AD8001AR-REEL

AD8001 AD | Alldatasheet

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REV. C Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. a AD8001 Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 1999

800 MHz, 50 mW

Current Feedback Amplifier

FEATURES

Excellent Video Specifications (R L = 150 V, G = +2) Gain Flatness 0.1 dB to 100 MHz 0.01% Differential Gain Error

0.0258 Differential Phase Error

5.5 mA Max Power Supply Current (55 mW) High Speed and Fast Settling

880 MHz, –3 dB Bandwidth (G = +1)

440 MHz, –3 dB Bandwidth (G = +2)

1200 V/ ms Slew Rate

10 ns Settling Time to 0.1% Low Distortion –65 dBc THD, f C = 5 MHz 33 dBm 3rd Order Intercept, F 1 = 10 MHz –66 dB SFDR, f = 5 MHz High Output Drive 70 mA Output Current Drives Up to Four Back-Terminated Loads (75 V Each) While Maintaining Good Differential Gain/Phase Performance (0.05%/0.25 8)

APPLICATIONS

8-Lead DIP (N-8, Q-8) 5-Lead and SOIC (SO-8) SOT-23-5 5AD8001 NC NC –IN NC +IN NC = NO CONNECT OUT 1VOUT AD8001 –VS +IN 5 +V S –IN PRODUCT DESCRIPTION The AD8001 is a low power, high-speed amplifier designed to operate on – 5 V supplies. The AD8001 features unique GAIN – dB –12 10M 100M 1G FREQUENCY – Hz VS = 65V RFB = 820V VS = 65V RFB = 1kV G = +2 RL = 100V Figure 1. Frequency Response of AD8001 buffer high-speed A-to-D converters. where size and power are critical. available in the industrial temperature range of –40°C to +85 °C. Figure 2. Transient Response of AD8001; 2 V Step, G = +2

REV. C–2– AD8001–SPECIFICATIONS(@ TA = + 258C, VS = 65 V, RL = 100 V, unless otherwise noted) Model AD8001A Conditions Min Typ Max Units DYNAMIC PERFORMANCE –3 dB Small Signal Bandwidth, N Package G = +2, < 0.1 dB Peaking, R F = 750 W 350 440 MHz G = +1, < 1 dB Peaking, R F = 1 kW 650 880 MHz R Package G = +2, < 0.1 dB Peaking, R F = 681 W 350 440 MHz G = +1, < 0.1 dB Peaking, R F = 845 W 575 715 MHz G = +1, < 0.1 dB Peaking, R F = 1 kW 575 795 MHz Bandwidth for 0.1 dB Flatness N Package G = +2, R F = 750 W 85 110 MHz R Package G = +2, R F = 681 W 100 125 MHz Slew Rate G = +2, V O = 2 V Step 800 1000 V/ ms G = –1, VO = 2 V Step 960 1200 V/ ms Settling Time to 0.1% G = –1, V O = 2 V Step 10 ns Rise and Fall Time G = +2, V O = 2 V Step, RF = 649 W 1.4 ns NOISE/HARMONIC PERFORMANCE Total Harmonic Distortion f C = 5 MHz, VO = 2 V p-p –65 dBc G = +2, RL = 100 W Input Voltage Noise f = 10 kHz 2.0 nV/ ÖHz Input Current Noise f = 10 kHz, +In 2.0 pA/ ÖHz –In 18 pA/ ÖHz Differential Gain Error NTSC, G = +2, R L = 150 W 0.01 0.025 % Differential Phase Error NTSC, G = +2, R L = 150 W 0.025 0.04 Degree Third Order Intercept f = 10 MHz 33 dBm 1 dB Gain Compression f = 10 MHz 14 dBm SFDR f = 5 MHz –66 dB DC PERFORMANCE Input Offset Voltage 2.0 5.5 mV TMIN–TMAX 2.0 9.0 mV Offset Drift 10 mV/°C –Input Bias Current 5.0 25 –m A TMIN–TMAX 35 –m A +Input Bias Current 3.0 6.0 –m A TMIN–TMAX 10 –m A Open Loop Transresistance V O = – 2.5 V 250 900 k W TMIN–TMAX 175 k W INPUT CHARACTERISTICS Input Resistance +Input 10 M W –Input 50 W Input Capacitance +Input 1.5 pF Input Common-Mode Voltage Range 3.2 – V Common-Mode Rejection Ratio Offset Voltage V CM = – 2.5 V 50 54 dB –Input Current V CM = – 2.5 V, TMIN–TMAX 0.3 1.0 mA/V +Input Current V CM = – 2.5 V, TMIN–TMAX 0.2 0.7 mA/V OUTPUT CHARACTERISTICS Output Voltage Swing R L = 150 W 2.7 3.1 – V Output Current R L = 37.5 W 50 70 mA Short Circuit Current 85 110 mA POWER SUPPLY Operating Range – 3.0 – 6.0 V Quiescent Current T MIN–TMAX 5.0 5.5 mA Power Supply Rejection Ratio +V S = +4 V to +6 V, –VS = –5 V 60 75 dB –VS = – 4 V to –6 V, +VS = +5 V 50 56 dB –Input Current T MIN–TMAX 0.5 2.5 mA/V +Input Current T MIN–TMAX 0.1 0.5 mA/V Specifications subject to change without notice.

conditions for extended periods may affect device reliability. due to a change in the stresses exerted on the die by the package. period can result in device failure. Figure 3. Plot of Maximum Power Dissipation vs. accumulate on the human body and test equipment and can discharge without detection. precautions are recommended to avoid performance degradation or loss of functionality. 1Standard Military Drawing Device. 2Refer to Evaluation Board section.

