UM0139 STMICROELECTRONICS | Alldatasheet

Document overview

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Technical content

Datasheet sections

  • 1 Delivery Checklist
  • 2 Connecting to the appl ication board for emulation
  • 2.1 Connecting the flex adapter to the EMU3 probe
  • 2.2 DIP16 microcontroller package
  • 2.3 SO16 microcontroller package
  • 2.4 SO8 microcontroller package
  • 2.5 DIP8 microcontroller package
  • 2.6 DFN8 microcontroller package
  • 2.7 DIP20 microcontroller package
  • 2.8 SO20 microcontroller package
  • 2.9 SDIP32 microcontroller package
  • 2.10 SO28 microcontroller package
  • 3 Emulation Characteristics
  • 3.1 On-chip peripheral configuration
  • 3.2 Hardware simulation
  • 3.3 Emulator electrical characteristics
  • 3.3.1 I/O port electrical characteristics
  • 3.3.2 Power follower characteristics
  • 3.4 Emulation functional limitations and discrepancies
  • 3.4.1 Limitations
  • 3.4.2 Discrepancies
  • 4 In-circuit debugging connection with ICD adapt er
  • 4.1 In-circuit debugging
  • 4.2 Run the application in standalone mode
  • 4.3 Connecting to the application
  • 4.3.1 Connection for DIP8 microcontroller package
  • 4.3.2 Connection for SO8 microcontroller package
  • 4.3.3 Connection for DFN8 microcontroller package

The ST7-EMU3 series emulators are the third generation of high-end emulators for ST7. development with ST7 Flash devices. connect to your application board in place of your ST7. emulator kit, or independently, in the ST7MDT10-TEB kit. sub-families and the ST7DALI. Table 1. Related hardware for ST7MDT10-EMU3 probe

1 Delivery Checklist

Emulator User Manual), as well as all of the probe accessories listed below. Figure 1. ST7-EMU3 terminology

  1. The ST7-EMU3 probe with slots for connections to the ST Micro Connect box, as well

(ref.: DB509) already installed in the ST7-EMU3 probe.

  1. Connection accessories for DIP8, DIP16, SO8, SO16 and DFN8 packages:

ST7-EMU3 probe and your application board. c) An SO8 to DIP8 device adapter (DB646). application board and a male-male connector for connection of the device adapter.

  1. Connection accessories for the DIP20 and SO20 packages: f) Flex adapter with DIP20 connector (ref.: DB482A) for connection between your probe and your application board. g) A DIP20 to DIP20 device adapter (ref.: DB535). Note: The DIP20 pinout on the flex adapter is askew by 90°. Y ou must place the DIP20 to DIP20 device adapter (ref.: DB535) between the flex adapter connector and a socket (not included) on your application board socket in order to correctly emulate your DIP20 application. h) A DIP20 to SO20 device adapter/socket (ref.: DB093). 4. Connection accessories for the SDIP32 and SO28 packages: i) Flex adapter with SDIP32 connector (ref.: DB510) for connection between the EMU3 probe and your application board. j) An SDIP32 to S028 device adapter (ref.: DB359) with connection pins to install on your application board. 5. ICD adapter (MB509) for connection to your application board when in-circuit debugging ST7FLITEUS microcontrollers. Note: The ICD Adapter comes with 16-pin variants of the ST7FLITEUSx with 1K of Flash memory (Package marking: ST7FLITEUSICD) and ST7FLITEU0x with 2K of Flash memory (Package marking: ST7FLITEU0ICD). Select the device that corresponds to the microcontroller that you are developing with and insert it in the SDIP16 socket on the ICD Adapter. Owners of other versions of ST7-EMU3 emulators can configure them to emulate the ST7226x, ST7LITE families and the ST7DALI with the ST7MDT10-TEB kit. This kit includes the ST7MDT10 TEB (ref.: DB509) to install in the probe, as well as the connection accessories listed above (No. 2-5).

