection (ADDR = 0x03) Not Required for Register Bank 0 Register Write for Read Enable (ADDR = 0x00) { addr[23:16] = 0x00, data[15:0] = 0x0006 } { addr[23:16] = REG_ADDR, data[15:0] = 0 } { addr[23:16] = 0x00, data[15:0] = 0x0004 } Register Read: 8-bit address of register to be read Register Write for Read Disable (ADDR = 0x00) SDI 16-bit Register Data Hi-Z (when SPI_MODE = 1b) Logic 0 (when SPI_MODE = 0b)SDO Frame 1 Frame 2 Frame 3 Frame 4 Figure 7-14. Register Read

7.5.3 Multiple Devices: Daisy-Chain Topology for SPI Configuration

Figure 7-15 shows a typical connection diagram with multiple devices in a daisy-chain topology. 24-bit ADS92XX ADC1 SDISDO 24-bit ADS92XX ADC2 SDISDO 24-bit ADS92XX ADC3 SDISDO 24-bit ADS92XX ADC4 SDISDO PICO POCI CS SCLK HOST CSSCLKCSSCLKCSSCLKCSSCLK Figure 7-15. Daisy-Chain Connections for SPI Configuration The CS and SCLK inputs of all ADCs are connected together and controlled by a single CS and SCLK pin of the controller, respectively. The SDI input pin of the first ADC in the chain (ADC1) is connected to the peripheral IN controller OUT (PICO) pin of the controller. The SDO output pin of ADC1 is connected to the SDI input pin of ADC2, and so on. The SDO output pin of the last ADC in the chain (ADC4) is connected to the peripheral OUT controller IN (POCI) pin of the controller. The data on the PICO pin passes through ADC1 with a 24-SCLK delay, as long as CS is active. Enable daisy-chain mode after power-up or after the device is reset. Set the daisy-chain length in the DAISY_CHAIN_LEN register to enable daisy-chain mode. The daisy-chain length is the number of ADCs in the chain, excluding ADC1. In Figure 7-15, the DAISY_CHAIN_LEN is 3.

7.5.3.1 Register Write With Daisy-Chain

Writing to registers in daisy-chain configuration requires N × 24 SCLKs in one SPI frame. Register writes in a daisy-chain configuration containing four ADCs, as illustrated in Figure 7-15, requires 96 SCLKs. The daisy-chain mode is enabled on power-up or after device reset. Configure the DAISY_CHAIN_LEN field to enable daisy-chain mode. Repeat the waveform in Figure 7-16 N times, where N is the number of ADCs in the daisy chain. Figure 7-17 provides the SPI waveform, containing N SPI frames, for enabling daisy-chain mode for N ADCs. www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 33 Product Folder Links: ADS9217 ADS9218 ADS9219

Logic 0 (when SPI_MODE = 0b)POCI DADCN DADC3 DADC2 DADC1 Figure 7-16. Register Write With Daisy-Chain N x 24 bits CS SCLK DAISY_CHAIN_LEN = 3 {ADC1} DAISY_CHAIN_LEN = 0 {ADC2, ADC3, and ADCN} DADC1[23:0] = DADC2[23:0] = DADC3[23:0] = DADCN[23:0] = { 0000 0001, 0000 0000, N-1, 00} PICO Logic 0 (when SPI_MODE = 0b)POCI Frame 1 Frame 2 DADCN DADC3 DADC2 DADC1 DADCN DADC3 DADC2 DADC1 Frame 3 DADCN DADC3 DADC2 DADC1 Frame N DADCN DADC3 DADC2 DADC1 DAISY_CHAIN_LEN = 3 {ADC1 and ADC2} DAISY_CHAIN_LEN= 0 {ADC3, ADCN} DAISY_CHAIN_LEN = 3 {ADC1, ADC2 and ADC3} DAISY_CHAIN_LEN = 0 {ADCN} DAISY_CHAIN_LENGTH = 3 {ADC1, ADC2, ADC3 and ADCN} Figure 7-17. Register Write to Configure Daisy-Chain Length

7.5.3.2 Register Read With Daisy-Chain

Figure 7-18 illustrates an SPI waveform for reading registers in daisy-chain configuration. Steps for reading registers from N ADCs connected in daisy-chain are: 1. Register read is enabled by writing to the following registers: a. Write to REG_BANK_SEL to select the desired register bank b. Enable register reads by writing SPI_RD_EN = 0b (default on power-up) 2. With the register bank selected and SPI_RD_EN = 0b, the controller reads register data by: a. N × 24-bit SPI frame containing the 8-bit register address to be read: N times (0xFE, 0x00, 8-bit register address) b. N × 24-bit SPI frame to read out register data: N times (0xFF, 0xFF, 0xFF) The 0xFE in step 2a configures the ADC for register read from the specified 8-bit address. At the end of step 2a, the output shift register in the ADC is loaded with register data. The ADC returns the 8-bit register address and corresponding 16-bit register data in step 2b. ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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Figure 7-18. Register Read With Daisy-Chain Configuration www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 35 Product Folder Links: ADS9217 ADS9218 ADS9219

8 Register Map

8.1 Register Bank 0

Figure 8-1. Register Bank 0 Map ADD D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 00h RESERVED SPI_MO DE SPI_RD _EN RESET 01h RESERVED DAISY_CHAIN_LEN RESERVED 03h RESERVED REG_BANK_SEL 04h RESERVED INIT_1 06h REG_00H_READBACK Table 8-1. Register Section/Block Access Type Codes Access Type Code Description R R Read W W Write R/W R/W Read or write Reset or Default Value -n Value after reset or the default value

8.1.2 Register 00h (offset = 0h) [reset = 0h]

Figure 8-2. Register 00h 15 14 13 12 11 10 9 8 RESERVED W-0h 7 6 5 4 3 2 1 0 RESERVED SPI_MODE SPI_RD_EN RESET W-0h W-0h W-0h W-0h Figure 8-3. Register 00h Field Descriptions Bit Field Type Reset Description 15-3 RESERVED W 0h Reserved. Do not change from the default reset value.

