ADG711BR-REEL

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CMOS Low Voltage, 4 Ω Quad, SPST Switches ADG711/ADG712/ADG713 Rev. B Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2004–2011 Analog Devices, Inc. All rights reserved.

FEATURES

1.8 V to 5.5 V single supply Low on resistance (2.5 Ω Typ) Low on resistance flatness −3 dB bandwidth > 200 MHz Rail-to-rail operation 16-lead TSSOP and SOIC packages Fast switching times: t ON =16 ns, tOFF =10 ns Typical power consumption (< 0.01 μW) TTL/CMOS compatible Qualified for automotive applications

APPLICATIONS

USB 1.1 signal switching circuits Cell phones PDAs Battery-powered systems Communication systems Sample hold systems Audio signal routing Video switching Mechanical reed relay replacement FUNCTIONAL BLOCK DIAGRAM IN1 IN2 IN3 IN4 SWITCHES SHOWN FOR A LOGIC “1” INPUT ADG711 00042-001 IN1 IN2 IN3 IN4 ADG712 IN1 IN2 IN3 IN4 ADG713 Figure 1. GENERAL DESCRIPTION The ADG711, ADG712, and ADG713 are monolithic CMOS devices containing four independently selectable switches. These switches are designed on an advanced submicron process that provides low power dissipation yet gives high switching speed, low on resistance, low leakage currents, and high bandwidth. They are designed to operate from a single 1.8 V to 5.5 V supply, making them ideal for use in battery-powered instruments and with the new generation of DACs and ADCs from Analog Devices, Inc. Fast switching times and high bandwidth make the parts suitable for switching USB 1.1 data signals and video signals. The ADG711, ADG712, and ADG713 contain four independent single-pole/single-throw (SPST) switches. The ADG711 and ADG712 differ only in that the digital control logic is inverted. The ADG711 switches are turned on with a logic low on the appropriate control input, while a logic high is required to turn on the switches of the ADG712. The ADG713 contains two switches whose digital control logic is similar to the ADG711, while the logic is inverted on the other two switches. Each switch conducts equally well in both directions when On. The ADG713 exhibits break-before-make switching action. The ADG711/ADG712/ADG713 are available in 16-lead TSSOP and 16-lead SOIC packages. PRODUCT HIGHLIGHTS 1. 1.8 V to 5.5 V Single-Supply Operation. The ADG711, ADG712, and ADG713 offer high performance and are fully specified and guaranteed with 3 V and 5 V supply rails. 2. Ver y L ow R ON (4.5 Ω maximum at 5 V , 8 Ω maximum at 3 V). At supply voltage of 1.8 V , RON is typically 35 Ω over the temperature range. 3. Low On Resistance Flatness. 4. −3 dB Bandwidth >200 MHz. 5. Low Power Dissipation. CMOS construction ensures low power dissipation. 6. Fast tON/tOFF. 7. Break-Before-Make Switching. This prevents channel shorting when the switches are configured as a multiplexer (ADG713 only). 8. 16-Lead TSSOP and 16-Lead SOIC Packages.

Rev. B | Page 2 of 16 TABLE OF CONTENTS

REVISION HISTORY

6/11—Rev. A to Rev. B 3/04—Rev. 0 to Rev. A

Rev. B | Page 3 of 16 SPECIFICATIONS VDD = +5 V ± 10%, GND = 0 V . All specifications −40°C to +85°C, unless otherwise noted. Table 1. Parameter +25°C −40°C to +85°C Unit Test Conditions/Comments ANALOG SWITCH Analog Signal Range 0 V to VDD V On Resistance (RON) 2.5 Ω typ VS = 0 V to VDD, IS = −10 mA; 4 4.5 Ω max See Figure 11 On Resistance Match Between 0.05 Ω typ VS = 0 V to VDD, IS = −10 mA Channels (ΔRON) 0.3 Ω max On Resistance Flatness (RFLAT(ON)) 0.5 Ω typ VS = 0 V to VDD, IS = −10 mA 1.0 Ω max LEAKAGE CURRENTS VDD = +5.5 V Source Off Leakage IS (Off ) ±0.01 nA typ VS = 4.5 V/1 V, VD = 1 V/4.5 V ±0.1 ±0.2 nA max See Figure 12 Drain Off Leakage ID (Off ) ±0.01 nA typ VS = 4.5 V/1 V, VD = 1 V/4.5 V ±0.1 ±0.2 nA max See Figure 12 Channel On Leakage ID, IS (On) ±0.01 nA typ VS = VD = 1 V, or 4.5 V ±0.1 ±0.2 nA max See Figure 13 DIGITAL INPUTS Input High Voltage, VINH 2.4 V min Input Low Voltage, VINL 0.8 V max Input Current IINL or IINH 0.005 μA typ VIN = VINL or VINH ±0.1 μA max DYNAMIC CHARACTERISTICS1 tON 11 ns typ RL = 300 Ω, CL = 35 pF 16 ns max VS = 3 V; see Figure 14 tOFF 6 ns typ RL = 300 Ω, CL = 35 pF 10 ns max VS = 3 V; see Figure 14 Break-Before-Make Time Delay, tD 6 ns typ RL = 300 Ω, CL = 35 pF (ADG713 Only) 1 ns min VS1 = VS2 = 3 V; see Figure 15 Charge Injection 3 pC typ VS = 2 V; RS = 0 Ω, CL = 1 nF; see Figure 16 Off Isolation −58 dB typ RL = 50 Ω, CL = 5 pF, f = 10 MHz −78 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 17 Channel-to-Channel Crosstalk −90 dB typ RL = 50 Ω, CL = 5 pF, f = 10 MHz; see Figure 18 Bandwidth −3 dB 200 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 19 CS 10 pF typ CD 10 pF typ CD, CS (On) 22 pF typ POWER REQUIREMENTS VDD = +5.5 V IDD 0.001 μA typ Digital inputs = 0 V or 5 V 1.0 μ max 1 Guaranteed by design, not subject to production test.

