ADG619BRT-REEL7

ADG619_07 AD | Alldatasheet

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CMOS, ±5 V/+5 V, 4 Ω, Single SPDT Switches ADG619/ADG620 Rev. C Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2001–2007 Analog Devices, Inc. All rights reserved.

FEATURES

6.5 Ω (maximum) on resistance 0.8 Ω (maximum) on-resistance flatness 2.7 V to 5.5 V single supply ±2.7 V to ±5.5 V dual supply Rail-to-rail operation 8-lead SOT-23, 8-lead MSOP Typical power consumption (<0.1 μW) TTL-/CMOS-compatible inputs

APPLICATIONS

D NOTES 1. SWITCHES SHOWN FOR A LOGIC 1 INPUT. 02617-001 Figure 1. GENERAL DESCRIPTION The ADG619/ADG620 are monolithic, CMOS single-pole double-throw (SPDT) switches. Each switch conducts equally well in both directions when the device is on. The ADG619/ADG620 offer a low on resistance of 4 Ω, which is matched to within 0.7 Ω between channels. These switches also provide low power dissipation, yet result in high switching speeds. The ADG619 exhibits break-before-make switching action, thus preventing momentary shorting when switching channels. The ADG620 exhibits make-before-break action. The ADG619/ADG620 are available in an 8-lead SOT-23 and an 8-lead MSOP . PRODUCT HIGHLIGHTS 1. Low on resistance (RON): 4 Ω typical. 3. Low power dissipation. 4. Fast tON/tOFF. 5. Tiny, 8-lead SOT-23 and 8-lead MSOP . Table 1. Truth Table for the ADG619/ADG620

0 On Off

1 Off On

Rev. C | Page 2 of 16 TABLE OF CONTENTS

REVISION HISTORY

3/07—Rev. B to Rev. C 1/06—Rev. A to Rev. B 6/03—Rev. 0 to Rev. A.

Rev. C | Page 3 of 16 SPECIFICATIONS DUAL SUPPLY VDD = +5 V ± 10%, VSS = −5 V ± 10%, GND = 0 V . All specifications −40°C to +85°C, unless otherwise noted. Table 2. B Version1 Parameter +25°C −40°C to +85°C Unit Test Conditions/Comments ANALOG SWITCH Analog Signal Range VSS to VDD V VDD = +4.5 V, VSS = −4.5 V On Resistance (RON) 4 Ω typ VS = ±4.5 V, IDS = −10 mA; see Figure 15 6.5 8.5 Ω max RON Match Between Channels (ΔRON) 0.7 Ω typ VS = ±4.5 V, IDS = −10 mA 1.1 1.35 Ω max On-Resistance Flatness (RFLAT (ON)) 0.7 0.8 Ω typ VS = ±3.3 V, IDS = −10 mA 1.35 1.4 Ω max LEAKAGE CURRENTS VDD = +5.5 V, VSS = −5.5 V Source Off Leakage, IS (Off) ±0.01 nA typ VS = ±4.5 V, VD = ∓ 4.5 V; see Figure 16 ±0.25 ±1 nA max Channel On Leakage, ID, IS (On) ±0.01 nA typ VS = VD = ±4.5 V; see Figure 17 ±0.25 ±1 nA max DIGITAL INPUTS Input High Voltage, VINH 2.4 V min Input Low Voltage, VINL 0.8 V max Input Current, IINL or IINH 0.005 μA typ VIN = VINL or VINH ±0.1 μA max Digital Input Capacitance, CIN 2 pF typ DYNAMIC CHARACTERISTICS2 ADG619 tON 80 ns typ RL = 300 Ω, CL = 35 pF 120 155 ns max VS = 3.3 V; see Figure 18 tOFF 45 ns typ RL = 300 Ω, CL = 35 pF 75 90 ns max VS = 3.3 V; see Figure 18 Break-Before-Make Time Delay, tBBM 40 ns typ RL = 300 Ω, CL = 35 pF 10 ns min VS1 = VS2 = 3.3 V; see Figure 19 ADG620 tON 40 ns typ RL = 300 Ω, CL = 35 pF 65 85 ns max VS = 3.3 V; see Figure 18 tOFF 200 ns typ RL = 300 Ω, CL = 35 pF 330 400 ns max VS = 3.3 V; see Figure 18 Make-Before-Break Time Delay, tMBB 160 ns typ RL = 300 Ω, CL = 35 pF 10 ns min VS = 0 V; see Figure 20 Charge Injection 110 pC typ VS = 0 V, RS = 0 Ω, CL = 1 nF; see Figure 21 Off Isolation −67 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 22 Channel-to-Channel Crosstalk −67 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 23 Bandwidth −3 dB 190 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 24 CS (Off ) 25 pF typ f = 1 MHz CD, CS (On) 95 pF typ f = 1 MHz

