ADM1023

ADM1023 ONSEMI | Alldatasheet

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© Semiconductor Components Industries, LLC, 2010 May, 2010 − Rev. 9

1 Publication Order Number:

ACPI-Compliant, High Accuracy Microprocessor System Temperature Monitor The ADM1023 is a 2−channel digital thermometer and under/overtemperature alarm for use in personal computers and other systems requiring thermal monitoring and management. Optimized for the Pentium® III, the higher accuracy allows systems designers to safely reduce temperature guard banding and increase system performance. The device can measure the temperature of a microprocessor using a diode−connected PNP transistor, which may be provided on−chip with the Pentium III or similar processors; or it can be a low−cost, discrete NPN/PNP device such as the 2N3904/2N3906. A novel measurement technique cancels out the absolute value of the transistor’s base emitter voltage so that no calibration is required. The second measurement channel measures the output of an on−chip temperature sensor to monitor the temperature of the device and its environment. The ADM1023 communicates over a 2−wire serial interface compatible with SMBus standards. Under/overtemperature limits can be programmed into the device over the serial bus, and an ALERT output signals when the on−chip or remote temperature is out of range. This output can be used as an interrupt or as an SMBus ALERT.

FEATURES

• Next Generation Upgrade of ADM1021
• On−Chip and Remote Temperature Sensing
• Offset Registers for System Calibration
• 1°C Accuracy and Resolution on Local Channel
• 0.125°C Resolution/1°C Accuracy on Remote Channel
• Programmable Over/Undertemperature Limits
• Programmable Conversion Rate
• Supports System Management Bus (SMBus) ALERT
• 2−Wire SMBus Serial Interface
• 200 /C0109A Max Operating Current (0.25 Conversions/Second)
• 1 /C0109A Standby Current
• 3.0 V to 5.5 V Supply
• Small 16−Lead QSOP Package
• Pb−Free Packages are Available

APPLICATIONS

• Desktop Computers
• Notebook Computers
• Smart Batteries
• Industrial Controllers
• Telecomm Equipment
• Instrumentation http://onsemi.com See detailed ordering and shipping information in the package dimensions section on page 15 of this data sheet.

ORDERING INFORMATION

xxx = Specific Device Code # = Pb−Free Package YYWW = Date Code XXX = Assembly Lot ID MARKING DIAGRAM QSOP−16 CASE 492 1023A RQZ #YYWW XXX ADM1023 TOP VIEW VDD GND ADD1 NC NC ADD0 GND NC ALERT SDATA NC16 NC STBY SCLK

Figure 1. Functional Block Diagram NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.

http://onsemi.com PIN ASSIGNMENT Pin No. Mnemonic Description 1 NC No Connect. 2 VDD Positive Supply, 3.0 V to 5.5 V. 3 D+ Positive Connection to Remote Temperature Sensor. 4 D− Negative Connection to Remote Temperature Sensor. 5 NC No Connect. 6 ADD1 Three−State Logic Input, Higher Bit of Device Address. 7 GND Supply 0 V Connection. 8 GND Supply 0 V Connection. 9 NC No Connect. 10 ADD0 Three−State Logic Input, Lower Bit of Device Address. 11 ALERT Open−Drain Logic Output Used as Interrupt or SMBus ALERT. 12 SDATA Logic Input/Output, SMBus Serial Data. Open−drain output. 13 NC No Connect. 14 SCLK Logic Input, SMBus Serial Clock. 15 STBY Logic Input Selecting Normal Operation (High) or Standby Mode (Low). 16 NC No Connect. ELECTRICAL CHARACTERISTICS (TA = TMIN to TMAX, VDD = 3.0 V to 3.6 V, unless otherwise noted. (Note 1) Parameter Test Conditions / Comments Min Typ Max Unit Power Supply and ADC Temperature Resolution, Local Sensor Guaranteed no missed codes 1.0 °C Temperature Resolution, Remote Sensor Guaranteed no missed codes 0.125 °C Temperature Error, Local Sensor TA = 60°C to 100°C TA = 0°C to 120°C −1.5 −3.0 ±0.5 ±1.0 +1.5 +3.0 Temperature Error, Remote Sensor TA, TD = 60°C to 100°C (Note 2) −1.0 +1.0 °C TA, TD = 0°C to 120°C (Note 2) −3.0 +3.0 °C Relative Accuracy TA = 60°C to 100°C 0.25 °C Supply Voltage Range (Note 3) 3.0 3.6 V Undervoltage Lockout Threshold VDD input, disables ADC, rising edge 2.55 2.7 2.8 V Undervoltage Lockout Hysteresis 25 mV Power−On Reset Threshold VDD, falling edge (Note 4) 0.9 1.7 2.2 V POR Threshold Hysteresis 50 mV Standby Supply Current VDD = 3.3 V, no SMBus activity SCLK at 10 kHz 1.0 4.0 5.0 /C0109A Average Operating Supply Current 0.25 conversions/sec rate 130 200 /C0109A Autoconvert Mode, Averaged Over 4 Sec 2 conversions/sec rate 225 370 /C0109A Conversion Time From stop bit to conversion complete (both channels) D+ forced to D− + 0.65 V 65 115 170 ms Remote Sensor Source Current High level (Note 4) Low level (Note 4) 120 7.0 205 300 /C0109A D− Source Voltage 0.7 V Address Pin Bias Current (ADD0, ADD1) Momentary at power−on reset 50 /C0109A