2 SPI_MODE W 0h

Select between legacy SPI mode and daisy-chain SPI mode for the configuration interface for register access. 0 : Daisy-chain SPI mode 1 : Legacy SPI mode

1 SPI_RD_EN W 0h

Enable register read access in legacy SPI mode. This bit has no effect in daisy-chain SPI mode. 0 : Register read disabled 1 : Register read enabled

0 RESET W 0h

ADC reset control. 0 : Normal device operation 1 : Reset all registers ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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8.1.3 Register 01h (offset = 1h) [reset = 0h]

Figure 8-4. Register 01h 15 14 13 12 11 10 9 8 RESERVED R/W-0h 7 6 5 4 3 2 1 0 RESERVED DAISY_CHAIN_LEN RESERVED R/W-0h R/W-0h R/W-0h Figure 8-5. Register 01h Field Descriptions Bit Field Type Reset Description 15-7 RESERVED R/W 0h Reserved. Do not change from the default reset value. 6-2 DAISY_CHAIN_L EN R/W 0h Configure the number of ADCs connected in daisy-chain for the SPI configuration. 0 : 1 ADC 1 : 2 ADCs 31 : 32 ADCs 1-0 RESERVED R/W 0h Reserved. Do not change from the default reset value.

8.1.4 Register 03h (offset = 3h) [reset = 2h]

Figure 8-6. Register 03h 15 14 13 12 11 10 9 8 RESERVED R/W-0h 7 6 5 4 3 2 1 0 REG_BANK_SEL R/W-2h Figure 8-7. Register 03h Field Descriptions Bit Field Type Reset Description 15-8 RESERVED R/W 0h Reserved. Do not change from the default reset value. 7-0 REG_BANK_SEL R/W 2h Register bank selection for read and write operations. 0 : Select register bank 0 2 : Select register bank 1 16 : Select register bank 2 www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 37 Product Folder Links: ADS9217 ADS9218 ADS9219

8.1.5 Register 04h (offset = 4h) [reset = 0h]

Figure 8-8. Register 04h 15 14 13 12 11 10 9 8 RESERVED R-0h 7 6 5 4 3 2 1 0 RESERVED INIT_1 R/W-0h Figure 8-9. Register 04h Field Descriptions Bit Field Type Reset Description 3-0 INIT_1 R/W 0h INIT_1 field for device initialization. Write 1011b during the initialization sequence. Write 0000b for normal operation.

8.1.6 Register 06h (offset = 6h) [reset = 2h]

Figure 8-10. Register 06h 15 14 13 12 11 10 9 8 REG_00H_READBACK R-0h 7 6 5 4 3 2 1 0 REG_00H_READBACK R-5h Figure 8-11. Register 06h Field Descriptions Bit Field Type Reset Description 15-0 REG_00H_READ BACK R 2h This register is a copy of the register address 0x00 for readback. The register address 0x00 is write-only. The default readback value is 2h because SPI_RD_EN in address 0x00 is required to be set to 1 for register reads. ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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8.2 Register Bank 1

Figure 8-12. Register Bank 1 Map ADD D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 0Dh RESERVED DATA_F ORMAT RESERVED LAT_INC GE_CAL _EN1 OSR_EN OSR RESERVED 10h RESERVED HI_FRE Q 12h RESERVED XOR_EN DATA_LANES 13h RESERVED RAMP_INC_A TP_MODE_CHA TP_EN_ CHA RESERV ED 14h TP0_A 15h TP1_A TP0_A 16h TP1_A 18h RESERVED RAMP_INC_B TP_MODE_CHB TP_EN_ CHB RESERV ED 19h TP0_B 1Ah TP1_B TP0_B 1Bh TP1_B 33h RESERVED GE_CAL _EN3 RESERVED GE_CAL _EN2 RESERVED 34h RESERVED LAT_EN RESERVED 90h RESERV ED TS_LD RESERVED 91h RESERVED TEMPERATURE_SENSOR C0h RESERVED CLK1 OSR_INIT1 OSR_CLK RESERVED PD_CH C1h RESERVED PD_REF RESERVED DATA_R ATE RESERVED CLK2 C4h RESERVED OSR_INIT2 RESERVED OSR_INI PD_CHI P C5h RESERVED HI_FRE Q_EN RESERVED CLK3 RESERVED RD_CLK RESERV ED CLK4 RESERVED FBh RESERVED NCO_SY SREF XOR_M ODE CLK5 MIXER_ EN FCh NCO_PHASE_COUNT[15:0] FDh NCO_FREQUENCY[7:0] NCO_PHASE_COUNT[23:16] FEh NCO_FREQUENCY[23:8] Table 8-2. Register Section/Block Access Type Codes Access Type Code Description R R Read W W Write R/W R/W Read or write Reset or Default Value -n Value after reset or the default value www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 39 Product Folder Links: ADS9217 ADS9218 ADS9219

8.2.1 Register 0Dh (offset = Dh) [reset = 2002h]

Figure 8-13. Register 0Dh 15 14 13 12 11 10 9 8 RESERVED DATA_FORMAT RESERVED LAT_INC R/W-0h R/W-1h R/W-0h R/W-0h 7 6 5 4 3 2 1 0 GE_CAL_EN1 OSR_EN OSR RESERVED R/W-0h R/W-0h R/W-0h R/W-2h Figure 8-14. Register 0Dh Field Descriptions Bit Field Type Reset Description 15-14 RESERVED R/W 0h Reserved. Do not change from the default reset value.

13 DATA_FORMAT R/W 1h

Select data format for the ADC conversion result. 0 : Straight binary format 1 : Two's-complement format 12-10 RESERVED R/W 0h Reserved. Do not change from the default reset value. 9-8 LAT_INC R/W 0h For ADS9219, set this field to 11b for optimum INL performance.

