ADG936/ADG936-R
Document overview
- Manufacturer or author: Analog Devices, Inc.
- PDF pages: 16
Technical content
ADG936/ADG936-R Data Sheet Rev. B | Page 2 of 16 TABLE OF CONTENTS
REVISION HISTORY
4/13—Rev. A to Rev. B 8/05—Rev. 0 to Rev. A 7/04—Revision 0: Initial Version
Data Sheet ADG936/ADG936-R Rev. B | Page 3 of 16 SPECIFICATIONS VDD = 1.65 V to 2.75 V , GND = 0 V, input power = 0 dBm, all specifications TMIN to TMAX, unless otherwise noted.1 Table 1. B Version Parameter Symbol Conditions Min Typ2 Max Unit AC ELECTRICAL CHARACTERISTICS Operating Frequency3 DC 2 GHz 3 dB Frequency4 4 GHz Input Power4 0 V dc bias 7 dBm
0.5 V dc bias 16 dBm
Insertion Loss S21, S12 DC to 100 MHz; VDD = 2.5 V ± 10% 0.4 0.5 dB 500 MHz; VDD = 2.5 V ± 10% 0.6 0.8 dB 1000 MHz; VDD = 2.5 V ± 10% 0.9 1.25 dB Isolation—RFCx to RF1x/RF2x S21, S12 100 MHz 52 60 dB
500 MHz 40 47 dB
1000 MHz 31 36 dB
Crosstalk—RF1x to RF2x S21, S12 100 MHz 53 69 dB
500 MHz 42 45 dB
1000 MHz 34 37 dB
Return Loss (On Channel)4 S11, S22 DC to 100 MHz 20 25 dB
500 MHz 19 23 dB
1000 MHz 16 24 dB
Return Loss (Off Channel)4 S11, S22 DC to 100 MHz 18 24 dB
500 MHz 17 23 dB
1000 MHz 16 21 dB
On Switching Time4 tON 50% CTRL to 90% RF 11 14 ns Off Switching Time4 tOFF 50% CTRL to 10% RF 10 13 ns Rise Time4 tRISE 10% to 90% RF 6.1 8 ns Fall Time4 tFAL L 90% to 10% RF 6 8 ns 1 dB Compression4 P–1 dB 1000 MHz 16 dBm Third-Order Intermodulation Intercept IP3 900 MHz/901 MHz, 4 dBm 27.5 32 dBm Video Feedthrough5 3 mV p-p DC ELECTRICAL CHARACTERISTICS Input High Voltage VINH VDD = 2.25 V to 2.75 V 1.7 V VINH VDD = 1.65 V to 1.95 V 0.65 VCC V Input Low Voltage VINL VDD = 2.25 V to 2.75 V 0.7 V VINL VDD = 1.65 V to 1.95 V 0.35 VCC V Input Leakage Current II 0 ≤ VIN ≤ 2.75 V ± 0.1 ± 1 µA CAPACITANCE4 RF Port On Capacitance CRF ON f = 1 MHz 2.5 pF Digital Input Capacitance CDIG f = 1 MHz 2 pF POWER REQUIREMENTS VDD 1.65 2.75 V Quiescent Power Supply Current IDD Digital inputs = 0 V or VDD 0.1 1 µA 1 Temperature range of B Version: −40°C to +85°C. 2 Typical values are at VDD = 2.5 V and 25°C, unless otherwise noted. 3 Operating frequency is the point at which insertion loss degrades by 1 dB. 4 Guaranteed by design, not subject to production test. 5 Video feedthrough is the dc transience at the output of any port of the switch when the control voltage is switched from high to low or from low to high in a 50 Ω test setup, measured with 1 ns rise time pulses and a 500 MHz bandwidth.
TA = 25°C, unless otherwise noted. Table 3. Truth Table
0 Off On
1 On Off
1 RF1x/RF2x off port inputs to ground = –0.5 V to VDD – 0.5 V. degradation or loss of functionality.
- EXPOSED PAD TIED TO SUBSTATE, GND.
