ACTS04MS RENESAS | Alldatasheet
Document overview
- Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 2
Technical content
Features
- Devices QML Qualified in Accordance with MIL-PRF-38535
- Detailed Electrical and Screening Requirements are Contained in SMD# 5962-96712 and Intersil’s QM Plan
- 1.25 Micron Radiation Hardened SOS CMOS
- Total Dose >300K RAD (Si)
- Single Event Upset (SEU) Immunity: <1 x 10 -10 Errors/ Bit/Day (Typ)
- SEU LET Threshold>100 MEV-cm2/mg
- Dose Rate Upset>1011 RAD (Si)/s, 20ns Pulse
- Dose Rate Survivability>1012 RAD (Si)/s, 20ns Pulse
- Latch-Up Free Under Any Conditions
- Military Temperature Range-55oC to +125oC
- Significant Power Reduction Compared to ALSTTL Logic
- DC Operating Voltage Range 4.5V to 5.5V
- Input Logic Levels - VIL = 0.8V Max - VIH = VCC/2 Min
- Input Current 1A at VOL, VOH
- Fast Propagation Delay14ns (Max), 9ns (Typ)
Description
The Intersil ACTS04MS is a Radiation Hardened Hex Inverter. The ACTS04MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of radi- ation hardened, high-speed, CMOS/SOS Logic Family. The ACTS04MS is supplied in a 14 lead Ceramic Flatpack (K suffix) or a Ceramic Dual-In-Line Package (D suffix). Pinouts
14 PIN CERAMIC DUAL-IN-LINE MIL-STD-1835 DESIGNATOR
CDIP2-T14, LEAD FINISH C TOP VIEW
14 PIN CERAMIC FLATPACK MIL-STD-1835 DESIGNATOR CDFP3-
F14, LEAD FINISH C TOP VIEW Functional Diagram TRUTH TABLE INPUTS OUTPUTS An Y n LH HL NOTE: L = Logic Level Low, H = Logic level High GND VCC Y 1A1 Y GND VCC Y Y An Yn
Ordering Information
PART NUMBER TEMPERATURE RANGE SCREENING LEVEL PACKAGE 5962F9671201VCC -55 oC to +125oC MIL-PRF-38535 Class V 14 Lead SBDIP 5962F9671201VXC -55 oC to +125oC MIL-PRF-38535 Class V 14 Lead Ceramic Flatpack ACTS04D/Sample 25 oC Sample 14 Lead SBDIP ACTS04K/Sample 25 oC Sample 14 Lead Ceramic Flatpack ACTS04HMSR 25 oCD i e D i e
FN3383 Rev.1.00 Page 2 of 2 January 1996 ACTS04MS Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com For additional products, see www.intersil.com/en/products.html © Copyright Intersil Americas LLC 2001. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. Die Characteristics DIE DIMENSIONS: 88 mils x 88 mils 2240mm x 2240mm METALLIZATION: Type: AlSi Metal 1 Thickness: 7.125k Å 1.125kÅ Metal 2 Thickness: 9kÅ 1kÅ GLASSIVATION: Type: SiO2 Thickness: 8kÅ 1kÅ WORST CASE CURRENT DENSITY: <2.0 x 105 A/cm2 BOND PAD SIZE: 4.3 mils x 4.3 mils > 110m x 110m Metallization Mask Layout ACTS04MS (11) A5 A2 (3) (10) Y5 Y2 (4) NC A3 (5) (12) Y6 NC (2) (1) VCC (14) (13) (9) (8) (7) GND (6)