Figure 2. Probe kit contents (not to scale)

Figure 2. Probe kit contents (not to scale) (continued)

2 Connecting to the application board for emulation

  • select the adapters and accessories for the target MCU
  • connect the flex adapter to the TEB, which is housed in the EMU3 probe, The target MCUs that are emulated by the ST7MDT10-EMU3 probe exist in various microcontroller packages. To connect the emulator to your application board, you must select the flex adapter, device adapter(s) and socket for the target microcontroller based on its package. Table 2 indicates which TEB connector to use, and the connection accessories required for emulation of each supported microcontroller package. Caution: Only use the flex adapters provided with the ST7MDT10-EMU3. Even though flex adapters from other ST7-EMU3 series emulators may look similar, each flex adapter is designed for use with the emulator that it is delivered with.

2.1 Connecting the flex adapter to the EMU3 probe

  1. Turn the EMU3 probe upside-down, unscrew the retaining screw and slide the bottom

Figure 3. Opening the bottom of the probe Table 2. TEB connectors and connection accessories for supported packages

  1. Using Table 2, identify the TEB connector to use based on your microcontroller’s

pin connector (W2) on the ST7MDT10-TEB (DB509). Figure 4. TEB connectors

  1. Replace the bottom panel of the probe housing so that the flex adapter feeds through
  2. Reconnect the probe to the ST Micro Connect box by connecting the two 80-pin flat

cables to the ST Micro Connect connection ports on the top face of the probe housing.

  1. Continue by connecting to your application board. A procedure for each supported

– Section 2.9: SDIP32 microcontroller package on page 18.

2.2 DIP16 microcontroller package

  1. Solder a DIP16 socket onto your application board.
  2. Align the pin 1 indicators on the DIP16 connector of the DB483A flex adapter and the

Figure 5. DIP16 connection

2.3 SO16 microcontroller package

  1. Solder the connection pins onto your application board in place of your microcontroller

Figure 6. Solder the SO16 socket to your application board

  1. Align the pin 1 indicators and then insert the pins of the DB483A flex adapter into the

DIP16/SO16 device adapter (DB489) as shown in Figure 7.

  1. Align the pin 1 indicators and then insert the pins soldered on your application board

into the DIP16/SO16 device adapter (DB489).

Figure 7. SO16 connection

2.4 SO8 microcontroller package

  1. Solder the connection pins for the DIP16/SO8 device adapter (DB645) onto your
  2. Align the pin 1 indicators of the DB483A flex adapter and the DIP16/SO8 device
  3. Align the pin 1 indicators and then insert the pins soldered on your application board

into the DIP16/SO8 device adapter (DB645). Figure 8. SO8 connection

2.5 DIP8 microcontroller package

  1. Solder the a SO8/DIP8 device adapter (DB646) onto your application board.
  2. Align the pin 1 indicators of the DB483A flex adapter and the DIP16/SO8 device
  3. Align the pin 1 indicator of the DIP16/SO8 device adapter with the pin 1 indicator for the

SO8/DIP8 device adapter into the DIP16/SO8 device adapter (see Figure 9). Figure 9. DIP8 connection

Connecting to the application board for emulation UM0139

2.6 DFN8 microcontroller package

  1. Solder the female DFN8 connector to your application board. 2. Align the pin 1 indicators of the DB483A flex adapter and the DIP16/SO8 device adapter (DB645), then insert the flex adapter’s pins into the device adapter as shown in Figure 10. 3. Align the pin 1 indicators of the DIP16/SO8 device adapter (DB645) and the 8-pin male connector of the SO8/DFN8 device adapter (DB715), then insert the pins of the SO8/DFN8 device adapter into the DIP16/SO8 device adapter (see Figure 10). 4. Insert the pins of the male-male DFN8 connector into the SO8/DFN8 device adapter (DB715). Because of the position of the ground (GND) pin, there is only one way to connect these (see inset in Figure 10). 5. Finally, insert the pins of the male-m ale DFN8 connector into the female DFN8 connector on your application board. Again, because of the position of the ground (GND) pin, there is only one way to connect these (see inset in Figure 10).

Figure 10. DFN8 connection

2.7 DIP20 microcontroller package

  1. Solder a DIP20 socket onto your application board.
  2. Align the pin 1 indicators on the DIP20/DIP20 device adapter (ref.: DB535) and the

adapter as shown in Figure 11.

  1. Next insert the pins of the DIP20 to DIP20 device adapter into the socket on your

Figure 11. DIP20 connection

2.8 SO20 microcontroller package

  1. Solder the connection pins for the DIP20/SO20 device adapter (DB093) onto your

ensure the correct spacing and alignment of the pins (see inset in Figure 12).

