ADN2843 AD | Alldatasheet
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Technical content
10.709 Gbps Laser Diode
REV. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective companies. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 © 2003 Analog Devices, Inc. All rights reserved. FUNCTIONAL BLOCK DIAGRAM MPD VCC IMPD IMPD2 GND MODE ALS ERSET PSET IDTONE ADN2844 IMPDMON IMPDMON2 IMMON IBMON FAIL DEGRADE GND GND GND ERCAP PAVCAP GND CONTROL IBIAS_CTRL D_IMOD IMOD_CTRL VCC VCC DATAP DATAN VCC VCC ADN2843 ADN2845 IMODN GND IBIAS ALS *ADN2850 OR ADN2860 OPTICAL SUPERVISOR LD GND IMODP ASET
FEATURES
Data Rates from 9.952 Gbps to 10.709 Gbps Typical Rise/Fall Time 25 ps/23 ps Bias Current Range 3 mA to 80 mA Modulation Current Range 5 mA to 80 mA Monitor Photodiode Current 50 /H9262A to 1200 /H9262A Closed-Loop Control of Both Average Optical Power and Extinction Ratio Laser Fail and Laser Degrade Alarms Automatic Laser Shutdown, ALS Dual MPD Functionality for Wavelength Control CML Data Inputs 50 /H9024 Internal Data Terminations
3.3 V Single-Supply Operation
Driver Supplied in Dice Format
APPLICATIONS
SONET OC-192, SDH STM-64 Supports 10.667 Gbps and 10.709 Gbps FEC Rates 10 Gb Ethernet IEEE802.3ae GENERAL DESCRIPTION The ADN2943 chipset consists of two components, the ADN2845 and the ADN2844. The ADN2845 is a 10.709 Gbps laser diode driver. The ADN2845 eliminates the need to ac couple since it can deliver 80 mA of modulation while dc coupled to the laser diode. It is intended to be copackaged with the laser to minimize bond lengths, which improves p erformance of the optical transmitter. For transmission line applications, contact HSN Application Group at fiberoptic.ic@analog.com. The ADN2844 offers a unique control loop algorithm and pro- vides dual loop control of both average power and extinction ratio. Programmable alarms are provided for laser fail (end of life) and laser degrade (impending fail). Both the ADN2844 and the ADN2845 are available as bare die. The ADN2844 is also available in 5 mm ¥ 5 mm 32-lead LFCSP. a
REV. 0–2– ADN2843–SPECIFICATIONS (VCC = 3.0 V to 3.6 V, All specifications T MIN to TMAX, unless otherwise noted. Typical values as specified at 25 /H11543C.) Parameter Min Typ Max Unit Conditions LASER BIAS (BIAS) Output Current I BIAS 38 0 m A Compliance Voltage 1.2 V CC – 1.0 V IBIAS during ALS 10 /H9262A See Note 1 ALS Shutdown Response Time 10 /H9262s MODULATION CURRENT (IMODP, IMODN) See Note 2 Output Current I MOD 58 0 m A Compliance Voltage 1.2 V CC V IMOD during ALS 10 /H9262A Rise Time 25 ps Fall Time 23 ps Random Jitter 170 fs rms See Note 3 Total Jitter 7.41 ps p-p See Note 4 POWER SET INPUT (PSET) External Capacitance 80 pF See Note 5 Voltage 1.15 1.35 V EXTINCTION RATIO SET INPUT (ERSET) Allowable Resistance Range 1.5 25 k /H9024 Voltage 1.15 1.35 V ALARM SET (ASET) Allowable Resistance Range 1.2 13.2 k /H9024 Voltage 1.15 1.35 V Hysteresis 5 % CONTROL LOOP Time Constant 0.22 s DATA INPUTS (DATAP, DATAN) V p-p (Single-Ended Peak-to-Peak) 300 800 mV Input Impedance (Single-Ended) 50 /H9024 LOGIC INPUTS (ALS, MODE) VIH 2.4 V VIL 0.8 V ALARM OUTPUTS (Internal 30 k to V CC) VOH 2.4 V VOL 0.4 V IDTONE fIN 10 1000 kHz Input Current Range 50 4000 /H9262A Voltage on IDTONE V CC – 2 V MONITOR PD (MPD, MPD2) Current 50 1200 /H9262A Input Voltage 1.65 V IBMON, IMMON, IMPDMON, IMPDMON2 IBMON, IMMON Division Ratio 100 A/A IMPDMON, IMPDMON2 1 A/A IMPDMON to IMPDMON2 Matching 2 % Measured at 1200 /H9262A Compliance Voltage 0 V CC – 1.5 V SUPPLY VCC 3.0 3.3 3.6 V ICC (ADN2844) 36 mA See Note 6 ICC (ADN2845) 75 mA See Note 6 NOTES 1In ALS mode current is sourced to the laser from the I BIAS pin, which reverse biases the laser. 2The ADN2845 high speed specifications are measured into a 5 /H9024 load. 3RMS jitter measured with a 0000 0000 1111 1111 repeating pattern at 10.7 Gbps rate. 4Peak-to-peak total jitter measured with a 2 13 – 1 PRBS with 80 CIDs pattern at 10.7 Gbps rate. 5Max capacitance refers to capacitance of photodiode and other parasitic capacitance. 6IBIAS = 0, IMOD = 0 (when ALS is asserted). See Power Dissipation section on page 7 for calculation of complete power dissipation. Specifications subject to change without notice.
