ADM1032 ONSEMI | Alldatasheet
Document overview
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Technical content
Features
- On−Chip and Remote Temperature Sensing
- Offset Registers for System Calibration
- 0.125°C Resolution/1°C Accuracy on Remote Channel
- 1°C Resolution/3°C Accuracy on Local Channel
- Fast (Up to 64 Measurements Per Second)
- 2−Wire SMBus Serial Interface
- Supports SMBus Alert
- Programmable Under/Overtemperature Limits
- Programmable Fault Queue
- Overtemperature Fail−Safe THERM Output
- Programmable THERM Limits
- Programmable THERM Hysteresis
- 170 /C0109A Operating Current
- 5.5 /C0109A Standby Current
- 3.0 V to 5.5 V Supply
- Small 8−Lead SOIC and MSOP Packages
- These are Pb−Free Devices
Applications
- Desktop and Notebook Computers
- Smart Batteries
- Industrial Controllers
- Telecommunications Equipment
- Instrumentation
- Embedded Systems MARKING DIAGRAMS http://onsemi.com PIN ASSIGNMENT VDD GND ALERT THERM (Top View) SCLK SDATA See detailed ordering and shipping information in the package dimensions section on page 16 of this data sheet.
ORDERING INFORMATION
MSOP−8 CASE 846AB SOIC−8 CASE 751 1032AR #YWW XXXX T1x = Refer to Order Info Table A = Assembly Location Y = Year W = Work Week /C0071= Pb−Free Package T1x AYW/C0071 /C0071 1032AR #YWW Marking #2Marking #1 # = Pb −Free Package Y = Year W = Work Week XX = Assembly Lot (Note: Microdot may be in either location)
Figure 1. Functional Block Diagram NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.
http://onsemi.com PIN ASSIGNMENT Pin No. Mnemonic Description 1 VDD Positive Supply, 3.0 V to 5.5 V. 2 D+ Positive Connection to Remote Temperature Sensor. 3 D− Negative Connection to Remote Temperature Sensor. 4 THERM THERM is an open−drain output that can be used to turn a fan on/off or throttle a CPU clock in the event of an overtemperature condition. Requires pullup to VDD, the same supply as the ADM1032. Note: Please refer to Power Sequencing Considerations; THERM Pin Pullup on page 15 for more information. 5 GND Supply Ground Connection. 6 ALERT Open−Drain Logic Output Used as Interrupt or SMBus Alert. 7 SDATA Logic Input/Output, SMBus Serial Data. Open−drain output. Requires pullup resistor. 8 SCLK Logic Input, SMBus Serial Clock. Requires pullup resistor.
ELECTRICAL CHARACTERISTICS
Parameter Conditions Min Typ Max Unit Power Supply Supply Voltage, VDD 3.0 3.30 5.5 V Average Operating Supply Current, ICC 0.0625 conversions/sec rate (Note 1) 170 215 /C0109A Standby mode 5.5 10 /C0109A Undervoltage Lockout Threshold VDD input, disables ADC, rising edge 2.35 2.55 2.8 V Power−On Reset Threshold 1.0 2.4 V Temperature−To−Digital Converter Local Sensor Accuracy 0 ≤ TA ≤ 100°C, VCC = 3 V to 3.6 V ±1 ±3 °C Resolution 1.0 °C Remote Diode Sensor Accuracy 60°C ≤ TD ≤ 100°C, VCC = 3 V to 3.6 V ±1 °C Resolution 0.125 °C Remote Sensor Source Current High level (Note 2) 230 /C0109A Low level (Note 2) 13 /C0109A Conversion Time From stop bit to conversion complete Both channels: one−shot mode with averaging switched on 35.7 142.8 ms One−shot mode with averaging off (that is, conversion rate = 32 or 64 conversions per second) 5.7 22.8 ms Open−Drain Digital Outputs (THERM, ALERT) Output Low Voltage, VOL IOUT = −6.0 mA (Note 2) 0.4 V High Level Output Leakage Current, IOH VOUT = VDD (Note 2) 0.1 1.0 /C0109A Serial Bus Timing (Note 2) Logic Input High Voltage, VIH SCLK, SDATA VDD = 3.0 V to 5.5 V 2.1 V Logic Input Low Voltage, VIL VDD = 3.0 V to 5.5 V 0.8 V Hysteresis SCLK, SDATA 500 mV 1. See Table 6 for information on other conversion rates. 2. Guaranteed by design, not production tested. 3. The SMBus timeout is a programmable feature. By default, it is not enabled. Details on how to enable it are available in the Serial Bus Interface section.
