ACTS244MS INTERSIL | Alldatasheet

Document overview

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Technical content

Features

  • Devices QML Qualified in Accordance with MIL-PRF-38535
  • Detailed Electrical and Screening Requirements are Contained in SMD# 5962-96718 and Intersil’s QM Plan
  • 1.25 Micron Radiation Hardened SOS CMOS
  • Single Event Upset (SEU) Immunity: <1 x 10 -10 Errors/Bit/Day (Typ)
  • Latch-Up Free Under Any Conditions oC to +125oC
  • Significant Power Reduction Compared to ALSTTL Logic
  • Input Logic Levels - VIL = 0.8V Max - VIH = VCC/2 Min
  • Input Current≤ 1µA at VOL, VOH

Description

The Intersil ACTS244MS is a Radiation Hardened Octal Non-Inverting Three-State Buffer having two active low enable inputs. The ACTS244MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of radiation hardened, high-speed, CMOS/SOS Logic Family. The ACTS244MS is supplied in a 20 lead Ceramic Flatpack (K suffix) or a Dual-In-Line Ceramic Package (D suffix). January 1996

Ordering Information

PART NUMBER TEMPERATURE RANGE SCREENING LEVEL PACKAGE 5962F9671801VRC -55 oC to +125oC MIL-PRF-38535 Class V 20 Lead SBDIP 5962F9671801VXC -55 oC to +125oC MIL-PRF-38535 Class V 20 Lead Ceramic Flatpack ACTS244D/Sample 25 oC Sample 20 Lead SBDIP ACTS244K/Sample 25 oC Sample 20 Lead Ceramic Flatpack ACTS244HMSR 25 oC Die Die Spec Number 518784 File Number 3187.1

AE, BE AIn, BIn AOn, BOn LLL LHH HXZ NOTE: H = High Voltage Level, L = Low Voltage Level, X = Immaterial, Z = High Impedance P N AE AI1 AO1 P NAI2 AO2 P NAI3 AO3 P NAI4 AO4 NOTE: (1 CIRCUIT OF 2) 1(19) 2(11) 4(13) 6(15) 8(17) 18(9) 16(7) 14(5) 12(3) Spec Number 518784

DIE DIMENSIONS: 100 x 100 (mils) 2.54 x 2.54 (mm) METALLIZATION: Type: AlSi Metal 1 Thickness: 7.125k Å ±1.125kÅ Metal 2 Thickness: 9kÅ ±1kÅ GLASSIVATION: Type: SiO2 Thickness: 8kÅ ±1kÅ WORST CASE CURRENT DENSITY: < 2.0 x 105A/cm2 BOND PAD SIZE: 110 x 110 (µm) 4.4 x 4.4 (mils) Metallization Mask Layout ACTS244MS BO4 (3) AI2 (4) BO3 (5) AI3 (6) BO2 (7) AI4 (8) VCC BO1 (9) AO4 (12) (13) BI2 (14) AO3 (15) BI3 (16) AO2 (17) BI4 (18) AO1 (20) VCC (20) AE (1) AI1 (2) BE (19) (11) BI1 (10) GND (10) GND Spec Number 518784 All Intersil semiconductor products are manufactured, assembled and tested underISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web sitehttp://www.intersil.com