AD1-10S CHIPQUIK | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 1
Technical content
D a t a s h e e t r e v i s i o n 1 . 8 www.chipquik.com Thermoset Chip Glue (Red) - 10cc syringe Product Highlights Lead-Free, RoHS 3 Compliant, REACH Compliant Heat curing epoxy adhesive designed to bond surface mount chips and ICs to printed circuit boards (PCBs). Higher Viscosity for Stencil Printing. Designed to be printed with stencil and squeegee. Allows large/heavy surface mount components to be permanently bonded to a PCB during reflow, allowing two-sided surface mount reflow without larger chips/ICs coming loose. Specifications C u r i n g T i m e : 9 0 t o 120 seconds at 150+ °C (302+ °F) Recommended Curing Temperature: 150 to 260 °C (302 to 500 °F) Maximum Curing Temperature: 260 °C (500 °F) Designed to cure at leaded and lead free reflow temperatures. Operating Temperature Range: - 4 0 t o 125 °C (-40 to 257 °F) (After Curing, After Reflow) Lap Shear Strength (After Curing): >15MPa (Steel-Steel, 25 °C (77 °F)) D e n s i t y : 1 . 25g/cc Viscosity (Malcom @ 5 RPM, 25°C): 450,000 mPa-s Glass Transition Temperature (Tg): 80°C Coefficient of Thermal Expansion (CTE) below Tg: 60x10^-6/K (60 ppm/°C) Coefficient of Thermal Expansion (CTE) above Tg: 120x10^-6/K (1 20 ppm/°C) T h e r m a l C o n d u c t i v i t y : 0 . 1 4 W / ( m ꞏ K ) Dielectric Strength: 2 5 K V / m m ( a t 2 5 ° C ) D i e l e c t r i c C o n s t a n t : 3 . 2 ( a t 2 5 ° C , 1 M H z ) D i e l e c t r i c L o s s A n g l e T a n g e n t : < 0 . 0 2 ( a t 2 5 ° C , 1 M H z ) Adhesive Spot Diameter Growth During Curing: <10% P a c k a g i n g : 1 0 c c / 1 0 g S y r i n g e S h e l f L i f e : R e f r i g e r a t e d > 3 m o n t h s , U n r e f r i g e r a t e d > 3 m o n ths Stencil Life Application Apply by dot dispensing, line dispensing, or with stencil and squeegee. Cleaning Clean using isopropyl alcohol (IPA). Storage and Handling Store at 3-25°C (37-77°F). Do not freeze. Allow 4 hours for thermoset chip glue to reach an operating temperature of 20-25°C (68-77°F) before use. Transportation This product has no shipping restrictions. Shipping below 0°C (32°F) or above 25°C (77°F) for normal transit times by ground or air will not impact this product’s stated shelf life. 1 © 1994-2023 Chip Quik® Inc. AADD11--1100SS