7 GE_CAL_EN1 R/W 0h

Global control for gain error calibration. 0 : Gain error calibration disabled for all channels 1 : Gain error calibration enabled for all channels

6 OSR_EN R/W 0h

Control for data averaging depth. 0 : Data averaging disabled 1 : Data averaging enabled 5-2 OSR R/W 0h Control for enabling data averaging. 0 : 2 samples averaged 1 : 4 samples averaged 2 : 8 samples averaged 3 : 16 samples averaged 1-0 RESERVED R/W 2h Reserved. Do not change from the default reset value.

8.2.2 Register 10h (offset = 10h) [reset = 0h]

Figure 8-15. Register 10h 15 14 13 12 11 10 9 8 RESERVED R/W-0h 7 6 5 4 3 2 1 0 RESERVED RESERVED R/W-0h R/W-0h Figure 8-16. Register 10h Field Descriptions Bit Field Type Reset Description 15-1 RESERVED R/W 0h Reserved. Do not change from the default reset value.

0 HI_FREQ R/W 0h

Analog input fast slew rate control 0: Normal slew rate 1: Fast slew rate. Fast analog input control enabled. Recommended for input frequencies >2MHz.See also HI_FREQ_EN. ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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8.2.3 Register 12h (offset = 12h) [reset = 2h]

Figure 8-17. Register 12h 15 14 13 12 11 10 9 8 RESERVED R/W-0h 7 6 5 4 3 2 1 0 RESERVED XOR_EN DATA_LANES R/W-0h R/W-0h R/W-2h Figure 8-18. Register 12h Field Descriptions Bit Field Type Reset Description 15-4 RESERVED R/W 0h Reserved. Do not change from the default reset value.

3 XOR_EN R/W 0h

Enables XOR operation on ADC conversion result. 0 : XOR operation is disabled 1 : ADC conversion result is bit-wise XOR with the PRBS bit by default 2-0 DATA_LANES R/W 2h Selects the number of output data lanes and number of data bits per output lane. 0 : ADC A and B data output on DOUTA and DOUTB respectively; 20 bits per ADC. 2 : ADC A and B data output on DOUTA and DOUTB respectively; 24 bits per ADC. 5 : ADC A and B data output on DOUTA; 20 bits per ADC. 7 : ADC A and B data output on DOUTA; 24 bits per ADC. www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 41 Product Folder Links: ADS9217 ADS9218 ADS9219

8.2.4 Register 13h (offset = 13h) [reset = 0h]

Figure 8-19. Register 13h 15 14 13 12 11 10 9 8 RESERVED R/W-0h 7 6 5 4 3 2 1 0 RAMP_INC_A TP_MODE_A TP_EN_A RESERVED R/W-0h R/W-0h R/W-0h R/W-0h Figure 8-20. Register 13h Field Descriptions Bit Field Type Reset Description 15-8 RESERVED R/W 0h Reserved. Do not change from the default reset value. 7-4 RAMP_INC_A R/W 0h Increment value for the ramp pattern output. The output ramp increments by N+1, where N is the value configured in this register. 3-2 TP_MODE_A R/W 0h Select digital test pattern for ADC A. 0 : Fixed pattern from the TP0_A register 1 : Fixed pattern from the TP0_A register 2 : Digital ramp output 3 : Alternate fixed pattern output from the TP0_A and TP1_A registers

1 TP_EN_A R/W 0h

Enable digital test pattern for data corresponding to ADC A. 0 : Data output is the ADC conversion result 1 : Data output is the digital test pattern for ADC A 0 RESERVED R/W 0h Reserved. Do not change from the default reset value.

8.2.5 Register 14h (offset = 14h) [reset = 0h]

Figure 8-21. Register 14h 15 14 13 12 11 10 9 8 TP0_A[15:0] R/W-0h 7 6 5 4 3 2 1 0 TP0_A[15:0] R/W-0h Figure 8-22. Register 14h Field Descriptions Bit Field Type Reset Description 15-0 TP0_A[15:0] R/W 0h Lower 16 bits of test pattern 0 ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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8.2.6 Register 15h (offset = 15h) [reset = 0h]

Figure 8-23. Register 15h 15 14 13 12 11 10 9 8 TP1_A[7:0] R/W-0h 7 6 5 4 3 2 1 0 TP0_A[23:16] R/W-0h Figure 8-24. Register 15h Field Descriptions Bit Field Type Reset Description 15-8 TP1_A[7:0] R/W 0h Lower eight bits of test pattern 1 7-0 TP0_A[23:16] R/W 0h Upper eight bits of test pattern 0

8.2.7 Register 16h (offset = 16h) [reset = 0h]

Figure 8-25. Register 16h 15 14 13 12 11 10 9 8 TP1_A[23:8] R/W-0h 7 6 5 4 3 2 1 0 TP1_A[23:8] R/W-0h Figure 8-26. Register 16h Field Descriptions Bit Field Type Reset Description 15-0 TP1_A[23:8] R/W 0h Upper 16 bits of test pattern 1 www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 43 Product Folder Links: ADS9217 ADS9218 ADS9219

8.2.8 Register 18h (offset = 18h) [reset = 0h]

Figure 8-27. Register 18h 15 14 13 12 11 10 9 8 RESERVED R/W-0h 7 6 5 4 3 2 1 0 RAMP_INC_B TP_MODE_B TP_EN_B RESERVED R/W-0h R/W-0h R/W-0h R/W-0h Figure 8-28. Register 18h Field Descriptions Bit Field Type Reset Description 15-8 RESERVED R/W 0h Reserved. Do not change from the default reset value. 7-4 RAMP_INC_B R/W 0h Increment value for the ramp pattern output. The output ramp increments by N+1, where N is the value configured in this register. 3-2 TP_MODE_B R/W 0h Select digital test pattern for ADC B. 0 : Fixed pattern from the TP0_B register 1 : Fixed pattern from the TP0_B register 2 : Digital ramp output 3 : Alternate fixed pattern output from the TP0_B and TP1_B registers

1 TP_EN_B R/W 0h

Enable digital test pattern for data corresponding to ADC B. 0 : Data output is the ADC conversion result 1 : Data output is the digital test pattern 0 RESERVED R/W 0h Reserved. Do not change from the default reset value.

