ACMD-7605 BOARDCOM | Alldatasheet

Document overview

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Technical content

Features

  • Miniature Size – 3.0 x 3.0 mm Max footprint – 1.2 mm Max height
  • High Power Rating – 33 dBm Abs Max Tx Power
  • RoHS Compliant Specifications
  • Rx Band Performance, 925-960 MHz, – 30 to +85°C – Insertion Loss: 4.0 dB max – Rx Noise Blocking: 48 dB min
  • Tx Band Performance, 880-915 MHz, – 30 to +85°C – Insertion Loss: 3.5 dB max – Tx Interferer Blocking: 51 dB min

Applications

Handsets or data terminals oper ating in UMTS Band 8 frequency range.

– 30°C +25°C +85°C Min Typ Max Min Typ Max Min Typ Max Antenna Port to Receive Port S23 Insertion Loss in Receive Band (925 – 960 MHz) dB 4.0 1.4 4.0 4.0 S22 Return Loss (SWR) of Receive Port in Receive Band S23 Attenuation in Transmit Band (880 – 915 MHz) dB 48 48 57 48 S23 Attenuation, 0 – 835 MHz dB 20 20 30 20 S23 Attenuation, 835 – 870 MHz dB 30 30 48 30 S23 Attenuation, 1805 – 1875 MHz dB 30 30 34 30 S23 Attenuation in Bluetooth Band (2400 – 2500 MHz) dB 30 30 51 30 Transmit Port to Antenna Port S31 Insertion Loss in Transmit Band (880 – 915 MHz) dB 3.5 1.3 3.0 3.5 S11 Return Loss (SWR) of Transmit Port in Transmit Band S31 Attenuation in Receive Band (925 – 960 MHz) dB 45 45 59 45 S31 Attenuation 0 – 820 MHz dB 27 27 38 27 S31 Attenuation in GPS Band (1574.42 – 1576.42 MHz) dB 22 22 31 22 S31 Attenuation in Transmit 2nd Harmonic Band (1760 – 1830 MHz) dB 20 20 30 20 S31 Attenuation in Bluetooth Band (2400 – 2500 MHz) dB 20 20 28 20 Antenna Port S33 Return Loss (SWR) of Antenna Port in Receive Band (925 – 960 MHz) S33 Return Loss (SWR) of Antenna Port in Transmit Band (880 – 915 MHz) Isolation Transmit Port to Receive Port S21 Tx-Rx Isolation in Receive Band (925 – 960 MHz) dB 48 48 57 48 S21 Tx-Rx Isolation in Transmit Band (880 – 915 MHz) dB 51 51 59 51 Notes: 1. TC is the case temperature and is defined as the temperature of the underside of the Duplexer where it makes contact with the circuit board. 2. Min/Max specifications are guaranteed at the indicated temperature with the input power to the Tx ports equal to or less than +29 dBm over all Tx frequencies unless otherwise noted. 3. Typical data is the average value of the parameter over the indicated band at the specified temperature. Typical values may vary over time.

Absolute Maximum Ratings [1] Parameter Unit Value Storage temperature °C –65 to +125 Maximum RF Input Power to Tx Port dBm +33 Maximum Recommended Operating Conditions [2] Parameter Unit Value Operating temperature, Tc [3], Tx Power ≤ 29 dBm °C –40 to +100 Operating temperature, Tc [3], Tx Power ≤ 30 dBm °C –40 to +85 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. The device will function over the recommended range without degradation in reliability or permanent change in performance, but is not guaranteed to meet electrical specifications. 3. TC is defined as case temperature, the temperature of the underside of the duplexer where it makes contact with the circuit board.

  1. Transmission line Gap (G) adjusted for Zo =
  2. I/O Pads (3 ea) 0.35 X 0.35, corner chamfer
  3. Ground vias positioned to maximize port-
  4. Tx connection on optionally placed in

Figure 19. PCB Layout (top view). tion of overall system performance.

Figure 23. Recommended Solder Stencil.

0.10 Notes:

  1. Chamfer or radius all corners 0.05 mm
  2. Stencil openings aligned to Boundary
  3. Non-I/O pad stencil openings aligned

Figure 24. Solder Stencil Overlaid on ACMD-7605 Bottom Metal Pattern.

For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved. AV02-1743EN - January 12, 2009 Package Moisture Sensitivity Feature Test Method Performance Moisture Sensitivity Level (MSL) at 260°C JESD22-A113D Level 3 0 50 100 150 200 250 300 Time, seconds 100 150 200 250 300Temperature, °C PROFILE.GRF PROFILE. WMF

6 February 2003

R. Waugh Tested profile shown. Figure 29. Verified SMT Solder Profile.

Ordering Information

Part Number No. of Devices Container ACMD-7605-BLK 25 Anti-static Bag ACMD-7605-TR1 1000 7-inch Reel