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Technical content
The ACT4060-448-QCC8C is a low-loss, compact, and econom ical surface-acoustic-wave ( SAW) filter in a surface-mount ceramic QCC8C case with 448.0 MHz center frequency. 1. Package Dimension (QCC8C) Pin Configuration
2 Input / Output
6 Output / Input
1,3,5,7 To be Grounded 4,8 Case Ground Sign Data (unit: mm) Sign Data (unit: mm) A 2.08 E 1.20 B 0.60 F 1.35 C 1.27 G 5.00 D 2.54 H 5.00 . M a r k i n g 3 . T e s t C i r c u i t ACT4060 Laser Marking 4. Typical Frequency Response
- Performance 5-1. Maximum Ratings Rating Value Unit Input Power Level P 0 dBm DC Voltage VDC 10 V Operable Temperature Range TA -40 to +85 ℃ Storage Temperature Range Tstg -40 to +85 ℃ 5-2. Electronic Characteristics Characteristic Minimum Typical Maximum Unit Center Frequency fC -- 448.000 -- MHz User Signal Band BW -- ±2.0 -- MHz I n s e r t i o n L o s s IL fC ± 2.0 MHz 3.0 4.5 dB Absolute Attenuation α DC to f C－ 25.0MHz fC＋25.0MHz to f C＋200.0MHz dB R i p p l e Δα fC ± 2.0 MHz 2.0 dB Input / Output Impedance (Nominal) 50 // 0pF CAUTION: Electrostatic Sensitive Device. Observe precautions for handling! 1. The frequency f C is defined as the midpoint between the 3dB frequencies. 2. Unless noted otherwise, all measurements are made with the f ilter installed in the specified test fixture that is connected to a 50Ω test system with VSWR≤1.2:1. The test fixture L and C are adjusted for minimum insertion loss at the filter center frequency, fC. Note that insertion loss, bandwidth, and passband shape are dependent on the impedance matching component values and quality. 3. Unless noted otherwise, specific ations apply over the entire specified operating temperature range. 4. The specifications of this device are based on the test circuit shown above and subject to change or obsolescence without notice. 5. All equipment designs utilizing this product must be approved by the appr opriate government agency prior to manufacture or sale. 6. Our liability is only assumed for the Surface Acousti c Wave (SAW) component(s) per se, not for applications, processes and circuits implemented within components or assemblies.