8.2.9 Register 19h (offset = 19h) [reset = 0h]

Figure 8-29. Register 19h 15 14 13 12 11 10 9 8 TP0_B[15:0] R/W-0h 7 6 5 4 3 2 1 0 TP0_B[15:0] R/W-0h Figure 8-30. Register 19h Field Descriptions Bit Field Type Reset Description 15-0 TP0_B[15:0] R/W 0h Lower 16 bits of test pattern 0 ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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8.2.10 Register 1Ah (offset = 1Ah) [reset = 0h]

Figure 8-31. Register 1Ah 15 14 13 12 11 10 9 8 TP1_B[7:0] R/W-0h 7 6 5 4 3 2 1 0 TP0_B[23:16] R/W-0h Figure 8-32. Register 1Ah Field Descriptions Bit Field Type Reset Description 15-8 TP1_B[7:0] R/W 0h Lower eight bits of test pattern 1 7-0 TP0_B[23:16] R/W 0h Upper eight bits of test pattern 0 www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 45 Product Folder Links: ADS9217 ADS9218 ADS9219

8.2.11 Register 33h (offset = 33h) [reset = 0h]

Figure 8-33. Register 33h 15 14 13 12 11 10 9 8 RESERVED GE_CAL_EN3 RESERVED R/W-0h R/W-0h R/W-0h 7 6 5 4 3 2 1 0 RESERVED GE_CAL_EN2 RESERVED R/W-0h R/W-0h R/W-0h Figure 8-34. Register 33h Field Descriptions Bit Field Type Reset Description 15-14 RESERVED R/W 0h Reserved. Do not change from the default reset value.

13 GE_CAL_EN3 R/W 0h

Global control for gain error calibration. 0 : Gain error calibration disabled for all channels 1 : Gain error calibration enabled for all channels 12-7 RESERVED R/W 0h Reserved. Do not change from the default reset value.

6 GE_CAL_EN2 R/W 0h

Global control for gain error calibration. 0 : Gain error calibration disabled for all channels 1 : Gain error calibration enabled for all channels 5-0 RESERVED R/W 0h Reserved. Do not change from the default reset value.

8.2.12 Register 34h (offset = 34h) [reset = 0h]

Figure 8-35. Register 34h 15 14 13 12 11 10 9 8 RESERVED R/W-0h 7 6 5 4 3 2 1 0 RESERVED LAT_EN RESERVED R/W-0h R/W-0h R/W-0h Figure 8-36. Register 34h Field Descriptions Bit Field Type Reset Description 15-5 RESERVED R/W 0h Reserved. Do not change from the default reset value.

4 LAT_EN R/W 0h For ADS9219, set this field to 11b for optimum INL

performance. 3-0 RESERVED R/W 0h Reserved. Do not change from the default reset value. ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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8.2.13 Register 90h (offset = 90h) [reset = 0h]

Figure 8-37. Register 90h 15 14 13 12 11 10 9 8 RESERVED TS_LD RESERVED R/W-0h R/W-0h R/W-0h 7 6 5 4 3 2 1 0 RESERVED R/W-0h Figure 8-38. Register 90h Field Descriptions Bit Field Type Reset Description 15 RESERVED R/W 0h Reserved. Do not change from the default reset value.

14 TS_LD R/W 0h

Trigger to load temperature sensor output in address 0x91. Transition from 0 to 1 if this bit triggers the data load operation. 13-0 RESERVED R/W 0h Reserved. Do not change from the default reset value.

8.2.14 Register 91h (offset = 91h) [reset = 00h]

Figure 8-39. Register 91h 15 14 13 12 11 10 9 8 RESERVED TEMPERATURE_SENSOR R/W-0h R/W-0h 7 6 5 4 3 2 1 0 TEMPERATURE_SENSOR R/W-0h Figure 8-40. Register 91h Field Descriptions Bit Field Type Reset Description 15-10 RESERVED R/W 0h Reserved. Do not change from the default reset value. 9-0 TEMPERATURE_ SENSOR R/W 0h 10-bit temperature sensor output. See the Temperature Sensor section. www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 47 Product Folder Links: ADS9217 ADS9218 ADS9219

8.2.15 Register C0h (offset = C0h) [reset = 0h]

Figure 8-41. Register C0h 15 14 13 12 11 10 9 8 RESERVED CLK1 OSR_INIT1 OSR_CLK R/W-0h R/W-0h R/W-0h R/W-0h R/W-0h 7 6 5 4 3 2 1 0 OSR_CLK RESERVED PD_CH R/W-0h R/W-0h R/W-0h Figure 8-42. Register C0h Field Descriptions Bit Field Type Reset Description 15-13 RESERVED R/W 0h Reserved. Do not change from the default reset value.

12 CLK1 R/W 0h

Selects the clock configuration based on output data-lanes. 0 : Configuration for DATA_LANES = 0 or 2 1 : Configuration for DATA_LANES = 5 or 7 11-10 OSR_INIT1 R/W 0h Initialization for data averaging. 0 : Configuration for disabling data averaging 1 : Configuration for enabling data averaging 9-7 OSR_CLK R/W 0h Data output clock configuration for data averaging. See Table 7-4 for more details. 6-2 RESERVED R/W 0h Reserved. Do not change from the default reset value. 1-0 PD_CH R/W 0h Power-down control for the analog input channels. 0 : Normal operation 1 : ADC A powered down 2 : ADC B powered down 3 : ADC A and B powered down ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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8.2.16 Register C1h (offset = C1h) [reset = 0h]

Figure 8-43. Register C1h 15 14 13 12 11 10 9 8 RESERVED PD_REF RESERVED DATA_RATE R/W-0h R/W-0h R/W-0h R/W-0h 7 6 5 4 3 2 1 0 RESERVED CLK2 R/W-0h R/W-0h Figure 8-44. Register C1h Field Descriptions Bit Field Type Reset Description 15-12 RESERVED R/W 0h Reserved. Do not change from the default reset value.