http://onsemi.com Parameter UnitMaxTypMinConditions Serial Bus Timing (Note 2) SDATA Output Low Sink Current SDATA forced to 0.6 V 6.0 mA ALERT Output Low Sink Current ALERT forced to 0.4 V 1.0 mA Logic Input Current, IIH, IIL −1.0 +1.0 /C0109A Input Capacitance, SCLK, SDATA 5.0 pF Clock Frequency 400 kHz SMBus Timeout (Note 3) 25 64 ms SCLK Clock Low Time, tLOW tLOW between 10% points 1.3 /C0109s SCLK Clock High Time, tHIGH tHIGH between 90% points 0.6 /C0109s Start Condition Setup Time, tSU:STA 600 ns Start Condition Hold Time, tHD:STA Time from 10% of SDATA to 90% of SCLK 600 ns Stop Condition Setup Time, tSU:STO Time from 90% of SCLK to 10% of SDATA 600 ns Data Valid to SCLK Rising Edge Time, tSU:DAT Time for 10% or 90% of SDATA to 10% of SCLK 100 ns Data Hold Time, tHD:DAT 300 ns Bus Free Time, tBUF Between start/stop condition 1.3 /C0109s SCLK, SDATA Rise Time, tR 300 ns SCLK, SDATA Fall Time, tF 300 ns 1. See Table 6 for information on other conversion rates. 2. Guaranteed by design, not production tested. 3. The SMBus timeout is a programmable feature. By default, it is not enabled. Details on how to enable it are available in the Serial Bus Interface section. Figure 2. Diagram for Serial Bus Timing
format is shown in Table 1 and Table 2. into the local and remote high and low limit registers. Table 1. Temperature Data Format (Local Table 2. Extended Temperature Resolution (Remote further details are given in Table 3 to Table 7. because its register address is 00h. accuracy on this channel, these offsets must be removed. and has no effect if nothing is written to them. Table 3. Sample Offset Register Codes is set when the remote sensor is open circuit. interrupt latch is set and the ALERT output goes low.
register bits are reset and the THERM output goes high. Table 4. Status Register Bit Assignments
7 BUSY 1 When ADC Converting
6 LHIGH
1 When Local High Temp Limit Tripped
5 LLOW
1 When Local Low Temp Limit Tripped
4 RHIGH
1 When Remote High Temp Limit
3 RLOW
1 When Remote Low Temp Limit
2 OPEN
1 When Remote Sensor Open−Circuit
1 RTHRM 1 When Remote THERM Limit Tripped
0 LTHRM1 1 When Local THERM Limit Tripped
- These flags stay high until the status register is read, or they are reset
and THERM O/Ps are also active in standby mode. is enabled. If Bit 7 is set to 1, the output is disabled. Table 5. Configuration Register Bit Assignments
7 MASK1 0 = ALERT Enabled
6 RUN/
Table 6. Conversion Rate Register Codes registers can be written to and read back over the SMBus. any value after powerup (Reg 0x21h). standby mode, after which the device returns to standby.