  1. Align the pin 1 indicators of the DB482A flex adapter and the DIP20/SO20 device

application board as shown in Figure 12. Figure 12. SO20 connection

2.9 SDIP32 microcontroller package

  1. Solder a SDIP32 socket onto your application board.
  2. Align the pin 1 indicators on the SDIP32 connector of the DB510 flex adapter and the

Figure 13. SDIP32 connection

2.10 SO28 microcontroller package

  1. Solder the connection pins for the SDIP32/SO28 device adapter (DB359) onto your

ensure the correct spacing and alignment of the pins (see inset in Figure 14).

  1. Align the pin 1 indicators on the SDIP32/SO28 device adapter and the DB510 flex

Figure 14. SO28 connection

3 Emulation Characteristics

3.1 On-chip peripheral configuration

dialog box so that the ST7-EMU3 probe accurately emulates your target device. In STVD7’s MCU Selection window, choose the MCU that you are using in your application. provided in the current version of the STVD7 Release Notes. The clock frequency options are summarized in Table 3 below. Table 3. Clock frequency options

16 MHz

Refer to the datasheet of your target ST7 MCU for more information on the watchdog timer. performed. If this option is set to No Reset, no chip reset will be performed. This option bit allows the Port C external interrupt mapping to be configured as ei0 or ei1.

3.2 Hardware simulation

be accessed when your emulator is not running. Simulation from STVD7’s main menu bar. Note: The list of Simulation commands may vary according to the selected microcontroller. Figure 15. Hardware simulation window Table 4. EXT_IT option bit mapping

that you have chosen in the MCU Configuration window.

  • LVD (Low Voltage Detector) Reset: When this simulation is chosen, a chip reset is generated immediately, as if low voltage had been detected by the emulator. The reset generated typically lasts 30 µs.
  • AVD (Auxiliary Voltage Detector) Interrupt + LVD Reset: When this simulation is chosen, an interrupt occurs immediately and lasts for a configurable duration. Once the duration of the interrupt is over, a chip reset occurs (lasting 30 µs typically), and immediately afterwards, another interrupt of the same configured duration occurs. To configure the duration of the two interrupts, click on the downward arrow button, and type in the duration in µs in the Delay field. This simulation scenario allows you to simulate a power-down of the chip (first interrupt), followed by a reset, and a power-up of the chip (2nd interrupt). By varying the duration of the interrupts preceding and following the chip reset, you can simulate different rates of powering down and up.
  • Clock Filter Interrupt: This feature is available with only certain target MCUs—see

Table 5. When this simulation is chosen, an interrupt occurs immediately, of the duration in µs in the Delay field. Table 5. Hardware simulation functions by target MCU

UM0139 Emulation Characteristics

3.3 Emulator electrical characteristics

This section details the specific electrical characteristics of the ST7MDT10-EMU3 emulator.

3.3.1 I/O port electri cal characteristics

The values shown in Table 6 are the specified values for the I/O port in pull up mode (at 25°C). Table 6. Values for I/O port in pull up mode

Description

Test Conditions Value in Volts (V) VCC (V) Min. Typ. Max. VIH High level input voltage 2.0 1.5 -- -- 4.5 3.15 -- -- 6.0 4.2 -- -- V IL Low level input voltage 2.0 -- -- 0.5 4.5 -- -- 1.35 6.0 -- -- 1.8 V OH High level output voltage 2.0 VI =V IH or VIL IO =- 2 0µA 1.9 2.0 -- 4.5 4.4 4.5 -- 6.0 5.9 6.0 -- 4.5 I VOL Low level output voltage 2.0 VI =V IH or VIL IO =2 0 µA -- 0.0 0.1 4.5 -- 0.0 0.1 6.0 -- 0.0 0.1 4.5 IO =6 . 0m A -- 0.17 0.26 6.0 IO =7 . 8m A -- 0.18 0.26