11 PD_REF R/W 0h

ADC reference voltage source selection. 0 : Internal reference enabled. 1 : Internal reference disabled. Connect the external reference voltage to the REFIO pin. 10-9 RESERVED R/W 0h Reserved. Do not change from the default reset value.

8 DATA_RATE R/W 0h

Select data rate for the data interface. 0 : Double data rate (DDR) 1 : Single data rate (SDR) 7-1 RESERVED R/W 0h Reserved. Do not change from the default reset value.

0 CLK2 R/W 0h

Select data rate for the data interface. 0 : Configuration for DATA_LANES = 2 or 7 1 : Configuration for DATA_LANES = 0 or 5

8.2.17 Register C4h (offset = C4h) [reset = 0h]

Figure 8-45. Register C4h 15 14 13 12 11 10 9 8 RESERVED R/W-0h 7 6 5 4 3 2 1 0 RESERVED OSR_INIT2 RESERVED OSR_INIT3 PD_CHIP R/W-0h R/W-0h R/W-0h R/W-0h R/W-0h Figure 8-46. Register C4h Field Descriptions Bit Field Type Reset Description 15-6 RESERVED R/W 0h Reserved. Do not change from the default reset value. 5-4 OSR_INIT2 R/W 0h Initialization for data averaging. 0 : Configuration for disabling data averaging 2 : Configuration for enabling data averaging 3-2 RESERVED R/W 0h Reserved. Do not change from the default reset value.

1 OSR_INIT3 R/W 0h

Initialization for data averaging. 0 : Configuration for disabling data averaging 1 : Configuration for enabling data averaging

0 PD_CHIP R/W 0h

Full chip power-down control. 0 : Normal device operation 1 : Full device powered-down www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 49 Product Folder Links: ADS9217 ADS9218 ADS9219

8.2.18 Register C5h (offset = C5h) [reset = 0h]

Figure 8-47. Register C5h 15 14 13 12 11 10 9 8 RESERVED HI_FREQ_EN RESERVED CLK3 RESERVED R/W-0h R/W-0h R/W-0h R/W-0h R/W-0h 7 6 5 4 3 2 1 0 RESERVED RD_CLK RESERVED CLK4 RESERVED R/W-0h R/W-0h R/W-0h R/W-0h R/W-0h Figure 8-48. Register C5h Field Descriptions Bit Field Type Reset Description 15-14 RESERVED R/W 0h Reserved. Do not change from the default reset value.

13 HI_FREQ_EN R/W 0h

Fast analog input slew rate enable. 0: Normal slew rate 1: Fast analog input control enabled. Recommended for input frequencies >2MHz. See also HI_FREQ. 12-10 RESERVED R/W 0h Reserved. Do not change from the default reset value.

9 CLK3 R/W 0h

Select data rate for the data interface. 0 : Configuration for DATA_LANES = 0 or 2 1 : Configuration for DATA_LANES = 5 or 7 8 - 7 RESERVED R/W 0h Reserved. Do not change from the default reset value. 6-5 RD_CLK R/W 0h Data output clock control for data averaging. See Data Averaging for more details. 4 RESERVED R/W 0h Reserved. Do not change from the default reset value. 3 - 2 CLK4 R/W 0h Clock configuration for ADS9217. See the Data Interface section for details. Not applicable for ADS9219 and ADS9218. 0 : 24-bit 2-lane mode 3 : all other modes 1 - 0 RESERVED R/W 0h Reserved. Do not change from the default reset value. ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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8.2.19 Register FBh (offset = FBh) [reset = 0h]

Figure 8-49. Register FBh 15 14 13 12 11 10 9 8 RESERVED R/W-0h 7 6 5 4 3 2 1 0 RESERVED NCO_SYSREF XOR_MODE CLK5 MIXER_EN R/W-0h R/W-0h R/W-0h R/W-0h R/W-0h Figure 8-50. Register FBh Field Descriptions Bit Field Type Reset Description 15-4 RESERVED R/W 0h Reserved. Do not change from the default reset value.

3 NCO_SYSREF R/W 0h

Set to 1b when applying periodic pulses on the SMPL_SYNC pin. 0: Synchronize the NCO with one pulse on the SMPL_SYNC pin. 1: Synchronize the NCO with the first pulse on the SMPL_SYNC pin when using periodic pulses.

2 XOR_MODE R/W 0h

Selects the bit with which the ADC output data is XORed when XOR output mode is enabled. 0 : PRBS bit is output after the ADC LSB. ADC output data is XORed with the PRBS bit. 1 : ADC output data is XORed with the LSB of the conversion result.

1 CLK5 R/W 0h

Clock configuration for the ADS9219 and ADS9218. See the Data Interface section for details. Not applicable for the ADS9217. 0 : 24-bit 2-lane SDR and DDR modes 1 : 24-bit 1-lane SDR and DDR modes

0 MIXER_EN R/W 0h 0: Digital down converter disabled

1: Digital down converter enabled www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 51 Product Folder Links: ADS9217 ADS9218 ADS9219

8.2.20 Register FCh (offset = FCh) [reset = 0h]

Figure 8-51. Register FCh 15 14 13 12 11 10 9 8 NCO_PHASE_COUNT R/W-0h 7 6 5 4 3 2 1 0 NCO_PHASE_COUNT R/W-0h Figure 8-52. Register FCh Field Descriptions Bit Field Type Reset Description 15-0 NCO_PHASE_CO UNT[15:0] R/W 0h Lower 15 bits of the NCO phase count. See the Digital Down Converter section.