Table 7. Consecutive ALERT Register Codes NOTE: x = don’t care bits, and y = SMBus timeout bit. Default = 0. See SMBus section for more information. Control of the ADM1032 is carried out via the serial bus. under the control of a master device. Table 8. List of ADM1032 Registers
00 Not Applicable Local Temperature Value 0000 0000 (00h)
01 Not Applicable External Temperature Value High Byte 0000 0000 (00h)
02 Not Applicable Status Undefined
10 Not Applicable External Temperature Value Low Byte 0000 0000
matter what data is written to it. over the bus, the slave device with that address responds. however, that address is Hex 4D (1001 101).
- The master initiates data transfer by establishing a
http://onsemi.com direction of the data transfer, that is, whether data is written to or read from the slave device. The peripheral whose address corresponds to the transmitted address responds by pulling the data line low during the low period before the ninth clock pulse, known as the acknowledge bit. All other devices on the bus now remain idle while the selected device waits for data to be read from or written to it. If the R/W bit is a 0, the master writes to the slave device. If the R/W bit is a 1, the master reads from the slave device. 2. Data is sent over the serial bus in sequences of nine clock pulses, eight bits of data followed by an acknowledge bit from the slave device. Transitions on the data line must occur during the low period of the clock signal and remain stable during the high period, since a low−to−high transition when the clock is high can be interpreted as a STOP signal. The number of data bytes that can be transmitted over the serial bus in a single read or write operation is limited only by what the master and slave devices can handle. 3. When all data bytes are read or written, stop conditions are established. In write mode, the master pulls the data line high during the 10th clock pulse to assert a STOP condition. In read mode, the master device overrides the acknowledge bit by pulling the data line high during the low period before the ninth clock pulse. This is known as no acknowledge. The master then takes the data line low during the low period before the 10th clock pulse, and high during the 10th clock pulse to assert a STOP condition. Any number of bytes of data can be transferred over the serial bus in one operation, but it is not possible to mix read and write in one operation because the type of operation is determined at the beginning and cannot subsequently be changed without starting a new operation. In the case of the ADM1032, write operations contain either one or two bytes, while read operations contain one byte and perform the following functions. To write data to one of the device data registers or read data from it, the address pointer register must first be set so that the correct data register is addressed. The first byte of a write operation always contains a valid address that is stored in the address pointer register. If data is written to the device, the write operation contains a second data byte that is written to the register selected by the address pointer register. This is illustrated in Figure 13. The device address is sent over the bus followed by R/W set to 0. This is followed by two data bytes. The first data byte is the address of the internal data register to be written to, which is stored in the address pointer register. The second data byte is the data to be written to the internal data register. When reading data from a register, there are two possibilities:
- If the address pointer register value is unknown or not the desired value, it is first necessary to set it to the correct value before data can be read from the desired data register. This is done by performing a write to the ADM1032 as before, but only the data byte containing the register read address is sent because data is not to be written to the register. This is shown in Figure 14. A read operation is then performed consisting of the serial bus address, R/W bit set to 1, followed by the data byte read from the data register. This is shown in Figure 15.
- If the address pointer register is known to be at the desired address already, data can be read from the corresponding data register without first writing to the address pointer register and Figure 14 can be omitted. Notes Although it is possible to read a data byte from a data register without first writing to the address pointer register, if the address pointer register is already at the correct value, it is not possible to write data to a register without writing to the address pointer register. The first data byte of a write is always written to the address pointer register. Don’t forget that some of the ADM1032 registers have different addresses for read and write operations. The write address of a register must be written to the address pointer if data is to be written to that register, but it is not possible to read data from that address. The read address of a register must be written to the address pointer before data can be read from that register.
interrogated in the usual way.
- If more than one device’s ALERT
in accordance with normal SMBus arbitration.
- Once the ADM1032 has responded to the alert
ADM1032 is still in standby. output that cannot be masked. the high temperature limit programmed.