Rev. C | Page 4 of 16 B Version1 Parameter +25°C −40°C to +85°C Unit Test Conditions/Comments POWER REQUIREMENTS VDD = +5.5 V, VSS = −5.5 V IDD 0.001 μA typ Digital inputs = 0 V or 5.5 V 1.0 μA max ISS 0.001 μA typ Digital inputs = 0 V or 5.5 V 1.0 μA max 1 Temperature range for B version is −40°C to +85°C. 2 Guaranteed by design, not subject to production test.

Rev. C | Page 5 of 16 SINGLE SUPPLY VDD = 5 V ± 10%, VSS = 0 V , GND = 0 V . All specifications −40°C to +85°C, unless otherwise noted. Table 3. B Version1 Parameter +25°C −40°C to +85°C Unit Test Conditions/Comments ANALOG SWITCH Analog Signal Range 0 V to VDD V VDD = 4.5 V, VSS = 0 V On Resistance (RON) 7 Ω typ VS = 0 V to 4.5 V, IDS = −10 mA; see Figure 15 10 12.5 Ω max RON Match Between Channels (ΔRON) 0.8 Ω typ VS = 0 V to 4.5 V, IDS = −10mA 1.1 1.3 Ω max On-Resistance Flatness (RFLAT (ON)) 0.5 0.5 Ω typ VS = 1.5 V to 3.3 V, IDS = −10 mA 1.2 Ω max LEAKAGE CURRENTS VDD = 5.5 V Source Off Leakage, IS (Off ) ±0.01 nA typ VS = 1 V/4.5 V, VD = 4.5 V/1 V; see Figure 16 ±0.25 ±1 nA max Channel On Leakage, ID, IS (On) ±0.01 nA typ VS = VD = 1 V/4.5 V; see Figure 17 ±0.25 ±1 nA max DIGITAL INPUTS Input High Voltage, VINH 2.4 V min Input Low Voltage, VINL 0.8 V max Input Current, IINL or IINH 0.005 μA typ VIN = VINL or VINH ±0.1 μA max Digital Input Capacitance, CIN 2 pF typ DYNAMIC CHARACTERISTICS2 ADG619 tON 120 ns typ RL = 300 Ω, CL = 35 pF 220 280 ns max VS = 3.3 V; see Figure 18 tOFF 50 ns typ RL = 300 Ω, CL = 35 pF 75 110 ns max VS = 3.3 V; see Figure 18 Break-Before-Make Time Delay, tBBM 70 ns typ RL = 300 Ω, CL = 35 pF 10 ns min VS1 = VS2 = 3.3 V; see Figure 19 ADG620 tON 50 ns typ RL = 300 Ω, CL = 35 pF 85 110 ns max VS = 3.3 V; see Figure 18 tOFF 210 ns typ RL = 300 Ω, CL = 35 pF 340 420 ns max VS = 3.3 V; see Figure 18 Make-Before-Break Time Delay, tMBB 170 ns typ RL = 300 Ω, CL = 35 pF 10 ns min VS = 3.3 V; see Figure 20 Charge Injection 6 pC typ VS = 0 V, RS = 0 Ω, CL = 1 nF; see Figure 21 Off Isolation −67 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure Channel-to-Channel Crosstalk −67 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure Bandwidth −3 dB 190 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 24 CS (OFF) 25 pF typ f = 1 MHz CD, CS (ON) 95 pF typ f = 1 MHz POWER REQUIREMENTS VDD = 5.5 V IDD 0.001 μA typ Digital inputs = 0 V or 5.5 V 1.0 μA max 1 Temperature range for B version is −40°C to +85°C. 2 Guaranteed by design, not subject to production test.

Rev. C | Page 6 of 16 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 4. Parameter Rating VDD to VSS 13 V VDD to GND −0.3 V to +6.5 V VSS to GND +0.3 V to −6.5 V Analog Inputs1 VSS − 0.3 V to VDD + 0.3 V Digital Inputs1 −0.3 V to VDD + 0.3 V or 30 mA (whichever occurs first) Peak Current, S or D 100 mA (pulsed at 1 ms, 10% duty cycle maximum) Continuous Current, S or D 50 mA Operating Temperature Range Industrial (B Version) −40°C to +85°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C MSOP θJA Thermal Impedance 206°C/W θJC Thermal Impedance 44°C/W SOT-23 θJA Thermal Impedance 229.6°C/W θJC Thermal Impedance 91.99°C/W Lead Temperature, Soldering (10 sec) 300°C IR Reflow, Peak Temperature 220°C 1 Overvoltages at IN, S, or D are clamped by internal diodes. Current should be limited to the maximum ratings given. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at a time. ESD CAUTION

Rev. C | Page 10 of 16 TERMINOLOGY IDD Positive supply current. ISS Negative supply current. RON Ohmic resistance between D and S terminals. ΔRON On resistance match between any two channels. RFLAT (ON) Flatness is defined as the difference between the maximum and minimum value of on resistance as measured over the specified analog signal range. IS (Off) Source leakage current with the switch off. ID, IS (On) Channel leakage current with the switch on. VD, VS Analog voltage on Terminal D and Terminal S. VINL Maximum input voltage for Logic 0. VINH Minimum input voltage for Logic 1. IINL, IINH Input current of the digital input. CS (Off) Off switch source capacitance. CD, CS (On) On switch capacitance. tON Delay between applying the digital control input and the output switching on. tOFF Delay between applying the digital control input and the output switching off. tMBB On time is measured between the 80% points of both switches, when switching from one address state to another. tBBM Off time or on time is measured between the 90% points of both switches, when switching from one address state to another. Charge Injection A measure of the glitch impulse transferred from the digital input to the analog output during switching. Crosstalk A measure of unwanted signal coupled through from one channel to another as a result of parasitic capacitance. Off Isolation A measure of unwanted signal coupling through an off switch. Bandwidth The frequency response of the on switch. Insertion Loss The loss due to the on resistance of the switch.

0.65 BSC

1.10 MAX

Figure 25. 8-Lead Mini Small Outline Package [MSOP]

2.90 BSC

1.60 BSC

0.15 MAX

0.90 SEATING

2.80 BSC

Figure 26. 8-Lead Small Outline Transistor Package [SOT-23]

Rev. C | Page 14 of 16 ORDERING GUIDE Model Temperature Range Package Description Package Option Branding1 ADG619BRM −40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 SVB ADG619BRM-REEL −40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 SVB ADG619BRM-REEL7 −40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 SVB ADG619BRMZ2 −40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 SCC ADG619BRMZ-REEL2 −40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 SCC ADG619BRMZ-REEL72 −40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 SCC ADG619BRT-REEL −40°C to +85°C 8-Lead Small Outline Transistor Package (SOT-23) RJ-8 SVB ADG619BRT-REEL7 −40°C to +85°C 8-Lead Small Outline Transistor Package (SOT-23) RJ-8 SVB ADG619BRT-500RL7 −40°C to +85°C 8-Lead Small Outline Transistor Package (SOT-23) RJ-8 SVB ADG619BRTZ-REEL2 −40°C to +85°C 8-Lead Small Outline Transistor Package (SOT-23) RJ-8 SCC ADG619BRTZ-REEL72 −40°C to +85°C 8-Lead Small Outline Transistor Package (SOT-23) RJ-8 SCC ADG619BRTZ-500RL72 −40°C to +85°C 8-Lead Small Outline Transistor Package (SOT-23) RJ-8 SCC ADG620BRM −40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 SWB ADG620BRM-REEL −40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 SWB ADG620BRM-REEL7 −40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 SWB ADG620BRMZ2 −40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 S21 ADG620BRT-REEL −40°C to +85°C 8-Lead Small Outline Transistor Package (SOT-23) RJ-8 SWB ADG620BRT-REEL7 −40°C to +85°C 8-Lead Small Outline Transistor Package (SOT-23) RJ-8 SWB ADG620BRTZ-REEL72 −40°C to +85°C 8-Lead Small Outline Transistor Package (SOT-23) RJ-8 S21 1 Branding on SOT-23 and MSOP is limited to three characters due to space constraints. 2 Z = RoHS Compliant Part.

Rev. C | Page 15 of 16 NOTES

Rev. C | Page 16 of 16 NOTES ©2001–2007 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the prop erty of their respective owners. C02617-0-3/07(C)