ADN9A2 DFI | Alldatasheet
Document overview
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Technical content
100M/1000M/2.5Gbps
4 PCIe x1, 1 SMBus,
C, 1 eMMC 2 USB 3.2, 8 USB 2.0 ADN9A2 Intel Atom Processor LPDDR5 Top View Bottom View
www.dfi.com MECHANICAL DRAWING BLOCK DIAGRAM Alder Lake -N series 35x24mm, BGA1264 TDP 6W - 15W eDP/DP DP++ USB 3.2 P1/P2 PCIe_LANE 1~4 USB2.0_Port 1~8 HDA Bus SPI BUS PICMG COM.0 Rev 3.1 Type-10 IMVP 9.1DDI_A DDI_B PTN3460 LVDS 24biteDP/LVDS DDI 0 USBSS P0/P1 TCP0/TCP1 PCIe_LANE 0~3 HSIO Lane 0~3 PCIE 3.0 Lane 72.5GLAN I226LM/IT MDIGLAN1 HSIO Lane 6 USB P0~7 HDA SPI USB 2.0 Port 1~8 HDA SPI TPM 2.0 SPI Flash BIOS (256M bit) eSPI to LPC Bridge F85227N eSPI BUS eSPI UART 0/1 LPC BUS LPC Embedded Controller IT5782VG-I Serial Port 1/2 SLP/LID BTN UART0/1 CAN1 Serial port1 Serial port2(CAN option) WDT Fan PWM/TACH_IN CMOS Backup EEPROM I2C BUS SMBUS I2C BUS I2C BUS SNDW SNDW (Optional) SNDW0 eMMC SMBUS GSPI2 SMBUS SMBUS I2C BUS 8bit DIO [4bit in, 4bit out] GSPI GSPI Bus GPIOGPIO 8bit MEMORY DOWN 8GB & 16GB Channel A Channel B LPDDR5 x32 LPDDR5 x32 LPDDR5 x32 LPDDR5 x32 eMMC 5.1 8G/16G/32G/64G/128G (Optional) eMMC 5.1 Bus SATA Gen3 0/1SATA 0/1 HSIO Lane 10/11 (OPTION) (OPTION) COM Express Row A/B (Type10) DC-Input +4.75V~+20V S/W S/W Limit H=7mm TOP BOTTOM Limit H=3.5mm 16.50
www.dfi.com PACKING LIST OPTIONAL ITEMS
ORDERING INFORMATION
Model Name P/N CPU Memory eMMC LVDS/eDP TPM 2.0 Thermal Operating Temp. ADN9A2-BC16-7425E 770-ADN9A21-100G Intel Atom Processor x7425E, 4 Cores, 12W 16GB 64GB LVDS N/A Heat Sink 0 to 60°C ADN9A2-BC86-N305 770-ADN9A21-300G Intel Core i3 Processor N305, 8 Cores, 9/15W 8GB 64GB LVDS N/A Heat Sink 0 to 60°C ADN9A2-BC86-N50 770-ADN9A21-600G Intel Processor N200, 2 Cores, 6W 8GB 64GB eDP N/A Heat Sink 0 to 60°C Heat Sink A71-008356-000G Heat Spreader A71-808364-000G COM335 Carrier Board Kit 770-CM3351-000G DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your sales representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © September 17, 2024 DFI Inc. SPECIFICATION SYSTEM Processor Intel Atom x7000E / Core-i / Pentium / Celeron series processors (Code Name : Alder Lake-N) Intel Atom Processor x7425E, 4 Cores, 1.5~3.4GHz, 12W Intel Atom Processor x7213E, 2 Cores, 1.7~3.2GHz, 10W Intel Atom Processor x7211E, 2 Cores, 1.0~3.2GHz, 6W Intel Processor Core i3-N305, 8 Cores, 1.0/1.8~3.8GHz, 9/15W Intel Processor N200, 4 Cores, 1.0~3.7GHz, 6W Intel Processor N97, 4 Cores, 2.0~3.6GHz, 12W Intel Processor N50, 2 Cores, 1.0~3.4GHz, 6W Memory LPDDR5 up to 16GB Dual Channel LPDDR5 4800MHz 8GB/16GB supported by project basis. In-band ECC (IBECC) Supported by all CPU SKUs BIOS AMI SPI 256Mbit GRAPHICS Controller Intel UHD Feature Open GL 4.6, DirectX 12.1 Vulkan 1.2 (Windows) Mesa 3D, Open GL 4.6, Vulkan 1.2 (Linux) HW Decode: 4K60 10b 4:2:0, 4:4:4 HEVC/VP9/SCC, 4K60 10b 4:2:0 AV1 HW Encode: 4K60 10b 4:2:0, 4:4:4 HEVC/VP9/SCC Display 1 x DDI 1 x LVDS/eDP LVDS: single channel 24-bit, resolution up to 1920x1200 @ 60Hz eDP: resolution up to 4096x2160 @ 60Hz HDMI: resolution up to 4096x2160 @ 30Hz DP++: resolution up to 4096x2160 @ 60Hz, 3840x2160 @60Hz Dual Displays DDI + LVDS/eDP EXPANSION Interface 4 x PCIe x1 (Gen 3) 1 x I C 1 x SMBus 1 x LPC 1 x SNDW (available upon request) 1 x GSPI 2 x UART (TX/RX) AUDIO Interface HD Audio ETHERNET Controller 1 x Intel I226-IT / I226-LM (10/100/1000Mbps/2.5Gbps) I/O USB 2 x USB 3.2 Gen2 8 x USB 2.0 SATA 2 x SATA 3.0 (up to 6Gb/s) eMMC 1 x 8GB/16GB/32GB/64GB/128GB eMMC 5.1 (available upon request) DIO 1 x 8-bit DIO WATCHDOG TIMER Output & Interval System Reset, Programmable via Software from 1 to 255 Seconds SECURITY TPM dTPM or fTPM (Optional) POWER Type 4.75V~20V, 5VSB, VCC_RTC (ATX mode) 4.75V~20V, VCC_RTC (AT mode) Consumption TBD OS SUPPORT OS Support (UEFI Only) Windows 11/10 IoT Enterprise 64-bit Linux ENVIRONMENT Temperature Operating: -5 to 65°C Storage: -40 to 85°C Humidity Operating: 5 to 90% RH Storage: 5 to 90% RH MTBF TBD MECHANISM Dimensions COM Express Mini 84mm (3.3") x 55mm (2.16") Compliance PICMG COM Express R3.1, Type 10 STANDARDS AND CERTIFICATIONS Certifications CE, FCC