ACS03MS INTERSIL | Alldatasheet
Document overview
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- PDF pages: 4
Technical content
Features
- Devices QML Qualified in Accordance with MIL-PRF-38535
- Detailed Electrical and Screening Requirements are Contained in SMD# 5962-96703 and Intersil’s QM Plan
- 1.25 Micron Radiation Hardened SOS CMOS
- Single Event Upset (SEU) Immunity: <1 x 10 -10 Errors/Bit/Day (Typ)
- Latch-Up Free Under Any Conditions oC to +125oC
- Significant Power Reduction Compared to ALSTTL Logic
- Input Logic Levels - VIL = 30% of VCC Max - VIH = 70% of VCC Min
- Input Current≤ 1µA at VOL, VOH
Description
The Intersil ACS03MS is a Radiation Hardened quad 2-input NAND gate with open drain outputs. The open drain output can drive resistive loads from a separate supply voltage. The ACS03MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of a radiation hardened, high-speed, CMOS/SOS Logic Family. The ACS03MS is supplied in a 14 lead Ceramic Flatpack (K suffix) or a Ceramic Dual-In-Line Package (D suffix).
Ordering Information
PART NUMBER TEMPERATURE RANGE SCREENING LEVEL PACKAGE 5962F9670301VCC -55 oC to +125oC MIL-PRF-38535 Class V 14 Lead SBDIP 5962F9670301VXC -55 oC to +125oC MIL-PRF-38535 Class V 14 Lead Ceramic Flatpack ACS03D/Sample 25 oC Sample 14 Lead SBDIP ACS03K/Sample 25 oC Sample 14 Lead Ceramic Flatpack ACS03HMSR 25 oC Die Die Spec Number 518779 File Number 3064.1
L L Z (Note 2), H (Note 3) L H Z (Note 2), H (Note 3) H L Z (Note 2), H (Note 3) HH L NOTES: 1. L = Low, H = High, Z = High Impedance 2. Without Pull-up Resistor 3. With Pull-up Resistor An Bn Yn Spec Number 518779
DIE DIMENSIONS: 68 mils x 79 mils 1730mm x 2010mm METALLIZATION: Type: AlSi Metal 1 Thickness: 7.125k Å ±1.125kÅ Metal 2 Thickness: 9kÅ ±1kÅ GLASSIVATION: Type: SiO2 Thickness: 8kÅ ±1kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 110µm x 110µm 4.3 mils x 4.3 mils Metallization Mask Layout ACS03MS B1 VCC B4 (12) A4 (11) Y4 (10) B3 (7) (8) (9) A3 Y1 (3) A2 (4) B2 (5) Y2 (6) (14) Y3GND (2) (13) (1) Spec Number 518779
All Intersil semiconductor products are manufactured, assembled and tested underISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web sitehttp://www.intersil.com Sales Office Headquarters NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (407) 724-7000 FAX: (407) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2.724.2111 ASIA Intersil (Taiwan) Ltd. Taiwan Limited 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029 ACS03MS Spec Number