DB800 DEC | Alldatasheet
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Data Sheet No. BRDB-800-1C MECHANICAL SPECIFICATION ACTUAL SIZE E31
8 AMP SILICON BRIDGE RECTIFIERS
MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS ' " ( ) $ * Average Forward Rectified Current Peak Forward Surge Current. Single 60Hz Half-Sine Wave Superimposed on Rated Load (JEDEC Method). T = 150 C + , Junction Operating and Storage Temperature Range T- , T.0/1 3 4465 798;:4< Continuous Power Dissipation in V Region @ T =80 C (Heat Sink Temp) = >@?BA C DFE PARAMETER (TEST CONDITIONS) Maximum DC Blocking Voltage Maximum Peak Recurrent Reverse Voltage Working Peak Reverse Voltage Series Number VGHJI VK@K@L VM6N M@OQP R VS@T SYMBOL UWVYX[ZW\\Y]_^W\`YacbYdfeYgfhYifjYkmlYnpoYqsrYt AMPS UNITS VOLTS Pu@v Pw 0 RMS Reverse Voltage ²0³³ ´µ ¶
- ¸ ¹ º0»¼¾½0¿À¡ÁÂäÄÅÇÆÈÊÉÌË0;ÎÏаÑ0ÒÓ ÔÕ0Õ Ö0×Ø Power Dissipation in V Region for 100 S Square Wave Ù Ú;ÛBÜ Ý ÞYßáàQâ;ãäßáå@åBæèç é;êBéWëéWìäíïîYð ñ ò ñäó ôYò ñQõ÷ö òáø@øBùèú û;üBûWýûWþäÿ WATTS Thermal Energy (Rating for Fusing) I t AMPS SEC I @ T = 50 C (Note 1) @T = 50 C (Note 2) Typical Thermal Resistance R R V"# Maximum Forward Voltage (Per Diode) at 4 Amps DC VOLTS VOLTS $% & ')((+*-,/. (10 Minimum Avalanche Voltage Maximum Avalanche Voltage V; <=?>@BA C VD EF?GH-IKJ Maximum Reverse Current at Rated VLM @ T = 25 C N O @T = 125 C P Q IRS Minimum Insulation Breakdown Voltage (Circuit to Case) VT UV Junction to Ambient (Note 2) Junction to Case (Note 1) b cd e A fggg h C/W i_j k l m n oKn p q r s/t)uvwx RATINGS INCHESMILLIMETERS MIN 6.4 12.2 18.5 SYM BL BH MAX MAX 7.6 13.2 19.6 MIN 0.73 0.25 0.48 0.77 0.3 0.52 LL LD 1.2 1.3 0.048 0.052 0.87522.2 n/a n/a SERIES DB800-DB810 and ADB804-ADB808DT DB804 y)z {)| UL RECOGNIZED - FILE #E124962 Tel.: (310) 767-1052 Fax: (310) 767-7958 DIOTEC ELECTRONICS CORP. Gardena, CA 90248 U.S.A 18020 Hobart Blvd., Unit B Å Á ¹ º »À »½_¶ ª_¹¶ ª_»º » ©¾º ¹ ¶¨ Á ¨ ¶¾º ¹ ¿¹º »½¿¹ Å ¸À ¹ ¯¹¶
- ½© » ABDB-800-1C BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOAD RATING TO 400 AMPS PEAK VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) Case: Terminals: Round silver plated copper pins Soldering: Per MIL-STD 202 Method 208 guaranteed Polarity: Marked on side of case; positive lead at beveled corner Mounting Position: Any. Through hole provided for #6 screw Weight: 0.18 Ounces (5.4 Grams) Molded Epoxy (UL Flammability Rating 94V-0) MECHANICAL DATA RoHS COMPLIANT
FIGURE 5. TYPICAL JUNCTION CAPACITANCE PER DIODE FIGURE 1. FORWARD CURRENT DERATING CURVE FIGURE 3. TYPICAL FORWARD CHARACTERISTIC PER DIODE FIGURE 4. TYPICAL REVERSE CHARACTERISTICS FIGURE 2. MAXIMUM NON-REPETITIVE SURGE CURRENT