REV. 0 ADN2843 –3– ABSOLUTE MAXIMUM RATINGS * (TA = 25°C, unless otherwise noted.) Operating Temperature Range Junction Temperature (T *Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADN2843 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. ORDERING GUIDE Temperature Package Model Range Option ADN2843CHIPSET –40°C to +85°C ADN2844 Control Loop: 32-Lead LFCSP ADN2845 Data Switch: Dice ADN2843CHIPSET-B –40°C to +85°C ADN2844 Control Loop: Dice ADN2845 Data Switch: Dice EVAL-ADN2843 Evaluation Board ADN2844 METALLIZATION PHOTOGRAPH GND VCC MODE 2390/H9262m 3000/H9262m ERCAP PAVCAP GND GND GND GND GND DEGRADE FAIL ALS IMMON IBMON IDTONE GND PSET ERSET ASET IMPD IMPDMON IMPDMON2 IMPD2 GND GND GND GND VCC IBIAS_CTRL IMOD_CTRL D_IMOD
REV. 0–4– ADN2843 PIN CONFIGURATIONS ADN2845 METALLIZATION PHOTOGRAPH GNDVCC VCC VCC NC NC IMODP IBIAS GNDIBIAS_CTRLALS IMOD_CTRL GND DATAP GND DATAN 1340/H9262m (/H1155020/H9262m) 1140/H9262m (/H1155020/H9262m) NC VCC (IMODN TERM) IMPD ASET GND PSET IMPD2 ERSET MODE PAVCAP GND GND GND ERCAP GND VCC D_IMOD VCC IBIAS_CTRL GND GND GND IMOD_CTRL GND FAIL IDTONE ALS IMMON DEGRADE GND GND IBMON IMPDMON IMPDMON2 32 31 30 29 28 27 26 25 91 0 1 1 1 2 13 14 15 16 ADN2844 BOND PAD SIZE: >115/H9262m BOND PAD PITCH: >104/H9262m DIE SIZE: 3000/H9262m /H11547 2390/H9262m DATAN GND NC DATAP GND VCC (IMODN TERM) NC IMODP NC IBIAS VCC GND ALS IMOD_CTRL IBIAS_CTRL GND ADN2845 PAD PITCH: 200/H9262m MAXIMUM DIE SIZE: 1.16mm /H11547 1.36mm DIE THICKNESS: 0.25mm SINGLE P AD SIZE: 92/H9262m /H11547 92/H9262m DOUBLE P AD SIZE: 151/H9262m /H11547 92/H9262m VCC VCC
REV. 0 ADN2843 –5– ADN2844 PIN FUNCTION DESCRIPTIONS Pin No. Mnemonic Function 1 ASET Alarm Current Threshold Set (Should be Terminated with a 1.2 k /H9024 Resistor when Not Used)
2 ERSET Extinction Ratio Current Set
3 PSET Average Optical Power Set
5 IMPD Monitor Photodiode Current Input (Tie to GND when Not in Use)
6I MPDMON Mirrored Current from IMPD (Tie to V CC when Not in Use)
7 IMPDMON2 M irrored Current from IMPD2 (For Optional Use with Two MPDs, Tie to V CC when Not in Use)
8I MPD2 Optional Second MPD Current Input (Tie to GND when Not in Use) 9G ND Negative Supply
10 V CC Positive Supply
11 ERCAP Extinction Ratio Loop Capacitor
12 PAVCAP Average Power Loop Capacitor
13 MODE Control Loop Operating Mode Logic Input (Should Not Be Left Floating)
14, 15, 17 GND N egative Supply 18, 31, 32 GND Negative Supply
16 GND Negative Supply
19 DEGRADE DEGRADE Alarm Output, Open Collector, Active High
20 FAIL FAIL Alarm Output, Open Collector, Active High
21 ALS Automatic Laser Shutdown Logic Input (Should Not Be Left Floating)
