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FULLY AUTOMATIC DICING MACHINE Fast, refined and innovative Minimized X-axis movement TWIN Dicing concept with two opposing Spindles Tokyo Seimitsu has introduced Japan’s first Wafer Dicing Machine, Model A-WD-75A in 1970 and tremendous contribution was made to success of Semiconductor industry with die separation process technology and its long term evolution with precession processing. Vast resource accumulated on Dicing Technology over four decades has enabled us to introduce next generation of Dicing machine, Model AD3000T with latest technology in FLUIDIC ENGINEERING, MECHATRONICS ENGINEERING and ENERGY CONSERVATION to lead the world with Dicing technology. World’s smallest Dicing Machine Achieved smallest footprint possible utilizing our own core technology. Size reduced down to 68% by comparison. World’s most efficient Dicing Machine Delivering fast X-axis (Up to 1,000 mm/sec) and Y-axis (Up to 300 mm/sec) processing speed. Low Cost of ownership. Introducing refined Graphic User Interface Tokyo Seimitsu was the first to Introduce TWIN Dicing Machine equipped with GUI and now refined GUI is available with HELP function as a standard feature for ease of operation. Ease of maintenance Widen front access door help improve routine maintenance with ease-of-maintenance in mind. TOKYO SEIMITSU
Max. work size Φ 305 mm Max. number of frames 12 inch (430 Φ) Spindle Rotation 60,000 min-1 OP:80,000 min-1 Max. blade diameter Φ 60 mm (2-Inch) Rated Output 1.8 KW X axis Available cutting range 310 mm Max. Speed 1000 mm/s Y1/Y2 axes Available cutting range 310 mm Max. Speed 300 mm/s Resolution 0.078 μm Accuracy 0.002 mm / 310 mm Z1/Z2 axes Stroke 34 mm Resolution 0.002 μm Max. Speed 80 mm/sec Repeatability 0.001 mm θ axis Range of rotation 380° Misc Voltage 3 Phase AC200 to 220 V ±10 % (Transformer adoptable) Power consumption 6.0 kVA (MAX) Air pressure 0.55 to 0.7 MPa Avg. Air consumption 210 L/min (0.55 MPa) Avg. Clean Air consumption 140 L/min Cutting Water, and others (pressure) 0.3 to 0.5 MPa Cutting Water, and others (Max Flow) Cutting Water:10.0 L/min Water curtain:3.0 L/min Others: 0.6 L/min Cooling Water (pressure) 0.3 to 0.5 MPa Cooling Water (Max Flow) 3.4 L/min (0.3 MPa) Exhaust 5.0 m / min more Size (W*D*H) 1290 mm x 1530 mm x 1900 mm Weight 1300 kg Optimized spacing by utilizing all components and optional unit well within the compartment Standard Spindles up to 60,000 rpm (80,000 rpm as optional) Enhanced throughput 1: X axis 1,000 mm/sec, Y axis 300 mm/sec, and Z axis 80 mm/sec 2: Two Optical Cutter-Set units 3: The Worlds’ smallest blade-to-blade distance 17” LCD touch panel and new GUI GUI(Graphical User Interface) with simple layout and large touch-buttons allow users’ interactive operation Easy and simple Kerf check function (AI kerf check function) Over 10,000 recipes storable USB port as standard (USB memory device can be used as external memory) Ease-of-maintenance Wide maintenance door and front-side accessibility allows easy of routine maintenance Optimized vacuum controller Reduces 50 % of air consumption compared with existing model Main Features Specifications Maintenance Set up space Tokyo Seimitsu has succeeded with footprint reduction by comparison with existing model Existing model AD3000T 4 unit 5 unit 2968-2, Ishikawa-machi, Hachioji-city, Tokyo 192-0032, Japan TEL: +81(0)42-642-0381 FAX: +81(0)42-631-5234 URL http://www.accretech.jp C-92-552-E-1707-2 International Marketing Dept. (Japan) New GUI TOKYO SEIMITSU