8.2.21 Register FDh (offset = FDh) [reset = 0h]

Figure 8-53. Register FDh 15 14 13 12 11 10 9 8 NCO_FREQUENCY R/W-0h 7 6 5 4 3 2 1 0 NCO_PHASE_COUNT R/W-0h Figure 8-54. Register FDh Field Descriptions Bit Field Type Reset Description 15-8 NCO_FREQUEN CY[7:0] R/W 0h Lower eight bits of the NCO phase count. See the Digital Down Converter section. 7-0 NCO_PHASE_CO UNT[23:16] R/W 0h Higher eight bits of the NCO phase count. See the Digital Down Converter section. ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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8.2.22 Register FEh (offset = FEh) [reset = 0h]

Figure 8-55. Register FEh 15 14 13 12 11 10 9 8 NCO_FREQUENCY R/W-0h 7 6 5 4 3 2 1 0 NCO_FREQUENCY R/W-0h Figure 8-56. Register FEh Field Descriptions Bit Field Type Reset Description 15-0 NCO_FREQUEN CY R/W 0h Higher 16 bits of the NCO phase count. See the Digital Down Converter section. www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 53 Product Folder Links: ADS9217 ADS9218 ADS9219

8.3 Register Bank 2

Figure 8-57. Register Bank 2 Map ADD D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 1Ch RESERVED CLK6 RESERVED Table 8-3. Register Section/Block Access Type Codes Access Type Code Description R R Read W W Write R/W R/W Read or write Reset or Default Value -n Value after reset or the default value

8.3.1 Register 1Ch (offset = 1Ch) [reset = 0h]

Figure 8-58. Register 1Ch 15 14 13 12 11 10 9 8 RESERVED R/W-0h 7 6 5 4 3 2 1 0 CLK6 RESERVED R/W-0h R/W-0h Figure 8-59. Register 1Ch Field Descriptions Bit Field Type Reset Description 15-8 RESERVED R/W 0h Reserved. Do not change from the default reset value. 7-6 CLK6 R/W 0h Clock configuration for ADS9217. See the Data Interface section for details. Not applicable for the ADS9219 and ADS9218. 0 : 24-bit 2-lane mode 3 : all other modes 5-0 RESERVED R/W 0h Reserved. Do not change from the default reset value. ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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9 Application and Implementation

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.

9.1 Application Information

The ADS921x features an integrated ADC driver, low-latency, high-speed, low AC and DC errors, and low temperature drift. These features make the ADS921x a high-performance signal-chain for applications where precision measurements with low-latency are required. The following section gives an example circuit and recommendations for using the ADS921x device family in a data acquisition (DAQ) system.

9.2 Typical Applications

9.2.1 Data Acquisition (DAQ) Circuit for ≤20kHz Input Signal Bandwidth

Figure 9-1 shows a 2-channel signal chain with minimum external components. This signal-chain significantly reduces solution size by driving the ADS921x with the 2-channel, fully differential amplifier (FDA) THS4552. 47pF VOCM VOCM THS4552 270pF RFB 270pF RFB 470pF 47pF ADC ADC VCMOUT AINAM AINAP AINBM AINBP ADS92XX Differential Source Single-ended Source Differential Source Single-ended Source VOCM THS4552 270pF RFB 270pF RFB 47pF 470pF 47pF RFB = 1k for Gain = 1 or RFB = 4.02k for Gain = 4 Figure 9-1. Data Acquisition (DAQ) Circuit for ≤20kHz Input Signal Bandwidth

9.2.1.1 Design Requirements

Table 9-1 lists the parameters for this typical application. Table 9-1. Design Parameters PARAMETER VALUE SNR ≥ 92dB THD ≤ –110dB Input signal frequency ≤ 20kHz www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 55 Product Folder Links: ADS9217 ADS9218 ADS9219

9.2.1.2 Detailed Design Procedure

Use the procedure discussed in this section for any ADS921x application circuit.

  • All ADS921x applications require the supply decoupling as provided in the Power Supply Recommendations section.
  • Make sure the values provided in this section meet the maximum throughput and input signal frequency design requirements given. Use a lower bandwidth signal chain when lower noise performance is required.

9.2.1.3 Application Curves

The following figures show the SNR and INL performance for the circuit in Figure 9-1, respectively. F r e q u e n c y ( k H z ) Amplitude (dBFS) 0 . 5 1 2 3 4 5 7 1 0 2 0 3 0 5 0 1 0 0 2 0 0 5 0 0 1 0 0 0 3 0 0 0 - 1 8 0 - 1 5 0 - 1 2 0 - 9 0 - 6 0 - 3 0 fIN = 2kHz, SNR = 95.5dBFS, THD = –122.5dB Figure 9-2. Typical FFT for fIN = 2kHz O u t p u t C o d e Integral Nonlinearity (LSB) 0 6 5 5 3 6 1 3 1 0 7 2 1 9 6 6 0 8 2 6 2 1 4 4 - 0 . 7 5 - 0 . 4 5 - 0 . 1 5 0 . 1 5 0 . 4 5 0 . 7 5 Typical INL = ±0.5LSB Figure 9-3. Typical INL ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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9.2.2 Data Acquisition (DAQ) Circuit for ≤100kHz Input Signal Bandwidth

Figure 9-4 shows a 2-channel signal chain with minimum external components. This signal-chain significantly reduces solution size by driving the ADS921x with the 2-channel, fully differential amplifier (FDA) THS4552. 47pF VOCM VOCM THS4552 270pF RFB 270pF RFB 470pF 47pF ADC ADC VCMOUT AINAM AINAP AINBM AINBP ADS92XX Differential Source Single-ended Source Differential Source Single-ended Source VOCM THS4552 270pF RFB 270pF RFB 47pF 470pF 47pF RFB = 1k for Gain = 1 or RFB = 4.02k for Gain = 4 Figure 9-4. Data Acquisition (DAQ) Circuit for ≤100kHz Input Signal Bandwidth

9.2.2.1 Design Requirements

Table 9-2 lists the parameters for this typical application. Table 9-2. Design Parameters PARAMETER VALUE SNR ≥ 91dB THD ≤ –110dB Input signal frequency ≤ 100kHz www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 57 Product Folder Links: ADS9217 ADS9218 ADS9219