22 IMMON Modulation Current Mirror Output, Current Source from V
23 IBMON Bias Current Mirror Output, Current Source from V CC
24 IDTONE ID Tone Input Current (Tie to V CC when Not in Use)
25 GND Negative Supply
27 IBIAS_CTRL C ontrol Output Current Sink
28 GND Negative Supply
29 IMOD_CTRL Control Output Current Sink
30 D_IMOD Control Output Current Sink
ADN2845 PIN FUNCTION DESCRIPTIONS Pin No. Mnemonic Function
1 DATAN AC-Coupled CML Data, Negative Differential Terminal
3, 13 NC No Connect, Leave Floating 4G ND Negative Supply
5 DATAP AC-Coupled CML Data, Positive Differential Terminal
6 ALS Automatic Laser Shutdown Logic Input
7 IMOD_CTRL M odulation Current Control Input (Control Circuit Sinks IMOD/10 from Pin to GND)
8I BIAS_CTRL BIAS Current Control Input (Control Circuit Sinks IBIAS/10 from Pin to GND) 9G ND Negative Supply
10 NC No Connect, Leave Floating
11 IBIAS BIAS Current
12 IMODP Modulation Current
CC VCC Connection for IMODN Termination Resistor
15 GND Negative Supply
16–18 V CC Positive Supply
beyond the threshold current, referred to as the slope efficiency, LI. Figure 1. Laser Transfer Function current and light-to-current slope efficiency. a constant average power over time and temperature. research and development time and second sourcing issues. The ADN2843 dual-loop control has two modes of operation. should be configured in Mode B (see Figure 4). where IAV is average MPD current. RPSET is again adjusted to re-establish the desired average power. environmental conditions and time. /H9024 or an RC >1000 s, whichever is lowest. alarm will be raised at 90% of the FAIL threshold.
- B est high frequency board layout techniques including power and ground planes should be used.
- To minimize inductance, keep the connections between the ADN2845 and the laser diode as short as possible. Inductances <0.3 nH are recommended for best performance. Critical bonds are IMODP and V CC (Pin 14). Ribbon bonding can be used to reduce bond inductance. Minimize bond lengths for ADN2845 pads to achieve low inductance.
- P lace bypass capacitor on laser anode as close to laser as possible.
- B ypass capacitors should be placed as close as possible to V CC pads.
- 50 /H9024 controlled impedance interconnects should be used on the DATA inputs.
- P arasitic capacitance on IBIAS_CTRL and IMOD_CTRL interconnects should be less than 100 pF. If decoupling caps are used on IBIAS_CTRL and IMOD_CTRL, they should be tied to V CC rather than GND.
- An inductor should be used in the bias current path. A Microwave Components coil 30-1847-GCCAS-01 (48 mil /H11003 24 mil) should be used.