Emulation Characteristics UM0139 The values shown in Table 7 are the specified values for the I/O port in true open drain mode (at 25°C). Table 7. Values for I/O port in true open drain mode Test Conditions Value in Volts (V) VCC (V) Min. Typ. Max. VIH High level input voltage 2.0 1.5 -- -- 4.5 3.15 -- -- 6.0 4.2 -- -- VIL Low level input voltage 2.0 -- -- 0.5 4.5 -- -- 1.35 6.0 -- -- 1.8 VOH High level output voltage 2.0 IO =- 2 0µA 1.9 2.0 -- 4.5 4.4 4.5 -- 6.0 5.9 6.0 -- VOL Low level output voltage 2.0 IO =2 0 µA -- 0.0 0.1 4.5 -- 0.0 0.1 6.0 -- 0.0 0.1 4.5 I O =4 . 0m A -- 0.17 0.26 6.0 IO =5 . 2m A -- 0.18 0.26

3.3.2 Power follower characteristics

within the range of 2.4 V and 5.5 V. taken using a single emulator. Slight differences may occur between emulators. the ADC conversion will be erroneous when VAPP is outside of the 2.5 to 5 V range. Figure 16. Power follower behavior

Emulation Characteristics UM0139

3.4 Emulation functional limitations and discrepancies

Some MCU’s may present specific limitations and discrepancies. Y ou will find information specific to your MCU and your hardware configuration in STVD7’s Discrepancies window. For more information refer to the STVD7 User Manual

3.4.1 Limitations

  • The Flash status control register is not emulated; flash memory is replaced by ROM on the emulator. Therefore, read/write access has been blocked at the FCSR address, to avoid misinterpretation of the contents of this address. If you attempt a read/write access the Flash Control/Status Register (FCSR), your program will stop running (the equivalent of a breakpoint) and an “access denied” message will appear. If this occurs, click Continue to continue running your program. To avoid interruptions in the running of your program on the emulator, it is advisable to temporarily comment out any read or write accesses to the FCSR.
  • For the ST7DALI and all targets in the ST7LITE2 family, the AMPCAL bit (bit 4) of the AMP CONTROL/DATA REGISTER LOW (ADCDRL) register (part of the ADC peripheral) can be set in STVD7 but will have no effect in emulation (this functionality is not emulated).

3.4.2 Discrepancies

  • When emulating the ADC peripheral on all supported microcontrollers, a stabilization time of 20 µs is required after changing the channel or starting a conversion.
  • For the ST7DALI and all targets in the ST7LITE2 family, stabilization time is required when changing the Amplifier Control bit AMPON: – 300 µs is needed to stabilize the ADC system when setting this bit, – 800 µs is needed to stabilize the ADC system when clearing this bit.

4 In-circuit debugging connection with ICD adapter

ICD are found in the ST7-EMU3 Emulator User Manual. on the adapter corresponds to the target device for your application.

4.1 In-circuit debugging

host PC. During in-circuit debugging, the RST/PA3 On jumper (TP2) must not be fitted. Figure 17. ICD On jumper (TP1)

  1. Make sure the in-circuit debugging tool and the application are powered off.
  2. Place the jumper on TP1 as shown in Figure 17.
  3. Connect to and power on the in-circuit debugging tool and application board.

the connection with a drop of solder on the CLKIN solder point (G2) shown in Figure 18. Figure 18. CLKIN solder point (G2) on the ICC connector. PA5 is not available for the application.

4.2 Run the application in standalone mode

microcontroller without being connected to an in-circuit debugging tool or the host PC. Figure 19. RST/PA3 On jumper (TP2) and the ICD On jumper (TP1) must not be fitted.

4.3 Connecting to the application

Figure 20. Connectors on the ICD Adapter board via an 8-pin connector on the bottom of the adapter (see Figure 20). microcontroller can only be used for reset.

  • Section 4.3.1: Connection for DIP8 microcontroller package on page 30
  • Section 4.3.2: Connection for SO8 microcontroller package on page 31
  • Section 4.3.3: Connection for DFN8 microcontroller package on page 32 10-pin ICC connector 8-pin connector Top Bottom

Table 8. Target MCU packages and their application connectors

4.3.1 Connection for DIP8 microcontroller package

  1. Solder the DIP8 Device adapter (DB646) onto your application board in place of your
  2. Plug the ICC cable from the in-circuit debugging tool into the 10-pin ICC connector on

the top of the ICD Adapter (MB509).

