ACS125MS INTERSIL | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 4
Technical content
Features
- Devices QML Qualified in Accordance with MIL-PRF-38535
- Detailed Electrical and Screening Requirements are Contained in SMD# 5962-96705 and Intersil’s QM Plan
- 1.25 Micron Radiation Hardened SOS CMOS
- Single Event Upset (SEU) Immunity: <1 x 10 -10 Errors/Bit/Day (Typ)
- Latch-Up Free Under Any Conditions oC to +125oC
- Significant Power Reduction Compared to ALSTTL Logic
- Input Logic Levels - VIL = 30% of VCC Max - VIH = 70% of VCC Min
- Input Current≤ 1µA at VOL, VOH
Description
The Intersil ACS125MS is a Radiation Hardened Quad Buffer with Three-State outputs. Each output has it’s own enable input, which when “HIGH” puts the output in a high impedance state. The ACS125MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of radiation hardened, high-speed, CMOS/SOS Logic Family. The ACS125MS is supplied in a 14 lead Ceramic Flatpack (K suffix) or a Ceramic Dual-In-Line Package (D suffix). January 1996
Ordering Information
PART NUMBER TEMPERATURE RANGE SCREENING LEVEL PACKAGE 5962F9670501VCC -55 oC to +125oC MIL-PRF-38535 Class V 14 Lead SBDIP 5962F9670501VXC -55 oC to +125oC MIL-PRF-38535 Class V 14 Lead Ceramic Flatpack ACS125D/Sample 25 oC Sample 14 Lead SBDIP ACS125K/Sample 25 oC Sample 14 Lead Ceramic Flatpack ACS125HMSR 25 oC Die Die Spec Number 518817 File Number 3565.1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
NOTE: L = Low, H = High, X = Don’t Care, Z = High Impedance An OEn Yn n P Spec Number 518817
DIE DIMENSIONS: 88 mils x 88 mils 2.24mm x 2.24mm METALLIZATION: Type: AlSi Metal 1 Thickness: 7.125k Å ±1.125kÅ Metal 2 Thickness: 9kÅ ±1kÅ GLASSIVATION: Type: SiO2 Thickness: 8kÅ ±1kÅ WORST CASE CURRENT DENSITY: <2.0 x 105 A/cm2 BOND PAD SIZE: > 4.3 mils x 4.3 mils > 110µm x 110µm Metallization Mask Layout ACS125MS OE1A1 (12) A4 NC Y1 (3) (11) Y4 (10)OE3 OE2 (4) NC A2 (5) (2) (1) OE4VCC (14) (13) (8) (9) GND (7) (6) Spec Number 518817
All Intersil semiconductor products are manufactured, assembled and tested underISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reli- able. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web sitehttp://www.intersil.com Sales Office Headquarters NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (321) 724-7000 FAX: (321) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2.724.2111 ASIA Intersil (Taiwan) Ltd. Taiwan Limited 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029 ACS125MS Spec Number