- T he recommended substrate connection is to GND. However, the performance is not affected by connecting the substrate to V CC. 22nF 10nF GND GND ERCAP PAVCAP MODE GND GND GND VCC D_IMOD IMOD_CTRL GND IBIAS_CTRLIDTONE IBMON IMMON ALS FAIL DEGRADE GND ASET ERSET PSET GND IMPD IMPDMON IMPDMON2 ADN2844 GND 32 25 IMPD2 GND DATAN GND NC GND DATAP IMODNTERM NC IMODP IBIAS ALS GND VCC VCC VCC GND ADN2845 IMOD_CTRL IBIAS_CTRL 1518 10nF 10k/H9024 1k/H9024 1k/H9024 22nF GND VCC 9 16 VCC 10nF 10nF 100/H9262F TANTALUM VCC 10nF VCC MPD 10nF VCC VCC 10nF VCCNOTES *FOR DIGITAL PROGRAMMING, THE ADN2850 OR ADN2860 OPTICAL SUPERVISOR CAN BE USED. OPTIONAL MONITORING OF CURRENTS. 1k/H9024 NC ** VCCVCCVCCVCC VCC
Figure 3. ADN2843 Application Circuit (Mode A)
*FOR DIGITAL PROGRAMMING, THE ADN2850 OR ADN2860 OPTICAL SUPERVISOR CAN BE USED. **OPTIONAL MONITORING OF CURRENTS. Figure 4. ADN2843 Application Circuit (Mode B)
REV. 0 ADN2843 –11– DIE PAD COORDINATES (With Origin in the Center of the Die) ADN2844 Pad Number Pad Name X ( /H9262m) Y ( /H9262m) 1 ASET 1014.00 –1019.00 2 ERSET 769.00 –1019.00 3 PSET 486.00 –1019.00 4 GND 186.00 –1019.00 5I MPD –132.00 –1019.00 6 IMPDMON –479.00 –1019.00 7 IMPDMON2 –811.00 –1019.00 8 IMPD2 –1056.00 –1019.00 9 GND –1339.00 –877.00 10 V CC –1339.00 –672.00 11 ERCAP –1339.00 –429.00 12 PAVCAP –1339.00 –204.00 13 MODE –1339.00 91.00 14 GND –1339.00 335.00 15 GND –1339.00 580.00 16 GND –1339.00 824.00 17 GND –1051.00 1019.00 18 GND –761.00 1019.00 19 DEGRADE –476.00 1019.00 20 FAIL –207.00 1019.00 21 ALS 102.00 1019.00 22 IMMON 387.00 1019.00 23 IBMON 653.00 1019.00 24 IDTONE 904.00 1019.00 25 GND 1359.00 995.00 26 V CC 1359.00 781.00 27 IBIAS_CNTRL 1359.00 523.00 28 GND 1359.00 317.00 29 IMOD_CTRL 1359.00 –29.00 30 D_IMOD 1359.00 –294.00 31 GND 1359.00 –562.00 32 GND 1359.00 –807.00 ADN2845 Pad Number Pad Name X ( /H9262m) Y ( /H9262m) 1 DATAN –500.00 400.00 2 GND* –500.00 222.00 3N C –500.00 0.00 4 GND* –500.00 –222.00 5 DATAP –500.00 –400.00 6 ALS –300.00 –600.00 7I MOD_CTRL –100.00 –600.00 8 IBIAS_CTRL 100.00 –600.00 9 GND* 300.00 –600.00 10 NC * 500.00 –400.00 11 IBIAS 500.00 –200.00 12 IMODP * 500.00 –30.00 13 NC * 500.00 178.00 14 V CC (IMODN)* 500.00 378.00 15 GND * 300.00 600.00 16 V CC* 100.00 600.00 17 V CC* –100.00 600.00 18 V CC* –300.00 600.00 *Denotes double bond pad.
REV. 0 C02764–0–4/03(0) –12– ADN2843 OUTLINE DIMENSIONS 32-Lead Lead Frame Chip Scale Package [LFCSP] 5 mm /H11547 5 mm (CP-32) Dimensions shown in millimeters COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2 0.30 0.23 0.18
0.20 REF
0.80 MAX
0.65 NOM
0.05 MAX
0.02 NOM
1.00 0.90 0.80 SEATING PLANE COPLANARITY 0.08 132 1617 BOTTOM VIEW 0.50 0.40 0.30 3.50 REF 0.50 BSC PIN 1 INDICATOR TOP VIEW 5.00 BSC SQ 4.75 BSC SQ SQ 3.25 3.10 2.95 PIN 1 INDICATOR
0.60 MAX
Exposed paddle should be soldered to the most negative supply of the ADN284 (ADN2844 also available as bare die)