9.2.2.2 Application Curves

The following figures show the FFT plots for the circuit in Figure 9-4. F r e q u e n c y ( k H z ) Amplitude (dBFS) 0 . 5 1 2 3 4 5 7 1 0 2 0 3 0 5 0 1 0 0 2 0 0 5 0 0 1 0 0 0 5 0 0 0 - 1 8 0 - 1 5 0 - 1 2 0 - 9 0 - 6 0 - 3 0 fIN = 100kHz, SNR = 92dB, THD = –117dB Figure 9-5. Typical FFT at 10MSPS/Channel: ADS9218 F r e q u e n c y ( k H z ) Amplitude (dBFS) 0 . 5 1 2 3 4 5 7 1 0 2 0 3 0 5 0 1 0 0 2 0 0 5 0 0 1 0 0 0 3 0 0 0 - 1 8 0 - 1 5 0 - 1 2 0 - 9 0 - 6 0 - 3 0 fIN = 100kHz, SNR = 92dB, THD = –117dB Figure 9-6. Typical FFT at 5MSPS/Channel: ADS9217

9.2.3 Data Acquisition (DAQ) Circuit for ≤1MHz Input Signal Bandwidth

Figure 9-7 shows a 2-channel solution with minimum external components. This signal-chain significantly reduces signal-chain size by driving the ADS9219 with the THS4541, which enables low-distortion performance with low power over wide signal bandwidth. 47pF VOCM VOCM THS4541 200 200 270pF 47pF ADC ADC VCMOUT AINAM AINAP AINBM AINBP ADS92XX Differential Source Single-ended Source Differential Source Single-ended Source 22pF 22pF 47pF 270pF 47pF 50 22pF 22pF VOCM THS4541 200 200 10 22pF 22pF 22pF 22pF Figure 9-7. Data Acquisition (DAQ) Circuit for ≤1MHz Input Signal Bandwidth ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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9.2.3.1 Design Requirements

Table 9-3 lists the parameters for this typical application. Table 9-3. Design Parameters PARAMETER VALUE SNR ≥ 80dB THD ≤ –100dB Input signal frequency ≤ 1MHz

9.2.3.2 Application Curves

The following figures show the FFT plots for the circuit in Figure 9-7. F r e q u e n c y ( k H z ) Amplitude (dBFS) 0 . 5 1 2 3 4 5 7 1 0 2 0 3 0 5 0 1 0 0 2 0 0 5 0 0 1 0 0 0 5 0 0 0 - 1 8 0 - 1 5 0 - 1 2 0 - 9 0 - 6 0 - 3 0 fIN = 1MHz, SNR = 93.3dB, THD = –104dB Figure 9-8. Typical FFT at 10MSPS/Channel: ADS9218 F r e q u e n c y ( k H z ) Amplitude (dBFS) 0 . 5 1 2 3 4 5 7 1 0 2 0 3 0 5 0 1 0 0 2 0 0 5 0 0 1 0 0 0 3 0 0 0 - 1 8 0 - 1 5 0 - 1 2 0 - 9 0 - 6 0 - 3 0 fIN = 1MHz, SNR = 90.5dB, THD = –104.2dB Figure 9-9. Typical FFT at 5MSPS/Channel: ADS9217 www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 59 Product Folder Links: ADS9217 ADS9218 ADS9219

9.3 Power Supply Recommendations

The ADS921x has three independent power supplies, AVDD_5V and VDD_1V8. The AVDD_5V supply provides power to the ADC driver. The VDD_1V8 provides power to the analog circuits and the digital interface. Set the AVDD_5 and VDD_1V8 supplies independently to voltages within the permissible range. Figure 9-10 shows how to decouple the power supplies. VDD_1V8 (pins 35, 36, and 37) AVDD_5V (pin 1) 0.1 μF1 μF GND (pin 2) AVDD_5V (pin 10) 0.1 μF1 μF GND (pin 9) GND (pins 34 and 38) 0.1 μF 1 μF VDD_1V8 (pins 13 and 14) GND (pins 12 and 15) 0.1 μF 1 μF 1.8V 1.8V Figure 9-10. Power-Supply Decoupling ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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9.4 Layout

9.4.1 Layout Guidelines

Figure 9-11 shows a board layout example for the ADS921x. Avoid crossing digital lines with the analog signal path and keep the analog input signals and the reference signals away from noise sources. Use 0.1 μF ceramic bypass capacitors in close proximity to the analog (AVDD_5V and VDD_1V8), and digital (VDD_1V8) power- supply pins. Avoid placing vias between the power-supply pins and the bypass capacitors. Place the reference decoupling capacitor close to the device REFIO and REFM pins. Avoid placing vias between the REFIO pin and the bypass capacitors. Connect the GND and REFM pins to a ground plane using short, low-impedance paths.

9.4.2 Layout Example

R R R R C C R R R R C C C C VCMOUT REFIO 1V8 1V8 5V 5V Figure 9-11. Example Layout www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 61 Product Folder Links: ADS9217 ADS9218 ADS9219

10 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below.

10.1 Documentation Support

10.1.1 Related Documentation

For related documentation, see the following:

  • Texas Instruments, REF70 2 ppm/°C Maximum Drift, 0.23 ppmp-p 1/f Noise, Precision Voltage Reference, data sheet
  • Texas Instruments, THS4552 Dual-Channel, Low-Noise, Precision, 150-MHz, Fully Differential Amplifier, data sheet
  • Texas Instruments, THS4541 Negative Rail Input, Rail-to-Rail Output, Precision, 850-MHz Fully Differential Amplifier, data sheet

10.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Notifications to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

10.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

10.4 Trademarks

TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.