  1. Align the pin 1 indicator on the ICD Adapter (MB509) with the pin 1 indicator for the

connector on the bottom of the ICD Adapter. Figure 21. DIP8 connection

4.3.2 Connection for SO 8 microcontroller package

  1. Solder the SO8 connector (8-pin header) onto your application board in place of your
  2. Plug the ICC cable from the in-circuit debugging tool into the 10-pin ICC connector on

the top of the ICD Adapter (MB509).

  1. Align the pin 1 indicator on the ICD Adapter (MB509) with the pin 1 indicator for the

on the bottom of the ICD Adapter. Figure 22. SO8 connection

4.3.3 Connection for DFN8 microcontroller package

  1. Solder the DFN8 female connector onto your application board in place of your
  2. Plug the ICC cable from the in-circuit debugging tool into the 10-pin ICC connector on

the top of the ICD Adapter (MB509).

  1. Plug the 8 pins of the DFN8 Device adapter (DB715) into the 8-pin connector on the

bottom of the ICD Adapter (MB509).

  1. Connect the DFN8 Device adapter (DB715) to the DFN female connector on your

Figure 23. DFN8 connection

UM0139 EMC conformity and safety requirements Appendix A EMC conformity and safety requirements This product respects the EMC requirements of the European guideline 89/336/EEC under the following conditions:

  • Any tester, equipment, or tool used at any production step, or for any manipulation of semiconductor devices, must have its shield connected to ground.
  • All provided ferrites must be attached as described in the hardware installation instructions of the relevant user manual.
  • The product must be placed on a conductive table top, made of steel or clean aluminum , or covered by an antistatic surface (superficial resistivity equal to or higher than 0.5 MΩ/cm2), grounded through a ground cable (conductive cable from protected equipment to ground isolated with a 1 MΩ resistor placed in series). Before every contact with the emulator, the operator must touch the surface of the grounded worktable just behind the rear panel of the emulator. All manipulation of finished goods must be done at such a grounded worktable.
  • The worktable must be free of all non-antistatic plastic objects.
  • An antistatic floor covering grounded through a conductive ground cable (with serial resistor between 0.9 and 1.5 MΩ) should be used.
  • It is recommended that you wear an antistatic wrist or ankle strap, connected to the antistatic floor covering or to the grounded equipment.
  • If no antistatic wrist or ankle strap is worn, before each manipulation of the powered-on tool, you must touch the surface of the grounded worktable just behind the rear panel of the emulator.
  • It is recommended that antistatic gloves or finger coats be worn.
  • It is recommended that nylon clothing be avoided while performing any manipulation of parts.

EMU3 probe distinct and defines its emulation capabilities, is the type of TEB it contains. (TEBs). This appendix tells you how to replace the TEB in your EMU3 probe.

  1. Turn the EMU3 probe upside-down, unscrew the retaining screw and slide the bottom

out as shown in Figure 3 on page 7.

  1. Remove the two screws that secure the TEB to the rest of the probe boards, as shown

Figure 24. Removing the TEB screws

  1. Remove the target emulation board that is currently in the probe by gripping the edge of

Changing the TEB in your ST7-EMU3 probe UM0139 5mm extension to the 10mm support on the DEB, as shown in Figure 26. The 5mm extensions are provided with your TEB and screw into the 10mm supports. However, remember that if you install a TEB with surface mounted microcontroller later, you will have to remove the 5mm extensions. 6. Once the TEB is firmly in place, refasten the two screws that fix the TEB to the DEB, as shown in Figure 15. Take care not to over-tighten the screws. 7. Connect the appropriate flex cable for your MCU package, as described in Section 2.1: Connecting the flex adapter to the EMU3 probe on page 7. 8. Replace the bottom panel of the probe housing such that the flex cable feeds through the slot provided. 9. Reconnect the probe to the ST Micro Connect box by connecting the two 80-pin flat cables to the ST Micro Connect connection ports on the top face of the probe housing. For details, refer to the ST7 EMU3 Emulator User Manual. If this is the first time that you have installed a new TEB in your EMU3 probe, your emulator and probe firmware will be updated automatically by STVD7 when you start a debug session. For more information refer to your STVD7 User Manual.

Revision history

Table 9. Document revision history 01-August-2001 1 Initial release. Updated references to include all ST7FLITEUx part numbers. root part number in the whole document. 29-June-2007 6 ST7-EMU3 replaced by ST7MDT10-EMU3 when relevant.