ADC10D1X00 NSC | Alldatasheet
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Technical content
The following is an explanation of the differences:
- C6 – This pin was used for an internal test function for pre- production silicon, but it is not bonded in production parts.
- C7 – This pin was used for an internal test function; it is not bonded in production parts and may be connected to any potential or left floating.
- E3/F4 – These pins are used for internal test functions; do not connect them.
- D1 – This pin was used for an internal test function for pre- production silicon, but it is internally bonded in production parts.
- D7 – On an earlier version of the silicon, J4/K2/D7 were shorted externally. On final silicon, D7 is connected to the other pins internally, so it is no longer necessary to do so externally.
- U7 – On an earlier version of the silicon, L2/M4/U7 were shorted externally. On final silicon, U7 is connected to the other pins internally, so it is no longer necessary to do so externally.
- W3 – This pin is used for an internal test function; do not connect it. Despite its name, note that the CALFAIL pin does not indicate that the execution of the calibration process has actually failed. Planning for Power Consumption In general, higher speed ADCs consume more power and the ADC12D1x00 family consumes more power than the ADC10D1x00. If a system will be upgraded from a 10-bit to 12-bit ADC, take care to design the power supply accordingly with margin, so that it can supply the maximum required pow- er. The limits for the power consumption, P C, may be found in each datasheet. www.national.com 2 AN-2128
3 www.national.com AN-2128
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