ACS245MS INTERSIL | Alldatasheet
Document overview
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Technical content
Features
- Devices QML Qualified in Accordance with MIL-PRF-38535
- Detailed Electrical and Screening Requirements are Contained in SMD# 5962-96707 and Intersil’ QM Plan
- 1.25 Micron Radiation Hardened SOS CMOS
- Single Event Upset (SEU) Immunity: <1 x 10 -10 Errors/Bit/Day (Typ)
- Latch-Up Free Under Any Conditions oC to +125oC
- Significant Power Reduction Compared to ALSTTL Logic
- Input Logic Levels - VIL = 30% of VCC Max - VIH = 70% of VCC Min
- Input Current≤ 1µA at VOL, VOH
Description
The Intersil ACS245MS is a Radiation Hardened octal non-inverting bidirectional bus transceiver intended for two-way asynchronous communication between data busses. The ACS245MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of radiation hardened, high-speed, CMOS/SOS Logic Family. The ACS245MS is supplied in a 20 lead Ceramic Flatpack (K suffix) or a Dual-In-Line Ceramic Package (D suffix). January 1996
Ordering Information
PART NUMBER TEMPERATURE RANGE SCREENING LEVEL PACKAGE 5962F9670701VRC -55 oC to +125oC MIL-PRF-38535 Class V 20 Lead SBDIP 5962F9670701VXC -55 oC to +125oC MIL-PRF-38535 Class V 20 Lead Ceramic Flatpack ACS245D/Sample 25 oC Sample 20 Lead SBDIP ACS245K/Sample 25 oC Sample 20 Lead Ceramic Flatpack ACS245HMSR 25 oC Die Die Spec Number 518780 File Number 3198.1
NOTE: H = High Voltage Level, L = Low Voltage Level, X = Immaterial P N N O TE: (1 of 8) P N BA OE DIR Spec Number 518780 All Intersil semiconductor products are manufactured, assembled and tested underISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web sitehttp://www.intersil.com
DIE DIMENSIONS: 96 mils x 117 mils 2.44mm x 2.97mm METALLIZATION: Type: AlSi Metal 1 Thickness: 7.125k Å ±1.125kÅ Metal 2 Thickness: 9kÅ ±1kÅ GLASSIVATION: Type: SiO2 Thickness: 8kÅ ±1kÅ WORST CASE CURRENT DENSITY: < 2.0 x 105A/cm2 BOND PAD SIZE: 110µm x 110µm 4.4 mils x 4.4 mils Metallization Mask Layout ACS245MS DIRA0 A1 (3) A2 (4) A3 (5) A4 (6) A5 (7) A6 (8) (10) (11) (12) (13) B5 (14) B4 (15) B3 (16) B2 (17) B1 (18) B0 OEVCC (9) (19)(20)(1)(2) A7 GND B7 B6 (10) GND VCC (20) Spec Number 518780