- If either temperature measured exceeds the high
- If the local or remote temperature continues to
to throttle the CPU clock or switch on a fan. down should it be at a critical temperature. a different power rail, usually that of the SMBus controller. Figure 17. Operation of the THERM Output Table 9. THERM Hysteresis Sample Values sets Bit 2 of the status register if a fault is detected.
http://onsemi.com In this respect, the ADM1032 differs from and improves upon competitive devices that output zero if the external sensor goes short−circuit. These devices can misinterpret a genuine 0°C measurement as a fault condition. When the D+ and D − lines are shorted together, an ALERT is always generated. This is because the remote value register reports a temperature value of −128°C. Since the ADM1032 performs a less−than or equal−to comparison with the low limit, an ALERT is generated even when the low limit is set to its minimum of −128°C. Applications Information — Factors Affecting Accuracy Remote Sensing Diode The ADM1032 is designed to work with substrate transistors built into processors’ CPUs or with discrete transistors. Substrate transistors are generally PNP types with the collector connected to the substrate. Discrete types can be either a PNP or an NPN transistor connected as a diode (base shorted to collector). If an NPN transistor is used, the collector and base are connected to D+ and the emitter to D−. If a PNP transistor is used, the collector and base are connected to D− and the emitter to D+. Substrate transistors are found in a number of CPUs. To reduce the error due to variations in these substrate and discrete transistors, a number of factors should be taken into consideration: 1. The ideality factor, n f, of the transistor. The ideality factor is a measure of the deviation of the thermal diode from the ideal behavior. The ADM1032 is trimmed for an n f value of 1.008. The following equation can be used to calculate the error introduced at a temperature T°C when using a transistor whose n f does not equal 1.008. Consult the processor data sheet for nf values. (eq. 2)/C0068T /C0043 /C0466nnatural /C00421.008/C0467 1.008 /C0032/C0466273.15 Kelvin /C0041T/C0467 This value can be written to the offset register and is automatically added to or subtracted from the temperature measurement. 2. Some CPU manufacturers specify the high and low current levels of the substrate transistors. The high current level of the ADM1032, I HIGH, is 230 /C0109A and the low level current, ILOW, is 13 /C0109A. If the ADM1032 current levels do not match the levels of the CPU manufacturers, then it can become necessary to remove an offset. The CPU’s data sheet advises whether this offset needs to be removed and how to calculate it. This offset can be programmed to the offset register. It is important to note that if accounting for two or more offsets is needed, then the algebraic sum of these offsets must be programmed to the offset register. If a discrete transistor is being used with the ADM1032, the best accuracy is obtained by choosing devices according to the following criteria:
- Base−emitter voltage greater than 0.25 V at 6 mA, at the highest operating temperature.
- Base−emitter voltage less than 0.95 V at 100 mA, at the lowest operating temperature.
- Base resistance less than 100 /C0087.
- Small variation in hFE (say 50 to 150) that indicates tight control of VBE characteristics. Transistors such as 2N3904, 2N3906, or equivalents in SOT−23 packages are suitable devices to use. Thermal Inertia and Self−Heating Accuracy depends on the temperature of the remote−sensing diode and/or the internal temperature sensor being at the same temperature as that being measured, and a number of factors can affect this. Ideally, the sensor should be in good thermal contact with the part of the system being measured, for example, the processor. If it is not, the thermal inertia caused by the mass of the sensor causes a lag in the response of the sensor to a temperature change. In the case of the remote sensor, this should not be a problem, since it is either a substrate transistor in the processor or a small package device, such as the SOT −23, placed in close proximity to it. The on−chip sensor, however, is often remote from the processor and is only monitoring the general ambient temperature around the package. The thermal time constant of the SOIC−8 package in still air is about 140 seconds, and if the ambient air temperature quickly changed by 100 °, it would take about 12 minutes (five time constants) for the junction temperature of the ADM1032 to settle within 1° of this. In practice, the ADM1032 package is in electrical and therefore thermal contact with a printed circuit board and can also be in a forced airflow. How accurately the temperature of the board and/or the forced airflow reflect the temperature to be measured also affects the accuracy. Self−heating due to the power dissipated in the ADM1032 or the remote sensor causes the chip temperature of the device or remote sensor to rise above ambient. However, the current forced through the remote sensor is so small that self−heating is negligible. In the case of the ADM1032, the worst−case condition occurs when the device is converting at 16 conversions per second while sinking the maximum current of 1 mA at the ALERT and THERM output. In this case, the total power dissipation in the device is about 11 mW. The thermal resistance, /C0113JA, of the SOIC−8 package is about 121°C/W. In practice, the package has electrical and therefore thermal connection to the printed circuit board, so the temperature rise due to self−heating is negligible.
