ADG918BRMZ1

ADG918_08 AD | Alldatasheet

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Rev. C | Page 2 of 16 TABLE OF CONTENTS

REVISION HISTORY

9/08—Rev. B to Rev. C 8/08—Rev. A to Rev. B Changes to Table 1, AC Electrical Characteristics, Third Order 9/04—Changed from Rev. 0 to Rev. A 8/03 Revision 0: Initial Version

Rev. C | Page 3 of 16 SPECIFICATIONS VDD = 1.65 V to 2.75 V , GND = 0 V , input power = 0 dBm, all specifications TMIN to TMAX, unless otherwise noted. Temperature range for B Version: −40°C to +85°C. Table 1. B Version Parameter Symbol Conditions Min Typ1 Max Unit AC ELECTRICAL CHARACTERISTICS Operating Frequency2 dc 2 GHz 3 dB Frequency3 4 GHz Input Power3 0 V dc bias 7 dBm

0.5 V dc bias 16 dBm

Insertion Loss S21, S12 DC to 100 MHz; VDD = 2.5 V ± 10% 0.4 0.7 dB 500 MHz; VDD = 2.5 V ± 10% 0.5 0.8 dB 1000 MHz; VDD = 2.5 V ± 10% 0.8 1.25 dB Isolation—RFC to RF1/RF2 S21, S12 100 MHz 57 60 dB (CP Package) 500 MHz 46 49 dB

1000 MHz 36 43 dB

Isolation—RFC to RF1/RF2 S21, S12 100 MHz 55 60 dB (RM Package) 500 MHz 43 47 dB

1000 MHz 34 37 dB

Isolation—RF1 to RF2 (Crosstalk) S21, S12 100 MHz 55 58 (CP Package) 500 MHz 41 44

1000 MHz 31 37

Isolation—RF1 to RF2 (Crosstalk) S21, S12 100 MHz 54 57 (RM Package) 500 MHz 39 42

1000 MHz 31 33

Return Loss (On Channel)3 S11, S22 DC to 100 MHz 21 27 dB

500 MHz 22 27 dB

1000 MHz 22 26 dB

Return Loss (Off Channel)3 S11, S22 DC to 100 MHz 18 23 dB ADG918 500 MHz 17 21 dB

1000 MHz 16 20 dB

tON 50% CTRL to 90% RF 6.6 10 ns Off Switching Time3 tOFF 50% CTRL to 10% RF 6.5 9.5 ns Rise Time3 tRISE 10% to 90% RF 6.1 9 ns Fall Time3 tFALL 90% to 10% RF 6.1 9 ns 1 dB Compression3 P–1 dB 1000 MHz 17 dBm Third Order Intermodulation Intercept IP3 900 MHz/901 MHz, 4 dBm 28.5 36 dBm Video Feedthrough4 2.5 mV p-p DC ELECTRICAL CHARACTERISTICS Input High Voltage VINH VDD = 2.25 V to 2.75 V 1.7 V V INH VDD = 1.65 V to 1.95 V 0.65 VCC V Input Low Voltage VINL VDD = 2.25 V to 2.75 V 0.7 V V INL VDD = 1.65 V to 1.95 V 0.35 VCC V Input Leakage Current II 0 V ≤ VIN ≤ 2.75 V ± 0.1 ± 1 μA

Rev. C | Page 4 of 16 B Version Parameter Symbol Conditions Min Typ 1 Max Unit CAPACITANCE3 RF On Capacitance CRF ON f = 1 MHz 1.6 pF CTRL Input Capacitance CCTRL f = 1 MHz 2 pF POWER REQUIREMENTS VDD 1.65 2.75 V Quiescent Power Supply Current IDD Digital inputs = 0 V or VDD 0.1 1 μA 1 Typical values are at VDD = 2.5 V and 25°C, unless otherwise stated. 2 Point at which insertion loss degrades by 1 dB. 3 Guaranteed by design, not subject to production test. 4 The dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 Ω test setup, measured with 1 ns rise time pulses and 500 MHz bandwidth.