Rev. B | Page 4 of 16 VDD = +3 V ± 10%, GND = 0 V . All specifications −40°C to +85°C, unless otherwise noted. Table 2. Parameter +25°C −40°C to +85°C Unit Test Conditions/Comments ANALOG SWITCH Analog Signal Range 0 V to VDD V On Resistance (RON) 5 5.5 Ω typ VS = 0 V to VDD, IS = −10 mA; 8 Ω max See Figure 11 On Resistance Match Between 0.1 Ω typ VS = 0 V to VDD, IS = −10 mA Channels (ΔRON) 0.3 Ω max On Resistance Flatness (RFLAT(ON)) 2.5 Ω typ VS = 0 V to VDD, IS = −10 mA LEAKAGE CURRENTS VDD = +3.3 V Source Off Leakage IS (Off ) ±0.01 nA typ VS = 3 V/1 V, VD = 1 V/3 V ±0.1 ±0.2 nA max See Figure 12 Drain Off Leakage ID (Off ) ±0.01 nA typ VS = 3 V/1 V, VD = 1 V/ 3 V ±0.1 ±0.2 nA max See Figure 12 Channel On Leakage ID, IS (On) ±0.01 nA typ VS = VD = 1 V, or 3 V ±0.1 ±0.2 nA max See Figure 13 DIGITAL INPUTS Input High Voltage, VINH 2.0 V min Input Low Voltage, VINL 0.4 V max Input Current IINL or IINH 0.005 μA typ VIN = VINL or VINH ±0.1 μA max DYNAMIC CHARACTERISTICS1 tON 13 ns typ RL = 300 Ω, CL = 35 pF 20 ns max VS = 2 V; see Figure 14 tOFF 7 ns typ RL = 300 Ω, CL = 35 pF 12 ns max VS = 2 V; see Figure 14 Break-Before-Make Time Delay, tD 7 ns typ RL = 300 Ω, CL = 35 pF (ADG713 Only) 1 ns min VS1 = VS2 = 2 V; see Figure 15 Charge Injection 3 pC typ VS = 1.5 V; RS = 0 Ω, CL = 1 nF; see Figure 16 Off Isolation −58 dB typ RL = 50 Ω, CL = 5 pF, f = 10 MHz −78 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 17 Channel-to-Channel Crosstalk −90 dB typ RL = 50 Ω, CL = 5 pF, f = 10 MHz; see Figure 18 Bandwidth −3 dB 200 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 19 CS 10 pF typ CD 10 pF typ CD, CS (On) 22 pF typ POWER REQUIREMENTS VDD = +3.3 V IDD 0.001 μA typ Digital inputs = 0 V or 3 V 1.0 μ max 1 Guaranteed by design, not subject to production test.

Rev. B | Page 5 of 16 ABSOLUTE MAXIMUM RATINGS TA = +25°C, unless otherwise noted. Table 3. Parameter Rating VDD to GND −0.3 V to +6 V Analog, Digital Inputs1 −0.3 V to VDD +0.3 V or 30 mA, whichever occurs first Continuous Current, S or D 30 mA Peak Current, S or D 100 mA (Pulsed at 1 ms, 10% duty cycle maximum) Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C θJA Thermal Impedance 150°C/W θJC Thermal Impedance 27°C/W θJA Thermal Impedance 125°C/W θJC Thermal Impedance 42°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C Soldering(Pb-Free) Reflow, Peak Temperature 260(+0/−5)°C Time at Peak Temperature 20 sec to 40 sec ESD 2 kV Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. ESD CAUTION 1 Overvoltages at IN, S or D will be clamped by internal diodes. Currents should be limited to the maximum ratings given.