10.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

10.6 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions. ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (May 2024) to Revision C (April 2025) Page

  • Changed REFIO Voltage vs Temperature, AVDD_5V Current vs Temperature, VDD_1V8 Current vs
  • Added Typical DNL curve and changed THD from −111.5dB to −118dB in condition statement of Typical FFT
  • Changed Register Map Settings for Output Data Interface for the ADS9219 and ADS9218 table and changed
  • Changed IOVDD to VDD_1V8 and Single-Ended Sampling Clock figure and Data Output Latency table in
  • Changed Application Curves section in Data Acquisition (DAQ) Circuit for ≤20kHz Input Signal Bandwidth
  • Changed SNR value from90.6dB to 93.3dB in Typical FFT at 10MSPS/Channel: ADS9218 Changes from Revision A (April 2024) to Revision B (May 2024) Page

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 63 Product Folder Links: ADS9217 ADS9218 ADS9219

12.1 Mechanical Data

www.ti.com PACKAGE OUTLINE C 40X 0.3 0.2 4.7 0.1 40X 0.5 0.3

1 MAX

(0.2) TYP 0.05 0.0036X 0.5 4.5 2X 4.5 A 6.1 5.9 B 6.1 5.9 0.3 0.2 0.5 0.3 VQFN - 1 mm max heightRHA0040C PLASTIC QUAD FLATPACK - NO LEAD 4219053/A 09/2016 PIN 1 INDEX AREA 0.08 C SEATING PLANE 10 21 11 20 40 31 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 EXPOSED THERMAL PAD DETAIL SEE TERMINAL SYMM SYMM NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. OPTIONAL TERMINAL SCALE 2.200 DETAIL TYPICAL ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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www.ti.com EXAMPLE BOARD LAYOUT

0.07 MIN

0.07 MAX

40X (0.25) 40X (0.6) ( 0.2) TYP VIA 36X (0.5) (5.8) (5.8) ( 4.7) (R0.05) TYP (1.5) (1.35) (0.75) TYP 4X (1.35) (0.75) TYP 4X (1.5) VQFN - 1 mm max heightRHA0040C PLASTIC QUAD FLATPACK - NO LEAD 4219053/A 09/2016 SYMM 11 20 3140 SYMM LAND PATTERN EXAMPLE SCALE:12X NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED METAL SOLDER MASK OPENING NON SOLDER MASK SOLDER MASK DETAILS DEFINED (PREFERRED) www.ti.com ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 65 Product Folder Links: ADS9217 ADS9218 ADS9219

www.ti.com EXAMPLE STENCIL DESIGN 40X (0.6) 40X (0.25) 36X (0.5) (5.8) (5.8) 9X ( 1.3) (1.5) TYP (1.5) TYP (R0.05) TYP VQFN - 1 mm max heightRHA0040C PLASTIC QUAD FLATPACK - NO LEAD 4219053/A 09/2016 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SYMM METAL TYP BASED ON 0.125 mm THICK STENCIL SOLDER PASTE EXAMPLE EXPOSED PAD 41: 69% PRINTED SOLDER COVERAGE BY AREA SCALE:15X SYMM 11 20 3140 ADS9217, ADS9218, ADS9219 SBASA74C – JANUARY 2023 – REVISED APRIL 2025 www.ti.com

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www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) ADS9217RHAR Active Production VQFN (RHA) | 40 2500 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -40 to 125 ADS9217 ADS9218RHAR Active Production VQFN (RHA) | 40 2500 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -40 to 125 ADS9218 ADS9218RHAR.A Active Production VQFN (RHA) | 40 2500 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -40 to 125 ADS9218 ADS9219RHAR Active Production VQFN (RHA) | 40 4000 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -40 to 125 ADS9219 ADS9219RHAR.A Active Production VQFN (RHA) | 40 4000 | LARGE T&R Yes NIPDAU Level-3-260C-168 HR -40 to 125 ADS9219 PADS9219RHAR Active Preproduction VQFN (RHA) | 40 4000 | LARGE T&R - Call TI Call TI -40 to 125 PADS9219RHAR.A Active Preproduction VQFN (RHA) | 40 4000 | LARGE T&R - Call TI Call TI -40 to 125 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1

www.ti.com 23-May-2025 Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 4-Jun-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 4-Jun-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ADS9217RHAR VQFN RHA 40 2500 367.0 367.0 35.0 ADS9218RHAR VQFN RHA 40 2500 367.0 367.0 35.0 ADS9219RHAR VQFN RHA 40 4000 367.0 367.0 35.0 Pack Materials-Page 2

www.ti.com GENERIC PACKAGE VIEW This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details. VQFN - 1 mm max heightRHA 40 PLASTIC QUAD FLATPACK - NO LEAD6 x 6, 0.5 mm pitch 4225870/A

www.ti.com PACKAGE OUTLINE C 40X 0.3 0.2 4.5 0.1 40X 0.5 0.3 (0.2) TYP 0.05 0.0036X 0.5 4.5 2X 4.5 A 6.1 5.9 B 6.1 5.9 0.3 0.2 0.5 0.3 (0.1) VQFN - 1 mm max heightRHA0040H PLASTIC QUAD FLATPACK - NO LEAD 4219055/B 08/22/2019 PIN 1 INDEX AREA 0.08 C SEATING PLANE 10 21 11 20 40 31 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 EXPOSED THERMAL PAD DETAIL SEE TERMINAL SYMM SYMM NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SEE SIDE WALL DETAIL SCALE 2.200 DETAIL OPTIONAL TERMINAL TYPICAL SIDE WALL DETAIL OPTIONAL METAL THICKNESS

www.ti.com EXAMPLE BOARD LAYOUT 40X (0.25) 40X (0.6) ( 0.2) TYP VIA 36X (0.5) (5.8) (5.8) ( 4.5) (R0.05) TYP (1.46) (1.27) (0.73) TYP 4X (1.27) (0.73) TYP 4X (1.46) VQFN - 1 mm max heightRHA0040H PLASTIC QUAD FLATPACK - NO LEAD 4219055/B 08/22/2019 SYMM 11 20 3140 SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:12X NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METALMETAL SOLDER MASK OPENING SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED) EXPOSED METAL

www.ti.com EXAMPLE STENCIL DESIGN 40X (0.6) 40X (0.25) 36X (0.5) (5.8) (5.8) 9X ( 1.26) (1.46) TYP (1.46) TYP (R0.05) TYP VQFN - 1 mm max heightRHA0040H PLASTIC QUAD FLATPACK - NO LEAD 4219055/B 08/22/2019 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SYMM METAL TYP SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 41: 70% PRINTED SOLDER COVERAGE BY AREA SCALE:15X SYMM 11 20 3140

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