http://onsemi.com Device Order Number* Package
Description
Shipping† External THERM Default ADM1032ARZ 8−Lead SOIC_N R−8 4C 98 Tube 85°CADM1032ARZ−REEL 8−Lead SOIC_N 4C 2500 Tape & Reel ADM1032ARZ−REEL7 8−Lead SOIC_N 4C 1000 Tape & Reel ADM1032ARZ−001 8−Lead SOIC_N #2 4C 98 Tube 108°C ADM1032ARMZ 8−Lead MSOP RM−8 T1J 4C 50 Tube 85°CADM1032ARMZ−REEL 8−Lead MSOP 4C 3000 Tape & Reel ADM1032ARMZ−R7 8−Lead MSOP 4C 1000 Tape & Reel ADM1032ARMZ−001 8−Lead MSOP T13 4C 50 Tube 108°C ADM1032ARMZ−1RL 8−Lead MSOP 4C 3000 Tape & Reel ADM1032ARMZ−002 8−Lead MSOP T1C 4D 50 Tube 85°CADM1032ARMZ−2R 8−Lead MSOP 4D 3000 Tape & Reel ADM1032ARMZ−2RL7 8−Lead MSOP 4D 1000 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *The “Z’’ suffix indicates Pb−Free package.
http://onsemi.com PACKAGE DIMENSIONS SEATING PLANE N J X 45/C0095 K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751 −01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A B S DH C 0.10 (0.004) DIM A MIN MAX MIN MAX INCHES 4.80 5.00 0.189 0.197 MILLIMETERS B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.053 0.069 D 0.33 0.51 0.013 0.020 G 1.27 BSC 0.050 BSC H 0.10 0.25 0.004 0.010 J 0.19 0.25 0.007 0.010 K 0.40 1.27 0.016 0.050 M 0 8 0 8 N 0.25 0.50 0.010 0.020 S 5.80 6.20 0.228 0.244 −X− −Y− G MYM0.25 (0.010) −Z− YM0.25 (0.010) Z S X S M /C0095/C0095/C0095/C0095 1.52 0.060 7.0 0.275 0.6 0.024 1.270 0.050 4.0 0.155 /C0466mm inches/C0467SCALE 6:1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* SOIC−8 NB CASE 751−07 ISSUE AJ
http://onsemi.com PACKAGE DIMENSIONS SBM0.08 (0.003) A ST NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. 846A-01 OBSOLETE, NEW STANDARD 846A-02. b ePIN 1 ID 8 PL 0.038 (0.0015) −T− SEATING PLANE A A1 c L DIM A MIN NOM MAX MIN MILLIMETERS INCHES A1 0.05 0.08 0.15 0.002 b 0.25 0.33 0.40 0.010 c 0.13 0.18 0.23 0.005 D 2.90 3.00 3.10 0.114 E 2.90 3.00 3.10 0.114 e 0.65 BSC L 0.40 0.55 0.70 0.016 −− 0.043 0.003 0.006 0.013 0.016 0.007 0.009 0.118 0.122 0.118 0.122
0.026 BSC
0.021 0.028 NOM MAX HE DD E MSOP8 CASE 846AB−01 ISSUE O *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 8X 8X 6X /C0466mm inches/C0467SCALE 8:1 1.04 0.041 0.38 0.015 5.28 0.208 4.24 0.167 3.20 0.126 0.65 0.0256 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 ADM1032/D Protected by US Patents 5,982,221; 6,097,239; 6,133,753; 6,169,442; 5,867,012. LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative