ADG408BRU

ADG408_06 AD | Alldatasheet

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High Performance Analog Multiplexers ADG408/ADG409 Rev. C Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2006 Analog Devices, Inc. All rights reserved.

FEATURES

44 V supply maximum ratings

VSS to VDD analog signal range Low on resistance (100 Ω maximum) Low power (ISUPPLY < 75 μA) Fast switching Break-before-make switching action Plug-in replacement for DG408/DG409

APPLICATIONS

D ADG409 S1A S4B DA DB S4A S1B 1-OF-4 DECODER 1-OF-8 DECODER A0 A1 ENA0 A1 A2 EN 00027-001 Figure 1. GENERAL DESCRIPTION The ADG408/ADG409 are monolithic CMOS analog multiplexers comprising eight single channels and four differential channels, respectively. The ADG408 switches one of eight inputs to a common output as determined by the 3-bit binary address lines A0, A1, and A2. The ADG409 switches one of four differential inputs to a common differential output, as determined by the 2-bit binary address lines A0 and A1. An EN input on both devices is used to enable or disable the device. When the device is disabled, all channels are switched off. The ADG408/ADG409 are designed on an enhanced LC2MOS process that provides low power dissipation yet gives high switching speed and low on resistance. Each channel conducts equally well in both directions when on and has an input signal range that extends to the supplies. In the off condition, signal levels up to the supplies are blocked. All channels exhibit break- before-make switching action, preventing momentary shorting when switching channels. Inherent in the design is low charge injection for minimum transients when switching the digital inputs. The ADG408/ADG409 are improved replacements for the DG408/DG409 analog multiplexers. PRODUCT HIGHLIGHTS 1. Extended Signal Range. The ADG408/ADG409 are fabricated on an enhanced LC2MOS process, giving an increased signal range that extends to the supply rails. 2. Low Power Dissipation. 3. Low RON. 4. Single-Supply Operation. For applications where the analog signal is unipolar, the ADG408/ADG409 can be operated from a single rail power supply. The parts are fully specified with a single 12 V power supply and remain functional with single supplies as low as 5 V .

Rev. C | Page 2 of 16 TABLE OF CONTENTS

REVISION HISTORY

10/06—Rev. B to Rev. C 3/03—Rev. A to Rev. B 2/01—Revision 0: Initial Version

Rev. C | Page 3 of 16 SPECIFICATIONS DUAL SUPPLY VDD = 15 V , VSS = −15 V , GND = 0 V , unless otherwise noted. Table 1. B Version T Version Parameter +25ºC −40ºC to +85ºC +25ºC −55ºC to +125ºC Unit Test Conditions/Comments ANALOG SWITCH Analog Signal Range VSS to VDD VSS to VDD V RON 40 40 Ω typ VD = ±10 V, IS = −10 mA 100 125 100 125 Ω max ∆RON 15 15 Ω max VD = +10 V, −10 V LEAKAGE CURRENTS Source Off Leakage IS (OFF) ±0.5 ±50 ±0.5 ±50 nA max VD = ±10 V, VS = 10 V; see m Figure 19 Drain Off Leakage ID (OFF) VD = ±10 V; VS = 10 V; see m Figure 20 ADG408 ±1 ±100 ±1 ±100 nA max ADG409 ±1 ±50 ±1 ±50 nA max Channel On Leakage ID, IS (ON) VS = VD = ±10 V; see Figure 21 ADG408 ±1 ±100 ±1 ±100 nA max ADG409 ±1 ±50 ±1 ±50 nA max DIGITAL INPUTS Input High Voltage, VINH 2.4 2.4 V min Input Low Voltage, VINL 0.8 0.8 V max Input Current IINL or IINH ±10 ±10 μA max VIN = 0 or VDD CIN, Digital Input Capacitance 8 8 pF typ f = 1 MHz DYNAMIC CHARACTERISTICS1 tTRANSITION 120 120 ns typ RL = 300 Ω, CL = 35 pF; 250 250 ns max VS1 = ±10 V, VS8 = 10 V; see m Figure 22 tOPEN 10 10 10 10 ns min RL = 300 Ω, CL = 35 pF; VS = 5 V; see Figure 23 tON (EN) 85 125 85 125 ns typ RL = 300 Ω CL = 35 pF; 150 225 150 225 ns max VS = 5 V; see Figure 24 tOFF (EN) 65 65 ns typ RL = 300 Ω, CL = 35 pF; 150 150 ns max VS = 5 V; see Figure 24 Charge Injection 20 20 pC typ VS = 0 V, RS = 0 Ω, CL = 10 nF; see Figure 25 OFF Isolation −75 −75 dB typ RL = 1 kΩ, f = 100 kHz; VEN = 0 V; see Figure 26 Channel-to-Channel Crosstalk 85 85 dB typ RL = 1 kΩ, f = 100 kHz; see Figure 27 CS (OFF) 11 11 pF typ f = 1 MHz CD (OFF) f = 1 MHz ADG408 40 40 pF typ ADG409 20 20 pF typ CD, CS (ON) f = 1 MHz ADG408 54 54 pF typ ADG409 34 34 pF typ

Rev. C | Page 4 of 16 B Version T Version Parameter +25ºC −40ºC to +85ºC +25ºC −55ºC to +125ºC Unit Test Conditions/Comments POWER REQUIREMENTS IDD 1 1 μA typ VIN = 0 V, VEN = 0 V 5 5 μA max ISS 1 1 μA typ 5 5 μA max IDD 100 100 μA typ VIN = 0 V, VEN = 2.4 V 200 500 200 500 μA max 1 Guaranteed by design, not subject to production test. SINGLE SUPPLY VDD = 12 V , VSS = 0 V , GND = 0 V , unless otherwise noted. Table 2. B Version T Version Parameter +25ºC −40ºC to +85ºC +25°C −55ºC to +125ºC Unit Test Conditions/Comments ANALOG SWITCH Analog Signal Range 0 to VDD 0 to VDD V RON 90 90 Ω typ VD = 3 V, 10 V, IS = –1 mA LEAKAGE CURRENTS Source Off Leakage IS (OFF) ±0.5 ±50 ±0.5 ±50 nA max VD = 8 V/0 V, VS = 0 V/8 V; see Figure 19 Drain Off Leakage ID (OFF) VD = 8 V/0 V, VS = 0 V/8 V; see Figure 20 ADG408 ±1 ±100 ±1 ±100 nA max ADG409 ±1 ±50 ±1 ±50 nA max Channel On Leakage ID, IS (ON) VS = VD = 8 V/0 V; see Figure 21 ADG408 ±1 ±100 ±1 ±100 nA max ADG409 ±1 ±50 ±1 ±50 nA max DIGITAL INPUTS Input High Voltage, VINH 2.4 2.4 V min Input Low Voltage, VINL 0.8 0.8 V max Input Current IINL or IINH ±10 ±10 μA max VIN = 0 or VDD CIN, Digital Input Capacitance 8 8 pF typ f = 1 MHz DYNAMIC CHARACTERISTICS1 tTRANSITION 130 130 ns typ RL = 300 Ω, CL = 35 pF; VS1 = 8 V/0 V, VS8 = 0 V/8 V; see Figure 22 tOPEN 10 10 ns typ RL = 300 Ω, CL = 35 pF; VS = 5 V; see Figure 23 tON (EN) 140 140 ns typ RL = 300 Ω CL = 35 pF; VS = 5 V; see Figure 24 tOFF (EN) 60 60 ns typ RL = 300 Ω, CL = 35 pF; VS = 5 V; see Figure 24 Charge Injection 5 5 pC typ VS = 0 V, RS = 0Ω, CL = 10 nF; see Figure 25 Off Isolation –75 –75 dB typ RL = 1 kΩ f = 100 kHz; VEN = 0 V; see Figure 26

Rev. C | Page 5 of 16 B Version T Version Parameter +25ºC −40ºC to +85ºC +25°C −55ºC to +125ºC Unit Test Conditions/Comments Channel-to-Channel Crosstalk 85 85 dB typ RL = 1 kΩ, f = 100 kHz; see Figure 27 CS (OFF) 11 11 pF typ f = 1 MHz CD (OFF) f = 1 MHz ADG408 40 40 pF typ ADG409 20 20 pF typ CD, CS (ON) f = 1 MHz ADG408 54 54 pF typ ADG409 34 34 pF typ POWER REQUIREMENTS IDD 1 1 μA typ VIN = 0 V, VEN = 0 V 5 5 μA max IDD 100 100 μA typ VIN = 0 V, VEN = 2.4 V 200 500 200 500 μA max 1 Guaranteed by design, not subject to production test.