Figure 10. Frequency Response, G = +2 Figure 11. 0.1 dB Flatness, R Package (for N Package Add

50 W to RF)

Figure 12. Distortion vs. Frequency, R L = 1 kW Figure 13. –3 dB Bandwidth vs. R F Figure 14. Distortion vs. Frequency, R L = 100 W

1 BACK TERMINATED

2 BACK TERMINATED

1 AND 2 BACK TERMINATED

Figure 15. Differential Gain and Differential Phase

Figure 16. Frequency Response, G = +1 Figure 17. Flatness, R Package, G = +1 (for N Package Add

100 W to RF)

Figure 18. Distortion vs. Frequency, R L = 1 kW Figure 19. –3 dB Bandwidth vs. R F, G = +1 Figure 20. Distortion vs. Frequency, R L = 100 W Figure 21. Large Signal Frequency Response, G = +1

Figure 34. CMRR vs. Frequency Figure 35. –3 dB Bandwidth vs. Frequency, G = –2 Figure 36. 100 mV Step Response, G = –1 Figure 37. PSRR vs. Frequency Figure 38. 2 V Step Response, G = –1

3 WAFER LOTS

Figure 39. Input Offset Voltage Distribution

Figure 48. AD8001 Driving a Dual A-to-D Converter consumption while not limiting the performance of the circuit.

careful attention to board layout and component selection. from the area near the input pins to reduce stray capacitance. for fast, large-signal changes at the output. ing input will significantly affect high speed performance. Figure 49. Inverting and Noninverting Configurations for Evaluation Boards

REV. C AD8001 –16– C1886c–0–12/99PRINTED IN U.S.A. 8-Lead Plastic DIP (N-8) SEATING PLANE 0.060 (1.52) 0.015 (0.38)0.210 (5.33) MAX 0.022 (0.558) 0.014 (0.356) 0.160 (4.06) 0.115 (2.93) 0.070 (1.77) 0.045 (1.15) 0.130 (3.30) MIN PIN 1 0.280 (7.11) 0.240 (6.10) 0.100 (2.54) BSC 0.430 (10.92) 0.348 (8.84) 0.195 (4.95) 0.115 (2.93) 0.015 (0.381) 0.008 (0.204) 0.325 (8.25) 0.300 (7.62) 8-Lead Plastic SOIC (SO-8) 0.1968 (5.00) 0.1890 (4.80) 0.2440 (6.20) 0.2284 (5.80) PIN 1 0.1574 (4.00) 0.1497 (3.80) 0.0500 (1.27) BSC 0.0688 (1.75) 0.0532 (1.35) SEATING PLANE 0.0098 (0.25) 0.0040 (0.10) 0.0192 (0.49) 0.0138 (0.35) 0.0098 (0.25) 0.0075 (0.19) 0.0500 (1.27) 0.0160 (0.41) 0.0196 (0.50) 0.0099 (0.25)3 458 OUTLINE DIMENSIONS Dimensions shown in inches and (mm). 8-Lead Cerdip (Q-8) 1 4 0.310 (7.87) 0.220 (5.59)PIN 1 0.005 (0.13) MIN 0.055 (1.4) MAX 0.100 (2.54) BSC 15° 0.320 (8.13) 0.290 (7.37) 0.015 (0.38) 0.008 (0.20) SEATING PLANE 0.200.(5.08) MAX 0.405 (10.29) MAX 0.150 (3.81) MIN 0.200 (5.08) 0.125 (3.18) 0.023 (0.58) 0.014 (0.36) 0.070 (1.78) 0.030 (0.76) 0.060 (1.52) 0.015 (0.38) 5-Lead Plastic Surface Mount (SOT-23) (RT-5) 0.1181 (3.00) 0.1102 (2.80) PIN 1 0.0669 (1.70) 0.0590 (1.50) 0.1181 (3.00) 0.1024 (2.60) 1 3 4 5 0.0748 (1.90) BSC 0.0374 (0.95) BSC 0.0079 (0.20) 0.0031 (0.08) 0.0217 (0.55) 0.0138 (0.35) 108 080.0197 (0.50) 0.0138 (0.35) 0.0059 (0.15) 0.0019 (0.05) 0.0512 (1.30) 0.0354 (0.90) SEATING PLANE 0.0571 (1.45) 0.0374 (0.95)