1. T D is the temperature of the remote thermal diode; TA, TD = 60°C to 100°C
2. Operation at V DD = 5.0 V guaranteed by design; not production tested
3. Guranteed by design; not production tested

Figure 2. Diagram for Serial Bus Timing

byte register at Address 0x10. 0x12 (low byte, left−justified). effect if nothing is written to them.

• Switching the device between normal operation and standby mode.
• Masking or enabling the ALERT output.
• Selecting the conversion rate. On initial powerup, the remote and local temperature values default to −128 °C. The device normally powers up converting, making a measure of local and remote temperature. These values are then stored before making a comparison with the stored limits. However, if the part is powered up in standby mode (STBY pin pulled low), no new values are written to the register before a comparison is made. As a result, both RLOW and LLOW are tripped in the status register, thus generating an ALERT output. This may be cleared in one of two ways:
• Change both the local and remote lower limits to –128°C and read the status register (which in turn clears the ALERT output).
• Take the part out of standby and read the status register (which in turn clears the ALERT output). This works only when the measured values are within the limit values.

Figure 13. Input Signal Conditioning CAPACITOR C1 IS OPTIONAL. IT IS ONLY NECESSARY IN NOISY ENVIRONMENTS. emitter voltage of a transistor, operating at constant current.

http://onsemi.com This is given by: (eq. 2)/C0068VBE /C0043nKT q /C00321n (N) where: K is Boltzmann’s constant. q is the charge on the electron (1.6 × 10 –19 Coulombs). T is the absolute temperature in Kelvins. N is the ratio of the two collector currents. n is the ideality factor of the thermal diode (TD). To measure /C0068V BE, the sensor is switched between operating currents of I and NI. The resulting waveform is passed through a low−pass filter to remove noise, then to a chopper−stabilized amplifier that performs the functions of amplification and rectification of the waveform to produce a dc voltage proportional to /C0068V BE. This voltage is measured by the ADC, which gives a temperature output in binary format. T o further reduce the effects of noise, digital filtering is performed by averaging the results of 16 measurement cycles. Signal conditioning and measurement of the internal temperature sensor are performed in a similar manner. Figure 13 shows the input signal conditioning used to measure the output of an external temperature sensor. This figure shows the external sensor as a substrate PNP transistor, provided for temperature monitoring on some microprocessors, but it could equally well be a discrete transistor. If a discrete transistor is used, the collector is not grounded and should be connected to the base. To prevent ground noise from interfering with the measurement, the more negative terminal of the sensor is not referenced to ground but is biased above ground by an internal diode at the D− input. If the sensor is operating in a noisy environment, C1 may optionally be added as a noise filter. Its value is 1000 pF maximum. See the Layout Considerations section for more information on C1. Sources of Errors on Thermal Transistors Measurement Method; The Effect of Ideality Factor (n) The effects of ideality factor (n) and beta ( /C0098) of the temperature measured by a thermal transistor are described in this section. For a thermal transistor implemented on a submicron process, such as the substrate PNP used on a Pentium III processor, the temperature errors due to the combined effect of the ideality factor and beta are shown to be less than 3°C. Equation 2 is optimized for a substrate PNP transistor (used as a thermal diode) usually found on CPUs designed on submicron CMOS processes such as the Pentium III processor. There is a thermal diode on board each of these processors. The n in Equation 2 represents the ideality factor of this thermal diode. This ideality factor is a measure of the deviation of the thermal diode from ideal behavior. According to Pentium III processor manufacturing specifications, measured values of n at 100°C are: (eq. 3) nMIN /C00431.0057 /C0116nTYPICAL /C00431.008 /C0116nMAX /C00431.0125 The ADM1023 takes this ideality factor into consideration when calculating temperature TTD of the thermal diode. The ADM1023 is optimized for nTYPICAL = 1.008; any deviation on n from this typical value causes a temperature error that is calculated below for the n MIN and n MAX of a Pentium III processor at TTD = 100°C. (eq. 4) /C0068TMIN /C00431.0057 /C00421.008 1.008 /C0032/C0466273.15 Kelvin /C0041100° C/C0467 /C0043/C00420.85° C /C0068TMAX /C00431.0125 /C00421.008 1.008 /C0032/C0466273.15 Kelvin /C0041100° C/C0467 /C0043/C00411.67° C Thus, the temperature error due to variation on n of the thermal diode for a Pentium III processor is about 2.5°C. In general, this additional temperature error of the thermal diode measurement due to deviations on n from its typical value is given by: (eq. 5)/C0068T /C0043n /C00421.008 1.008 /C0032/C0466273.15 Kelvin /C0041TTD/C0467 where TTD is in °C. Beta of Thermal Transistor (/C0098) In Figure 13, the thermal diode is a substrate PNP transistor where the emitter current is forced into the device. The derivation of Equation 2 assumed that the collector currents were scaled by N as the emitter currents were also scaled by N. Thus, this assumes that beta (/C0098) of the transistor is constant for various collector currents. Figure 14 shows typical /C0098 variation vs. collector current for Pentium III processors at 100°C. The maximum /C0098 is 4.5 and varies less than 1% over the collector current range from 7 /C0109A to 300 /C0109A.Figure 14. Variation of /C0098 with Collector Currents /C0110/C0098 7 300 /C0098 IC (mA) /C0098MAX < 4.5 IC = IE /C0098 /C0098+1 IE Expressing the collector current in terms of the emitter current. (eq. 6)IC /C0043IE /C0426/C0098/C0324(/C0098/C00411)] where: (eq. 7) /C0098/C0466300 /C0109A/C0467/C0043/C0098/C04667 /C0109A/C0467(1 /C0041/C0101) /C0101/C0043/C0068/C0098/C0324/C0098and /C0098/C0043/C0098(7/C0109A) Rewriting the equation for /C0068VBE, to include the ideality factor, n, and beta, /C0098 yields: (eq. 8)/C0068VBE /C0043nKT q /C00321n/C0426(1 /C0041/C0101) /C0032/C0466/C0098/C00411/C0467 (1 /C0041/C0101) /C0098/C00411 /C0032N/C0427 All /C0098 variations of less than 1% ( /C0101 < 0.01) contribute to temperature errors of less than 0.4°C.