Figure 2. Pin Configuration 1 IN1 Digital Control Input. Its logic state controls the status of the Switch S1-D1. 2 D1 Drain Pin. Can be used as input or output. 3 S1 Source Pin. Can be used as input or output. 4 NC Not internally connected. 5 GND The most negative power supply pin. 6 S4 Source Pin. Can be used as input or output. 7 D4 Drain Pin. Can be used as input or output. 8 IN4 Digital Control Input. Its logic state controls the status of the Switch S4-D4. 9 IN3 Digital Control Input. Its logic state controls the status of the Switch S3-D3. 10 D3 Drain Pin. Can be used as input or output. 11 S3 Source Pin. Can be used as input or output. 12 NC Not internally connected. 13 V DD The most positive power supply pin. 14 S2 Source Pin. Can be used as input or output. 15 D2 Drain Pin. Can be used as input or output. 16 IN2 Digital Control Input. Its logic state controls the status of the Switch S3-D3. Table 5. Truth Table (ADG711/ADG712) Table 6. Truth Table (ADG713)

0 Off On

1 On Off

Ohmic resistance between D and S. ΔRON On resistance match between any two channels, ie., RONmax − RONmin. RFLAT(ON) Flatness is defined as the difference between the maximum and minimum value of on resistance as measured over the specified analog signal range. IS (OFF) Source leakage current with the switch off. I D (OFF) Drain leakage current with the switch off. I D, IS (ON) Channel leakage current with the switch on. V D (VS) Analog voltage on Terminals D, S. C S (OFF) Off switch source capacitance. CD (OFF) Off switch drain capacitance. CD, CS (ON) On switch capacitance. tON Delay between applying the digital control input and the output switching on. tOFF Delay between applying the digital control input and the output switching off. tD Off time or on time measured between the 90% points of both switches, when switching from one address state to another (ADG713 only). Crosstalk A measure of unwanted signal that is coupled through from one channel to another as a result of parasitic capacitance. Off Isolation A measure of unwanted signal coupling through an off switch. Charge Injection A measure of the glitch impulse transferred from the digital input to the analog output during switching. Bandwidth The frequency at which the output is attenuated by 3 dB. On Response The frequency response of the on switch.

Rev. B | Page 14 of 16 ORDERING GUIDE Model1, 2 Temperature range Package Description Package Option ADG711BR −40°C to +85°C Standard Small Outline(SOIC) R-16 ADG711BR-REEL −40°C to +85°C Standard Small Outline(SOIC) R-16 ADG711BR-REEL7 −40°C to +85°C Standard Small Outline(SOIC) R-16 ADG711BRZ −40°C to +85°C Standard Small Outline(SOIC) R-16 ADG711BRZ-REEL −40°C to +85°C Standard Small Outline(SOIC) R-16 ADG711BRZ-REEL7 −40°C to +85°C Standard Small Outline(SOIC) R-16 ADG711BRU −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16 ADG711BRU-REEL −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16 ADG711BRU-REEL7 −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16 ADG711BRUZ −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16 ADG711BRUZ-REEL −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16 ADG711BRUZ-REEL7 −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16 ADG711WBRUZ-REEL −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16 ADG712BR −40°C to +85°C Standard Small Outline(SOIC) R-16 ADG712BR-REEL −40°C to +85°C Standard Small Outline(SOIC) R-16 ADG712BR-REEL7 −40°C to +85°C Standard Small Outline(SOIC) R-16 ADG712BRZ −40°C to +85°C Standard Small Outline(SOIC) R-16 ADG712BRZ-REEL −40°C to +85°C Standard Small Outline(SOIC) R-16 ADG712BRZ-REEL7 −40°C to +85°C Standard Small Outline(SOIC) R-16 ADG712BRU −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16 ADG712BRU-REEL −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16 ADG712BRU-REEL7 −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16 ADG712BRUZ −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16 ADG712BRUZ-REEL −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16 ADG712BRUZ-REEL7 −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16 ADG713BR −40°C to +85°C Standard Small Outline(SOIC) R-16 ADG713BRZ −40°C to +85°C Standard Small Outline(SOIC) R-16 ADG713BRZ-REEL −40°C to +85°C Standard Small Outline(SOIC) R-16 ADG713BRZ-REEL7 −40°C to +85°C Standard Small Outline(SOIC) R-16 ADG713BRU −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16 ADG713BRU-REEL −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16 ADG713BRU-REEL7 −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16 ADG713BRUZ −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16 ADG713BRUZ-REEL −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16 ADG713BRUZ-REEL7 −40°C to +85°C Thin Shrink Small Outline(TSSOP) RU-16 1 Z = RoHS Compliant Part. 2 W = Qualified for Automotive Applications. AUTOMOTIVE PRODUCTS The AD711W models are available with controlled manufacturing to support the quality and reliability requirements of automotive applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to obtain the specific Automotive Reliability reports for these models.

Rev. B | Page 15 of 16 NOTES

Rev. B | Page 16 of 16 NOTES ©2004–2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the prop erty of their respective owners. D00042-0-6/11(B)