ACS86MS INTERSIL | Alldatasheet

Document overview

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Technical content

Features

  • 1.25 Micron Radiation Hardened SOS CMOS
  • Total Dose 300K RAD (Si)
  • Single Event Upset (SEU) Immunity <1 x 10 -10 Errors/Bit-Day (Typ)
  • SEU LET Threshold >80 MEV-cm2/mg
  • Dose Rate Upset >1011 RAD (Si)/s, 20ns Pulse
  • Latch-Up Free Under Any Conditions
  • Military Temperature Range: -55 oC to +125oC
  • Significant Power Reduction Compared to ALSTTL Logic
  • DC Operating Voltage Range: 4.5V to 5.5V
  • Input Logic Levels - VIL = 30% of VCC Max - VIH = 70% of VCC Min
  • Input Current≤1µA at VOL, VOH

Description

The Intersil ACS86MS is a radiation hardened quad 2-input exclusive OR gate. A high logic level on both inputs forces the output to a logic low state. The ACS86MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of the radiation hardened, high-speed, CMOS/SOS Logic Family. Spec Number 518849 File Number 3995

of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS

  1. All voltages referenced to device GND.
  2. Force/measure functions may be interchanged.
  3. For functional tests, VO≥4.0V is recognized as a logic “1”, and VO≤0.5V is recognized as a logic “0”.

TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS

  1. All voltages referenced to device GND.
  2. AC measurements assume RL = 500Ω , CL = 50pF, Input TR = TF = 3ns.

TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS

  1. The parameters listed in Table 3 are controlled via design or process parameters. Min and Max Limits are guaranteed but not directly test-

ed. These parameters are characterized upon initial design release and upon design changes which affect these characteristics. TABLE 4. POST IRRADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS

  1. All voltages referenced to device GND.
  2. For functional tests, VO≥4.0V is recognized as a logic “1”, and VO≤0.5V is recognized as a logic “0”.

TABLE 5. DELTA PARAMETERS (+25

  1. All delta calculations are referenced to 0 hour readings or pre-life readings.

TABLE 6. APPLICABLE SUBGROUPS

  1. Alternate Group A testing may be exercised in accordance with MIL-STD-883, Method 5005.

TABLE 7. TOTAL DOSE IRRADIATION

  1. Except FN test which will be performed 100% Go/No-Go.

TABLE 8. BURN-IN TEST CONNECTIONS (+125

  1. Each pin except VCC and GND will have a series resistor of 500Ω± 5%.

TABLE 9. IRRADIATION TEST CONNECTIONS (TA = +25 oC, ±5oC)

  1. Each pin except VCC and GND will have a series resistor of 47kΩ± 5%. Group E, Subgroup 2, sample size is 4 dice/wafer, 0 failures.

Specifications ACS86MS Spec Number 518849 Propagation Delay Timing Diagram and Load Circuit Intersil - Space Products MS Screening Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) Radiation Verification (Each Wafer) Method 1019,

4 Samples/Wafer, 0 Rejects

100% Nondestructive Bond Pull Method 2023 100% Internal Visual Inspection Method 2010 100% Temperature Cycling Method 1010 Condition C (-65 o to +150oC) 100% Constant Acceleration 100% PIND Testing 100% External Visual Inspection 100% Serialization 100% Initial Electrical Test 100% Static Burn-In 1 Method 1015, 24 Hours at +125 oC Min 100% Interim Electrical Test 1 (Note 1) 100% Static Burn-In 2 Method 1015, 24 Hours at +125oC Min 100% Interim Electrical Test 2 (Note 1) 100% Dynamic Burn-In Method 1015, 240 Hours at +125 oC or 180 Hours at +135oC 100% Interim Electrical Test 3 (Note 1) 100% Final Electrical Test 100% Fine and Gross Seal Method 1014 100% Radiographics Method 2012 (2 Views) 100% External Visual Method 2009 Group A (All Tests) Method 5005 (Class S) Group B (Optional) Method 5005 (Class S) (Note 2) Group D (Optional) Method 5005 (Class S) (Note 2) CSI and/or GSI (Optional) (Note 2) Data Package Generation (Note 3) NOTES: 1. Failures from interim electrical tests 1 and 2 are combined for determining PDA (PDA = 5% for subgroups 1, 7, 9 and delta failures com- bined, PDA = 3% for subgroup 7 failures). Interim electrical tests 3 PDA (PDA = 5% for subgroups 1, 7, 9 and delta failures combined, PDA = 3% for subgroup 7 failures). 2. These steps are optional, and should be listed on the purchase order if required. 3. Data Package Contents: Cover Sheet (P.O. Number, Customer Number, Lot Date Code, Intersil Number, Lot Number, Quantity). Certificate of Conformance (as found on shipper). Lot Serial Number Sheet (Good Unit(s) Serial Number and Lot Number). Variables Data (All Read, Record, and delta operations). Group A Attributes Data Summary. Wafer Lot Acceptance Report (Method 5007) to include reproductions of SEM photos. NOTE: SEM photos to include percent of step coverage. X-Ray Report and Film, including penetrometer measurements. GAMMA Radiation Report with initial shipment of devices from the same wafer lot; containing a Cover Page, Disposition, RAD Dose, Lot Number, Test Package, Spec Number(s), Test Equipment, etc. Irradiation Read and Record data will be on file at Intersil. VS INPUT OUTPUT VIH VSS VOH VOL TPLH TPHL VS AC VOLTAGE LEVELS PARAMETER ACS UNITS VCC 4.50 V VIH 4.50 V VS 2.25 V VIL 0 V GND 0 V DUT TEST CL RL POINT 50pF 500Ω

All Intersil semiconductor products are manufactured, assembled and tested underISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web sitehttp://www.intersil.com ACS86MS Metallization Mask Layout ACS86MS (2) (1) (13) GND Y3Y2 Y1 (3) A2 (4) NC B2 (5) (12) A4 (11) Y4 NC A1 B4B1 (6) (7) (8) (10) B3 (14) VCC (9) Spec Number 518849 Die Characteristics DIE DIMENSIONS: 88 mils x 88 mils 2.24mm x 2.24mm METALLIZATION: Type: AlSiCu Metal 1 Thickness: 6.75k Å (Min), 8.25kÅ (Max) Metal 2 Thickness: 9kÅ (Min), 11kÅ (Max) GLASSIVATION: Type: SiO2 Thickness: 8kÅ ±1kÅ DIE ATTACH: Material: Silver Glass or JM7000 Polymer after 7/1/95 WORST CASE CURRENT DENSITY: < 2.0 x 105 A/cm2 BOND PAD SIZE: > 4.3 mils x 4.3 mils > 110µm x 110µm