ACPDA10C2V5U-HF COMCHIP | Alldatasheet

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  • Low leakage current. - IEC 61000-4-2 (ESD) ±16kV(Contact), ±18kV(air). SMD ESD Protection Diode Maximum Rating (at TA=25°C unless otherwise noted) Electrical Characteristics (at TA=25°C unless otherwise noted) SymbolParameter Value UnitConditions Symbol TypParameter Min Max UnitConditions VBR V VWorking peak reverse voltage VRWM Reverse leakage current IR µA Clamping voltage VVCIPP = 5A, TP = 8/20µs, I/O to GND Junction capacitance CJ pFVR = 0V, f = 1MHz, I/O to GND DFN2510-10 Dimensions in inches and (millimeter) 0.102(2.60) 0.094(2.40) 0.043(1.10) 0.035(0.90) 0.010(0.25) 0.022(0.55) 0.018(0.45) 0.020(0.50)BSC 0.006(0.15) 0.002(0.05) MAX. 0.018(0.45) 0.014(0.35) 0.008(0.20) 0.004(0.10) 0.018(0.45) 0.012(0.30) Pin 1 Mechanical data - Case: DFN2510-10 package, molded plastic. - Mounting position: Any Operating junction temperature range Tj °C Storage temperature range TSTG °C kV IEC 61000-4-2(air) IEC 61000-4-2(contact)ESD capability -55 to +125 Peak pulse current IPP ATP = 8/20µs 5 ±16ESD -55 to +150 ±18 Breakdown voltage Forward voltage VF VIF = 10mA, I/O to GND 1.2 IT = 1mA, I/O to GND VRWM = 2.5V, I/O to GND Circuit Diagram GND Pin 3 & 8 I/O Pin 1 I/O Pin 2 I/O Pin 4 I/O Pin 5 - Working voltage: 2.5V Peak pulse power PPP WTP = 8/20µs - Terminals: Gold plated, solderable per MIL-STD-750, method 2026. REV:A Page 1AQW-G7095 3.5 0.5 0.60 0.80 2.5 I/O I/O I/O I/O N/C 1 2 3 4 5 10 9 8 7 6 N/C N/C N/C GND GND - AEC-Q101 Qualified & PPAP. ACPDA10C2V5U-HF

Typical Rating and Characteristic Curves (ACPDA10C2V5U-HF) SMD ESD Protection Diode 1.0 Fig.4 - Typical Capacitance Between Terminals Characteristics Reverse Voltage, (V) Capacitance Between Terminals, (pF) 21 5 Fig.3 - Typical Clamping Voltage vs. Peak Pulse Current Peak Pulse Current, (A) Clamping Voltage, (V) Mounting on glass epoxy PCBs 0 25 50 75 100 125 100 120 Fig.2 - Power Rating Derating Curve Ambient Temperature, (°C) Power Rating, (%) Fig.1 - 8/20µs Peak Pulse Current Waveform Acc. IEC 61000-4-5 0 10 15 20 25 305 Time, (µs) td= t Ipp/2 e -t Percentage of Ipp 20% 40% 60% 80% 100% 120% Test Waveform parameters tf=8µs td=20µs Ta=25°C Peak Value Ipp 0.1 0.2 0.3 0.4 0.9 0.5 0.6 0.7 0.8 0.5 2.532 4 1 1.5 Comchip Technology CO., LTD. REV:A Page 2AQW-G7095

Reel Taping Specification Trailer Device Leader 400mm (min)160mm (min) Direction of Feed Index hole A B C d E F P T W DD1D2 SYMBOL (mm) (inch) E F P P0 P1 T W W1 SYMBOL (mm) (inch) A B C d D D1 D2 1.14 ± 0.05DFN2510-10 DFN2510-10 0.045 ± 0.002 2.64 ± 0.05 0.104 ± 0.002 0.64 ± 0.05 0.025 ± 0.002 1.50 + 0.10 − 0.00 0.059 + 0.004 − 0.000 178.00 ± 1.00 7.008 ± 0.039 60.00 ± 0.50 2.362 ± 0.020 13.50 ± 0.20 0.531 ± 0.008 1.75 ± 0.10 0.069 ± 0.004 3.50 ± 0.05 0.138 ± 0.002 4.00 ± 0.10 0.157 ± 0.004 4.00 ± 0.10 0.157 ± 0.004 2.00 ± 0.05 0.079 ± 0.002 0.20 ± 0.05 0.008 ± 0.002 8.00 ± 0.30 0.315 ± 0.012 12.00 + 0.50 − 0.00 0.472 + 0.020 − 0.000 .xxxx Comchip Technology CO., LTD. REV:A Page 3 120° AQW-G7095

3,000 REEL ( pcs ) Reel Size (inch) REEL PACK DFN2510-10 Part Number ACPDA10C2V5U-HF Marking Code .E2V5 SMD ESD Protection Diode .E2V5 Suggested P.C.B. PAD Layout SIZE (inch) 0.089 (mm) 2.25 1.40 0.615 0.055 0.024 DFN2510-10 0.25 0.010 E 0.40 0.016 A B C D F 0.50 0.020 G 0.17 0.007 A G C B D E F Note: 1.The pad layout is for reference purposes only. Comchip Technology CO., LTD. REV:A Page 4AQW-G7095