resolution are shown in Table 1 and Table 2. Table 1. Temperature Data Format

1. The ADM1023 differs from the ADM1021 in that the

into the local and remote high and low limit registers. Table 2. Extended Temperature Resolution different addresses for read and write operations. operation or for a subsequent read operation. register can accept values from −128.875°C to +127.875°C. value register does not wrap around +127°C or −128°C.

Table 3. List of ADM1023 Registers

00 Not applicable Local temperature value 1000 0000 (0x80) (−128°C)

01 Not applicable Remote temperature value high byte 1000 0000 (0x80) (−128°C)

02 Not applicable Status Undefined

10 Not applicable Remote temperature value low byte 0000 0000

19 Not applicable Reserved 0000 0000

1. Writing to Address 0F causes the ADM1023 to perform a single measurement. It is not a data register as such; thus, it does not matter what

Table 4. Offset Values flags indicating the results of the limit comparisons. interrupt latch is set, and the ALERT output goes low.

Table 5. Status Register Bit Assignments

7 BUSY At 1 when ADC converting

6 LHIGH* At 1 when local high temp limit tripped

5 LLOW* At 1 when local low temp limit tripped

4 RHIGH* At 1 when remote high temp limit tripped

3 RLOW* At 1 when remote low temp limit tripped

2 OPEN* At 1 when remote sensor open−circuit

part was placed in standby mode. Table 6. Configuration Register Bit Assignments

7 MASK1 0 = ALERT Enabled

6 RUN/STOP 0 = Run

consumption, as shown in Table 7. Table 7. Conversion Rate Register Code backward−compatibility with the ADM1021. standby mode, after which the device returns to standby. address is irrelevant and is not stored. Control of the ADM1023 is carried out via the serial bus. is powered down, and they do not pull down the SMBus. over the bus, the slave device with that address responds. different addresses are possible, as shown in Table 8. powerup, so changing them after powerup has no effect.

Table 8. Device Addresses (Note 1)

0 NC 0011 001

1 NC 1001 101

1. ADD0 and ADD1 are sampled at powerup only.
2. The master initiates data transfer by establishing a

the start condition and shift in the next 8 bits. or read from, the slave device. reads from the slave device.