Rev. C | Page 6 of 16 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 3. Parameter Rating VDD to VSS 44 V VDD to GND −0.3 V to +32 V VSS to GND +0.3 V to −32 V Analog, Digital Inputs VSS − 2 V to VDD + 2 V or 20 mA, whichever occurs first Continuous Current, S or D 20 mA Peak Current, S or D (Pulsed at 1 ms, 10% Duty Cycle Maximum) 40 mA Operating Temperature Range Industrial (B Version) −40° C to +85°C Extended (T Version) −55° C to +125°C Storage Temperature Range −65° C to +150°C Junction Temperature 150°C θJA, Thermal Impedance 76°C/W Lead Temperature, Soldering (10 sec) 300°C θJA, Thermal Impedance 117°C/W Lead Temperature, Soldering (10 sec) 260°C θJA, Thermal Impedance 155°C/W θJC, Thermal Impedance 50°C/W θJA, Thermal Impedance 77°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION

Figure 2. ADG408 Pin Configuration Figure 3. ADG409 Pin Configuration Table 4. ADG408 Pin Function Descriptions device is disabled and all switches are off.

3 VSS Most Negative Power Supply Potential in

it can be connected to ground. 13 VDD Most Positive Power Supply Potential. 14 GND Ground (0 V) Reference. Table 5. ADG409 Pin Function Descriptions device is disabled and all switches are off. it can be connected to ground. 14 VDD Most Positive Power Supply Potential. 15 GND Ground (0 V) Reference. Table 6. ADG408 Truth Table Table 7. ADG409 Truth Table

20 TIME (ns)60

Figure 10. Switching Time vs. VIN (Bipolar Supply) Figure 11. Switching Time vs. Single Supply Figure 12. Positive Supply Current vs. Switching Frequency Figure 13. Switching Time vs. VIN (Single Supply) Figure 14. Switching Time vs. Bipolar Supply Figure 15. Negative Supply Current vs. Switching Frequency

Rev. C | Page 13 of 16 TERMINOLOGY RON Ohmic resistance between D and S. ΔRON Difference between the RON of any two channels. IS (OFF) Source leakage current when the switch is off. ID (OFF) Drain leakage current when the switch is off. ID, IS (ON) Channel leakage current when the switch is on. VD (VS) Analog voltage on Terminal D and Terminal S. CS (OFF) Channel input capacitance for off condition. CD (OFF) Channel output capacitance for off condition. CD, CS (ON) On switch capacitance. CIN Digital input capacitance. tON (EN) Delay time between the 50% and 90% points of the digital input and switch on condition. tOFF (EN) Delay time between the 50% and 90% points of the digital input and switch off condition. tTRANSITION Delay time between the 50% and 90% points of the digital inputs and the switch on condition when switching from one address state to another. tOPEN Off time measured between the 80% point of both switches when switching from one address state to another. VINL Maximum input voltage for Logic 0. VINH Minimum input voltage for Logic 1. IINL (IINH) Input current of the digital input. Crosstalk A measure of unwanted signal that is coupled through from one channel to another as a result of parasitic capacitance. Off Isolation A measure of unwanted signal coupling through an off channel. Charge Injection A measure of the glitch impulse transferred from the digital input to the analog output during switching. IDD Positive supply current. ISS Negative supply current.

Rev. C | Page 16 of 16 ORDERING GUIDE Model Temperature Range Package Description Package Option ADG408BN −40°C to +85°C 16-Lead Plastic Dual In-Line Package [PDIP] N-16 ADG408BNZ1 −40°C to +85°C 16-Lead Plastic Dual In-Line Package [PDIP] N-16 ADG408BR −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16 ADG408BR-REEL −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16 ADG408BR-REEL7 −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16 ADG408BRU −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 ADG408BRU-REEL −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 ADG408BRU-REEL7 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 ADG408BRUZ1 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 ADG408BRUZ-REEL1 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 ADG408BRUZ-REEL71 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 ADG408BRZ1 −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16 ADG408BRZ-REEL1 −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16 ADG408BRZ-REEL71 −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16 ADG408TQ −55°C to +125°C 16-Lead Ceramic Dual In-Line Package [CERDIP] Q-16 ADG408BCHIPS DIE ADG409BN −40°C to +85°C 16-Lead Plastic Dual In-Line Package [PDIP] N-16 ADG409BNZ1 −40°C to +85°C 16-Lead Plastic Dual In-Line Package [PDIP] N-16 ADG409BR −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16 ADG409BR-REEL −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16 ADG409BR-REEL7 −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16 ADG409BRU −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 ADG409BRU-REEL −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 ADG409BRU-REEL7 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 ADG409BRUZ1 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 ADG409BRUZ-REEL1 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 ADG409BRUZ-REEL71 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 ADG409BRZ1 −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16 ADG409BRZ-REEL1 −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16 ADG409BRZ-REEL71 −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16 ADG409TQ −55°C to +125°C 16-Lead Ceramic Dual In-Line Package [CERDIP] Q-16 1 Z = Pb-free part. ©2006 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. C00027-0-10/06(C)