ACS521MS INTERSIL | Alldatasheet
Document overview
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Technical content
Features
- Devices QML Qualified in Accordance with MIL-PRF-38535
- Detailed Electrical and Screening Requirements are Contained in SMD# 5962-96709 and Intersil’ QM Plan
- 1.25 Micron Radiation Hardened SOS CMOS
- Single Event Upset (SEU) Immunity: <1 x 10 -10 Errors/Bit/Day (Typ)
- Latch-Up Free Under Any Conditions oC to +125oC
- Significant Power Reduction Compared to ALSTTL Logic
- Input Logic Levels - VIL = 30% of VCC Max - VIH = 70% of VCC Min
- Input Current≤ 1µA at VOL, VOH
Description
The Intersil ACS521MS is a Radiation Hardened 8 bit magnitude com- parator device. It provides a low output YB when Word A equals word B and input GB is low. All other input states cause a high output. The ACS521MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of radiation hardened, high-speed, CMOS/SOS Logic Family. The ACS521MS is supplied in a 20 lead Ceramic Flatpack (K suffix) or a Ceramic Dual-In-Line Package (D suffix). January 1996 Pinouts
20 PIN CERAMIC DUAL-IN-LINE
MIL-STD-1835 DESIGNATOR CDIP2-T20, LEAD FINISH C TOP VIEW
20 PIN CERAMIC FLATPACK
MIL-STD-1835 DESIGNATOR CDFP4-F20, LEAD FINISH C TOP VIEW 1GB GND VCC YB 12 0 GB GND VCC YB
Ordering Information
PART NUMBER TEMPERATURE RANGE SCREENING LEVEL PACKAGE 5962F9670901VRC -55 oC to +125oC MIL-PRF-38535 Class V 20 Lead SBDIP 5962F9670901VXC -55 oC to +125oC MIL-PRF-38535 Class V 20 Lead Ceramic Flatpack ACS521D/Sample 25 oC Sample 20 Lead SBDIP ACS521K/Sample 25 oC Sample 20 Lead Ceramic Flatpack ACS521HMSR 25 oC Die Die Spec Number 518821 File Number 3111.1
0A = BL 0A ≠ BH 1XXH NOTE: L = Low, H = High, X = Don’t Care A B GB 1 YB Spec Number 518821 All Intersil semiconductor products are manufactured, assembled and tested underISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web sitehttp://www.intersil.com
DIE DIMENSIONS: 102mils x 102mils 2,600mm x 2,600mm METALLIZATION: Type: AlSi Metal 1 Thickness: 7.125k Å ±1.125kÅ Metal 2 Thickness: 9kÅ ±1kÅ GLASSIVATION: Type: SiO2 Thickness: 8kÅ ±1kÅ WORST CASE CURRENT DENSITY: <2.0 x 105 A/cm2 BOND PAD SIZE: > 4.3mils x 4.3mils > 110µm x 110µm Metallization Mask Layout ACS521MS (1) GB (2) A0 (20) VCC (16) B6 GND (10) A4 (11) B4 (12) NC A1 (4) A3 (8) (14) B5 (15) A6 B1 (5) NC A2 (6) NC B2 (7) B3 (9) A5 (13) (17) A7 NC 3) B0 (18) B7 (19) YB