1. Data is sent over the serial bus in sequences of

Acknowledge bit from the slave device. what the master and slave devices can handle.

1. When all data bytes have been read or written,

during the low period before the ninth clock pulse. 10th clock pulse to assert a stop condition. Figure 15. Writing a Register Address to the Address Pointer Register, then Writing Data to the Selected Register Figure 16. Writing to the Address Pointer Register Only

http://onsemi.com 4. If more than one device’s ALERT output is low, the one with the lowest device address has priority, in accordance with normal SMBus arbitration. 5. Once the ADM1023 has responded to the ARA, it resets its ALERT output, provided that the error condition that caused the ALERT no longer exists. If the SMBALERT line remains low, the master sends ARA again, and so on until all devices whose ALERT outputs were low have responded. Low Power Standby Modes The ADM1023 can be put into a low power standby mode using hardware or software, that is, by taking the STBY input low or by setting Bit 6 of the configuration register. When STBY is high or Bit 6 is low, the ADM1023 operates normally. When STBY is pulled low or Bit 6 is high, the ADC is inhibited, and any conversion in progress is terminated without writing the result to the corresponding value register. The SMBus is still enabled. Power consumption in the standby mode is reduced to less than 10 /C0109A if there is no SMBus activity, or 100 /C0109A if there are clock and data signals on the bus. These two modes are similar but not identical. When STBY is low, conversions are completely inhibited. When Bit 6 is set, but STBY is high, a one−shot conversion of both channels can be initiated by writing any data value to the one−shot register (Address 0x0F). Sensor Fault Detection The ADM1023 has a fault detector at the D+ input that detects if the external sensor diode is open−circuit. This is a simple voltage comparator that trips if the voltage at D+ exceeds V CC – 1.0 V (typical). The output of this comparator is checked when a conversion is initiated and sets Bit 2 of the status register if a fault is detected. If the remote sensor voltage falls below the normal measuring range, for example, due to the diode being short−circuited, the ADC outputs –128°C (1000 0000 000). Because the normal operating temperature range of the device extends only down to 0°C, this output code is never seen in normal operation and can be interpreted as a fault condition. In this respect, the ADM1023 differs from, and improves upon, competitive devices that output 0 if the external sensor goes short−circuit. Unlike the ADM1023, these other devices can misinterpret a genuine 0 °C measurement as a fault condition. If the external diode channel is not being used and is shorted out, the resulting ALERT may be cleared by writing 0x80 (−128°C) to the low limit register. Factors Affecting Accuracy, Remote Sensing Diode The ADM1023 is designed to work with substrate transistors built into processors or with discrete transistors. Substrate transistors are generally PNP types with the collector connected to the substrate. Discrete types can be either PNP or NPN, connected as a diode (base−shorted to collector). If an NPN transistor is used, the collector and base are connected to D+ and the emitter to D−. If a PNP transistor is used, the collector and base are connected to D− and the emitter to D+. The user has no choice with substrate transistors, but if a discrete transistor is used, the best accuracy is achieved by choosing devices according to the following criteria:

• Base emitter voltage greater than 0.25 V at 6 /C0109A, at the highest operating temperature.
• Base emitter voltage less than 0.95 V at 100 /C0109A, at the lowest operating temperature.
• Base resistance less than 100 /C0087.
• Small variation in hfe (approximately 50 to 150), which indicates tight control of VBE characteristics. Transistors such as 2N3904, 2N3906, or equivalents in SOT−23 packages are suitable devices to use. Thermal Inertia and Self−Heating Accuracy depends on the temperature of the remote sensing diode and/or the internal temperature sensor being at the same temperature as that being measured, and a number of factors can affect this. Ideally, the sensor should be in good thermal contact with the part of the system being measured, such as the processor, for example. If it is not in good thermal contact, the thermal inertia caused by the mass of the sensor causes a lag in the response of the sensor to a temperature change. With the remote sensor, this should not be a problem, as it will be either a substrate transistor in the processor or a small package device, such as SOT−23, placed in close proximity to it. The on−chip sensor, however, is often remote from the processor and monitors only the general ambient temperature around the package. The thermal time constant of the QSOP−16 package is about 10 seconds. In practice, the package has electrical, and hence thermal, connection to the printed circuit board. Therefore, the temperature rise due to self−heating is negligible. Layout Considerations Digital boards can be electrically noisy environments, and the ADM1023 is measuring very small voltages from the remote sensor; therefore, care must be taken to minimize noise induced at the sensor inputs. The following precautions are needed:
• Place the ADM1023 as close as possible to the remote sensing diode. Provided that the worst noise sources, such as clock generators, data/address buses, and CRTs, are avoided, this distance can be 4 to 8 inches.
• Route the D+ and D− tracks close together, in parallel, with grounded guard tracks on each side. Provide a ground plane under the tracks if possible (see Figure 19).