Rev. C | Page 5 of 16 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 2. Parameter Rating VDD to GND –0.5 V to +4 V Inputs to GND –0.5 V to VDD + 0.3 V1 Continuous Current 30 mA Input Power 18 dBm Operating Temperature Range Industrial (B Version) –40°C to +85°C Storage Temperature Range –65°C to +150°C Junction Temperature 150°C θJA Thermal Impedance 206°C/W θJA Thermal Impedance (2-layer board) 84°C/W θJA Thermal Impedance (4-layer board) 48°C/W Lead Temperature, Soldering (10 sec) 300°C IR Reflow, Peak Temperature (<20 sec) 235°C ESD 1 kV 1RF1 and RF2 off port inputs to ground: −0.5 V to VDD – 0.5 V. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION

Figure 4. 8-Lead MSOP (RM-8) and Table 3. Pin Function Descriptions 1 VDD Power Supply Input. These parts can be operated from 1.65 V to 2.75 V, and VDD should be decoupled to GND. 2 CTRL Logic Control Input. See Table 4. 3, 6, 7 GND Ground Reference Point for All Circuitry on the Part. 4 RFC COMMON RF Port for Switch. Table 4. Truth Table

0 RF2 to RFC

1 RF1 to RFC

Figure 17. P-1 dB vs. Frequency

Rev. C | Page 10 of 16 TERMINOLOGY VDD Most positive power supply potential. IDD Positive supply current. GND Ground (0 V) reference. CTRL Logic control input. V INL Maximum input voltage for Logic 0. VINH Minimum input voltage for Logic 1. I INL (IINH) Input current of the digital input. C IN Digital input capacitance. t ON Delay between applying the digital control input and the output switching on. tOFF Delay between applying the digital control input and the output switching off. tRISE Rise time; time for the RF signal to rise from 10% to 90% of the on level. tFALL Fall time; time for the RF signal to fall from 90% to 10% of the on level. Off Isolation The attenuation between the input and output ports of the switch when the switch control voltage is in the off condition. Insertion Loss The attenuation between the input and output ports of the switch when the switch control voltage is in the on condition. P–1 dB 1 dB compression point. The RF input power level at which the switch insertion loss increases by 1 dB over its low level value. It is a measure of how much power the on switch can handle before the insertion loss increases by 1 dB. IP3 Third order intermodulation intercept. This is a measure of the power in false tones that occur when closely spaced tones are passed through a switch, whereby the nonlinearity of the switch causes these false tones to be generated. Return Loss The amount of reflected power relative to the incident power at a port. Large return loss indicates good matching. By measuring return loss, the VSWR (voltage standing wave ratio) can be calculated from conversion charts. VSWR indicates the degree of matching present at a switch RF port. Video Feedthrough Spurious signals present at the RF ports of the switch when the control voltage is switched from high to low or low to high without an RF signal present.

high performance wideband switches with a minimum of effort. information about operating the evaluation board. of the PCB over the environmental conditions being evaluated. a metal thickness of 0.014 inches. Figure 29. ADG9xx Evaluation Board Top View

0.65 BSC

1.10 MAX

Figure 30. 8-Lead Mini Small Outline Package [MSOP] EXPOSED PAD IS CONNECTED INTERNAL LY.

0.65 TYP

0.90 MAX

0.85 NOM

0.05 MAX

0.01 NOM

0.20 REF

0.60 MAX

Figure 31. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]

Rev. C | Page 16 of 16 ORDERING GUIDE Model Temperature Range Package Description Package Option Branding ADG918BRM –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 W4B ADG918BRM-500RL7 –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 W4B ADG918BRM-REEL –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 W4B ADG918BRM-REEL7 –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 W4B ADG918BRMZ1 –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 W4B# ADG918BRMZ-500RL71 –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 W4B# ADG918BRMZ-REEL1 –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 W4B# ADG918BRMZ-REEL71 –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 W4B# ADG918BCP-500RL7 –40°C to +85°C 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) CP-8-2 W4B ADG918BCP-REEL7 –40°C to +85°C 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) CP-8-2 W4B ADG918BCPZ-500RL71 –40°C to +85°C 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) CP-8-2 W4B# ADG918BCPZ-REEL71 –40°C to +85°C 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) CP-8-2 W4B# ADG919BRM –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 W5B ADG919BRM-500RL7 –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 W5B ADG919BRM-REEL –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 W5B ADG919BRM-REEL7 –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 W5B ADG919BRMZ1 –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 S1X ADG919BRMZ-REEL1 –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 S1X ADG919BRMZ-REEL71 –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 S1X ADG919BCP-500RL7 –40°C to +85°C 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) CP-8-2 W5B ADG919BCP-REEL7 –40°C to +85°C 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) CP-8-2 W5B ADG919BCPZ-REEL71 –40°C to +85°C 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) CP-8-2 S1X EVAL-ADG918EBZ1 Evaluation Board EVAL-ADG919EBZ1 Evaluation Board 1 Z = RoHS Compliant Part, # denotes RoHS compliant product, may be top or bottom marked. ©2003–2008 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the prop erty of their respective owners. D03335-0-9/08(C)