15 GND
11 RF2B
Figure 5. 20-Lead TSSOP (RU-20) Figure 6. 20-Lead 4 mm × 4 mm LFCSP (CP-20-1) Table 4. Pin Function Descriptions 1 18 RFCA Common RF Port for Switch A. GND Ground Reference Point for All Circuitry on the Part. 10 8 RFCB Common RF Port for Switch B. 12 10 INB Logic Control Input. 19 16 INA Logic Control Input. EP EP Exposed Pad. The exposed pad must be tied to substrate, GND.
ADG936/ADG936-R Data Sheet Rev. B | Page 6 of 16 TERMINOLOGY Table 5. Parameter Description VDD Most Positive Power Supply Potential. IDD Positive Supply Current. GND Ground (0 V) Reference. INx Logic Control Input. VINL Maximum Input Voltage for Logic 0. VINH Minimum Input Voltage for Logic 1. IINL (IINH) Input Current of the Digital Input. CIN Digital Input Capacitance. tON Delay Between Applying the Digital Control Input and the Output Switching On. tOFF Delay Between Applying the Digital Control Input and the Output Switching Off. tRISE Rise Time. Time for the RF signal to rise from 10% of the on level to 90% of the on level. tFAL L Fall Time. Time for the RF signal to fall from 90% of the on level to 10% of the on level. Off Isolation The Attenuation Between Input and Output Ports of the Switch When the Switch Control Voltage Is in the Off Condition. Insertion Loss The Attenuation Between Input and Output Ports of the Switch When the Switch Control Voltage Is in the On Condition. Crosstalk Measure of Unwanted Signal Coupled Through from One Channel to Another as a Result of Parasitic Capacitance. P–1 dB 1 dB Compression Point. The RF input power level at which the switch insertion loss increases by 1 dB over its low level value. P–1 dB is a measure of how much power the on switch can handle before the insertion loss increases by 1 dB. IP3 Third-Order Intermodulation Intercept. This is a measure of the power in false tones that occurs when closely spaced tones are passed through a switch, whereby the nonlinearity of the switch causes these false tones to be generated. Return Loss The Amount of Reflected Power Relative to the Incident Power at a Port. Large return loss indicates good matching. By measuring return loss, the voltage standing wave ratio (VSWR) can be calculated from conversion charts. VSWR indicates the degree of matching present at a switch RF port. Video Feedthrough Spurious Signals Present at the RF Ports of the Switch When the Control Voltage Is Switched from High to Low or from Low to High Without an RF Signal Present.
switches with minimal effort. dielectric constant of 4.3 and an overall thickness of 0.062 in. Figure 29. ADG936 and ADG936-R Evaluation Board Top View
6.40 BSC
Figure 30. 20-Lead Thin Shrink Small Outline Package [TSSOP] COMPLIANT TOJEDEC STANDARDS MO-220-WGGD-1.
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
Figure 31. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
ADG936/ADG936-R Data Sheet Rev. B | Page 14 of 16 ORDERING GUIDE Model1 Temperature Range Package Description Package Option2 ADG936BRU –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20 ADG936BRU-500RL7 –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20 ADG936BRUZ –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20 ADG936BRUZ-REEL –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20 ADG936BRUZ-REEL7 –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20 ADG936BCPZ –40°C to +85°C 20-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-20-6 ADG936BCPZ-RL –40°C to +85°C 20-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-20-6 ADG936BCPZ-RL7 –40°C to +85°C 20-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-20-6 EVAL-ADG936EBZ Evaluation Board RU-20 ADG936BRU-R –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20 ADG936BRU-R-500RL7 –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20 ADG936BRU-R-REEL –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20 ADG936BRU-R-REEL7 –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20 ADG936BRUZ-R –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20 ADG936BCPZ-R –40°C to +85°C 20-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-20-6 ADG936BCPZ-R-REEL –40°C to +85°C 20-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-20-6 EVAL-ADG936REBZ Evaluation Board RU-20 1 Z = RoHS Compliant Part.
2 CP-20-6 package was formerly CP-20-1 package
Data Sheet ADG936/ADG936-R Rev. B | Page 15 of 16 NOTES
ADG936/ADG936-R Data Sheet Rev. B | Page 16 of 16 NOTES © 2004–2013 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D04503–0–4/13(B)