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• Use wide tracks to minimize inductance and reduce noise pickup. 10 mil track minimum width and spacing is recommended.

Figure 19. Arrangement of Signal Tracks

• Try to minimize the number of copper/solder joints, which can cause thermocouple effects. Where copper/solder joints are used, make sure that they are in both the D+ and D− path and at the same temperature. Thermocouple effects should not be a major problem as 1°C corresponds to about 240 /C0109V , and thermocouple voltages are about 3 /C0109V/°C of temperature difference. Unless there are two thermocouples with a big temperature differential between them, thermocouple voltages should be much less than 240 /C0109V.
• Place a 0.1 /C0109F bypass capacitor close to the VDD pin and 1000 pF input filter capacitors across D+, D− close to the ADM1023.
• If the distance to the remote sensor is more than 8 inches, the use of twisted pair cable is recommended. This is effective up to approximately 6 to 12 feet.
• For longer distances (up to 100 feet), use shielded, twisted−pair cable such as Belden #8451 microphone cable. Connect the twisted pair to D+ and D−, and connect the shield to GND close to the ADM1023. Leave the remote end of the shield unconnected to avoid ground loops. Because the measurement technique uses switched current sources, excessive cable and/or filter capacitance can affect the measurement. When using long cables, the filter capacitor may be reduced or removed. Cable resistance can also introduce errors. A 1 /C0087 series resistance introduces about 1°C error. Application Circuits Figure 20 shows a typical application circuit for the ADM1023, using a discrete sensor transistor connected via a shielded, twisted−pair cable. The pullups on SCLK, SDATA, and ALERT are required only if they are not already provided elsewhere in the system.

Figure 20. Typical Application Circuit using this type of I/O controller. Figure 21. System Using ADM1023 and I/O Controller

2 USB PORTS

2 IDE PORTS

Device Number Temperature Range Package Type Package Option Shipping† ADM1023ARQZ 0°C to +120°C 16−Lead QSOP RQ−16 98 Tube ADM1023ARQZ−REEL 0°C to +120°C 16−Lead QSOP RQ−16 2500 Tape & Reel ADM1023ARQZ−R7 0°C to +120°C 16−Lead QSOP RQ−16 1000 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *The “Z’’ suffix indicates Pb−Free part.

http://onsemi.com PACKAGE DIMENSIONS QSOP16 CASE 492−01 ISSUE O MAX MILLIMETERS G R −B− −A− L M0.25 (0.010) T U −T− SEATING PLANE K D16 PL C M0.25 (0.010) T BAS S V N J M F 8 PL DETAIL E DETAIL E H x 45/C0095 RAD. MOLD PIN DIM MIN MAXMIN INCHES A 4.80 4.980.189 0.196 B 3.81 3.990.150 0.157 C 1.55 1.730.061 0.068 D 0.20 0.310.008 0.012 F 0.41 0.890.016 0.035 G 0.64 BSC0.025 BSC H 0.20 0.460.008 0.018 J 0.249 0.1910.0098 0.0075 K 0.10 0.250.004 0.010 L 5.84 6.200.230 0.244 M 0 8 0 N 0 7 0 7 P 0.18 0.280.007 0.011 Q 0.51 DIA0.020 DIA R 0.64 0.890.025 0.035 U 0.64 0.890.025 0.035 V NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. THE BOTTOM PACKAGE SHALL BE BIGGER THAN THE TOP PACKAGE BY 4 MILS (NOTE: LEAD SIDE ONLY). BOTTOM PACKAGE DIMENSION SHALL FOLLOW THE DIMENSION STATED IN THIS DRAWING. 4. PLASTIC DIMENSIONS DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 6 MILS PER SIDE. 5. BOTTOM EJECTOR PIN WILL INCLUDE THE COUNTRY OF ORIGIN (COO) AND MOLD CAVITY I.D./C0095/C0095/C0095 /C00950 8 0 /C0095/C0095/C0095 8 /C0095 /C0095/C0095/C0095/C0095 MARK Q P 0.013 X 0.005 DP. MAX RAD. 0.005−0.010 TYP ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 ADM1023/D Protected by U.S. Patents 5,195,827; 5,867,012; 5,982,221; 6,097,239; 6,133,753; 6,169,442; other patents pending. Pentium is a registered trademark of Intel Corporation. LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative